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JPH08274060A - Substrate rotating device - Google Patents

Substrate rotating device

Info

Publication number
JPH08274060A
JPH08274060A JP7372895A JP7372895A JPH08274060A JP H08274060 A JPH08274060 A JP H08274060A JP 7372895 A JP7372895 A JP 7372895A JP 7372895 A JP7372895 A JP 7372895A JP H08274060 A JPH08274060 A JP H08274060A
Authority
JP
Japan
Prior art keywords
substrate
movable
turntable
claw
peripheral edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7372895A
Other languages
Japanese (ja)
Other versions
JP2891894B2 (en
Inventor
Atsushi Rokusha
淳 六車
Takahiko Hiroi
孝彦 広井
Shinya Uchida
伸也 内田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Nippon Sanso Corp
Original Assignee
Taiyo Toyo Sanso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Toyo Sanso Co Ltd filed Critical Taiyo Toyo Sanso Co Ltd
Priority to JP7372895A priority Critical patent/JP2891894B2/en
Publication of JPH08274060A publication Critical patent/JPH08274060A/en
Application granted granted Critical
Publication of JP2891894B2 publication Critical patent/JP2891894B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

(57)【要約】 【目的】 円形の基板を確実且つ容易に回転させること
ができ、基板表面については勿論、基板裏面についても
必要に応じて良好に洗浄させることができる基板回転装
置を提供する。 【構成】 環状の回転盤2は、その内周ギヤ2cに噛合
するピニオン3により、回転駆動される。回転盤2上に
は、基板周縁部8aを係合保持する複数の固定爪4と、
基板の周縁部8aを係合保持しうる基板保持位置と基板
周縁部8aから離間する基板保持解除位置とに亘って移
動自在な複数の可動爪5とが設けられている。各可動爪
5は、基板保持位置に附勢保持されており、シリンダ2
0を伸長さることにより基板保持解除位置に動作され
る。固定爪群と可動爪群とは、回転盤2の直径線X−X
を挟んで対向配置されている。
(57) [Abstract] [PROBLEMS] To provide a substrate rotating device capable of reliably and easily rotating a circular substrate and properly cleaning not only the front surface of the substrate but also the back surface of the substrate as necessary. . [Structure] An annular rotary disk 2 is rotationally driven by a pinion 3 meshing with an inner peripheral gear 2c thereof. On the turntable 2, a plurality of fixed claws 4 for engaging and holding the board peripheral portion 8a,
A plurality of movable claws 5 that are movable between a substrate holding position where the peripheral edge 8a of the substrate can be engaged and held and a substrate holding release position where the peripheral edge 8a is separated from the substrate peripheral edge 8a are provided. Each movable claw 5 is biased and held at the substrate holding position, and the cylinder 2
By extending 0, it is moved to the substrate holding release position. The fixed claw group and the movable claw group are the diameter line XX of the turntable 2.
They are arranged opposite to each other.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】円形をなすシリコンウエハ等の基
板は、例えば、基板を回転させつつこれに向けて超純水
等の洗浄流体を噴射させることにより洗浄されるが、本
発明は、かかる洗浄工程において基板を水平回転させる
ための基板回転装置に関するものである。
BACKGROUND OF THE INVENTION A circular substrate such as a silicon wafer is cleaned by, for example, rotating the substrate and spraying a cleaning fluid such as ultrapure water toward the substrate. The present invention relates to a substrate rotating device for horizontally rotating a substrate in a cleaning process.

【0002】[0002]

【従来の技術】従来のこの種の基板回転装置としては、
図8及び図9に示す如く、回転駆動される回転軸33の
上端部に円形の回転盤32を同心状に設け、回転盤32
の上面に吸引溝34aを形成すると共に、回転軸33に
吸引溝34aに開口し且つ真空ポンプの吸引部(図示せ
ず)に連通する吸引通路34bを形成して、シリコンウ
エハ等の基板8を、その裏面8cを回転盤32の上面に
吸着保持させた同心状態で、水平回転させるように構成
されたもの(以下「従来装置」という)がよく知られて
いる。而して、洗浄工程にあっては、図8に示す如く、
基板8を回転盤32上に吸着保持させた上、回転盤32
を回転軸33の駆動により所定速度で回転させながら、
回転盤32の上方に配置したノズル23から洗浄流体
(例えば、超純水又はこれを凍結させた微凍結粒との混
合スラリ)24を基板表面8bに向けて噴射させ、この
噴射流体により基板表面8bを全面的に洗浄するのであ
る。
2. Description of the Related Art As a conventional substrate rotating device of this type,
As shown in FIGS. 8 and 9, a circular rotary disc 32 is concentrically provided on the upper end of a rotary shaft 33 that is driven to rotate.
A suction groove 34a is formed on the upper surface of the substrate, a suction passage 34b is formed in the rotary shaft 33, the suction passage 34b opening to the suction groove 34a and communicating with a suction portion (not shown) of the vacuum pump, and the substrate 8 such as a silicon wafer is It is well known that the back surface 8c is sucked and held on the upper surface of the turntable 32 and is horizontally rotated in a concentric state (hereinafter referred to as "conventional apparatus"). In the cleaning process, as shown in FIG.
The substrate 8 is suction-held on the turntable 32, and then the turntable 32
While rotating the rotating shaft 33 at a predetermined speed,
A cleaning fluid (for example, ultrapure water or a mixed slurry of fine frozen particles obtained by freezing the same) 24 is jetted from a nozzle 23 arranged above the turntable 32 toward the substrate surface 8b, and the jet fluid causes the substrate surface to be jetted. 8b is entirely cleaned.

【0003】[0003]

【発明が解決しようとする課題】しかし、従来装置にあ
っては、基板裏面8cを回転盤32の上面に直接吸着さ
せるため、基板裏面8cが回転盤32との接触により汚
染されたり、傷付いたりする虞れがある。しかも、ノズ
ル23から噴射された洗浄流体24の一部が、基板表面
8bの洗浄後に吸引溝34aへと吸引されて、吸引通路
34bから真空ポンプ側へと侵入する虞れがあり、真空
ポンプの運転状態次第では、基板8の吸着保持が不安定
となる虞れがある。また、基板8を、その重心が回転盤
32の回転中心と一致させた状態(以下「適正状態」と
いう)で回転盤32に保持させておかないと、基板8が
遠心力により回転盤32から離脱して落下し、破損する
虞れがある。一方、かかる適正状態となるように基板8
を回転盤32上にセットすることは、極めて困難であ
り、かなりの熟練度を要する。また、基板8の洗浄は基
板裏面8cについても行う必要がある場合があるが、従
来装置では、基板裏面8cを全面的に回転盤32に吸着
保持させる構造であるため、基板裏面8cについての洗
浄はこれを行うことができない。
However, in the conventional apparatus, since the back surface 8c of the substrate is directly attracted to the upper surface of the turntable 32, the back surface 8c of the substrate is contaminated or scratched by the contact with the turntable 32. There is a risk that Moreover, part of the cleaning fluid 24 ejected from the nozzle 23 may be sucked into the suction groove 34a after cleaning the substrate surface 8b, and may enter the vacuum pump side from the suction passage 34b. Depending on the operating state, the suction and holding of the substrate 8 may become unstable. Further, unless the substrate 8 is held on the turntable 32 in a state where the center of gravity thereof coincides with the center of rotation of the turntable 32 (hereinafter referred to as “appropriate state”), the substrate 8 is removed from the turntable 32 by centrifugal force. It may come off, fall, and be damaged. On the other hand, the substrate 8 is set so as to be in such an appropriate state.
Is extremely difficult to set on the turntable 32 and requires a considerable degree of skill. Although it may be necessary to clean the substrate back surface 8c also on the substrate back surface 8c, the conventional apparatus has a structure in which the substrate back surface 8c is entirely adsorbed and held on the turntable 32, and therefore the substrate back surface 8c is cleaned. Can't do this.

【0004】本発明は、かかる点に鑑みてなされたもの
で、上記したような問題を生じることなく、円形の基板
を確実且つ容易に回転させることができ、基板表面につ
いては勿論、基板裏面についても必要に応じて良好に洗
浄させることができる基板回転装置を提供することを目
的とするものである。
The present invention has been made in view of the above points, and a circular substrate can be reliably and easily rotated without causing the above-mentioned problems. Another object of the present invention is to provide a substrate rotating device that can be satisfactorily cleaned as needed.

【0005】[0005]

【課題を解決するための手段】この課題を解決した本発
明の基板回転装置は、特に、水平回転自在に支持された
環状の回転盤と、回転盤を回転駆動させる駆動機構と、
回転盤上の一定位置に保持されており、円形の基板を回
転盤と同心状の水平状態に保持すべく基板の周縁部を係
合保持する複数の固定爪と、回転盤上に、固定爪に係合
保持させた基板の周縁部を係合保持しうる基板保持位置
と該基板の周縁部から所定量離間する基板保持解除位置
とに亘って水平揺動自在に設けられた複数の可動爪と、
各可動爪と回転盤との間に介装されており、当該可動爪
を前記両位置に亘って動作させる可動爪動作機構と、を
具備するものである。而して、固定爪群と可動爪群と
は、回転盤の直径線を挟んで対向配置されている。
A substrate rotating apparatus according to the present invention, which has solved the above-mentioned problems, particularly comprises an annular turntable supported so as to be horizontally rotatable, and a drive mechanism for rotationally driving the turntable.
A plurality of fixed claws that are held at a fixed position on the turntable and that engage and hold the peripheral edge of the substrate to hold the circular substrate in a horizontal state concentric with the turntable, and a fixed claw on the turntable. A plurality of movable claws horizontally swingably provided between a substrate holding position capable of engaging and holding the peripheral edge of the substrate engaged and held with the substrate and a substrate holding release position spaced from the peripheral edge of the substrate by a predetermined amount. When,
And a movable claw operating mechanism that is interposed between each movable claw and the turntable and that operates the movable claw across both positions. Thus, the fixed claw group and the movable claw group are arranged so as to face each other with the diameter line of the turntable interposed therebetween.

【0006】[0006]

【作用】洗浄工程の開始に当たっては、まず、基板を回
転盤上にこれと同心状の水平状態つまり適正状態にセッ
トさせる。すなわち、各可動爪を基板保持解除位置に位
置させた上、基板を固定爪群と可動爪群との間に挿入さ
せ、更に基板周縁部を各固定爪に係合保持させる。この
とき、固定爪群と可動爪群とが回転盤の直径線を挟んで
対向配置されていることから、基板周縁部を固定爪群に
係合保持させることによって、基板を適正状態に位置決
めし且つ保持させておくことができる。しかる後、各可
動爪を基板保持位置に動作させて基板周縁部に係合させ
る。これによって、基板は固定爪群及び可動爪群により
適正状態に確実に保持されることになる。
In starting the cleaning process, first, the substrate is set on the turntable in a horizontal state concentric with it, that is, in an appropriate state. That is, each movable claw is positioned at the substrate holding release position, the substrate is inserted between the fixed claw group and the movable claw group, and the board peripheral portion is engaged with and held by each fixed claw. At this time, since the fixed claw group and the movable claw group are arranged so as to face each other with the diameter line of the turntable interposed therebetween, the peripheral edge of the substrate is engaged and held by the fixed claw group to position the substrate in an appropriate state. And it can be held. After that, each movable claw is moved to the substrate holding position to be engaged with the peripheral portion of the substrate. This ensures that the substrate is held in an appropriate state by the fixed claw group and the movable claw group.

【0007】このように基板を回転盤上にセットさせた
上で、洗浄工程を開始する。すなわち、回転盤を回転駆
動させると共に、基板に向けて洗浄流体を噴出させる。
After the substrate is set on the turntable in this way, the cleaning process is started. That is, the rotating disk is driven to rotate and the cleaning fluid is ejected toward the substrate.

【0008】このとき、回転盤が環状のものであるた
め、基板裏面側には洗浄流体を噴出させるスペースが存
在することから、基板が周縁部のみを固定爪及び可動爪
により係合保持されているにすぎないこととも相俟っ
て、基板裏面についても、洗浄流体の噴出による洗浄を
行うことができる。すなわち、必要に応じて、基板表面
のみならず、基板裏面をも同時に洗浄させることができ
る。
At this time, since the rotating disk is annular, there is a space for ejecting the cleaning fluid on the back surface side of the substrate, so that the substrate is engaged and held only by the fixed pawl and the movable pawl. In addition to the above, the back surface of the substrate can be cleaned by jetting the cleaning fluid. That is, not only the front surface of the substrate but also the back surface of the substrate can be simultaneously cleaned as needed.

【0009】また、基板はその周縁部のみが係合保持さ
れているにすぎないことから、従来装置における如く基
板裏面が汚染されたり、傷付いたりすることがない。し
かも、基板は、その周縁部を固定爪群及び可動爪群によ
り径方向移動を阻止された状態で、回転盤と同心状に保
持されているから、回転による遠心力が作用した場合に
も、回転盤から離脱,落下するようなことが全くない。
Further, since the substrate is engaged and held only at its peripheral portion, the back surface of the substrate is not contaminated or scratched as in the conventional apparatus. Moreover, since the substrate is held concentrically with the turntable in a state where its peripheral portion is prevented from moving in the radial direction by the fixed claw group and the movable claw group, even when centrifugal force due to rotation acts, It never separates from the turntable or falls.

【0010】さらに、一般に、基板の重心はその中心位
置にあるから、基板を上記した如く回転盤と同心状に保
持させておくと、基板の重心と回転盤の回転中心とが一
致することになり、遠心力により基板が径方向に偏倚す
るような虞れがない。つまり、回転に伴い基板が振動す
るようなことがなく、固定爪群及び可動爪群による基板
保持が確実に行われる。
Further, in general, the center of gravity of the substrate is at the center position, so that if the substrate is held concentrically with the turntable as described above, the center of gravity of the substrate will coincide with the center of rotation of the turntable. Therefore, there is no fear that the substrate is radially displaced due to the centrifugal force. That is, the substrate does not vibrate with the rotation, and the fixed claw group and the movable claw group reliably hold the substrate.

【0011】以上のようにして基板表面又は基板両面の
洗浄が終了すると、各可動爪を基板保持解除位置にもた
らして基板周縁部から離脱させた上、基板を固定爪群か
ら離脱させるべく移動させることによって、回転盤から
取外す。このとき、各可動爪を基板保持解除位置へと動
作できること、固定爪群と可動爪群とが回転盤の直径線
を挟んで対向配置されていることから、各可動爪を基板
保持解除位置へと動作させることにより、基板を容易に
回転盤から取外すことができる。
When the cleaning of the substrate surface or both surfaces of the substrate is completed as described above, each movable claw is brought to the substrate holding release position to be separated from the peripheral edge of the substrate, and then the substrate is moved to be separated from the fixed claw group. By removing it from the turntable. At this time, since the movable claws can be moved to the substrate holding release position, and the fixed claw group and the movable claw group are arranged to face each other with the diameter line of the turntable interposed therebetween, the movable claws are moved to the substrate holding release position. The substrate can be easily removed from the turntable by operating the.

【0012】[0012]

【実施例】以下、本発明の構成を図1〜図7に示す実施
例に基づいて具体的に説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The construction of the present invention will be specifically described below with reference to the embodiments shown in FIGS.

【0013】この実施例の基板回転装置1は、図1〜図
4に示す如く、回転盤2と、これを回転駆動させる駆動
機構3と、回転盤2上に設けられた複数の固定爪4…及
び可動爪5…と、各可動爪5を動作させる各可動爪動作
機構6とを具備してなり、洗浄槽内に配置された移動架
台7上に取付けられている。
As shown in FIGS. 1 to 4, the substrate rotating apparatus 1 of this embodiment has a rotating disk 2, a drive mechanism 3 for rotating the rotating disk 2, and a plurality of fixed claws 4 provided on the rotating disk 2. .. and movable claws 5 and movable claw operation mechanisms 6 for operating the movable claws 5, and are mounted on a movable base 7 arranged in the cleaning tank.

【0014】回転盤2は、図1及び図4に示す如く、内
径部をシリコンウエハ等の円形状基板8より大径とした
円環状の本体2a及びその上面に着脱自在に取付けた支
持台2bからなり、本体2aと移動架台7に固着した円
環状の支持体9との間に介装したベアリング10によ
り、移動架台7上に水平回転自在に支持されている。な
お、本体2aと支持体9との間には、円環状の凹凸から
なるラビリンス11a,11bが形成されていて、洗浄
液等のベアリング10への侵入を防止すべく工夫されて
いる。
As shown in FIGS. 1 and 4, the turntable 2 has an annular main body 2a having an inner diameter larger than that of a circular substrate 8 such as a silicon wafer, and a support base 2b detachably attached to the upper surface thereof. The bearing 10 is interposed between the main body 2a and the annular support 9 fixed to the movable base 7, and is supported on the movable base 7 so as to be horizontally rotatable. Between the main body 2a and the support 9, labyrinths 11a and 11b having annular irregularities are formed, and are devised so as to prevent invasion of cleaning liquid or the like into the bearing 10.

【0015】駆動機構3は、図1及び図4に示す如く、
回転盤2の本体2aの内径部に形成した大径の内歯状ギ
ヤ2cと、移動架台7に取付けた駆動モータ12と、そ
のモータ駆動軸に取付けられて前記ギヤ2cに噛合する
ピニオンギヤ12aとを具備してなり、駆動モータ12
により回転盤2を所定速度で一定方向に回転駆動させる
ように構成されている。
The drive mechanism 3 is, as shown in FIGS. 1 and 4,
A large-diameter internal tooth gear 2c formed on the inner diameter portion of the main body 2a of the turntable 2, a drive motor 12 attached to the moving base 7, and a pinion gear 12a attached to the motor drive shaft and meshing with the gear 2c. Drive motor 12
Thus, the turntable 2 is rotationally driven in a fixed direction at a predetermined speed.

【0016】固定爪群4…と可動爪群5…とは、図1に
示す如く、回転盤2上にその直径線X−Xを挟んで対向
配置されており、夫々、次のように構成されている。な
お、この実施例では、4個の固定爪4…と2個の可動爪
5…とを設けてある。
As shown in FIG. 1, the fixed claw group 4 and the movable claw group 5 are arranged so as to face each other on the rotary table 2 with the diameter line XX interposed therebetween, and each has the following structure. Has been done. In this embodiment, four fixed claws 4 ... And two movable claws 5 ... Are provided.

【0017】各固定爪4は、図1〜図4、図6及び図7
に示す如く、基板8の周縁部8aに係合しうる略V字形
の係合凹部4aを形成した矩形ブロック状のものであ
り、回転盤2の支持台2b上に一対の水平支軸13,1
3及びコイルバネ14,14を介して回転盤2の径方向
に進退可能に附勢保持されている。すなわち、図6に示
す如く、固定爪4に固着した一対の水平支軸13,13
を支持台2b上に立設した支持体15に回転盤2の径方
向に進退自在に支持させると共に、各水平支軸13に固
定爪4と支持体15との間に配してコイルバネ14を嵌
挿し、且つ固定爪4の回転盤2の中心方向へのコイルバ
ネ14,14による変位量を各水平支軸13の端部に取
付けたストッパ13aにより規制することによって、固
定爪4を、基板8を回転盤2と同心状に係合保持しうる
一定位置に、附勢保持させてある(図1参照)。すなわ
ち、各固定爪4は、図7に示す如く、コイルバネ14,
14及びストッパ13aにより、係合凹部4aが基板周
縁部8aを係合保持しうる前記一定位置たる位置決め位
置(図7(A)位置)に、係合凹部4aが基板周縁部8
aから離間する方向へと移動可能な状態で附勢保持され
ている。なお、各固定爪4には、その支持手段(水平支
軸13等)の上面側をカバーするカバー16が取付けら
れており、水平支軸13,13はカバー16に固着され
ている。
Each fixed claw 4 is shown in FIGS. 1 to 4, 6 and 7.
As shown in FIG. 2, it is of a rectangular block shape in which a substantially V-shaped engaging concave portion 4a that can be engaged with the peripheral edge portion 8a of the substrate 8 is formed, and a pair of horizontal support shafts 13, 1
Via 3 and the coil springs 14 and 14, the turntable 2 is urged and held so as to be able to advance and retract in the radial direction. That is, as shown in FIG. 6, a pair of horizontal support shafts 13 and 13 fixed to the fixed claw 4 is provided.
Is supported by a support member 15 provided upright on the support base 2b so as to be movable back and forth in the radial direction of the turntable 2, and each horizontal support shaft 13 is arranged between the fixed claw 4 and the support member 15 to have a coil spring 14 attached thereto. The fixed claw 4 is inserted into the fixed claw 4 in the direction of the center of the turntable 2 by the coil springs 14, 14 and the displacement of the fixed claw 4 is regulated by the stopper 13a attached to the end of each horizontal support shaft 13. Is urged and held at a fixed position where it can be engaged and held concentrically with the turntable 2 (see FIG. 1). That is, as shown in FIG. 7, each fixed claw 4 has a coil spring 14,
14 and the stopper 13a, the engaging concave portion 4a is located at the positioning position (position shown in FIG. 7A) which is the fixed position where the engaging concave portion 4a can engage and hold the substrate peripheral portion 8a.
It is urged and held so as to be movable in a direction away from a. A cover 16 is attached to each of the fixed claws 4 to cover the upper surface side of the supporting means (horizontal support shaft 13 or the like), and the horizontal support shafts 13 and 13 are fixed to the cover 16.

【0018】各可動爪5は、図1〜図4及び図5に示す
如く、基板周縁部8aに係合しうる略V字形の係合凹部
5aを形成した固定爪4と同様の矩形ブロック状のもの
であり、回転盤2の支持台2bに立設した鉛直支軸17
により水平揺動自在に軸支された揺動体18に取付けら
れていて、基板8を固定爪4…により回転盤2と同心状
に水平保持させたときにおいて基板周縁部8aを係合保
持しうる基板保持位置(図1及び図5に示す位置)と、
基板周縁部8aから所定量離間する基板保持解除位置
(図3に示す位置)とに亘って、水平揺動自在とされて
いる。
As shown in FIGS. 1 to 4 and 5, each movable claw 5 has a rectangular block shape similar to the fixed claw 4 having a substantially V-shaped engaging recess 5a which can be engaged with the substrate peripheral edge 8a. And a vertical support shaft 17 which is erected on the support base 2b of the turntable 2.
Is attached to an oscillating body 18 which is horizontally swingably supported by, and when the substrate 8 is horizontally held concentrically with the turntable 2 by the fixing claws 4, the substrate peripheral portion 8a can be engaged and held. A substrate holding position (the position shown in FIGS. 1 and 5),
It is horizontally swingable over a substrate holding release position (a position shown in FIG. 3) that is separated from the substrate peripheral portion 8a by a predetermined amount.

【0019】各可動爪動作機構6は、図1〜図5に示す
如く、回転盤2の支持台2bと揺動体18との間に介装
した線状バネ19と、回転盤2の本体2aに取付けた可
動爪動作体たる空気圧シリンダ20とからなる。バネ1
9は、図4及び図5に示す如く、中央部分をコイル状に
巻回したもので、コイル状部分を鉛直支軸17に嵌挿支
持させ、一端部を支持台2b側のピン21に係止させる
と共に他端部を揺動体18側のピン22に係止させるこ
とによって、揺動体18つまり可動爪5を基板保持位置
方向に附勢している。また、空気圧シリンダ20は揺動
体18を押圧揺動させうるピストンロッド20aを有す
るもので、揺動体18に取付けられた可動爪5をバネ1
9に抗して基板保持解除位置へと動作させる最伸長位置
たる作動位置(図2及び図3に示す位置)と可動爪5を
何ら動作させ得ない最縮小位置たる非作動位置(図1に
示す位置)とに亘って、ピストンロッド20aを回転盤
2の径方向に伸縮させるものである。ピストンロッド2
0aを作動位置から非作動位置にもたらすと、可動爪5
がバネ19により基板保持解除位置から基板保持位置へ
と自動復帰され、該位置に保持されることになるが、作
動位置に位置するピストンロッド20aは揺動体18か
ら所定量離間しており、可動爪5の基板保持解除位置へ
の変位(バネ19に抗しての揺動変位)を妨げないよう
になっている。つまり、ピストンロッド20aを非作動
位置に位置させた状態では、可動爪5はバネ19により
基板保持位置に附勢保持されるも、基板保持解除位置方
向への一定以上の負荷(バネ19の附勢力を超える負
荷)が作用した場合には、バネ19に抗して適正状態に
ある基板8の周縁部8aから係合凹部5aが離脱する状
態へと変位されうるようになっている。
As shown in FIGS. 1 to 5, each movable claw operating mechanism 6 has a linear spring 19 interposed between a support base 2b of the rotary disc 2 and an oscillating body 18, and a main body 2a of the rotary disc 2. And a pneumatic cylinder 20 which is a movable claw operating body attached to the. Spring 1
As shown in FIGS. 4 and 5, reference numeral 9 denotes a coil in which a central portion is wound in a coil shape. The coiled portion is inserted into and supported by the vertical support shaft 17, and one end is engaged with the pin 21 on the support base 2b side. By stopping and stopping the other end with the pin 22 on the side of the rocking body 18, the rocking body 18, that is, the movable claw 5 is urged toward the substrate holding position. Further, the pneumatic cylinder 20 has a piston rod 20a capable of oscillating the oscillating body 18 and pushes the movable pawl 5 attached to the oscillating body 18 into the spring 1.
The operating position (the position shown in FIGS. 2 and 3) which is the most extended position for moving the substrate holding release position against 9 and the non-operating position which is the most contracted position where the movable claw 5 cannot be operated (see FIG. 1). (The position shown), the piston rod 20a is expanded and contracted in the radial direction of the turntable 2. Piston rod 2
0a from the operating position to the non-operating position, the movable claw 5
Is automatically returned from the substrate holding release position to the substrate holding position by the spring 19 and is held at that position, but the piston rod 20a located at the operating position is separated from the oscillating body 18 by a predetermined amount and is movable. Displacement of the claw 5 to the substrate holding release position (swing displacement against the spring 19) is not hindered. That is, when the piston rod 20a is in the non-actuated position, the movable claw 5 is urged and held in the substrate holding position by the spring 19, but a load of a certain amount or more in the direction of the substrate holding release position (the spring 19 is urged). When a load exceeding the force acts, the engaging recess 5a can be displaced against the spring 19 from the peripheral portion 8a of the substrate 8 in a proper state.

【0020】なお、上記各バネ14,19による附勢力
は、基板8を固定爪4…及び可動爪5…により保持させ
た場合において、基板8が回転盤2と同心位置に位置す
べくバランスされ且つ回転盤2による回転力によっても
基板8が適正状態に維持されることを条件として、可及
的に小さく設定しておくことが望ましい。
The biasing forces of the springs 14 and 19 are balanced so that the substrate 8 is located at the concentric position with the turntable 2 when the substrate 8 is held by the fixed claws 4 and the movable claws 5. Moreover, it is desirable to set the substrate 8 as small as possible on the condition that the substrate 8 is maintained in an appropriate state by the rotating force of the turntable 2.

【0021】ところで、移動架台7は、洗浄開始位置と
該位置から基板8の半径に略一致する距離だけ離れた洗
浄終了位置との間に亘って往復直線移動されるようにな
っている。そして、この移動架台7の移動経路上には、
回転盤2上に保持された基板8に向けて洗浄流体24を
噴出する上下一対のノズル23a,23bが固定配置さ
れている。両ノズル23a,23bは、基板8の表裏面
8b,8cにおける同一箇所に向けて洗浄流体24を噴
出させるもので、移動架台7を洗浄開始位置に位置させ
た状態では、洗浄流体24を基板8の中心に向けて噴出
させ(図1鎖線図示参照)、移動架台7を洗浄終了位置
に位置させた状態では、洗浄流体24を基板8の周縁部
8aに向けて噴出させる(図1及び図4実線図示参照)
ようになっている。すなわち、移動架台7の洗浄開始位
置から洗浄終了位置への移動に伴って、各ノズル23
a,23bから噴出される洗浄流体24の基板表面8b
及び基板裏面8cへの衝突位置が、基板8の中心位置か
ら周縁位置へと相対的に直線移動されるようになってい
る。なお、下ノズル23bは、移動架台7の移動によっ
ては回転盤2に干渉しないように、回転盤2の内径部に
臨んで配置されている。
By the way, the movable pedestal 7 is adapted to reciprocate linearly between a cleaning start position and a cleaning end position separated from the position by a distance substantially corresponding to the radius of the substrate 8. Then, on the moving path of this moving base 7,
A pair of upper and lower nozzles 23a, 23b for ejecting the cleaning fluid 24 toward the substrate 8 held on the turntable 2 are fixedly arranged. Both of the nozzles 23a and 23b eject the cleaning fluid 24 toward the same positions on the front and back surfaces 8b and 8c of the substrate 8, and when the movable platform 7 is located at the cleaning start position, the cleaning fluid 24 is ejected. Of the cleaning fluid 24 is ejected toward the center of the substrate 8 (see the chain line in FIG. 1), and the cleaning fluid 24 is ejected toward the peripheral edge 8a of the substrate 8 in the state where the movable gantry 7 is positioned at the cleaning end position (FIGS. 1 and 4). (See the solid line illustration)
It has become. That is, as the movable base 7 moves from the cleaning start position to the cleaning end position, each nozzle 23
Substrate surface 8b of cleaning fluid 24 jetted from a and 23b
Further, the collision position on the back surface 8c of the substrate is relatively linearly moved from the central position of the substrate 8 to the peripheral position. The lower nozzle 23b is arranged so as to face the inner diameter portion of the turntable 2 so as not to interfere with the turntable 2 due to the movement of the movable mount 7.

【0022】以上のように構成された基板回転装置1を
使用すれば、従来装置を使用した場合におけるような問
題を生じることなく、基板8の洗浄を容易に且つ良好に
行うことができる。
By using the substrate rotating device 1 configured as described above, the substrate 8 can be easily and satisfactorily cleaned without causing the problems as in the case of using the conventional device.

【0023】洗浄工程の開始に当たっては、基板8を回
転盤2上にこれと同心状の適正状態にセットさせるが、
かかるセット作業は何らの熟練を必要とせず極めて容易
に行うことができる。すなわち、まず、各空気圧シリン
ダ20を最伸長させて各可動爪5を基板保持解除位置に
位置させた上、基板8を固定爪4…と可動爪5…との間
に挿入させる(図3参照)。そして、基板周縁部8aを
各固定爪4の係合凹部4aに係合させる(図2参照)。
このとき、固定爪群4…と可動爪群5…とが回転盤2の
直径線X−Xを挟んで対向配置されていることから、基
板周縁部8aを固定爪群4…の係合凹部4a…に係合保
持させることによって、基板8を適正状態に位置決めし
且つ保持させておくことができる。しかる後、各空気圧
シリンダ20を最縮小させると、各可動爪5はバネ19
により基板保持位置に自動的復帰して、各可動爪5の係
合凹部5aが基板周縁部8aに係合する。これによっ
て、基板8は、回転盤2と同心の適正状態に確実に保持
されることになる(図1及び図4参照)。したがって、
何らの熟練を必要とするなく、基板8を回転盤2と同心
状の水平状態に容易に且つ確実にセットさせることがで
きる。また、ロボットによるセットも可能となる。
At the start of the cleaning process, the substrate 8 is set on the turntable 2 in an appropriate state concentric with it.
Such setting work can be performed extremely easily without requiring any skill. That is, first, each pneumatic cylinder 20 is fully extended to position each movable claw 5 at the substrate holding release position, and then the substrate 8 is inserted between the fixed claws 4 and the movable claws 5 (see FIG. 3). ). Then, the board peripheral portion 8a is engaged with the engagement concave portion 4a of each fixing claw 4 (see FIG. 2).
At this time, since the fixed claw group 4 and the movable claw group 5 are arranged so as to face each other with the diameter line XX of the turntable 2 interposed therebetween, the board peripheral edge portion 8a is engaged with the fixed claw group 4. The substrate 8 can be positioned and held in an appropriate state by engaging and holding the substrates 4a. After that, when the pneumatic cylinders 20 are reduced to the maximum size, the movable claws 5 move to the springs 19.
Thus, the movable claw 5 is automatically returned to the substrate holding position, and the engaging concave portions 5a of the movable claws 5 are engaged with the substrate peripheral edge portion 8a. This ensures that the substrate 8 is held in a proper state concentric with the turntable 2 (see FIGS. 1 and 4). Therefore,
It is possible to easily and surely set the substrate 8 in a horizontal state concentric with the turntable 2 without requiring any skill. Also, setting by a robot is possible.

【0024】このように基板8を適正状態にセットさせ
た上、モータ12を起動して回転盤2を回転させると共
に、各ノズル23a,23bから洗浄流体24を噴出さ
せて、基板8の表裏面8b,8cを同時に洗浄させる。
そして、基板8における洗浄箇所つまり洗浄流体の衝突
箇所は、移動架台7を洗浄開始位置から洗浄終了位置へ
と移動させるに伴って、基板中心部から基板周縁部へと
相対的に変位していき、基板8が回転されていることと
も相俟って、基板表面8b及び基板裏面8cが全面的に
洗浄される。
After the substrate 8 is set in the proper state in this way, the motor 12 is started to rotate the turntable 2 and the cleaning fluid 24 is ejected from each of the nozzles 23a and 23b, so that the front and back surfaces of the substrate 8 are ejected. 8b and 8c are washed at the same time.
Then, the cleaning portion on the substrate 8, that is, the collision portion of the cleaning fluid, is relatively displaced from the central portion of the substrate to the peripheral portion of the substrate as the moving platform 7 is moved from the cleaning start position to the cleaning end position. In addition to the fact that the substrate 8 is rotated, the substrate front surface 8b and the substrate back surface 8c are entirely cleaned.

【0025】このとき、基板8がその周縁部8aのみを
保持されていることから、従来装置における如く基板裏
面8cが汚染されたり、傷付いたりすることがない。ま
た、基板8は、その周縁部8aを固定爪4…及び可動爪
5…により径方向移動を阻止された状態で、回転盤2と
同心状に保持されているから、回転による遠心力が作用
した場合にも、回転盤2から離脱,落下するようなこと
が全くない。しかも、一般に、基板8の重心はその中心
位置にあるから、基板8を上記した如く回転盤2と同心
状に保持させておくと、基板8の重心と回転盤2の回転
中心とが一致することになり、遠心力により基板8が径
方向に偏倚するような虞れがない。つまり、回転に伴い
基板8が振動するようなことがなく、固定爪4…及び可
動爪5…による基板保持が確実に行われる。
At this time, since the substrate 8 is held only on the peripheral portion 8a, the back surface 8c of the substrate is not contaminated or scratched as in the conventional apparatus. Further, the substrate 8 is held concentrically with the turntable 2 in a state where the peripheral edge portion 8a thereof is prevented from moving in the radial direction by the fixed claws 4 and the movable claws 5, so that centrifugal force due to rotation acts. Even if it is done, there is no possibility that it will fall out of the turntable 2 or fall. Moreover, in general, the center of gravity of the substrate 8 is at the center position thereof, so that if the substrate 8 is held concentrically with the turntable 2 as described above, the center of gravity of the substrate 8 and the rotation center of the turntable 2 coincide. Therefore, there is no possibility that the substrate 8 will be displaced in the radial direction due to the centrifugal force. In other words, the substrate 8 does not vibrate with the rotation, and the fixed claws 4 and the movable claws 5 reliably hold the substrate.

【0026】ところで、洗浄残滓は遠心力とノズル23
a,23bからの噴出流体24によって基板8上をその
周縁部方向へと流動し、基板外に飛散するが、固定爪4
…及び可動爪5…によって係合保持されて箇所において
は、係合凹部4a…,5a…に洗浄残滓が侵入,堆積す
るため、これが洗浄後も基板8に付着,残存して、基板
8の清浄化が不十分となる虞れがある。しかし、かかる
虞れは、次のような作用により完全に排除される。
By the way, the cleaning residue is centrifugal force and the nozzle 23.
The fluid 24 ejected from a and 23b flows on the substrate 8 in the direction of the peripheral edge thereof and is scattered outside the substrate.
... and the movable claws 5 are engaged and held, the cleaning residue enters and accumulates in the engaging recesses 4a, 5a, so that the cleaning residue adheres to and remains on the substrate 8 even after cleaning. There is a risk that the cleaning will be insufficient. However, such fear is completely eliminated by the following actions.

【0027】すなわち、固定爪4又は可動爪5には、こ
れが回転盤2の回転に伴ってノズル23a,23bに直
対向する位置にもたらされたとき、ノズル23a,23
bから噴出される洗浄流体24,24が衝突して、バネ
14,19に抗する方向への押圧力が作用することにな
る。而して、洗浄工程の初期段階つまり移動架台4が洗
浄開始位置ないしその近傍に位置している段階では、洗
浄流体24,24がノズル23a,23bから基板周縁
部8aから離れた箇所に噴出されているため、上記押圧
力がバネ14,19による附勢力に比して小さく、固定
爪4又は可動爪5がバネ14,19により基板周縁部8
aを係合保持しうる位置から変位しない(図7(A)参
照)。しかし、洗浄工程の終了段階つまり移動架台4が
洗浄開始位置に位置する段階に近づくと、洗浄流体2
4,24の噴射箇所が固定爪4又は可動爪5に近づくた
め、上記押圧力が大きくなってバネ14,19による附
勢力に打ち勝ちようになり、ノズル23a,23bに直
対向する位置にもたらされた固定爪4又は可動爪5がバ
ネ14,19に抗して変位し、基板周縁部8aから離脱
することになる(図7(B)参照)。その結果、基板周
縁部8aから離脱した固定爪4又は可動爪5の係合凹部
4a,5aに侵入,堆積した洗浄残渣は、洗浄流体2
4,24により洗い流され、基板周縁部8aに残留する
ことがない。したがって、基板8の表裏面8b,8c
を、固定爪4…及び可動爪5…で保持させた部分を含め
て、全面的且つ完璧に清浄化することができる。なお、
一の固定爪4又は可動爪5が基板周縁部8aから離脱し
た場合にも、基板8は他の固定爪4…及び可動爪5…に
よって保持されていることから、固定爪4及び可動爪5
の設置数及び設置場所を適当に設定しておく(例えば、
図1参照)ことにより、全体として基板8を適正状態に
保持する機能は何ら損なわれない。
That is, when the fixed claw 4 or the movable claw 5 is brought to a position directly opposite to the nozzles 23a, 23b as the turntable 2 rotates, the nozzles 23a, 23b.
The cleaning fluids 24, 24 ejected from b collide with each other, and a pressing force in the direction against the springs 14, 19 acts. Thus, at the initial stage of the cleaning process, that is, at the stage where the movable pedestal 4 is located at or near the cleaning start position, the cleaning fluids 24, 24 are jetted from the nozzles 23a, 23b to a position away from the substrate peripheral edge 8a. Therefore, the pressing force is smaller than the urging force of the springs 14 and 19, and the fixed claw 4 or the movable claw 5 is supported by the springs 14 and 19 on the substrate peripheral edge portion 8.
It is not displaced from the position where a can be engaged and held (see FIG. 7A). However, when approaching the end stage of the cleaning process, that is, the stage in which the movable base 4 is located at the cleaning start position,
Since the injection points of 4, 24 approach the fixed claw 4 or the movable claw 5, the pressing force increases and tends to overcome the urging force of the springs 14, 19 to bring them to positions directly opposite the nozzles 23a, 23b. The fixed claws 4 or the movable claws 5 thus displaced are displaced against the springs 14 and 19 and separated from the substrate peripheral portion 8a (see FIG. 7B). As a result, the cleaning residue that has entered and accumulated in the engaging recesses 4a and 5a of the fixed claw 4 or the movable claw 5 that has separated from the substrate peripheral edge 8a is the cleaning fluid 2
It is washed away by Nos. 4 and 24 and does not remain on the substrate peripheral edge 8a. Therefore, the front and back surfaces 8b, 8c of the substrate 8
Can be completely and completely cleaned including the part held by the fixed claws 4 ... and the movable claws 5. In addition,
Even when one fixed claw 4 or the movable claw 5 is detached from the substrate peripheral edge portion 8a, the substrate 8 is held by the other fixed claws 4 ... and the movable claws 5 ...
Set the number and installation location of the
1), the function of holding the substrate 8 in a proper state as a whole is not impaired.

【0028】基板洗浄の終了後は、各可動爪5を空気圧
シリンダ20により基板保持解除位置にもたらして基板
周縁部8aから離脱させた上(図2参照)、基板8を固
定爪4…から離脱させるべく移動させることによって
(図3参照)、回転盤2から取外す。このとき、可動爪
5…を基板保持解除位置へと動作できること、固定爪群
4…と可動爪群5…とが回転盤2の直径線X−Xを挟ん
で対向配置されていることから、可動爪5…を基板保持
解除位置へと動作させた上で、基板8を上記直交線X−
Xと直交する方向に水平移動させるだけで、基板8を容
易に回転盤2から取外すことができる。なお、固定爪4
…及び可動爪5…を支持させた支持台2bは回転盤2の
本体2aに着脱自在となっているから、固定爪4…及び
可動爪5…の配置を異にする支持台2bを複数種類用意
しておくことにより、基板回転装置1を径の異なる基板
8に対して汎用的に適用することが可能となり、便利で
ある。
After the substrate cleaning is completed, each movable claw 5 is brought to the substrate holding release position by the pneumatic cylinder 20 to be removed from the substrate peripheral portion 8a (see FIG. 2), and the substrate 8 is removed from the fixed claws 4 ... It is removed from the turntable 2 by moving it (see FIG. 3). At this time, since the movable claws 5 can be moved to the substrate holding release position, and the fixed claw group 4 and the movable claw group 5 are arranged to face each other with the diameter line XX of the turntable 2 interposed therebetween, After moving the movable claws 5 to the substrate holding release position, the substrate 8 is moved to the orthogonal line X-.
The substrate 8 can be easily removed from the turntable 2 only by horizontally moving in the direction orthogonal to X. The fixed claw 4
, And the movable claws 5 are supported on the main body 2a of the turntable 2 so that the fixed claws 4 and the movable claws 5 have different arrangements. By preparing the substrate rotating device 1, it is possible to apply the substrate rotating device 1 to substrates 8 having different diameters, which is convenient.

【0029】なお、本発明は上記各実施例に限定される
ものではなく、本発明の基本原理を逸脱しない範囲にお
いて、適宜に変更,改良することができる。
The present invention is not limited to the above-mentioned embodiments, but can be appropriately changed and improved without departing from the basic principle of the present invention.

【0030】例えば、固定爪4及び可動爪5の数,形状
は任意であり、基板8の形状等に応じて適宜に設定する
ことができる。また、各固定爪4は、上記実施例の如く
附勢保持させることなく、一定位置に固定させるように
しておいてもよい。また、駆動機構3の構成は任意であ
り、例えば外歯状ギヤ10に代えて内歯状ギヤを使用し
てもよい。また、可動爪動作機構6の構成も任意であ
り、例えば、上記実施例の如く基板保持位置へと附勢保
持させず、シリンダ等により基板保持位置と基板保持解
除位置とに選択的に動作させるように構成してもよい。
さらに、上記実施例では、本発明を基板表面8bのみな
らず基板裏面8cをも洗浄する場合に適用したが、基板
表面8bのみを洗浄する場合にも当然に適用することが
できる。
For example, the numbers and shapes of the fixed claws 4 and the movable claws 5 are arbitrary and can be appropriately set according to the shape of the substrate 8. Further, each fixing claw 4 may be fixed at a fixed position without being biased and held as in the above embodiment. Further, the configuration of the drive mechanism 3 is arbitrary, and for example, an internal gear may be used instead of the external gear 10. Further, the structure of the movable claw operating mechanism 6 is also arbitrary, and for example, it is not urgingly held to the substrate holding position as in the above-mentioned embodiment, but is selectively moved to the substrate holding position and the substrate holding releasing position by a cylinder or the like. It may be configured as follows.
Furthermore, in the above-described embodiment, the present invention is applied to the case of cleaning not only the substrate front surface 8b but also the substrate back surface 8c, but it is naturally applicable to the case of cleaning only the substrate front surface 8b.

【0031】[0031]

【発明の効果】以上の説明から容易に理解されるよう
に、請求項1の発明によれば、基板を、基板裏面を汚染
させたり傷付けたりすることなく、回転盤上の適正位置
に確実に保持させた状態で、安定して回転させることが
できる。また、基板の回転盤上への取付,取外を容易に
且つ効率良く行うことができる。しかも、回転盤を環状
のものとして、基板裏面下に洗浄流体の噴出領域を確保
できるようにしたから、基板表面のみならず基板裏面を
も洗浄させることができる。したがって、本発明の基板
回転装置を使用すれば、冒頭で述べた如き問題を生じる
ことなく、基板の洗浄を極めて良好且つ効率良く行うこ
とができる。
As can be easily understood from the above description, according to the first aspect of the invention, the substrate can be securely placed at the proper position on the turntable without contaminating or scratching the back surface of the substrate. It can be stably rotated while being held. In addition, the substrate can be easily and efficiently attached to and removed from the turntable. In addition, since the rotating disk has an annular shape and a jetting region of the cleaning fluid can be secured below the back surface of the substrate, not only the front surface of the substrate but also the back surface of the substrate can be cleaned. Therefore, if the substrate rotating device of the present invention is used, the substrate can be cleaned extremely favorably and efficiently without causing the problems described at the beginning.

【0032】さらに、請求項2の発明によれば、基板周
縁部の固定爪及び可動爪による係合部分における洗浄残
滓付着を確実に防止し、基板の洗浄による清浄化を極め
て完全に行うことができる。
Further, according to the second aspect of the present invention, it is possible to surely prevent the cleaning residue from adhering to the engaging portion by the fixed claw and the movable claw on the peripheral edge of the substrate, and to perform the cleaning by cleaning the substrate quite completely. it can.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る基板回転装置の一実施例を示した
もので、基板周縁部を固定爪群及び可動爪群に係合保持
させた状態を示す平面図である。
FIG. 1 shows an embodiment of a substrate rotating device according to the present invention, and is a plan view showing a state where a peripheral edge portion of a substrate is engaged and held by a fixed claw group and a movable claw group.

【図2】基板周縁部を固定爪群にのみ係合保持させた状
態を示す図1相当の平面図である。
FIG. 2 is a plan view corresponding to FIG. 1, showing a state in which the peripheral edge of the substrate is engaged and held only by a fixed claw group.

【図3】基板周縁部が固定爪群及び可動爪群の何れにも
係合しない状態を示す図1相当の平面図である。
FIG. 3 is a plan view corresponding to FIG. 1 showing a state where the peripheral edge of the substrate is not engaged with either the fixed claw group or the movable claw group.

【図4】図1のIV−IV線に沿う断面図である。FIG. 4 is a sectional view taken along line IV-IV in FIG.

【図5】図1のV部(可動爪)を拡大して示す一部切欠
の平面図である。
5 is a partially cutaway plan view showing an enlarged V portion (movable claw) of FIG. 1. FIG.

【図6】図1のVI部を(固定爪)を拡大して示す一部切
欠の平面図である。
FIG. 6 is a partially cutaway plan view showing a VI portion (fixed claw) of FIG. 1 in an enlarged manner.

【図7】図6のVII−VII線に沿う断面図である。7 is a sectional view taken along line VII-VII of FIG.

【図8】従来装置を示す縦断側面図である。FIG. 8 is a vertical sectional side view showing a conventional device.

【図9】図9のIX−IX線に沿う横断平面図である。9 is a cross-sectional plan view taken along the line IX-IX in FIG.

【符号の説明】[Explanation of symbols]

1…基板回転装置、2…回転盤、3…駆動機構、4…固
定爪、4a,5a…係合凹部、5…可動爪、6…可動爪
動作機構、7…移動架台、8…基板、8a…基板周縁
部、8b…基板表面、8c…基板裏面、9…ベアリン
グ、14…コイルバネ、19…線状バネ、20…空気圧
シリンダ(可動爪動作体)。
DESCRIPTION OF SYMBOLS 1 ... Substrate rotating device, 2 ... Rotating plate, 3 ... Driving mechanism, 4 ... Fixed claw, 4a, 5a ... Engagement recessed part, 5 ... Movable claw, 6 ... Movable claw operating mechanism, 7 ... Moving stand, 8 ... Board, Reference numeral 8a ... Substrate peripheral portion, 8b ... Substrate front surface, 8c ... Substrate rear surface, 9 ... Bearing, 14 ... Coil spring, 19 ... Linear spring, 20 ... Pneumatic cylinder (movable pawl operating body).

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 水平回転自在に支持された環状の回転盤
と、回転盤を回転駆動させる駆動機構と、回転盤上の一
定位置に保持されており、円形の基板を回転盤と同心状
の水平状態に保持すべく基板の周縁部を係合保持する複
数の固定爪と、回転盤上に、固定爪に係合保持させた基
板の周縁部を係合保持しうる基板保持位置と該基板の周
縁部から所定量離間する基板保持解除位置とに亘って移
動自在に設けられた複数の可動爪と、各可動爪と回転盤
との間に介装されており、当該可動爪を前記両位置に亘
って動作させる可動爪動作機構と、を具備し、固定爪群
と可動爪群とが回転盤の直径線を挟んで対向配置されて
いることを特徴とする基板回転装置。することを特徴と
する基板回転装置。
1. An annular turntable supported rotatably horizontally, a drive mechanism for driving the turntable to rotate, and a circular substrate concentric with the turntable that is held at a fixed position on the turntable. A plurality of fixed claws that engage and hold the peripheral edge of the substrate to hold the substrate in a horizontal state, a substrate holding position that can engage and hold the peripheral edge of the substrate engaged and held by the fixed claw on the turntable, and the substrate. A plurality of movable claws movably provided to a substrate holding release position spaced apart from the peripheral edge of the movable claw by a predetermined amount, and the movable claws are interposed between the movable claws and the turntable. And a movable claw operating mechanism that moves the movable claw across a position, and the fixed claw group and the movable claw group are arranged to face each other with the diameter line of the turntable interposed therebetween. A substrate rotating device characterized by:
【請求項2】 各固定爪及び可動爪は、基板の周縁部を
係合保持しうる係合凹部を有するものであり、各固定爪
は、その係合凹部が基板の周縁部を係合保持しうる前記
一定位置たる位置決め位置に、該係合凹部が基板の周縁
部から離間する方向へと移動可能な状態で附勢保持され
ており、各可動爪動作機構が、可動爪を基板保持位置へ
と附勢保持するバネと、可動爪をその係合凹部が基板の
周縁部から離間する方向へと前記バネに抗して移動可能
ならしめる非作動位置と可動爪を基板保持解除位置へと
動作させる作動位置とに亘って操作自在な可動爪動作体
とを具備してなるものであることを特徴とする、請求項
1に記載する基板回転装置。
2. The fixed claw and the movable claw have engaging recesses capable of engaging and holding the peripheral edge of the substrate, and the fixed recesses of the fixed claw engage and hold the peripheral edge of the substrate. The movable claw operating mechanism holds the movable claw at the substrate holding position in such a manner that the engaging concave portion is biased and held in a movable position in a direction away from the peripheral edge of the substrate. A spring for biasing and holding the movable claw to a non-actuated position for moving the movable claw against the spring in a direction in which the engaging concave portion of the movable claw separates from the peripheral edge of the substrate, and the movable claw to the substrate holding release position. The substrate rotating device according to claim 1, further comprising a movable claw operating body that is operable over an operating position to be operated.
JP7372895A 1995-03-30 1995-03-30 Substrate rotating device Expired - Fee Related JP2891894B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7372895A JP2891894B2 (en) 1995-03-30 1995-03-30 Substrate rotating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7372895A JP2891894B2 (en) 1995-03-30 1995-03-30 Substrate rotating device

Publications (2)

Publication Number Publication Date
JPH08274060A true JPH08274060A (en) 1996-10-18
JP2891894B2 JP2891894B2 (en) 1999-05-17

Family

ID=13526591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7372895A Expired - Fee Related JP2891894B2 (en) 1995-03-30 1995-03-30 Substrate rotating device

Country Status (1)

Country Link
JP (1) JP2891894B2 (en)

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