JPH0823010A - Semiconductor device - Google Patents

Abstract

(57) [Summary] [Purpose] To increase the adhesive strength of the resin encapsulant to the carrier tape and the strength of itself. [Structure] The inner leads 5 formed on the carrier tape 1 are gang bonded to the bumps 13 protruding from the pads 12 of the pellet 2 to mount the pellets on the carrier tape 1, and the pellets and the inner lead groups are formed on the tape body. A resin-sealed tape with the resin-sealed body 15
In the carrier type package IC 17, the sealing resin 31 is filled in the small holes 8 formed in the tape body 2 inside the resin sealing body to form the filling resin portion 9 in the tape body 2. [Effect] Since the filled resin portion 9 anchors on the tape body 2 in the resin sealing body 15, the adhesive force of the resin sealing body to the tape body increases, and the filled resin portion 9 becomes a rib. The strength of the body itself increases. As a result, the moisture resistance of the tape carrier type package 16 is increased, and the IC 17 can be highly integrated and downsized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing technique, and more particularly to a semiconductor device manufacturing technique provided with a tape carrier (or film carrier) type package. , Which are effectively used for manufacturing a semiconductor integrated circuit device (hereinafter referred to as IC).

[0002]

2. Description of the Related Art An IC having a tape carrier type package for realizing a thin and highly workable mounting.
As a semiconductor pellet (hereinafter, simply referred to as a pellet) and a carrier tape, tape automated bonding (Tape Automated B
There is one in which the resin encapsulation body is molded by the potting method, which is mechanically and electrically connected by an onding: TAB).

That is, a plurality of pads for taking out this circuit to the outside are formed on the first main surface of the pellet in which the semiconductor integrated circuit is formed, and the pads are formed on the outer peripheral portion of each pad. Bumps made of a conductor such as gold are provided on the surface of each of them. On the other hand, the carrier tape is constructed by forming an inner lead and an outer lead group on a tape body made of an insulating resin such as polyimide. Then, the pellets are arranged on the carrier tape so that the bumps are aligned with the inner leads, respectively, and the bumps and the inner leads are simultaneously bonded by a bonding tool, thereby being electrically and mechanically connected. After that, the sealing resin is potted on the tape body so as to seal the pellet and the inner lead group,
The resin sealing body is molded.

An example of a tape carrier type package using the TAB technology is shown in Japanese Patent Publication No.
No. 1-13379, and "Electronic Materials December 1988 Separate Volume" issued by the Industrial Research Institute Co., Ltd., December 13, 1988, P105 to P113.

[0005]

An IC having a tape carrier type package is an IC for driving a liquid crystal panel because it is thin and can be mounted with good workability.
Widely used as. In general, a liquid crystal panel is required to have a large-sized screen, and in response to this demand, high integration and relative relative to an IC having a tape carrier type package as an IC for driving a liquid crystal panel. Is required to reduce.

However, in an IC having a conventional tape carrier type package, no consideration is given to the adhesive force of the resin encapsulant to the carrier tape or the mechanical strength of the resin encapsulant itself. It has been clarified by the present inventor that there is a problem that the adhesive strength and the mechanical strength are deteriorated as the package size is reduced, and the moisture resistance of the resin-sealed package is deteriorated.

An object of the present invention is to provide a semiconductor device capable of enhancing the adhesive force of a resin sealing body to a carrier tape and the mechanical strength of the resin sealing body itself.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0009]

The typical ones of the inventions disclosed in the present application will be outlined below.

That is, a plurality of pads for taking out the electronic circuit to the outside are formed on the first main surface of the semiconductor pellet in which the electronic circuit is built, and on the other hand, the inner lead and the tape are formed on the tape body of the carrier tape. Outer leads are formed, each pad and each inner lead are gang-bonded and the pellets are electrically and mechanically connected to the carrier tape, and pellets and inner leads are formed in the area of the pellets in the tape body. In a semiconductor device that is resin-sealed with a resin sealing body, the resin sealing resin is filled in a recess formed in the tape main body inside the resin sealing body, so that the resin sealing body is sealed. A filling resin portion is formed on the tape body inside the stopper.

[0011]

According to the above-mentioned means, the sealing resin supplied to the region of the concave portion is filled in the hollow portion of the concave portion during the molding operation of the resin sealing body, and the concave portion is filled with the filled resin. The filled resin portion that enhances the adhesive force to the tape body and the mechanical strength of the resin sealing body itself is formed. In other words, by filling the concave portion with the filled resin portion, a part of the resin sealing body is anchored to the tape body, so that the adhesive strength of the resin sealing body to the tape body is enhanced. Become. Also, since the mechanical strength (rigidity or flexibility) of the filled resin part is larger than that of the tape body, the filled resin part is formed in the tape body sandwiched between the intermediate parts of the resin sealing body. As a result, the filled resin portion is brought into the state of exerting the function of the reinforcing rib, and the mechanical strength (rigidity) of the resin sealing body itself is enhanced.

[0012]

1 shows a semiconductor device according to an embodiment of the present invention, in which (a) is a partial cutaway enlarged plan view and (b) is a partially cutaway enlarged plan view.
Is an enlarged partial front view. FIG. 2 is a partially omitted plan view. FIG. 3 and subsequent figures are explanatory views showing the manufacturing method.

In this embodiment, the semiconductor device according to the present invention is an IC equipped with a tape carrier type package.
(Hereinafter, simply referred to as IC). Hereinafter, the structure of this IC will be described in detail by explaining its manufacturing method.

The pellet 10 used in the IC according to this embodiment is constructed as shown in FIG.
That is, in a so-called pre-process in the IC manufacturing process, after a semiconductor integrated circuit (not shown) for driving a liquid crystal panel is built in a silicon wafer (not shown) for each pellet portion, the silicon wafer is not formed. The pellets 10 are formed into small flat plate-like pieces each having a rectangular shape in a plan view by dicing each pellet part.
One end surface of the pellet 10 (hereinafter referred to as the first main surface).
A plurality of pads 12 for taking out the semiconductor integrated circuit to the outside are provided at 11 at the outer peripheral portion of the pellet, arranged annularly at appropriate intervals so as not to interfere with each other. The bumps 13 are formed on the pads 12 formed on the first main surface 11 of the pellet 10 in a substantially hemispherical shape using a gold (Au) -based material so as to project from the first main surface 11. There is.

In this embodiment, the carrier tape 1 constituting the tape carrier type package is constructed as shown in FIG. That is, the carrier tape 1 includes the IC pellet 10 and the inner lead group as a tape.
The tape main body 2 as a carrier having an insulating property is provided so as to be mechanically and electrically connected by automated bonding (TAB). The tape body 2 is made of an insulating resin such as polyimide, and is integrally formed so that the same pattern is continuous in the longitudinal direction. However, the description and illustration are given for only one unit. Feed holes 3 used for pitch feed are formed at equal pitches on both side edges of the tape body 2 in the width direction. Further, pellet accommodating holes 4 for accommodating the pellets 10 are formed in the central portion of the tape body 2 in the width direction so as to be arranged in a single-row column with equal pitches. Each pellet accommodating hole 4 is formed in a rectangular shape slightly similar to the outer shape of the pellet 10.

A plurality of inner leads 5 for electrically drawing the integrated circuit formed on the pellet 10 to the outside are provided.
It is formed by being arranged on the four sides of the pellet accommodating hole 4 on a flat surface (hereinafter, referred to as an upper surface) on one side of the tape body 2. As the inner lead 5, a thin plate made of a conductive material such as copper foil is fixed to the upper surface of the tape body 2 by an appropriate means such as welding or bonding, and this thin plate is etched into a desired pattern by a lithographic process. It is formed by The inner leads 5 are wired such that a plurality of them are divided into four sides in the pellet accommodation hole 4,
The tips of the inner leads 5 are projected into the pellet housing holes 4, respectively. The inner leads 5 are formed so as to be electrically disconnected from each other. Further, the same number of the inner leads 5 as the pads 12 in the pellet 10 are provided, and the tips of the inner leads 5 are provided in the respective pads 1.
It is arranged so as to match each of the two.

Outer leads 6 are similarly formed on the outer sides of the inner leads 5, and are mechanically and electrically connected to each other. That is, each inner lead 5 and each outer lead 6 are connected in series. The outer end of each outer lead 6 is appropriately routed on the upper surface of the tape body 2 and is wired outside both long sides of the pellet housing hole 4. An elongated hole 7 is formed in a rectangular shape on the outside of one long side of the pellet accommodating hole 4 in the tape body 2, and the outer lead 6 wired on this side is protruded outward across the elongated hole 7. ing. An outer lead 6a group on the input side is constituted by the outer leads that cross the elongated hole 7, and the outer lead 6a group on the input side is electrically connected to a controller (not shown) for driving a liquid crystal panel. become.

The outer ends of the outer leads wired to the other side of the pellet receiving hole 4 of the tape body 2 are fixed on the tape body 2, and the outer leads 6b on the output side are provided.
Is composed. Then, the outer lead 6 on the output side
b is connected to the terminal of the liquid crystal panel (not shown). A tin-plated film (not shown) is formed on the surfaces of the inner leads 5 and the outer leads 6 to cooperate with the bumps 13 to form a connection portion described later.

In this embodiment, the tape body 2 is provided with a large number of small holes 8 as recesses for forming the filled resin portion,
It is arranged in the vicinity of the pellet accommodating hole 4 so as to have a circular hole shape penetrating in the thickness direction. That is, the group of small holes 8 is annularly arranged at equal intervals in the circumferential direction so as to surround the periphery of the pellet accommodating hole 4 in a region of the tape body 2 where a resin sealing body to be described later is formed. As will be described later, each small hole 8 is filled with potting resin in its hollow portion to form a filled resin portion that enhances the adhesive force of the resin sealing body to the tape body 2 and the strength of the resin sealing body itself. It is like this. Therefore, the small holes 8 may be replaced with notches or recesses that can be filled with resin. Further, in order to improve the filling property of the resin, it is desirable to arrange the small holes 8 so as not to overlap the inner leads 5. However, it is not necessary to completely avoid the state in which the small holes 8 overlap with the inner leads 5.

Next, a mounting operation for electrically and mechanically connecting the pellets 10 to the carrier tape 1 having the above structure will be described. When the pellet 10 is inner lead bonded to the carrier tape 1, the carrier tape 1 is stretched between sprockets (not shown) and intermittently fed in one direction as shown in FIG. 5A. . Then, in the bonding stage disposed in the stretched carrier tape 1, the pellets 10 are accommodated in the pellet accommodating holes 4 from below, and the pads 12 are aligned with the inner leads 5, respectively. The bumps 13 are thermocompression-bonded to the tips of the inner leads 5 by the bonding tool 21 to perform gang bonding. At this time, a gold-tin eutectic is formed between the tin plating film deposited on the surface of the inner leads 5 and the bumps 13 made of a gold-based material. The tip portion of the inner lead 5 is electrically and mechanically connected by the connection portion 14 including the bump 13.

Around the pellet 10 thus tape-automated-bonded and the inner lead 5 group, a resin encapsulant 15 formed by potting an insulating resin such as epoxy-phenol resin is formed on the pellet 10. The inner lead 5 group is molded with resin. That is, as shown in FIG.
The encapsulating resin 31 is supplied from above the carrier tape 1 by the potting device 32 so that the encapsulating resin 31 is evenly applied to the pellet accommodation hole 4 as a center. The potting resin 31 potted in this way goes around to the lower surface of the tape body 2 through the gap between the inner peripheral surface of the pellet housing hole 4 and the outer peripheral surface of the pellet 10, and the pellet 10 and the inner lead 5 group as a whole. As a result, the resin encapsulant 15 encapsulating the pellet 10 and the inner lead 5 group with resin is molded over the upper surface and the lower surface of the tape body 2.

When potting the resin encapsulant 15, the encapsulating resin 31 supplied to the area of the small hole 8 is filled in the hollow portion of the small hole 8, and the small hole 8 is sealed with the filled resin. The filling resin portion 9 that enhances the adhesive force of the stopper 15 to the tape body 2 and the mechanical strength of the resin sealing body 15 itself is formed. That is, when the filled resin portion 9 penetrates the small hole 8, a part of the resin sealing body 15 is anchored to the tape main body 2, so that the resin sealing body 15 is attached to the tape main body 2. The adhesive force is in an enhanced state. Further, since the mechanical strength (rigidity or flexibility) of the filled resin portion 9 is larger than that of the tape body 2, the filled resin portion is filled in the tape body 2 sandwiched in the intermediate portion of the resin sealing body 15. By the portion 9 penetrating, the filled resin portion 9 is brought into a state of exhibiting the function of the reinforcing rib, and the mechanical strength (rigidity) of the resin sealing body 15 itself is enhanced.

When the resin encapsulant 15 is molded in this way, a tape carrier type package 16 is formed. That is, the package 16 includes a resin encapsulant 15, a tape main body 2 in which the resin encapsulant 15 is molded, and a group of outer leads 6 protruding outward from the resin encapsulant 15 molded in the tape main body 2. It is composed of and.

The IC 17 on which the tape carrier type package 16 is formed is kept attached to the carrier tape 1, or is cut at a predetermined position and is separated from the carrier tape 1 individually. Is arranged at a predetermined position, and is electrically connected between the output side outer lead 6b and the panel side terminal (not shown). A controller (not shown) of the liquid crystal panel is electrically connected to the input side outer lead 6a.

According to the above embodiment, the following effects can be obtained. (1) Since the sealing resin 31 supplied to the area of the small hole 8 is filled into the hollow portion of the small hole 8 during the molding operation of the resin sealing body 15, the filled resin portion 9 is formed.
The filling resin portion 9 can enhance the adhesive force of the resin sealing body 15 to the tape body 2 and the mechanical strength of the resin sealing body 15 itself. As a result, the moisture resistance of the tape carrier type package 16 can be improved.

(2) Due to the above (1), the quality and reliability of the IC 17 having the tape carrier type package 16 can be improved and the IC 17 can be improved.
It is possible to further promote high integration and downsizing.

(3) By promoting the high integration and downsizing of the IC 17 having the tape carrier type package 16 which is thin and can be mounted with good workability, this is for driving a liquid crystal panel. When it is used as an IC, the size of a liquid crystal panel can be promoted.

(4) By forming the concave portion by a group of circular small holes 8 penetrating the tape body 2, the small holes 8 are formed.
Since the filled resin portion 9 filled in the tape penetrates the tape body 2 and is anchored, the anchoring effect is extremely high, and the adhesive force of the resin sealing body 15 to the tape body 2 can be further enhanced. Therefore, the moisture resistance of the tape carrier type package 16 can be further enhanced.

(5) By arranging the small holes 8 as concave portions so as to surround the periphery of the pellet 10 in the tape main body 2, the resin encapsulant 15 is formed on the entire circumference of the pellet 10 by the filled resin portion 9 group. Since the adhesive strength of the tape carrier 2 to the tape body 2 and the mechanical strength of the resin sealing body 15 itself can be uniformly increased, the moisture resistance performance of the tape carrier type package 16 can be further and uniformly increased. .

Although the invention made by the present inventor has been specifically described based on the embodiments, the invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the concave portion for forming the filling resin portion for enhancing the adhesive force of the resin encapsulation body to the tape body and the mechanical strength of the resin encapsulation body itself is not limited to the small hole, and the tape body is not limited thereto. It is possible to configure by the notch portion, the depression, and the minute concave portion group which can be filled with the resin formed in the above.

In order to improve the filling property of the sealing resin into the hollow portion, it is desirable to arrange the recess for forming the resin-filled portion so as not to overlap each inner lead. However, it is not necessary to completely avoid the state where the recess for forming the resin-filled portion overlaps each inner lead.

Further, it is desirable to appropriately set the arrangement, size and the like of the filled resin portion depending on the necessity of increasing the adhesive force of the resin sealing body to the tape body and the strength of the resin sealing body itself. At that time, the filled resin portion is not limited to be uniformly arranged as a whole, but may be partially or intensively arranged.

The bump for bonding the pad and the inner lead is not limited to be provided on the pad side, but may be provided on the inner lead side. Further, the bump is not limited to be formed of a gold-based material, but may be formed of a material such as a solder material that can electrically and mechanically connect the pad and the inner lead.

In the above description, the invention made by the present inventor was mainly applied to a tape carrier type IC for driving a liquid crystal panel, which is the field of application which was the background of the invention, but the invention is not limited thereto. TAB type tape carrier type I without support ring
It can be applied to all semiconductor devices including a tape carrier type package such as C.

[0036]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

By forming a filling resin portion in which the resin of the resin sealing body is filled in the tape body inside the resin sealing body, the adhesive force of the resin sealing body to the tape body and the resin sealing by the filling resin portion. Since the mechanical strength of the stopper itself can be enhanced, the moisture resistance performance of the tape carrier type package can be enhanced.

[Brief description of drawings]

1A and 1B show a semiconductor device according to an embodiment of the present invention, where FIG. 1A is a partially cutaway enlarged partial plan view, and FIG. 1B is an enlarged partial front view.

FIG. 2 is a partially omitted plan view.

FIG. 3 shows a pellet, (a) is a plan view,
(B) is a front sectional view.

FIG. 4 shows a carrier tape, (a) is a partially omitted plan view, and (b) is a sectional view taken along line bb of (a).

FIG. 5 shows a manufacturing process, (a) is a vertical sectional view showing an inner lead bonding step, and (b) is a vertical sectional view showing a packaging step.

[Explanation of symbols]

1 ... Carrier tape, 2 ... Tape body, 3 ... Feed hole, 4
... Pellet receiving hole, 5 ... Inner lead, 6 ... Outer lead, 7 ... Long hole, 8 ... Small hole (recess filled with resin), 9
... Filled resin portion, 10 ... Pellet, 11 ... First main surface, 12
... pads, 13 ... bumps, 14 ... connection parts, 15 ... resin encapsulant, 16 ... tape carrier type package, 17 ... IC (semiconductor device) equipped with tape carrier type package, 21 ... bonding tool, 31 ... Sealing resin, 3
2 ... Potting device.

Claims (3)

[Claims] 1. A plurality of pads for taking out the electronic circuit to the outside are formed on a first main surface of a semiconductor pellet in which the electronic circuit is formed, and on the other hand, an inner lead and a tape are formed on a tape body of a carrier tape. Outer leads are formed, each pad and each inner lead are gang-bonded and the pellets are electrically and mechanically connected to the carrier tape, and pellets and inner leads are formed in the area of the pellets in the tape body. In a semiconductor device that is resin-sealed with a resin sealing body, a resin forming the resin sealing body is filled in a recess formed in the tape body inside the resin sealing body, A semiconductor device, wherein a filling resin portion is formed on a tape body inside the stopper. 2. The recess is formed so as to penetrate the tape body, and the filled resin portion filled in the recess is anchored while penetrating the tape body. The semiconductor device described. 3. The recess is provided in the tape body so as to surround the periphery of the pellet.
Alternatively, the semiconductor device according to claim 2.