JPH08265003A - Resonator and filter - Google Patents

Abstract

PURPOSE: To obtain the resonator and the filter with a high Q and a low insertion loss. CONSTITUTION: A resonator 20 includes a laminate 22 comprising plural dielectric layers 22a-22f. Three thin rectangular throughholes 38a-38c are made to the 1st dielectric layer 22a, on which the 2nd dielectric layer 22b with L-shaped throughholes 38d, 38e made to them are laminated. A conductive material such as conductor paste is filled in the throughholes 38a-38d and line electrodes 24a-24e forming an inductor L are formed in them. The 3rd dielectric layer 22c having a capacitor electrode 28a is laminated on an upper side of the 2nd dielectric layer 22b, and the 4th dielectric layer 22d with other capacitor electrode 28b is laminated to the upper side of the 3rd dielectric layer. A capacitor C is made up of the capacitor electrodes 28a, 28b. The capacitor electrode 28a(28b) is connected to the line electrode 24d(24e) via connection electrodes 32a1, 32a2 (32b).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resonator and a filter, and more particularly to a resonator and a filter used in, for example, a portable radio device.

[0002]

2. Description of the Related Art FIG. 19 is an exploded front view showing an example of a conventional resonator which is a background of the present invention, and FIG. 20 is a sectional view showing a main part thereof. The resonator 1 shown in FIGS. 19 and 20 includes a first dielectric layer 2a. A strip-shaped pattern electrode 3 is formed on one main surface of the first dielectric layer 2a. Further, a second dielectric layer 2b is formed on one main surface of the first dielectric layer 2a so as to cover the pattern electrode 3. A first ground electrode 4a is formed on the second dielectric layer 2b so as to face the pattern electrode 3. A first ground electrode 4 is formed on the second dielectric layer 2b.
A fourth dielectric layer 2d is formed so as to cover a. A second ground electrode 4b is formed on the other main surface of the first dielectric layer 2a so as to face the pattern electrode 3. Further, a third dielectric layer 2c is formed on the other main surface of the first dielectric layer 2a so as to cover the second ground electrode 4b. The first and second dielectric layers 2a and 2b, the pattern electrode 3, and the first and second ground electrodes 4a and 4b form a stripline.

The resonator 1 shown in FIGS. 19 and 20 has a ceramic green sheet on one main surface of which a conductor paste serving as a pattern electrode is printed in a thick film, or a conductor paste serving as an earth electrode on one main surface of a thick film. It is formed by stacking another ceramic green sheet or a ceramic green sheet on which no conductor paste is formed, pressing them and firing them.

FIG. 21 is a perspective view showing an example of a conventional filter which is the background of the present invention, and FIG. 22 is an exploded perspective view thereof. This filter 10 has a first dielectric layer 11a.
including. On one main surface of the first dielectric layer 11a, two strip-shaped pattern electrodes 12a and 12b are formed in parallel with each other. These pattern electrodes 12a and 12b are electromagnetically coupled. Further, a second dielectric layer 11b is formed on one main surface of the first dielectric layer 11a so as to cover the pattern electrodes 12a and 12b. Two capacitor electrodes 13a and 13b are formed on the second dielectric layer 11b. Further, a third dielectric layer 11c is formed on the second dielectric layer 11b so as to cover the capacitor electrodes 13a and 13b. Two capacitor electrodes 13c and 13d are formed on the third dielectric layer 11c so as to face the two capacitor electrodes 13a and 13b.
Further, a fourth dielectric layer 11d is formed on the third dielectric layer 11c so as to cover the capacitor electrodes 13c and 13d. The first ground electrode 14a is formed on the fourth dielectric layer 11d. A seventh dielectric layer 11g is formed on the fourth dielectric layer 11d so as to cover the first ground electrode 14a. Further, two capacitor electrodes 13e and 13f are formed on the other main surface of the first dielectric layer 11a. Further, the capacitor electrode 13e is formed on the other main surface of the first dielectric layer 11a.
And 13f so as to cover the fifth dielectric layer 11e
Is formed. A second ground electrode 14b is formed below the fifth dielectric layer 11e so as to face the two capacitor electrodes 13e and 13f. Further, a sixth dielectric layer 11f is formed below the fifth dielectric layer 11e so as to cover the second ground electrode 14b.

Six external electrodes 15a to 15f are formed on the side surfaces of the first to seventh dielectric layers 11a to 11g.
The external electrodes 15a and 15d are the capacitor electrodes 13c.
And 13d, respectively. These external electrodes 15a and 15d are respectively used as input / output terminals. The external electrode 15b is connected to one end of the pattern electrode 12a and the capacitor electrodes 13a and 13e.
The external electrode 15c is connected to one end of the pattern electrode 12b and the capacitor electrodes 13b and 13f. External electrode 1
5e and 15f are the first and second ground electrodes 14
a and 14b. These external electrodes 15e
And 15f are used as ground terminals, respectively.

In the filter 10 shown in FIGS. 21 and 22, the first to fourth dielectric layers 11a to 11d,
The pattern electrode 12a and the first and second ground electrodes 1
A resonator composed of a strip line is formed by 4a and 14b, and the first to fourth dielectric layers 11a to 11d are formed.
The pattern electrode 12b and the first and second ground electrodes 1
A resonator composed of another strip line is formed with 4a and 14b. In this case, since the pattern electrodes 12a and 12b are electromagnetically coupled, the two resonators are also electromagnetically coupled. Furthermore, this filter 10
Then, between the capacitor electrodes 13a and 13c, between the capacitor electrodes 13b and 13d, between the capacitor electrode 13e and the second ground electrode 14b, and between the capacitor electrode 13f and the second ground electrode 14b,
A capacitor is formed in each case. Therefore, this filter 10 has the equivalent circuit shown in FIG.

The filter 10 shown in FIGS. 21 and 22.
Is a ceramic green sheet with a thick film printed conductor paste to be a pattern electrode on one main surface, another ceramic green sheet with a thick film printed conductor paste to be a capacitor electrode on one main surface, and a ground electrode on one main surface. It is formed by stacking yet another ceramic green sheet on which the conductor paste is formed into a thick film, or a ceramic green sheet on which the conductor paste is not formed, and pressing and firing them.

[0008]

However, in the resonator 1 shown in FIGS. 19 and 20, since the pattern electrode 3 serving as an inductor is formed by thick film printing or the like, the thickness t of the pattern electrode 3 (see FIG. 20). Is several μm to 10 μm
Only to the extent. Therefore, the direct current resistance is high, the resistance component at high frequencies is large, and the Q characteristic of the resonator 1 is poor. That is, in the resonator 1, the resistance component and the conductor loss in the pattern electrode 3 are large, and the Q is small. Further, since the pattern electrode is formed by thick film printing, there is a variation in the film thickness of the electrode film, which may make it difficult to make the inductance value constant.

Similarly, also in the filter 10 shown in FIGS. 21 and 22, since the pattern electrodes 12a and 12b serving as inductors are formed by thick film printing or the like, the thickness of each of the pattern electrodes 12a and 12b is several μm. Only about 10 μm. Therefore, in this filter 10, the pattern electrodes 12a and 12b are
, The resistance loss and the conductor loss are large, the Q of each resonator is small, and the insertion loss is large. In this case, since the resistance component of the inductor in the conventional filter is large, there are many filters that can be commercialized, for example, only two-stage products with Q = 30 or less.

Further, since the pattern electrode is formed by thick film printing, the variation in the film thickness of the electrode film is relatively large,
Therefore, there is a fear that the inductance value is difficult to stabilize. Therefore, it is necessary to adjust the characteristics of the filter, for example, by trimming the capacitor.

Further, when a conventional filter having a pattern electrode serving as an inductor formed by thick film printing or the like as the filter 10 shown in FIGS. 21 and 22 is made to function as a band pass filter (BPF), the band thereof is reduced. In the pass filter (BPF), since the insertion loss in the pass band becomes large, it is necessary to improve it. In this case, the Q characteristic of the bandpass filter (BPF) can be improved to some extent depending on the number of stages of the filter, but the insertion loss increases as the number of stages increases.

Therefore, the main object of the present invention is to
To provide a resonator and a filter having a large insertion loss and a large insertion loss.

[0013]

A resonator according to the present invention includes a laminated body including a plurality of dielectric layers, a line electrode formed on at least one dielectric layer in the laminated body to serve as an inductor, and a laminated body. And forming a hole corresponding to the line electrode in at least one dielectric layer in the stack, and applying a conductor to the hole. It is a resonator formed.

Further, in the resonator according to the present invention, a hole corresponding to the line electrode may be formed in the laminated body, and the dielectric layer for applying a conductor to the hole may be formed of a magnetic layer.

Further, the filter according to the present invention includes a laminated body including a plurality of dielectric layers, and at least one of the laminated bodies.
The line electrode includes a plurality of line electrodes formed on one dielectric layer to serve as an inductor, and a plurality of capacitors formed in the laminate and electrically connected to the inductor.
It is a filter formed by forming holes corresponding to line electrodes in at least one dielectric layer in a laminate and applying a conductor to the holes.

Further, in the filter according to the present invention, a hole corresponding to the line electrode may be formed in the laminated body, and the dielectric layer for giving a conductor to the hole may be formed of a magnetic layer.

[0017]

The line electrode to be an inductor is formed by forming a hole in a ceramic green sheet made of a dielectric material or a magnetic material and applying a conductor to the hole. As compared with the case where the electrode serving as the inductor is formed by using the method described above, the film thickness of the line electrode serving as the inductor is increased, and the variation in the film thickness is small. Therefore, the cross-sectional area of the line electrode increases and the resistance component of the line electrode decreases. That is, the flow path of the current is increased in the line electrode, and the resistance component and the conductor loss of the line electrode are reduced. Further, the variation in thickness is smaller than that of the conventional resonator and filter in which the electrode serving as the inductor is formed by thick film printing or the like. for that reason,
Variation in inductance value is reduced.

[0018]

According to the present invention, since the resistance component in the line electrode serving as an inductor can be reduced, a resonator and a filter having a large Q and a small insertion loss can be obtained.
Moreover, the variation in the inductor value is smaller than that in the conventional resonator and filter in which the electrode serving as the inductor is formed by thick film printing or the like, so that the trimming process can be reduced.

The above-mentioned objects, other objects, features and advantages of the present invention will become more apparent from the detailed description of the following embodiments with reference to the drawings.

[0020]

1 is a perspective view showing an example of a resonator as an embodiment of the present invention, and FIG. 2 is an exploded perspective view showing a main part thereof.

This resonator 20 has a rectangular parallelepiped laminated body 22.
including. The laminated body 22 includes, for example, a rectangular first dielectric layer 22a made of a ceramic layer. On the first dielectric layer 22a, two line electrodes 24a and 24b having, for example, a rectangular cross section and a rod shape are formed at intervals in the longitudinal direction thereof. The two line electrodes 24a and 24b are
The first dielectric layer 22a is formed at the central portion in the longitudinal direction of the first dielectric layer 22a in parallel from one end in the width direction thereof to the center thereof with a gap. The two line electrodes 24a and 24b have a first
Is formed from one end to the other end of the dielectric layer 22a in the thickness direction. The two line electrodes 24a and 24b are formed so that their thicknesses are substantially the same as the thickness of the first dielectric layer 22a. Therefore, the two line electrodes 24
The upper end and the lower end of the a and 24b in the thickness direction are exposed at the one main surface (upper surface) and the other main surface (lower surface) of the first dielectric layer 22a, respectively. Further, one end of each of the two line electrodes 24a and 24b in the longitudinal direction is exposed at one side surface in the width direction of the first dielectric layer 22a.

Further, the first dielectric layer 22a is separated from the two line electrodes 24a and 24b by a distance from the other line electrodes 24a and 24b.
One line electrode 24c is formed. This line electrode 2
4c is formed in an elongated rod shape with a rectangular cross section, and is formed longer than the line electrodes 24a and 24b. In this case, two line electrodes 24a and 24b and one line electrode 24c
And are formed at intervals in the width direction of the first dielectric layer 22a. The line electrode 24c is the first dielectric layer 22a.
Is formed so as to extend in the longitudinal direction. The line electrode 24c is
It is formed inside both ends of the first dielectric layer 22a in the longitudinal direction. The line electrode 24c is formed from one end to the other end of the first dielectric layer 22a in the thickness direction. The thickness of the line electrode 24c is formed to be substantially the same as the thickness of the first dielectric layer 22a, like the two line electrodes 24a and 24b. Therefore, the upper end and the lower end of the line electrode 24c in the thickness direction are respectively formed in the first dielectric layer 2
2a is exposed on one main surface (upper surface) and the other main surface (lower surface).

One main surface (upper surface) of the first dielectric layer 22a
A second dielectric layer 22b made of a ceramic layer is formed so as to cover the upper surfaces of the line electrodes 24a, 24b and 24c.

The second dielectric layer 22b has another two layers.
Two line electrodes 24d and 24e are formed. Each of the two line electrodes 24d and 24e is formed to have a rectangular cross section and an L shape in a plane, and the thickness thereof is formed to be substantially the same as that of the second dielectric layer 22b. Therefore, the upper end portion and the lower end portion of the line electrodes 24d and 24e in the thickness direction are exposed at the one main surface (upper surface) and the other main surface (lower surface) of the second dielectric layer 22b, respectively. The one line electrode 24d and the other line electrode 24e are arranged in line symmetry when the portion extending from one end to the other end of the second dielectric layer 22b in the longitudinal direction and extending from one end to the other end of the second dielectric layer 22b is the symmetry axis. It The two line electrodes 24d and 24e are
The second dielectric layer 22b is formed inside both ends in the longitudinal direction and the width direction, respectively.

In this case, one line electrode 24d has one end thereof opposed to the other end of the line electrode 24a in the longitudinal direction, and the other end opposed to one end of the line electrode 24c in the longitudinal direction. And is formed on the second dielectric layer 22b. Further, the other line electrode 24e is arranged so that one end thereof faces the other end of the line electrode 24b in the longitudinal direction and the other end faces the other end of the line electrode 24c in the longitudinal direction. The second dielectric layer 22b is formed.

Therefore, when the second dielectric layer 22b is laminated on the first dielectric layer 22a, the line electrode 24
The other end of a and the one end of the line electrode 24d are in surface contact with each other,
The other end of the line electrode 24d and the one end of the line electrode 24c are in surface contact with each other. Further, the other end of the line electrode 24b and one end of the line electrode 24e are in surface contact, and the other end of the line electrode 24e and the other end of the line electrode 24c are in surface contact. These line electrodes 24a, 24b, 24c,
An inductor is formed by 24d and 24e.

On the second dielectric layer 22b, the upper surfaces of the two line electrodes 24d and 24e are covered,
A third dielectric layer 22c made of a ceramic layer is formed.

In the third dielectric layer 22c, two via holes 26a and 26b penetrating from one main surface to the other main surface are formed. One via hole 26a is formed at a position corresponding to one end of the line electrode 24d. The other via hole 26b is formed at a position corresponding to one end of the line electrode 24e.

Further, on the upper surface of the third dielectric layer 22c,
A planar capacitor electrode 28a is formed except for the periphery of the via hole 26a. In this case, the capacitor electrode 28
The a is formed so as to face the upper surfaces (planar portions) of the line electrodes 24d and 24e.

Further, on the third dielectric layer 22c,
A fourth dielectric layer 22d made of a ceramic layer is formed so as to cover the upper surface (planar portion) of the capacitor electrode 28a.

In the fourth dielectric layer 22d, one via hole 30a penetrating from one main surface to the other main surface is formed. The via hole 30a is formed at a position corresponding to the via hole 26a. In addition, the fourth dielectric layer 22
Another planar capacitor electrode 28b is formed on d so as to face the upper surface (planar portion) of the capacitor electrode 28a.

Connection electrodes 32a1 and 32a2 are formed inside the via holes 26a and 30a, respectively. In this case, one end of the connection electrode 32a1 is connected to one end of the line electrode 24d, and the other end thereof is connected to the substantially central portion of the capacitor electrode 28b via the connection electrode 32a2. A connection electrode 32b is formed inside the via hole 26b. One end of the connection electrode 32b is connected to one end of the line electrode 24e, and the other end thereof is connected to a substantially central portion of the capacitor electrode 28a.

Further, on the fourth dielectric layer 22d,
As the protective layer, a fifth dielectric layer 22e made of a ceramic layer is formed so as to cover the upper surface (planar portion) of the capacitor electrode 28b.

On the other hand, on the other main surface (lower surface) of the first dielectric layer 22a, line electrodes 24a, 24 are provided as protective layers.
A sixth dielectric layer 22f made of a ceramic layer is formed so as to cover the lower surfaces of b and 24c.

On the two lateral sides of the laminated body 22, 4
Two external electrodes 34a, 34b, 34c and 34d are formed. In this case, two external electrodes 34a and 34b are formed on one side surface of the stacked body 22 in the width direction, and two external electrodes 34c and 34d are formed on the other side surface of the stacked body 22 in the width direction. The external electrode 34a is connected to one end of the line electrode 24a, and the external electrode 34b is connected to one end of the line electrode 24b. The external electrode 34a is used as an input terminal, and the external electrode 34b is used as an output terminal. The external electrodes 34c and 34d are used as dummy electrodes and are not connected to other electrodes.

In this resonator 20, the line electrodes 24a,
An inductor L is formed by 24b, 24c, 24d and 24e, and a capacitor C is formed between the two capacitor electrodes 28a and 28b. Therefore, this resonator 20 has the equivalent circuit shown in FIG.

Next, an example of a method of manufacturing the resonator 20 will be described in detail with reference to FIG.

First, a ceramic green sheet 36a to be the first dielectric layer 22a is prepared. As shown in FIG. 4A, rectangular holes 38a, 38b and 38c corresponding to the line electrodes 24a, 24b and 24c are formed in the ceramic green sheet 36a, respectively. The holes 38a, 38b and 38c are formed by, for example, punching so as to penetrate from one main surface of the ceramic green sheet 36a to the other main surface. Hole 38
As shown in FIG. 4C, conductor layers 40a, 40b, 40c are formed inside a, 38b, and 38c, for example, by being filled with a conductor paste.

In this case, the holes 38a and 38b are formed centrally in the longitudinal direction of the ceramic green sheet 36a, extending from the position spaced apart from one end in the width direction thereof to the center, and are spaced apart from each other and are parallel to each other. It Further, a hole 38c is formed in the ceramic green sheet 36a at a distance from the two holes 38a and 38b. Two
The three holes 38a, 38b and 38c are formed at intervals in the width direction of the ceramic green sheet 36a. The hole 38c is formed so as to extend in the longitudinal direction of the ceramic green sheet 36a, and is formed longer than the holes 38a and 38b.

Also, as shown in FIG. 4B, a ceramic green sheet 36f to be the sixth dielectric layer 22f is prepared.

Then, the ceramic green sheet 36a
As shown in FIGS. 4 (A), 4 (B) and 4 (F), a ceramic green sheet 36f is laminated underneath so as to cover the holes 38a, 38b and 38c.

Further, a ceramic green sheet 36b to be the second dielectric layer 22b is prepared. As shown in FIG. 4D, holes 38d corresponding to the line electrodes 24d and 24e are formed in the ceramic green sheet 36b.
And 38e are formed respectively. Those holes 38d
And 38e are formed by, for example, punching so as to penetrate from one main surface to the other main surface of ceramic green sheet 36b. Inside the holes 38d and 38e,
As shown in FIG. 4E, the conductor layers 40d and 40e are formed by filling a conductor paste, for example. The holes 38d and 38e are each formed in a rectangular cross-section and in a plane L shape. One hole 38d
And the hole 38e on the other side is the ceramic green sheet 36.
When a portion extending from one end to the other end in the width direction of the center of b in the longitudinal direction is defined as an axis of symmetry, it is formed in line symmetry.

In this case, one hole 38d is made of ceramic so that one end thereof faces the other end of the hole 38a in the longitudinal direction and the other end faces one end of the hole 38c in the longitudinal direction. It is formed on the green sheet 36b. The other end of the hole 38e is opposed to the other end of the hole 38b in the longitudinal direction of the hole 38b, and the other end of the hole 38e is opposed to the other end of the hole 38c in the longitudinal direction.
6b is formed.

Then, the ceramic green sheet 36a
As shown in FIGS. 4D and 4F, a ceramic green sheet 36b is laminated on the above.

Further, a ceramic green sheet 36c to be the third dielectric layer 22c is prepared. As shown in FIG. 4 (F), two via holes 26a and 26b are formed in the ceramic green sheet 36c at a central portion thereof with a space in the longitudinal direction. Beer hall 2
The insides of 6a and 26b are filled with a conductor paste to be the connection electrodes 32a1 and 32b to form connection conductors 44a1 and 44b, respectively. Further, on the ceramic green sheet 36c, except for the periphery of the via hole 26a, a thick film of a conductor paste or the like is printed, so that the capacitor electrode 28
A conductor layer 42a to be a is formed.

Then, the ceramic green sheet 36c
Is laminated on the ceramic green sheet 36b so that the conductor layer 42a faces upward, as shown in FIG. 4 (F).

A ceramic green sheet 36d to be the fourth dielectric layer 22d is prepared. As shown in FIG. 4F, one via hole 30a is formed in the ceramic green sheet 36d. The via hole 30a is formed at a position corresponding to the via hole 26a. By filling the inside of the via hole 30a with a conductive paste, the connection conductor 4 becomes the connection electrode 32a2.
4a2 is formed. Furthermore, another conductor layer 42b to be another capacitor electrode 28b is formed on the ceramic green sheet 36d by thick-film printing of another conductor paste. In this case, the connecting conductor 44
One end of a2 is connected to the connecting conductor 44a1 and the other end thereof is connected to the conductor layer 42b.

Then, the ceramic green sheet 36d
Is laminated on the ceramic green sheet 36c with the conductor layer 42b facing upward, as shown in FIG. 4 (F). In this case, the conductor layer 40d is the connection conductor 44a.
1 and 44a2, and is connected to the conductor layer 42b. In addition, the conductor layer 44e, via the connection conductor 44b,
It is connected to the conductor layer 42a.

Further, a ceramic green sheet 36e to be the fifth dielectric layer 22e is prepared. This ceramic green sheet 36e, as shown in FIG.
It is laminated on the ceramic green sheet 36d so as to cover the conductor layer 42b.

The laminated body 22 such as the ceramic green sheets 36a to 36f is shown in FIG.
One end in the longitudinal direction of the conductor layers 40a and 40b, which are cut at a portion connecting the longitudinally intermediate portions of the holes 38a and 38b indicated by the dotted chain line H-H and become the line electrodes 24a and 24b, have the width of the ceramic green sheet 36a. Exposed on one side of the direction. The exposure of the one end portions of the conductor layers 40a and 40b may be performed after the subsequent firing of the laminated body.

Then, by firing the laminated body, the first to sixth dielectric layers 22a to 22f, the line electrodes 24a to 24e, and the capacitor electrodes 28a and 28 are formed.
b, the connection electrodes 32a and 32b are formed.

Then, the first to sixth dielectric layers 22a ...
External electrodes 34a to 34d are formed on the side surface of 22f by baking an electrode material such as silver,
The resonator 20 is manufactured.

In this resonator 20, the line electrodes 24a, 24b, 24c and the line electrodes 24d, 24e forming the inductor L are formed to have substantially the same thickness as the ceramic green sheets 36a and 36b, respectively. The cross-sectional area of the line electrode is increased as compared with the resonator 1 of the conventional example shown in FIGS. for that reason,
The resistance component and conductor loss of the line electrode are reduced. In this embodiment, the thickness of the line electrodes 24a to 24e is several tens of μm.
To about several hundreds of μm.

The widths, lengths and thicknesses of the line electrodes 24a to 24e are defined by the widths and lengths of the holes 38a to 38e provided in the ceramic green sheets 36a and 36b and the thicknesses of the ceramic green sheets 36a and 36b. . Therefore, compared to the conventional resonator 1, variations in the shape and thickness of the inductor pattern can be reduced, and a predetermined inductance value can be obtained. In this case, the variation of the inductance value can be suppressed to ± 2% or less and reduced. Therefore, the variation of the resonance frequency of the resonator 20 also becomes small.

That is, in this resonator 20, the cross-sectional area of the line electrode is larger than that of the conventional resonator 1 shown in FIGS. The resistance component and conductor loss in the electrodes are reduced.

Therefore, the resonator 20 of this embodiment has a Q value larger than that of the resonator 1 of the conventional example shown in FIGS. 19 and 20.
Becomes larger and the insertion loss becomes smaller.

Further, the opposing capacitor electrodes 28a and 28b have connection electrodes 32a1 and 3 at substantially the center thereof.
2a2 and 32b connect to the ends of the line electrodes 24d and 24e inside the stack. Therefore, in this resonator 20, the inductance component of the capacitor C is reduced and the frequency characteristic of the capacitor C is improved.
In the capacitor C, the ends of the opposing capacitor electrodes may be connected to the line electrode serving as the inductor L, which is a connection electrode formed inside the via hole.

Therefore, this resonator 20 has a better Q characteristic than the conventional resonator 1 shown in FIGS. 19 and 20. In this embodiment, for example, as shown in FIG. 5, compared with the conventional resonator 1 shown in FIGS. 19 and 20, the amount of attenuation is increased by about 5.8 dB and the Q characteristic is improved.

The dielectric layer in the above embodiment is
Other insulating layers or magnetic layers may be used. Further, by forming another element inside the resonator 20 or mounting a component on the surface, a device such as a module having a resonator can be formed.

FIG. 6 is a perspective view showing an example of a filter as another embodiment of the present invention, FIG. 7 is an exploded perspective view showing a main part thereof, and FIG. 8 is an equivalent circuit diagram thereof. In this embodiment, a filter used as an LC type bandpass filter will be described.

The filter 50 is a rectangular parallelepiped laminated body 5.
2 inclusive. The laminated body 52 includes, for example, a rectangular first dielectric layer 52a made of a ceramic layer. On the first dielectric layer 52a, two line electrodes 54a and 54b having a rectangular cross section and elongated rod shapes are formed at intervals in the longitudinal direction. Two line electrodes 54a and 5
4b is formed on one end side in the width direction of the first dielectric layer 52a and extends in the longitudinal direction thereof. The line electrodes 54a and 54b are formed inside both ends in the longitudinal direction and the width direction of the first dielectric layer 52a.

The two line electrodes 54a and 54b are
It is formed from one end to the other end of the first dielectric layer 52a in the thickness direction. Each of the line electrodes 54a and 54b is formed so that its thickness is substantially the same as the thickness of the first dielectric layer 52a. Therefore, the upper end portion and the lower end portion in the thickness direction of the line electrode 54a are exposed at the one main surface (upper surface) and the other main surface (lower surface) of the first dielectric layer 52a, respectively. Similarly, the upper end portion and the lower end portion of the line electrode 54b in the thickness direction respectively have the first dielectric layer 52a.
It is exposed on one main surface (upper surface) and the other main surface (lower surface).

On one main surface of the first dielectric layer 52a, a second dielectric layer 52b made of a ceramic layer is formed so as to cover the upper surface portions of the line electrodes 54a and 54b.

In the second dielectric layer 52b, four via holes 58a, 58 are provided at intervals in the longitudinal direction.
b, 58c and 58d are formed. One via hole 58a is formed at a position corresponding to one end of the line electrode 54a in the longitudinal direction, and one via hole 58b is formed at a position corresponding to the other end of the line electrode 54a in the longitudinal direction. One via hole 58c is used for the line electrode 54.
The via hole 58d is formed at a position corresponding to one longitudinal end of the line b, and one via hole 58d is formed at a position corresponding to the other longitudinal end of the line electrode 54b. Beer hole 58
Connection electrodes 63a1, 63b, 63c and 63d1 are provided inside a, 58b, 58c and 58d, respectively.
Is formed.

A capacitor electrode 60a is formed on the second dielectric layer 52b. The capacitor electrode 60a is formed except for the periphery of the via holes 58a and 58d.

Further, on the second dielectric layer 52b,
A third dielectric layer 52c made of a ceramic layer is formed so as to cover the planar capacitor electrode 60a.

In the third dielectric layer 52c, the via hole 6 is formed at a position corresponding to the via holes 58a and 58d.
2a and 62d are formed. Connection electrodes 63a2 and 63d2 are formed inside the via holes 62a and 62d, respectively.

On the third dielectric layer 52c, the other two planar capacitor electrodes 60b are spaced apart in the longitudinal direction so as to face the capacitor electrodes 60a.
And 60c are formed.

In this case, one end of the line electrode 54a in the longitudinal direction is connected to the capacitor electrode 60b via the connection electrodes 63a1 and 63a2, and the other end is connected to the capacitor electrode 60a via the connection electrode 63b. . Further, one end of the line electrode 54b in the longitudinal direction is connected to the capacitor electrode 60c via the connection electrodes 63d1 and 63d2, and the other end is connected to the capacitor electrode 60a via the connection electrode 63c.

On the third dielectric layer 52c, a fourth dielectric layer 52d as a protective layer is formed so as to cover the two capacitor electrodes 60b and 60c.

On the other hand, a fifth dielectric layer 52e is formed on the other main surface (lower surface) of the first dielectric layer 52a so as to cover the lower surfaces of the line electrodes 54a and 54b.

On the fifth dielectric layer 52e, two line electrodes 64a and 64b having a rectangular cross section and having a rod shape, for example, are formed in parallel with each other in the longitudinal direction at intervals. The two line electrodes 64a and 64b are connected to the fifth dielectric layer 52.
It extends in the width direction of e and is formed shorter than the length of the line electrodes 54a and 54b. Line electrodes 64a and 6
4b is formed inside both ends in the longitudinal direction and the width direction of the fifth dielectric layer 52e.

In this case, one end of the line electrode 64a in the longitudinal direction is formed so as to face one end of the line electrode 54a in the longitudinal direction, and one end of the line electrode 64b in the longitudinal direction is formed in the longitudinal direction of the line electrode 54b. It is formed so as to face one end. That is, the run-in electrodes 54a and 64a
And are arranged in an L shape when viewed two-dimensionally. Similarly, the run-in electrodes 54b and 64b are
It is arranged in an L shape. Further, the line electrodes 54a, 64
a and 54b, 64b are line-symmetrical with respect to the center of the first dielectric layer 52a and the fifth dielectric layer 52e in the longitudinal direction and the portion extending from one end to the other end in the width direction as the axis of symmetry. Will be placed.

The two line electrodes 64a and 64b are
It is formed from one end to the other end in the thickness direction of the fifth dielectric layer 52e. Two line electrodes 64a and 64b
Is formed to have a thickness substantially the same as the thickness of the fifth dielectric layer 52e. Therefore, the line electrode 64
The upper end and the lower end in the thickness direction of a are respectively the fifth
The dielectric layer 52e is exposed at one main surface (upper surface) and the other main surface (lower surface) of Similarly, the upper end portion and the lower end portion of the line electrode 64b in the thickness direction are exposed at the one main surface (upper surface) and the other main surface (lower surface) of the fifth dielectric layer 52e, respectively.

Below the fifth dielectric layer 52e, a sixth dielectric layer 52f made of a ceramic layer is formed so as to cover the lower surface portions of the line electrodes 64a and 64b.
In addition, four via holes 6 are formed in the sixth dielectric layer 52f.
8a, 68b, 68c and 68d are formed. In this case, the via hole 68a is formed at a position corresponding to one end of the line electrode 64a in the longitudinal direction.
b is formed at a position corresponding to the via holes 58a and 62a. Further, the via hole 68c is provided with the line electrode 64b.
The via hole 68d is formed at a position corresponding to one longitudinal end of the via hole 68d, and the via hole 68d is formed at a position corresponding to the via holes 58d and 62d. Also, four via holes 68a, 68
Connection electrodes 75a1, 75b1, 75c1 and 75d1 are formed inside b, 68c and 68d, respectively.

Still another planar capacitor electrode 72a is formed under the sixth dielectric layer 52f. The capacitor electrode 72a has via holes 70b and 70d described later.
Is formed excluding the peripheral portion. Further, a seventh dielectric layer 52g made of a ceramic layer is formed below the sixth dielectric layer 52f so as to cover the capacitor electrode 72a.

Four via holes 70a, 70b, 70c and 70d are formed in the seventh dielectric layer 52g. In this case, two via holes 70a and 70b
Are formed at positions corresponding to the via holes 68a and 68b, respectively, and the other two via holes 70c and 70d are formed at positions corresponding to the via holes 68c and 68d, respectively. Also, four via holes 7
0a, 70b, 70c and 70d have connection electrodes 75a2, 75b2, 75c2 and 75, respectively.
d2 is formed.

Under the seventh dielectric layer 52g, another two rectangular surface-shaped capacitor electrodes 72b and 72c are formed at intervals in the longitudinal direction. The two capacitor electrodes 72b and 72c sandwich the seventh dielectric layer 52g and the capacitor electrode 72 on the seventh dielectric layer 52g.
It is formed so as to face a. Capacitor electrode 7
2b and capacitor electrode 72c are formed except for the peripheral portions of via holes 74a and 74c, which will be described later, respectively.

Below the seventh dielectric layer 52g, 2
An eighth dielectric layer 52h made of a ceramic layer is formed so as to cover the two capacitor electrodes 72b and 72c. The via hole 70a is formed in the eighth dielectric layer 52h.
Via holes 74a and 74c are formed at positions corresponding to and 70c, respectively. Connection electrodes 75a3 and 75c3 are formed inside the via holes 74a and 74c, respectively. Further, the two capacitor electrodes 72b and 72c are respectively connected to the extraction electrode 7
6b and 76c. The lead electrode 76b is formed from one of the capacitor electrodes 72b to one end of the eighth dielectric layer 52h in the longitudinal direction. Extraction electrode 7
6c is formed from the other capacitor electrode 72c to the other longitudinal end portion of the eighth dielectric layer 52h.

Below the eighth dielectric layer 52h, a rectangular ground electrode 78 is formed. Eighth dielectric layer 52h
A ninth dielectric layer 52i made of a ceramic layer is formed under the so as to cover the ground electrode 78. The ground electrode 78 has two lead electrodes 78a and 78b on both sides in the width direction at the center in the longitudinal direction.
Have. The lead electrode 78a is formed from the ground electrode 78 to one end of the ninth dielectric layer 52i in the width direction. The extraction electrode 78b is connected to the ninth electrode from the ground electrode 78.
Is formed over the other end portion of the dielectric layer 52i in the width direction.

In this case, one end of the line electrode 64a in the longitudinal direction is connected to the capacitor electrode 7 via the connection electrode 75a1.
2a and connection electrodes 75a2 and 75a
3 is connected to the ground electrode 78. Line electrode 6
The other end portion in the longitudinal direction of 4a has connection electrodes 75b1 and 7b.
It is connected to the capacitor electrode 72b via 5b2. Further, one end of the line electrode 64b in the longitudinal direction is connected to the capacitor electrode 72a via the connection electrode 75c1,
Moreover, it is connected to the ground electrode 78 via the connection electrodes 75c2 and 75c3. The other end of the line electrode 64b in the longitudinal direction is connected to the capacitor electrode 72c via the connection electrodes 75d1 and 75d2.

Below the ninth dielectric layer 52i, a tenth dielectric layer 52j made of a ceramic layer is formed as a protective layer.

On the side surface of the laminated body 52, four external electrodes 8 are provided.
0a, 80b, 80c and 80d are formed. In this case, one external electrode 80a is formed on one side surface in the longitudinal direction of the laminated body 52, and one external electrode 80b is formed on the other side surface in the longitudinal direction of the laminated body 52. Further, one external electrode 80c is formed on one side surface of the stacked body 52 in the width direction, and one external electrode 80d is formed on the other side surface of the stacked body 52 in the width direction.

External electrodes 80a and 80b are connected to lead electrode 76a of capacitor electrode 72b and lead electrode 76c of capacitor electrode 72c, respectively. The external electrode 80a is used as an input terminal, and the external electrode 80b is used as an output terminal. The external electrodes 80c and 80d are connected to the lead electrodes 78a and 78b of the ground electrode 78, respectively, and are used as ground terminals.

In this filter 50, the line electrode 54
a, 54b, 64a and 64b form inductors L1, L2, L3 and L4, respectively. Also,
Capacitors C1 and C2 are formed between the capacitor electrodes 60a and 60b and between the capacitor electrodes 60a and 60c, respectively. Further, a capacitor C is provided between the capacitor electrodes 72a and 72b and between the capacitor electrodes 72a and 72c, respectively.
3 and C4 are formed respectively.

Therefore, the filter 50 has an equivalent circuit shown in FIG.

Next, an example of a method of manufacturing the filter 50 will be described in detail with reference to FIG.

First, a ceramic green sheet 82a to be the first dielectric layer 52a is prepared. As shown in FIG. 9A, two long and narrow rectangular holes 56a and 56b are formed in the ceramic green sheet 82a at one end in the width direction and at intervals in the longitudinal direction. The two holes 56a and 56b are formed so as to extend in the longitudinal direction of the ceramic green sheet 82a. The two holes 56a and 56b are formed by, for example, punching so as to penetrate from one main surface of the ceramic green sheet 82a to the other main surface. The inside of the two holes 56a and 56b is filled with a conductor paste as shown in FIG.
a and 86b are formed respectively.

Further, a ceramic green sheet 82e to be the fifth dielectric layer 52e is prepared. In this ceramic green sheet 82e, as shown in FIG. 9B, two elongated rectangular holes 66a and 66b are formed in parallel with each other at intervals in the longitudinal direction. The holes 66a and 66b are formed to extend in the width direction of the ceramic green sheet 82e. In this case, one end in the longitudinal direction of the hole 56a and one end in the longitudinal direction of the hole 66a face each other, and the hole 56a
The holes 66a and 66b are formed so that one end of the b in the longitudinal direction and one end of the hole 66b in the longitudinal direction face each other. The holes 66a and 66b are formed, for example, by punching so as to penetrate from one main surface of the ceramic green sheet 82e to the other main surface thereof. As shown in FIG. 9 (E), the inside of the holes 66a and 66b is filled with a conductor paste, whereby the conductor layers 88a, 88 are formed.
b are formed respectively.

Further, a ceramic green sheet 82f to be the sixth dielectric layer 52f is prepared. In this ceramic green sheet 82f, as shown in FIG. 9C, four via holes 68a, 68b, 68c and 6 are formed.
8d is formed. In this case, the via hole 68a is the hole 6
6a is formed at a position corresponding to the other end in the longitudinal direction of 6a, and the via hole 68b is formed at a position corresponding to one end in the longitudinal direction of the hole 66a. Further, 68c is formed at a position corresponding to the other end of the hole 66b in the longitudinal direction, and the via hole 6 is formed.
8d is formed at a position corresponding to one end of the hole 66b in the longitudinal direction. Via holes 68a, 68b, 68c and 6
As shown in FIG. 9D, the inside of 8d is filled with a conductor paste or the like, so that the connection electrodes 75a1, 7a
5b1, 75c1 and 75d1 connecting conductor 84a
1, 84b1, 84c1 and 84d1 are formed, respectively.

Next, the ceramic green sheets 82a,
82e and 82f are shown in FIG. 9 (D), FIG. 9 (E), and FIG.
They are stacked as shown in (H).

Then, one ends of the conductor layers 88a and 88b are connected to the other ends of the conductor layers 86a and 86b, respectively.

Further, a ceramic green sheet 82b to be the second dielectric layer 52b is prepared. In this ceramic green sheet 82b, as shown in FIG. 9 (F), four via holes 58a, 58b, 58c and 5 are formed.
8d is formed. Via holes 58a, 58b, 58c
And 58d are filled with a conductor paste to form connection electrodes 63a1, 63b1, 63c1 and 63d1, which are connection conductors 90a1, 90b1, 90c.
1 and 90d1 are formed respectively. further,
On one main surface (upper surface) of the ceramic green sheet 82b, as shown in FIG. 9G, except for the peripheral portions of the via holes 58a and 58d, a conductor paste or the like is printed in a thick film, so that the capacitor electrode 60a is formed. The conductor layer 92a is formed.

Then, this ceramic green sheet 8
As shown in FIG. 9H, 2b is laminated on the ceramic green sheet 82a so that the conductor layer 92a faces upward.

Further, a ceramic green sheet 82c to be the third dielectric layer 52c is prepared. Two via holes 62a and 62d are formed in the ceramic green sheet 82c. Via holes 62a and 62d
As shown in FIG. 9H, the inside of each of the connection electrodes 63a2 and 63d is filled with the conductor paste.
The connection conductors 90a2 and 90d2 to be 2 are respectively filled. Furthermore, the ceramic green sheet 82
A thick film of a conductor paste or the like is printed on the c at a distance in the longitudinal direction, so that the capacitor electrode 6
Conductor layers 94a and 94b serving as 0b and 60c are formed.

Then, the ceramic green sheet 82c
As shown in FIG. 9H, the ceramic green sheets 82b are arranged so that the conductor layers 94a and 94b face upward.
Stacked on top of.

In this case, the conductor layer 88a has the other end connected to the conductor layer 92a via the connection conductor 90b1 and one end connected to the conductor layer 94a via the connection conductors 90a1 and 90a2. The other end of the conductor layer 88b is connected to the conductor layer 92a via the connection conductor 90c1 and one end thereof is connected to the conductor layer 94b via the connection conductors 90d1 and 90d2.

Further, a ceramic green sheet 82d to be the fourth dielectric layer 52d is prepared. This ceramic green sheet 82d is, as shown in FIG.
It is laminated on the ceramic green sheet 82c so as to cover the conductor layers 94a and 94b.

Further, a ceramic green sheet 82g to be the seventh dielectric layer 52g is prepared. This ceramic green sheet 82g has four via holes 70
a, 70b, 70c and 70d are formed. In this case, the four via holes 70a to 70d are formed at positions corresponding to the via holes 68a to 68d provided in the ceramic green sheet 82f, respectively. By filling the inside of the four via holes 70a, 70b, 70c and 70d with a conductor paste or the like, as shown in FIG.
As shown in (H), the connection electrodes 75a2, 75b2, 7
5c2 and 75d2 connecting conductors 84a2, 84b
2, 84c2 and 84d2 are formed, respectively.

Also, via holes 70b and 70d are formed on one main surface (upper surface) of the ceramic green sheet 82g.
The conductor layer 96a to be the capacitor electrode 72a is formed by thick-film printing the conductor paste except the peripheral portion.

82 g of ceramic green sheet
As shown in FIG. 9 (H), is laminated under the ceramic green sheet 82f such that the conductor layer 96a is sandwiched between the ceramic green sheets 82f and 82g.

A ceramic green sheet 82h to be the eighth dielectric layer 52h is prepared. This ceramic green sheet 82h has two via holes 74a.
And 74c are formed. Via holes 74a and 7
4c are formed at positions corresponding to via holes 70a and 70c, respectively. Via holes 74a and 74
The connection conductor 8 that becomes the connection electrodes 75a3 and 75c3 by being filled with a conductor paste or the like inside c
4a3 and 84c3 are formed respectively. Further, a conductor paste is thick-film printed on the ceramic green sheet 82h except for the peripheral portions of the via holes 74a and 74c.
Conductor layers 98b and 98c that will become b and the capacitor electrode 72c are formed, respectively.

Then, this ceramic green sheet 8
In 2h, as shown in FIG. 9H, the conductor layers 98b and 98c are ceramic green sheets 82g and 82h.
Ceramink green sheet 82 so that it is sandwiched between
g underneath.

Further, a ceramic green sheet 82i to be the ninth dielectric layer 52i is prepared. The conductor layer 10 serving as the ground electrode 78 is formed on the upper surface of the ceramic green sheet 82i by thick film printing of the conductor paste.
0 is formed. In this case, the lead conductors 102a and 102b to be the lead electrodes 78a and 78b are formed by thick-printing the conductor paste from the center of the conductor layer 100 in the longitudinal direction to one end and the other end of the ceramic green sheet 82i in the width direction. Conductor layer 10
It is formed with 0.

Further, this ceramic green sheet 8
As shown in FIG. 9H, 2i is laminated below the ceramic green sheet 82h such that the conductor layer 100 and the lead conductors 102a and 102b are sandwiched between the ceramic green sheets 82h and 82i.

In this case, the other end of the conductor layer 86a is connected to the conductor layer 96a via the connection conductor 84a1 and the conductor layer 1 via the connection conductors 84a2 and 84a3.
00 is connected. One end of the conductor layer 86a is connected to the connection conductor 8
It is connected to the conductor layer 98b via 4b1 and 84b2. The other end of the conductor layer 86b is connected to the connection conductor 84c.
1 is connected to the conductor layer 96a via 1 and is connected to the conductor layer 100 via connection conductors 84c2 and 84c3. One end of the conductor layer 86b is connected to the conductor layer 98c via the connection conductors 84d1 and 84d2.

A ceramic green sheet 82j to be the tenth dielectric layer 52j is prepared. The ceramic green sheet 82j is laminated below the ceramic green sheet 82i.

Then, the laminated body of these ceramic green sheets 82a to 82j is pressure-bonded and fired, whereby the first to tenth dielectric layers 52a to 52j, the line electrodes 54a, 54b, 64a and 64b, the capacitor electrodes. 60a-60c and capacitor electrodes 72a-7
2c, ground electrode 78, connection electrodes 63a1, 63a2
63b, 63c, 63d1, 63d2, connection electrode 75a
1,75a2,75a3,75b1,75b2,75c
1, 75c2, 75c3, 75d1, 75d2 are formed.

Then, the first to tenth dielectric layers 52a are formed.
External electrodes 80a to 80d are formed on the side surfaces of .about.52j by baking an electrode material such as silver, and the filter 50 is manufactured.

In this filter 50, the inductors L1,
Line electrodes 54a, 54 serving as L2, L3, and L4
b, 64a and 64b each have a conductor layer formed by filling a hole provided in the ceramic green sheet with a conductor material such as a conductor paste. Therefore, as shown in FIGS. Compared with the filter 10 of the conventional example in which the line electrode is formed on the surface of the green sheet by thick film printing or the like, the cross-sectional area of each line electrode is increased, the flow path of the current is increased in each line electrode, and Resistance component and conductor loss are reduced. In the filter 50 of this embodiment, the inductors L1,
Line electrodes 54a, 5 forming L2, L3 and L4
4b and the line electrodes 64a and 64b are formed to have substantially the same thickness as the ceramic green sheets 82a and 82e, respectively.

Therefore, the filter 50 of this embodiment is
Compared with the filter 10 of the conventional example shown in FIGS. 21 and 22, the Q of each resonator becomes large and the insertion loss becomes small. With this filter 50, a steep bandpass filter having a Q value of about 70 can be obtained. Further, in this filter 50, the insertion loss in the pass band is reduced and the filter characteristic is improved. Further, even if the number of stages of the filter is reduced, the same filter characteristic as that of the conventional filter can be obtained, so that the size can be reduced.

Further, in the filter 50 of this embodiment, the line electrodes 54a and 54b and the line electrodes 64a and 64a.
The width, length, and thickness of b are the ceramic green sheets 82.
It is determined by the width and length of the holes 56a and 56b and the holes 66a and 66b provided in a and 82e, and the thickness of the ceramic green sheets 82a and 82e. Therefore, as compared with the conventional filter 10, variations in the shape and thickness of the inductor pattern can be reduced, and a predetermined inductance value can be obtained. In this case, the variation of the inductance value can be suppressed to ± 1% or less and reduced.
Therefore, in this filter 50, in the manufacturing process,
By trimming the capacitors C1, C2, C3, and C4, it is possible to reduce the step of adjusting the filter characteristics.

FIG. 10 is a perspective view showing another example of a filter as still another embodiment of the present invention, FIG. 11 is an exploded perspective view showing the main part thereof, and FIG. 12 is its equivalent circuit diagram. is there. In this embodiment, a filter used as an LC type low-pass filter will be described.

The filter 110 is a rectangular parallelepiped laminated body 11
2 inclusive. The laminated body 112 includes, for example, a rectangular first dielectric layer 112a made of a ceramic layer. On the first dielectric layer 112a, for example, one L-shaped line electrode 114 is formed on one side in the longitudinal direction. The long side portion of the line electrode 114 is the first dielectric layer 112a.
Is formed to extend in the longitudinal direction of the first dielectric layer 112a, and the short side portion thereof is formed to extend in the width direction of the first dielectric layer 112a. In addition, one end portion 115 of the line electrode 114 has the first dielectric layer 11
It is exposed at one end face in the longitudinal direction of 2a.

The line electrode 114 is the first dielectric layer 11
It is formed from one end to the other end in the thickness direction of 2a. The thickness of the line electrode 114 is formed to be substantially the same as the thickness of the first dielectric layer 112a. That is, the line electrode 114
The upper and lower ends in the thickness direction of the first dielectric layer 1
12a on one main surface (upper surface) and the other main surface (lower surface),
Exposed.

In this case, the first dielectric layer 112a contains
An L-shaped hole 116 is formed on one side in the longitudinal direction. The holes 116 are formed by, for example, punching so as to penetrate from the one main surface to the other main surface of the first dielectric layer 112a. Then, a conductor such as a conductor paste is filled in the inside of the hole 116 to form a conductor layer to be the line electrode 114.

On one main surface (upper surface) of the first dielectric layer 112a, the upper surface of the line electrode 114 is covered,
A second dielectric layer 112b made of a ceramic layer is formed.

On the second dielectric layer 112b, one line electrode 118 having, for example, a rectangular cross section and an elongated rod shape is formed. The line electrode 118 is formed at the center of the second dielectric layer 112b and extends in the longitudinal direction thereof. in this case,
The line electrode 118 is arranged so that one end in the longitudinal direction faces the other end of the line electrode 114. The line electrode 118 is formed from one end to the other end of the second dielectric layer 112b in the thickness direction. The thickness of the line electrode 118 is formed to be substantially the same as the thickness of the second dielectric layer 112b. That is, the upper end portion and the lower end portion in the thickness direction of the line electrode 118 are exposed on the one main surface (upper surface) and the other main surface (lower surface) of the second dielectric layer 112b.

Further, on the second dielectric layer 112b,
A third dielectric layer 112c made of a ceramic layer is formed so as to cover the upper surface of the line electrode 118.

The third dielectric layer 112c has, for example, one L-shaped line electrode 122 on one side in the longitudinal direction.
Is formed. When the line electrode 122 has a portion extending from one end to the other end in the width direction of the center of the first to third dielectric layers 112a to 112c in the longitudinal direction as an axis of symmetry,
It is arranged in line symmetry with the line electrode 114. Line electrode 1
One end portion 123 of 22 is exposed at one end face in the longitudinal direction of the third dielectric layer 112c. In this case, the line electrode 114
One end portion 115 of the line electrode 122 is exposed on one side surface in the longitudinal direction of the laminated body 112, and one end portion 123 of the line electrode 122 is exposed on the other side surface in the longitudinal direction of the laminated body 112. The line electrode 122 is formed from one end to the other end of the second dielectric layer 112c in the thickness direction. Line electrode 122
Is formed to have substantially the same thickness as that of the second dielectric layer 112c. That is, the upper end portion and the lower end portion of the line electrode 122 in the thickness direction are exposed on the one main surface (upper surface) and the other main surface (lower surface) of the second dielectric layer 122c.

The line electrodes 118 and 122 are similar to the line electrode 114 in the dielectric layers 112b and 112c.
In addition, holes 117 and 123 corresponding to the line electrodes 118 and 122, respectively, are formed by, for example, punching or the like. Then, the holes 117 and 123 are filled with a conductor paste or the like to form conductor layers to be the line electrodes 118 and 122, respectively. In this case, when the dielectric layers 112a, 112b and 112c are laminated, the line electrode 114 is formed at one end of the line electrode 118.
The other end of the line electrode 122 is connected by surface contact, and the other end of the line electrode 118 is connected by surface contact with the other end of the line electrode 122.

On the third dielectric layer 112c, a fourth dielectric layer 112d is formed as a protective layer so as to cover the upper surface of the line electrode 122.

On the other hand, a fifth dielectric layer 112e is formed on the other main surface (lower surface) of the first dielectric layer 112a so as to cover the lower surface of the line electrode 114.

Under the fifth dielectric layer 112e, rectangular planar capacitor electrodes 124a and 124b are formed at intervals in the longitudinal direction thereof. Capacitor electrodes 124a and 124b have extraction electrodes 126a and 126b, respectively. Further, two capacitor electrodes 124 are provided below the fifth dielectric layer 112e.
A sixth dielectric layer 112f made of a ceramic layer is formed so as to cover a and 124b. in this case,
The extraction electrode 126a of the capacitor electrode 124a and the extraction electrode 126b of the capacitor electrode 124b are formed to extend from the capacitor electrodes 124a and 124b to one end and the other end of the sixth dielectric layer 112f in the longitudinal direction, respectively.

Below the sixth dielectric layer 112f, the other 1
Two planar capacitor electrodes 128 are formed. Also,
Below the sixth dielectric layer 112f, the capacitor electrode 12
A seventh dielectric layer 112g made of a ceramic layer is formed so as to cover 8th layer. In this case, the capacitor electrode 128 is formed so as to extend in the longitudinal direction at the center on the seventh dielectric layer 112g. The capacitor electrode 128 is
The sixth dielectric layer 11 is sandwiched by the sixth dielectric layer 112f.
It is formed so as to face the capacitor electrodes 124a and 124b on 2f.

Under the seventh dielectric layer 112g, two other rectangular planar-shaped condenser electrodes 130a and 130b are formed at intervals in the longitudinal direction. The capacitor electrodes 130a and 130b have extraction electrodes 132a and 132b, respectively. Also, the seventh
Below the dielectric layer 112g of the capacitor electrode 130a
Eighth dielectric layer 112h made of a ceramic layer is formed so as to cover and 130b. In this case, 2
The one capacitor electrodes 130a and 130b are formed so as to face the capacitor electrode 128 on the seventh dielectric layer 112g with the seventh dielectric layer 112g interposed therebetween. The lead electrodes 132a and 132b are formed to extend from the capacitor electrodes 130a and 130b, respectively, to one end and the other end in the longitudinal direction of the eighth dielectric layer 112h.

Below the eighth dielectric layer 112h, a rectangular ground electrode 134 is formed. Eighth dielectric layer 1
Under 12h, the ground electrode 134 is covered,
A ninth dielectric layer 112i made of a ceramic layer is formed. In this case, the ground electrode 134 is formed so as to face the two capacitor electrodes 130a and 130b on the eighth dielectric layer 112h with the eighth dielectric layer 112h interposed therebetween. Further, the ground electrode 134 has two lead electrodes 134a and 134b on the both sides in the width direction at the center in the longitudinal direction. Extraction electrode 1
Reference numeral 34a denotes a portion from one end of the ground electrode 134 in the width direction to the ninth electrode.
Is formed over one end portion of the dielectric layer 112i in the width direction. The lead electrode 134b is formed from the other widthwise end of the ground electrode 134 to the other widthwise other end of the ninth dielectric layer 112i.

Below the ninth dielectric layer 112i, a tenth dielectric layer 112 made of a ceramic layer is provided as a protective layer.
j is formed.

Four external electrodes 136a, 136b, 136c and 136d are formed on the side surface of the laminated body 112. In this case, one external electrode 136a is formed on one side surface in the longitudinal direction of the laminated body 112, and one external electrode 136b is formed on the other side surface in the longitudinal direction of the laminated body 112. In addition, 1 is provided on one side surface of the laminated body 112 in the width direction.
One external electrode 136c is formed, and one external electrode 136d is formed on the other side surface of the stacked body 112 in the width direction.

The external electrode 136a includes one end of the line electrode 122 and the extraction electrode 12 of the capacitor electrode 124a.
6a and the extraction electrode 132 of the capacitor electrode 130a
connected to a. The external electrode 136b is connected to one end of the line electrode 114, the lead electrode 126b of the capacitor electrode 124b, and the lead electrode 132b of the capacitor electrode 130b. In this case, the external electrode 1
36a is used as an input terminal, and the external electrode 136b is used as an output terminal. Furthermore, the external electrode 136c
And 136d are connected to the extraction electrodes 134a and 134b of the ground electrode 134, respectively, and are used as ground terminals.

In this filter 110, the line electrode 11
An inductor L is formed at 4, 118 and 122. Also, four capacitor electrodes 124a, 124b,
130a and 130b and one capacitor electrode 12
A capacitor C1 is formed between the capacitor C1 and the capacitor C8. Furthermore, 2
Two capacitors C2 and C3 are formed between one capacitor electrode 130a and 130b and one ground electrode 134.

Therefore, this filter 110 is similar to that of FIG.
2 has an equivalent circuit.

Similar to the embodiment shown in FIGS. 6 to 9, this filter 110 also has a smaller resistance component and conductor loss of the line electrode than the conventional filter 10 shown in FIGS. 21 and 22. Therefore, the filter 10 has a small insertion loss and is used as a steep low-pass filter having a large Q.

FIG. 13 is a perspective view showing still another example of the filter as another embodiment of the present invention, FIG. 14 is an exploded perspective view showing the main part thereof, and FIG. 15 is its equivalent circuit diagram. is there. In this embodiment, a filter used as an LC type high-pass filter will be described.

The filter 140 is a rectangular parallelepiped laminated body 14
2 inclusive. The laminated body 142 includes, for example, a rectangular first dielectric layer 142a formed of a ceramic layer. The first dielectric layer 142a is provided with, for example, an elongated rod-shaped line electrode 144 having a rectangular cross section at the center thereof. The line electrode 144 is formed to extend from one end in the width direction of the first dielectric layer 142a to the other end side. In this case, one end portion of the line electrode 144 in the longitudinal direction has the first dielectric layer 142a.
Is formed inside the other end in the width direction.

In this case, the line electrode 144 is formed from one end to the other end of the first dielectric layer 142a in the thickness direction. The thickness of the line electrode 144 is equal to that of the first dielectric layer 1
It is formed to have almost the same thickness as 42a. Therefore, the upper end portion and the lower end portion of the line electrode 144 in the thickness direction are exposed on the one main surface (upper surface) and the other main surface (lower surface) of the first dielectric layer 142a. In addition, the line electrode 144
Has its one end in the longitudinal direction exposed at one end face in the width direction of the first dielectric layer 142a.

On one main surface (upper surface) of the first dielectric layer 142a, the upper surface of the line electrode 144 is covered,
A second dielectric layer 142b made of a ceramic layer is formed.

On the second dielectric layer 142b, 1 is formed at a position corresponding to the upper surface of the other end of the line electrode 144 in the longitudinal direction.
One via hole 148 is formed. This beer hole 1
The inside of the connection conductor 48 is filled with a conductor such as a conductor paste to give a connection electrode, which serves as a connection conductor 1.
50 are formed. In addition, the second dielectric layer 142b
On the upper part of the capacitor, three rectangular surface-shaped capacitor electrodes 152, 154 and 156 are formed at intervals in the longitudinal direction. In this case, the line electrode 144 and the capacitor electrode 154 are connected via the connection electrode 150.
Further, capacitor electrodes 152 and 156 have extraction electrodes 152a and 156a, respectively. The extraction electrode 152a is connected to the second electrode from the capacitor electrode 152.
Is formed so as to extend to one longitudinal end of the dielectric layer 142b, and the extraction electrode 156a is formed to extend from the capacitor electrode 156 to the other longitudinal end of the second dielectric layer 142b.

A third dielectric layer 142c made of a ceramic layer is formed on the second dielectric layer 142b so as to cover the three capacitor electrodes 152, 154 and 156.
Is formed.

Another layer is formed on the third dielectric layer 142c.
Two planar capacitor electrodes 158 are formed. The capacitor electrode 158 is formed so as to face the three capacitor electrodes 152, 154 and 156 on the second dielectric layer 142b with the third dielectric layer 142c interposed therebetween. Further, a fourth dielectric layer 142d made of a ceramic layer is formed on the third dielectric layer 142c so as to cover the capacitor electrode 158. Further, on the fourth dielectric layer 142d, if necessary, fifth and sixth dielectric layers 142e and 142e, which are ceramic layers, are formed.
42f are laminated in that order. The fourth and fifth
And sixth dielectric layers 142d, 142e and 142
f is formed as a protective layer.

Similarly, on the other main surface (lower surface) of the first dielectric layer 142a, a seventh dielectric layer 142g made of a ceramic layer is formed as a protective layer so as to cover the lower surface of the line electrode 144, Further, if necessary, the eighth and ninth dielectric layers 142h and 142i are laminated in that order.

Four external electrodes 160a, 160b, 160c and 160d are formed on the side surface of the laminated body 142. In this case, one external electrode 160a is formed on one side surface of the laminated body 142 in the longitudinal direction, and one external electrode 160b is formed on the other side surface of the laminated body 142 in the longitudinal direction. In addition, 1 is provided on one side surface of the laminated body 142 in the width direction.
One external electrode 160c is formed, and one external electrode 160d is formed on the other side surface of the stacked body 142 in the width direction.

External electrodes 160a and 160b are connected to lead electrode 152a of capacitor electrode 152 and lead electrode 156a of capacitor electrode 156, respectively. In this case, the external electrode 160a is used as an input terminal and the external electrode 160b is used as an output terminal. The external electrode 160c is connected to one end of the line electrode 144. The external electrode 160c is used as a ground terminal. The external electrode 160d is used as a dummy electrode and is not connected to other electrodes.

In this filter 140, the line electrode 14
At 4, the inductor L is formed. Further, two capacitors C1 and C2 are provided between the three capacitor electrodes 152, 154, 156 and one capacitor electrode 158.
Is formed. Therefore, the filter 140 has the equivalent circuit shown in FIG.

Similar to the embodiment shown in FIGS. 6 to 9, this filter 110 also has a smaller resistance component and conductor loss of the line electrode than the filter 10 of the conventional example shown in FIGS. 21 and 22. Therefore, this filter 10 is used as a steep high-pass filter with a small insertion loss and a large Q.

FIG. 16 is a perspective view showing another example of the filter as still another embodiment of the present invention, FIG. 17 is an exploded perspective view showing the main part thereof, and FIG. 18 is its equivalent circuit diagram. is there. In this embodiment, a filter used as an LC type bandpass filter will be described.

The filter 170 includes a rectangular parallelepiped laminated body 172. The laminated body 172 includes, for example, a rectangular first dielectric layer 172a made of a ceramic layer. First
In the dielectric layer 172a, two line electrodes 174 having a rectangular cross section and having a rod shape are arranged at intervals in the longitudinal direction.
And 176 are formed. The two line electrodes 174 and 176 are formed to extend in the width direction of the first dielectric layer 172a. Line electrodes 174 and 17
6 is formed inside both ends in the width direction and the longitudinal direction of the first dielectric layer 172a.

The two line electrodes 174 and 176 are
It is formed from one end to the other end of the first dielectric layer 172a in the thickness direction. Two line electrodes 174 and 176
Are formed to have substantially the same thickness as that of the first dielectric layer 172a. Therefore, the line electrode 1
The upper end and the lower end of 74 in the thickness direction are exposed at one main surface (upper surface) and the other main surface (lower surface) of the first dielectric layer 172a, respectively. Similarly, the line electrode 176
The upper end and the lower end in the thickness direction of are exposed at one main surface (upper surface) and the other main surface (lower surface) of the first dielectric layer 172a, respectively.

The two line electrodes 174 and 176 are
Line electrodes 174 and 17 are formed on the first dielectric layer 172a.
6, holes 174a and 176a corresponding to the shape of 6 are provided, and inside the holes 174a and 176a,
It is formed by filling and applying a conductor such as a conductor paste.

On one main surface (upper surface) of the first dielectric layer 172a, the second dielectric layer 17 made of a ceramic layer is formed so as to cover the upper surfaces of the line electrodes 174 and 176.
2b is formed.

The second dielectric layer 172b is formed in a long and thin rod shape with a rectangular cross section, for example, at intervals in the longitudinal direction.
Two line electrodes 178 and 180 are formed. The two line electrodes 178 and 180 are formed on both sides of the second dielectric layer 172b in the longitudinal direction and extend in the width direction thereof. In this case, line electrodes 178 and 1
80 is arranged such that one end portion in the longitudinal direction thereof faces the line electrodes 174 and 176, respectively. Further, the line electrodes 178 and 180 are formed inside both ends in the width direction and the length direction of the second dielectric layer 172b.

The two line electrodes 178 and 180 are
The second dielectric layer 172b is formed from one end to the other end in the thickness direction. Two line electrodes 178 and 180
Are formed to have substantially the same thickness as the second dielectric layer 172b. Therefore, the line electrode 1
The upper and lower ends of 78 and 180 in the thickness direction are exposed at one main surface (upper surface) and the other main surface (lower surface) of the second dielectric layer 172b, respectively. The two line electrodes 178 and 180 are provided with holes 178a and 180a corresponding to the shapes of the line electrodes 178 and 180, respectively, in the second dielectric layer 172b,
The holes 178a and 180a are formed by filling and applying a conductor such as a conductor paste.

A third dielectric layer 172c made of a ceramic layer is formed on the upper surface of the second dielectric layer 172b so as to cover the upper surfaces of the line electrodes 178 and 180.

The third dielectric layer 172c has a long and narrow rod-like shape with a rectangular cross section, for example, at intervals in the longitudinal direction.
Two line electrodes 182 and 184 are formed. The two line electrodes 182 and 184 are formed so as to extend in the longitudinal direction of the third dielectric layer 172c. The line electrodes 182 and 184 are connected to the third dielectric layer 172c.
Is formed inside both ends in the width direction and the longitudinal direction. In this case, the line electrode 182 is arranged such that one end of the line electrode 182 in the longitudinal direction faces the other end of the line electrode 178 in the longitudinal direction. Further, the line electrode 184 is arranged such that one longitudinal end thereof opposes the other longitudinal end of the line electrode 180.

The two line electrodes 182 and 184 are
The third dielectric layer 172c is formed from one end to the other end in the thickness direction. Two line electrodes 182 and 184
Are formed to have substantially the same thickness as that of the third dielectric layer 172c. Therefore, the line electrode 1
The upper and lower ends of 82 and 184 in the thickness direction are exposed at one main surface (upper surface) and the other main surface (lower surface) of the third dielectric layer 172c, respectively. The two line electrodes 182 and 184 are provided with holes 182a and 184a corresponding to the shapes of the line electrodes 182 and 184, respectively, in the third dielectric layer 172c.
The holes 182a and 184a are filled with a conductor such as a conductor paste to be formed therein.

Therefore, the first to third dielectric layers 172 are
When a to 172c are stacked, the line electrode 174 is connected to one end of the line electrode 178 and the line electrode 182 is connected to the other end of the line electrode 178. The line electrode 176 is connected to one end of the line electrode 180, and the line electrode 184 is connected to the other end of the line electrode 180.

A fourth dielectric layer 172d made of a ceramic layer is formed on the upper surface of the third dielectric layer 172c so as to cover the upper surfaces of the line electrodes 182 and 184.

The fourth dielectric layer 172d has two bar-shaped line electrodes 1 each having a rectangular cross section and spaced from each other in the central portion thereof.
86 and 188 are formed. One line electrode 18
6 is formed at a position corresponding to the other end in the longitudinal direction of the line electrode 182 on the third dielectric layer, and the other line electrode 188 is the longitudinal direction of the line electrode 184 on the third dielectric layer. Is formed at a position corresponding to the other end of the.

The two line electrodes 186 and 188 are
Line electrodes 186 and 18 are formed on the fourth dielectric layer 172d.
Holes (not shown) corresponding to the shape of 8 are provided respectively, and the inside of these holes is filled with a conductor such as a conductor paste to be formed. Therefore,
The line electrodes 186 and 188 have the upper end and the lower end thereof in the thickness direction, respectively, at the fourth dielectric layer 17
It is exposed on the upper and lower surfaces of 2d.

Further, on the fourth dielectric layer 172d, a substantially rectangular planar capacitor electrode 190 is formed except for the line electrodes 186 and 188. The capacitor electrode 190 is connected to the extraction electrodes 194 and 1
Has 96. The extraction electrodes 194 and 196 are, respectively, at the central portion in the longitudinal direction of the capacitor electrode 190,
From one end and the other end in the width direction to the fourth dielectric layer 1
It is formed to extend to one end and the other end of 72d in the width direction.

A fifth dielectric layer 172e made of a ceramic layer is formed on the upper surface of the fourth dielectric layer 172d so as to cover the upper surfaces of the capacitor electrode 190 and the line electrodes 186 and 188.

In the fifth dielectric layer 172e, the line electrodes 18 are formed in the portions corresponding to the line electrodes 186 and 188.
Line electrodes 198 and 200 having substantially the same shape and size as those of 6 and 188 are formed, respectively. That is, the line electrode 1
In 98 and 200, the upper end and the lower end in the thickness direction are exposed at the upper surface and the lower surface of the fifth dielectric layer 172e, respectively.

Further, on the fifth dielectric layer 172e,
Two capacitor electrodes 202 and 204 each having a rectangular surface shape are formed at intervals in the longitudinal direction. The capacitor electrodes 202 and 204 are arranged on the fourth dielectric layer 172d with the fifth dielectric layer 172e interposed therebetween.
90 is formed so as to face one flat surface portion 192a and the other flat surface portion 192b in the longitudinal direction.
Further, the line electrodes 198 and 200 are respectively
Connection electrodes 205 and 207 are connected to capacitor electrodes 202 and 204, respectively. Capacitor electrode 20
2 and 204 have extraction electrodes 206 and 208, respectively. The extraction electrode 206 is formed from the capacitor electrode 202 to one end of the fifth dielectric layer 172e in the width direction. In addition, the extraction electrode 208
Is from the capacitor electrode 204 to the fifth dielectric layer 172e.
Is formed over the other end in the width direction.

On the upper surface of the fifth dielectric layer 172e, line electrodes 198 and 200, capacitor electrodes 202 and 2 are formed.
A sixth dielectric layer 172f made of a ceramic layer is formed so as to cover the upper surface of 04.

On the upper surface of the sixth dielectric layer 172f, three rectangular planar capacitor electrodes 210, 212 and 214 are formed at intervals in the longitudinal direction. Capacitor electrodes 210 and 214 have extraction electrodes 216 and 218, respectively. In this case, the extraction electrode 216 is formed from the capacitor electrode 210 to one end of the sixth dielectric layer 172f in the width direction. The lead electrode 218 is formed from the capacitor electrode 214 to the other widthwise end of the sixth dielectric layer 172f.

On the upper surface of the sixth dielectric layer 172f, a seventh dielectric layer 172 made of a ceramic layer is formed so as to cover the three capacitor electrodes 210, 212 and 214.
g is formed.

On the upper surface of the seventh dielectric layer 172g, two rectangular planar capacitor electrodes 220 and 222 are formed at intervals in the longitudinal direction. The capacitor electrodes 220 and 222 are respectively the extraction electrodes 224.
And 226. In this case, the extraction electrode 224
Is from the capacitor electrode 220 to the seventh dielectric layer 172g.
Is formed over one end in the width direction. The lead electrode 226 is formed from the capacitor electrode 222 to the other widthwise end of the seventh dielectric layer 172g.

On the upper surface of the seventh dielectric layer 172g, an eighth dielectric layer 172h made of a ceramic layer is formed so as to cover the two capacitor electrodes 220 and 222.

On the upper surface of the eighth dielectric layer 172h, a rectangular ground electrode 228 is formed. Ground electrode 22
No. 8 has two capacitor electrodes 220 and 22 on the seventh dielectric layer 172g with the eighth dielectric layer 172h interposed therebetween.
It is formed so as to face 2. In addition, the ground electrode 22
8 has extraction electrodes 230 and 232. In this case, the extraction electrode 230 is formed from the ground electrode 228 to one end of the seventh dielectric layer 172g in the width direction. In addition, the extraction electrode 232 is the ground electrode 22.
It is formed over the other end in the width direction of the eighth to seventh dielectric layers 172g. Although not shown, it goes without saying that a protective layer may be further formed on the eighth dielectric layer 172h.

On the other hand, a rectangular ground electrode 234 is formed on the other main surface (lower surface) of the first dielectric layer 172a. Further, the ninth dielectric layer 172i made of a ceramic layer is formed on the lower surface of the first dielectric layer 172a so as to cover the lower surface portions of the two line electrodes 220 and 222.
Is formed.

The ground electrode 234 is the extraction electrode 236.
And 238. In this case, the extraction electrode 236
Are formed from the ground electrode 234 to one end in the width direction of the ninth dielectric layer 172i. In addition, the extraction electrode 238 is connected from the ground electrode 234 to the ninth dielectric layer 17
It is formed over the other end in the width direction of 2i.

Six external electrodes 240a, 240b, 240c, 240d, 240e and 240f are formed on the side surface of the laminated body 172. In this case, the three external electrodes 240a to 240 are provided on one side surface of the stacked body 172 in the width direction.
c is formed, and the other three external electrodes 240d to 240f are formed on the other side surface of the stacked body 172 in the width direction.

The external electrode 240a is the capacitor electrode 20.
The second lead electrode 206 and the lead electrode 224 of the capacitor electrode 220 are connected. In addition, the external electrode 24
0b is the extraction electrode 194 of the capacitor electrode 190.
And the lead electrode 230 of the ground electrode 228 and the lead electrode 236 of the ground electrode 234. Further, the external electrode 240c is connected to the extraction electrode 218 of the capacitor electrode 214. The external electrode 240d is connected to the extraction electrode 216 of the capacitor electrode 210. The external electrode 240e is the capacitor electrode 190.
Extraction electrode 196, a ground electrode 228 extraction electrode 232, and a ground electrode 234 extraction electrode 238.
Connected to. Further, the external electrode 240f is connected to the extraction electrode 208 of the capacitor electrode 204 and the extraction electrode 226 of the capacitor electrode 222.

In this case, the external electrode 240d is used as an input terminal and the external electrode 240c is used as an output terminal. The external electrode 240a is the capacitor electrode 2
02 and 220 are used as connecting electrodes, and external electrode 240f is used as a connecting electrode connecting capacitor electrodes 204 and 222. Furthermore, the external electrodes 240b and 240e are used as ground terminals, respectively.

In this filter 170, the line electrode 17
4, 178, 182, 186 and 198 form the inductor L1 and the line electrodes 176, 180, 18
4, 188 and 200 form inductor L2. Further, the capacitor electrodes 190, 202, 204,
210, 212, 214, 220, 222 and the ground electrodes 228, 234, the five capacitors C1, C2.
C3, C4 and C5 are formed. Therefore, this filter 170 has an equivalent circuit shown in FIG.

Similar to the embodiment shown in FIGS. 6 to 9, this filter 110 also has a smaller resistance component and conductor loss of the line electrode than the conventional filter 10 shown in FIGS. 21 and 22. Therefore, the filter 10 has a small insertion loss and is used as a steep bandpass filter having a large Q.

As disclosed in each of the above-described embodiments, in the resonator and filter according to the present invention, the pattern of the inductor L is set to, for example, FIG. 2, FIG. 7, FIG. 11 or FIG.
In addition to the case of forming a multi-layer as in the embodiment shown in FIG. 7 and the like, it may be formed of one layer as shown in FIG. 14, for example.

Further, in the resonator and the filter according to the present invention, in order to form each line electrode, by making the shape and size of each hole provided in each ceramic green sheet the same, each inductance value becomes the same. It becomes possible to Therefore, in the resonator and the filter according to the present invention, a slight deviation of each inductance value from the design value can be easily corrected, and the accuracy of the resonator and the filter can be improved.
Further, in each of the above-described examples, the formation of the laminated body is shown by stacking the ceramic green sheets, but the present invention is not limited to this. For example, the ceramic slurry or the conductive paste is repeatedly printed and dried to form the laminated body. May be.

Further, in each of the above-mentioned embodiments, each line electrode is formed on the dielectric layer made of the ceramic green sheet, but each line electrode may be formed on the magnetic layer. In this case, the ceramic green sheet made of a magnetic material is provided with holes corresponding to the line electrodes to be the inductors, and the holes are filled with a conductor such as a conductor paste to form each line electrode.

Further, in each of the above-mentioned embodiments, the dielectric layer as the ceramic layer is formed of one ceramic green sheet, but in the present invention, the number and thickness of the ceramic green sheets forming the ceramic layer are It may be changed arbitrarily.

In each of the above-mentioned embodiments, the conductor paste is thick-film printed on the ceramic green sheet in order to form each capacitor electrode and ground electrode, but each electrode is formed by other known means. May be done.

[Brief description of drawings]

FIG. 1 is a perspective view showing an example of a resonator as an embodiment of the present invention.

FIG. 2 is an exploded perspective view showing a main part of the resonator shown in FIG.

FIG. 3 is an equivalent circuit diagram of the resonator shown in FIG.

FIG. 4 is an illustrative view showing one example of a process for manufacturing the resonator shown in FIG.

5 is a graph showing frequency characteristics of the resonator shown in FIG. 1 and the resonator shown in FIG.

FIG. 6 is a perspective view showing an example of a filter as another embodiment of the present invention.

FIG. 7 is an exploded perspective view showing a main part of the filter shown in FIG.

FIG. 8 is an equivalent circuit diagram of the filter shown in FIG.

9 is an illustrative view showing one example of a process for manufacturing the filter shown in FIG.

FIG. 10 is a perspective view showing another example of a filter as still another embodiment of the present invention.

11 is an exploded perspective view showing a main part of the filter shown in FIG.

12 is an equivalent circuit diagram of the filter shown in FIG.

FIG. 13 is a perspective view showing still another example of a filter as another embodiment of the present invention.

FIG. 14 is an exploded perspective view showing a main part of the filter shown in FIG.

FIG. 15 is an equivalent circuit diagram of the filter shown in FIG.

FIG. 16 is a perspective view showing another example of a filter as still another embodiment of the present invention.

FIG. 17 is an exploded perspective view showing a main part of the filter shown in FIG.

18 is an equivalent circuit diagram of the filter shown in FIG.

FIG. 19 is an exploded front view showing an example of a conventional resonator which is a background of the present invention.

20 is a cross-sectional schematic view showing a main part of the resonator shown in FIG.

FIG. 21 is a perspective view showing an example of a conventional filter which is the background of the present invention.

22 is an exploded perspective view of the filter shown in FIG. 21. FIG.

23 is an equivalent circuit diagram of the filter shown in FIG.

[Explanation of symbols]

20 resonator 22 laminated body 22a first dielectric layer 22b second dielectric layer 22c third dielectric layer 22d fourth dielectric layer 22e fifth dielectric layer 22f sixth dielectric layer 38a, 38b, 38c, 38d, 38e hole 24a, 24b, 24c, 24d, 24e line electrode 28a, 28b capacitor electrode 26a, 26b, 30a via hole 32a1, 32a2, 32b connection electrode 34a, 34b, 34c, 34d external electrode 50 filter 52 laminated Body 52a First dielectric layer 52b Second dielectric layer 52c Third dielectric layer 52d Fourth dielectric layer 52e Fifth dielectric layer 52f Sixth dielectric layer 52g Seventh dielectric layer 52h Eighth dielectric layer 52i Ninth dielectric layer 52j Tenth dielectric layer 56a, 56b, 66a, 66b Holes 54a, 54b 64a, 64b line electrodes 60a, 60b, 60c, 72a, 72b, 72c capacitor electrodes 78 grounded electrodes 58a, 58b, 58c, 58d, 62a, 62d, 6
8a, 68b, 68c, 68d, 70a, 70b, 70
c, 70d, 74a, 74c Via hole 63a1, 63a2, 63b, 63c, 63d1, 63
d2, 75a1, 75a2, 75a3, 75b1, 75
b2, 75c1, 75c2, 75d1, 75d2, 75
d3 connection electrode 80a-80d external electrode

Claims (4)

[Claims] 1. A laminate including a plurality of dielectric layers, formed on at least one dielectric layer in the laminate,
A line electrode serving as an inductor; and a capacitor formed in the laminate and electrically connected to the inductor, wherein the line electrode is provided in at least one dielectric layer in the laminate and has a hole corresponding to the line electrode. And a resonator formed by applying a conductor to the hole. 2. The resonator according to claim 1, wherein a hole corresponding to the line electrode is formed, and the dielectric layer provided with a conductor in the hole is a magnetic layer. 3. A laminate including a plurality of dielectric layers, formed on at least one dielectric layer in the laminate,
A plurality of line electrodes serving as inductors, and a plurality of capacitors formed in the laminate and electrically connected to the inductors, wherein the line electrodes are provided on at least one dielectric layer in the laminate. A filter formed by forming a hole corresponding to the hole and applying a conductor to the hole. 4. The filter according to claim 3, wherein a hole corresponding to the line electrode is formed, and the dielectric layer provided with a conductor in the hole is a magnetic layer.