JPH08279548A - Pin used in hot plate type proximity bake furnace and furnace using the same - Google Patents

Abstract

(57) [Abstract] [Purpose] By making the pins that support the substrate of the hot plate type proximity bake oven made of synthetic resin,
The pins prevent the back surface of the substrate from being scratched. A hot plate type proximity bake furnace 1 is provided with a plurality of heads 8 that project upward from a soaking plate 32 of a hot plate 4 and that supports a substrate 5, and is mounted on the head 8. The proximity pins 6 and 6a for holding the substrate 5 and the heat equalizing plate 3 at a distance capable of proximity baking are made of synthetic resin.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pin used for a hot plate type proximity bake furnace which heats a substrate by bringing it close to the heating surface of a hot plate in the manufacture of elements such as ICs and liquid crystal panels. The present invention relates to a hot plate type proximity bake furnace using the same.

[0002]

2. Description of the Related Art Conventionally, a photoresist is applied in a photoresist applying process (a part of the photolithography process),
As shown in FIG. 6, a substrate for an IC and a device such as a liquid crystal panel is a hot plate 4 including a heater 2 and a soaking plate 3.
Is continuously conveyed to the bake furnace having the above-mentioned structure by the operation of a conveying beam (not shown). The substrate 5 transferred onto the hot plate 4 is heated to evaporate the solvent in the photoresist applied to the substrate 5 to some extent, so that the bonding of the photoresist mainly containing the photosensitizer can be strengthened.

As a method for fixing the substrate 5 in close contact with the soaking plate 3 in the above baking furnace, there is a vacuum adsorption method. In the vacuum adsorption type baking furnace, the hot plate 4 is formed by the vacuum pipe 9 formed in the hot plate 4.
The substrate 5 conveyed above is pressed against the heat equalizing plate 3.
As a result, the temperature rising rate of the substrate 5 is increased, and a uniform temperature distribution can be obtained within the substrate 5.

However, in this vacuum suction method, the surface of the hot plate 4 is scratched when the glass substrate 5 is carried in and out due to dust adhering to the back surface of the glass substrate 5 and irregularities and scratches formed on the back surface of the glass substrate 5. The smoothness may be lost. At this time, the scratches formed on the surface of the hot plate 4 are not transferred onto the surface of the hot plate 4 by the glass substrate 5.
Is transferred to the back side of. Particularly, in the case of a glass substrate, it causes a defect. Further, it is difficult to wash the resist on the end face of the glass substrate 5 coated with the photoresist, and the glass substrate 5 having the end face to which the resist adheres is the hot plate 4
Then, the resist on the end surface scatters and adheres to the front and back surfaces of the glass substrate 5. Therefore, a pattern defect occurs, which causes a reduction in the yield of the substrate 5 in the photolithography process.

Therefore, the substrate 5 is brought close to the hot plate 4 by a distance of several hundreds of microns to heat-treat the substrate 5.
So-called proximity bake ovens have been used in recent years. In this proximity bake furnace, as shown in FIG. 7, a plurality of proximity pins 16 are installed on the hot plate 4 so that the substrate 5 is held in a state in which the substrate 5 is close to the surface of the hot plate 4 within about 1 mm or less. It is configured. As a result, the above-mentioned problem caused by the contact between the hot plate 4 and the substrate 5 is solved for the time being. The proximity pin 16 is usually made of stainless steel, and the heat of the hot plate 14 is transmitted to the substrate 5 by radiation or via the pin 16.

[0006]

In the conventional hot plate type proximity bake furnace described above, at high temperature,
The load and the creep load are repeatedly applied to the hot plate 4 itself via the proximity pins 16 when the substrate 5 is carried in and out. Therefore, as described above, the proximity pin 16 that supports the substrate 5 is made of stainless steel, which has excellent mechanical strength at high temperatures, corrosion resistance, and wear resistance.

However, in the hot plate 4 provided with the stainless proximity pins 16, the back surface of the substrate 5 is easily scratched by the pins 4 when the substrate 1 is carried in and out. Therefore, the inventors of the present application performed electrolytic polishing on the stainless proximity pin 16 and attempted to use the pin 16 having a clean finished surface without any distortion on the surface. However, due to variations in the polishing level, that is, the plurality of proximity pins 1 that support the substrate 5
In No. 6, there is a problem that a pin having a low polishing level causes scratches on the surface of the substrate 5.

Therefore, the inventors of the present application examined the material of the pin 16 itself, and used polytetrafluoroethylene (P) as an alternative to the stainless proximity pin.
TFE) proximity pins were manufactured and tried to be used.
However, there is a problem in that the head of the proximity pin, that is, the contact portion that supports the substrate 5 is deformed due to repeated loading and unloading of the substrate 5 under high temperature (110 to 200 ° C.). Further, a proximity pin made of a mixture of PTFE and glass or graphite at a ratio of 15 to 25% by weight was manufactured and tried to be used. But,
Even with this, sufficient heat resistance and abrasion resistance could not be obtained. Therefore, it is urgently desired to prevent the back surface of the substrate from being scratched by the pins.

An object of the present invention is to provide a hot plate type proximity bake furnace which does not cause scratches on the back surface of a substrate and a pin used therein.

[0010]

A pin used in a hot plate type proximity bake furnace according to the present invention is a hot plate type proximity bake furnace in which a substrate is placed on a hot plate to perform a proximity bake. Used, a plurality of heating plates are provided so as to project from the heating surface of the hot plate and have a head for supporting the substrate, and a proximity bake between the substrate placed on the head and the heating surface of the hot plate. It is to keep it at a possible distance.

The pin is made of synthetic resin, preferably wholly aromatic polyimide resin. The wholly aromatic polyimide resin has the following formula

[0012]

Embedded image And the like. In the above formula, n is preferably 2100 to 3100, more preferably 2300 to 290.
0. Particularly preferred wholly aromatic polyimide resins are commercially available "Vespel" SP-1, SP-21 or S.
P-211 (trade name of DuPont) can be used. The wholly aromatic polyimide resin has 3 to 20
%, Preferably 8 to 15% of graphite or fluororesin may be contained. Further, in this pin, it is preferable that the cross-sectional shape of the head supporting the substrate is substantially trapezoidal or semi-circular. Further, it is preferable that the pin includes a locking portion below the head thereof, which is partially bent or bulged to be locked to the hot plate, thereby making it difficult to pull out from the hot plate.

A furnace using the pins of the present invention is a hot plate type proximity bake furnace in which a substrate is placed on a hot plate and a proximity bake is performed. This proximity bake furnace has a plurality of heads that are provided on the heating surface so as to project from the heating surface of the hot plate, and that has a head for supporting the substrate, and the substrate placed on the head and the heating surface of the hot plate are connected to each other. It is equipped with the pins mentioned above, which are held at a distance that allows proximity bake.

Further, in this proximity bake furnace,
It is preferable that the above-mentioned pins hold the substrate placed on the head thereof and the heating surface of the hot plate at a distance of 0.2 to 0.5 mm. Further, in this proximity bake furnace, the contact area between the head of each pin supporting the substrate and the substrate placed on the head is preferably 0.008 to 0.2 square mm. In addition, the pin here is not limited to a so-called pin shape in which the shaft part and the head part are different,
It refers to one having a role as a spacer for holding the substrate and the heating surface of the hot plate at the above-mentioned predetermined distance. Therefore, for example, the shaft portion and the head portion may have the same outer diameter.

[0015]

In the pin used in the hot plate type proximity bake furnace and the furnace using this pin according to the present invention, first, the substrate is placed on the hot plate. At this time, the substrate is supported by the heads of pins made of synthetic resin, which protrude from the heating surface of the hot plate and are provided in plural on the heating surface. This pin holds the substrate and the heated surface of the hot plate at a proximity bakeable distance.

When this pin is a molded article made of wholly aromatic polyimide resin, for example, Vespel, it has excellent heat resistance, wear resistance, creep characteristics, electrical characteristics and vacuum characteristics, and especially in terms of heat resistance. The continuous use at 260 ° C and the intermittent use at 480 ° C are possible, and in terms of creep characteristics, the creep at 260 ° C and 186 kg / cm ² is suppressed to only 0.6% after 1000 hours. .

When the head has a rectangular cross-section, the contact area between the head of each pin that supports the substrate and the substrate placed on the head increases, and the temperature distribution of the substrate becomes uneven.
For this reason, the resist sensitivity becomes non-uniform, and the pattern becomes abnormal. However, in the pin of the present invention, the cross-sectional shape of the head that supports the substrate is substantially trapezoidal or semi-circular, and the contact area between the head of each pin that supports the substrate and the substrate placed on the head. Is 0.008 to 0.2 mm 2, the contact area between the head of the pin and the substrate placed on the head is limited, and the degree of non-uniformity of the temperature distribution on the substrate surface is determined by the resist sensitivity. Can be lowered to the extent that it does not affect.

Further, if the distance between the substrate placed on the head of the hot plate and the heating surface of the hot plate is less than 0.2 mm, the pin is bent and the temperature distribution is non-uniform on the substrate surface. Is likely to occur. On the contrary, if the distance between the substrate and the heating surface of the hot plate exceeds 0.5 mm, the radiant heat is not evenly transferred from the heating surface of the hot plate to the substrate. However, in the hot plate type proximity bake furnace according to claim 7 of the present invention, the substrate placed on the head of the hot plate and the heating surface of the hot plate are held at a distance of 0.2 mm to 0.5 mm. Since the height of the head of the pin is set so that the non-uniformity of heat transferred to the substrate surface is unlikely to occur. Further, the pin used in the furnace, below the head of the pin, is provided with a locking portion that is partially bent or bulged to be locked to the hot plate, thereby making it difficult to come out of the hot plate, The stability of the pins that come into contact with the substrate is obtained when the substrate is loaded and unloaded.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an embodiment of the present invention and shows a hot plate type proximity bake furnace utilizing a conventional hot plate. The hot plate type proximity bake furnace 1 is mainly configured by a hot plate 4 including a heater 2 and a soaking plate 3 provided in close contact with the upper surface of the heater 2.

A plurality of proximity pins 6 for supporting the glass substrate 5 carried on the hot plate 4 from the back surface are provided on the front surface of the heat equalizing plate 3. The pin 6 is a Vespel molded product. In addition, Vespel is
It is produced by condensation of p, p'-diaminodiphenyl ether and pyromellitic acid. 2 and 3
The pin 6 shown in FIG. 2 is composed of a shaft portion 7 and a head portion 8, and the shaft portion 7 is inserted into each opening 9a of the vacuum suction pipe 9 formed in the hot plate 4.

A plurality of openings 9a of the pipe 9 are provided on the surface of the heat equalizing plate 3. The opening 9a has the inserted pin 6
The head portions 8 are formed at predetermined intervals according to the size of the glass substrate 5 so that the glass substrate 5 can be supported above the heat equalizing plate 3. The pipe 9 is a part of the fixing mechanism of the substrate 5 which is used in the conventional vacuum suction method, but in this embodiment, the vacuum suction is not used for fixing the substrate 5, and the opening 9a is provided on each pin 6 with a pin. It is used only as a fixed part of.

The shaft portion 7 of the pin 6 has a diameter of 0.8 mm to
It is formed of a cylinder having a length of 1.0 mm and a length of 10 mm to 15 mm. The head 8 has a substantially trapezoidal cross section, that is, it is formed as a truncated cone. The head 8 has a height of 0.2 mm to 0.5 mm and a bottom surface diameter of 1.5 mm to
2.0 mm, diameter of top surface (crown 8a) is 0.05 mm
Is about 0.25 mm.

The pin 6a shown in FIG. 3 is composed of a shaft portion 7 similar to the pin 6. Head 8 of pin 6a
Is formed of a spherical zone having a substantially semicircular cross section. Head 8
Has a height of 0.2 mm to 0.5 mm, a bottom bottom diameter of 1.5 mm to 2.0 mm, and a top surface (crown 8a).
Has a diameter of 0.05 mm to 0.25 mm. In addition, the shaft portion 7 may be not only a cylinder but also a prism. Also,
The cross section of the cylinder may be an ellipse.

With such a structure, the contact area between the crown 8a of each pin 6, 6a and the substrate 5 placed on the crown 8a can be set to 0.008 to 0.2 square mm. it can. Next, regarding the physical properties of Vespel, various properties compared with other materials are shown in Table 1.

[0025]

[Table 1]

As described above, Vespel has excellent thermal characteristics, and greatly exceeds PTFE at heat distortion temperature and continuous use temperature. Further, as shown in FIG. 4, it has high tensile strength at high temperature. Further, Table 2 shows various characteristics of the friction characteristics of Vespel compared with other materials.

[0027]

[Table 2]

Here, the frictional limit PV value is the limit value of the pressure and speed conditions under which a substance having a non-lubricating slip property, that is, an abrasion resistance, can normally maintain a frictional state. It is an index that indicates that the worn surface is swelling. Since the value of Vespel is high, damage to the substrate 5 due to friction between the surface of the hot plate 4 and the substrate 5 carried in and out can be minimized.

Next, the photolithography process of the substrate 5 using the hot plate type proximity bake furnace 1 will be described. The glass substrate 5 of an element such as an IC and a liquid crystal panel, which is coated with a photoresist in the photoresist coating process (a part of the photolithography process), is continuously transferred to the baking furnace 1 by the operation of a transfer beam (not shown). It The glass substrate 5 transferred to the baking oven 1 has pins 6,
It is supported by the head 8 of 6a and placed above the hot plate 4.

At this time, if the head has a rectangular cross-sectional shape, the contact area between the head of each pin supporting the substrate 5 and the substrate 5 placed on the head is large, and the surface of the substrate 5 is The temperature distribution becomes non-uniform. For this reason, the resist sensitivity becomes non-uniform, and the pattern becomes abnormal.

However, here, the pin 6 or 6a is
The head 8 supporting the substrate 5 has a substantially trapezoidal or semi-circular cross-sectional shape, that is, it is formed by a truncated cone or a spherical zone, and the contact area between the tops 8a of the pins 6 and 6a and the substrate 5. Is set in the range of 0.008 to 0.2 square mm. Therefore, the contact area between the pins 6 and 6a and the substrate 5 is limited, and the degree of nonuniformity of the temperature distribution of the substrate 5 can be reduced to such an extent that the resist sensitivity is not affected.

If the distance between the back surface of the substrate 5 placed on the pins 6 and 6a and the heat equalizing plate 2 is less than 0.2 mm, the deflection of the substrate 5 causes uneven temperature distribution on the substrate 5. Cheap. On the contrary, the distance between the back surface of the substrate 5 and the heat equalizing plate 2 is 0.5.
If it exceeds mm, the radiant heat is not uniformly transmitted from the heat equalizing plate 2 to the substrate 5. However, the pins 6 and 6a are connected to the substrate 5
Since the back surface of the soaking plate and the soaking plate 2 are set to be held at a distance of 0.2 mm to 0.5 mm, the soaking plate 3 to the substrate 5
On the other hand, the radiant heat can be uniformly transmitted, and the nonuniformity of temperature hardly occurs on the substrate 5.

Next, with the back surface of the substrate 5 and the heat equalizing plate 3 held at a distance capable of proximity bake, the substrate 5
The coating is heated to evaporate some of the solvent in the applied photoresist to enhance the bonding of the photoresist. The substrate 5 which has been heat-treated for a predetermined time is carried to the next step by the operation of a carrying beam (not shown). Since the pins 6 and 6a are fitted in the opening 9a, the pins 6 and 6a are not separated from the surface of the heat equalizing plate 3 when the substrate 5 is loaded or unloaded.

As described above, in this embodiment, since the substrate 5 and the heat equalizing plate 3 do not directly contact with each other, dust and back surface of the glass substrate 5 which are frequently generated in the conventional baking furnace of the vacuum adsorption system and the back surface of the glass substrate 5 are frequently encountered. It is possible to suppress the occurrence of scratches on the surface of the heat equalizing plate 3 due to the unevenness and scratches formed on the surface. Therefore, transfer of scratches on the heat equalizing plate 3 to the back surface of the substrate 5 is suppressed. Further, since the substrate 5 is not vacuum-adsorbed on the heat equalizing plate 3, the photoresist applied to the end surface of the substrate 5 does not scatter.

Further, by using the proximity pins 6 and 6a integrally formed by Vespel, it is possible to prevent the back surface of the substrate 5 from being damaged by the conventional proximity pin 16 made of stainless steel. Therefore, the yield of the substrate 5 can be significantly improved. In addition, Vespel shaped proximity pins 6,6a
Has mechanical strength, corrosion resistance, and wear resistance at high temperatures, which cannot be obtained by PTFE, so that the labor such as maintenance and replacement can be reduced.

As shown in FIG. 5, the Vespel has the normal resin "Vespel SP-1", 15
% Vespel SP-21 with 15% graphite and 15% graphite with 10% PTFE "Vespel SP-211"
Etc., and any of them can be used as a material for molding the proximity pin of the present invention, but "Vespel SP-1" and "Vespel SP-21" are preferable, and "Vespel SP-211" is particularly preferable. . "Vespel SP-211" has a high frictional limit PV value and can further prevent damage to the substrate 5 due to friction.

In the above embodiment, the pins 6 and 6 described above are used.
Although the head portion 8 of 6a has an outer diameter larger than that of the shaft portion 7, if it has a role as a spacer for holding the substrate 5 and the heat equalizing plate 3 at the above-described predetermined distance, There is no limit to its shape. Therefore, for example, it may be a pin in which the shaft portion and the head portion have the same outer diameter. In this case, by using the structure in which the pins are supported inside the hot plate 4, the same use as described above is possible.

[Other Embodiments] In the above embodiment, the pins 6 and 6 are used.
The shaft portion 7 of 6a is formed of a cylinder whose axis extends straight, but the shape is not limited as long as it can be inserted into the opening portion 9a of the hot plate 4. Therefore, as shown in FIG. 8, the shaft portion 7 may be provided with a bent portion 7a as a locking portion, or as shown in FIG. 9, the shaft portion 7 may be provided with a bulging portion 7b as a locking portion. Good. In this case, by inserting the shaft portion 7 into the opening 9a, it becomes difficult for the pins 6 and 6a to come out of the hot plate 4. Therefore, the substrate 5 placed on the pins 6 and 6a can be stabilized.

[0039]

In the pins used in the hot plate type proximity bake furnace and the furnace using the pins according to the first and fifth aspects of the present invention, the substrate is heated by projecting from the heating surface of the hot plate. It is supported by the heads of a plurality of synthetic resin pins provided on the surface. This pin holds the substrate and the heated surface of the hot plate at a proximity bakeable distance. Since the pins are made of synthetic resin, the back surface of the board is not scratched. Since the substrate and the heat equalizing plate of the hot plate do not come into contact with each other, scratches on the back surface of the substrate due to transfer of scratches on the surface of the heat equalizing plate do not occur.

According to the second aspect of the present invention, the pin is a molded product made of wholly aromatic polyimide resin. Therefore,
It is possible to obtain a molded product made of a material having excellent heat resistance and versatility.

According to the invention of claim 3, the pin is

[0042]

Embedded image Made of synthetic resin, which has heat resistance, wear resistance, creep characteristics, electrical characteristics and vacuum characteristics. For example, PTF
Superior to synthetic resins such as E and MC nylon. Since it has mechanical strength under high temperature, corrosion resistance, and abrasion resistance, the back surface of the substrate is not scratched, and the maintenance and replacement of pins can be reduced.

When the head has a rectangular cross-section, the contact area between the head of each pin supporting the substrate and the substrate placed on the head increases, and the temperature distribution of the substrate becomes uneven. Become. For this reason, the resist sensitivity becomes non-uniform, and the pattern becomes abnormal. However, in the pin of the present invention, the cross-sectional shape of the head supporting the substrate is substantially trapezoidal or semicircular,
When the contact area between the head of each pin supporting the substrate and the substrate placed on the head is 0.008 to 0.2 mm 2, the pin is placed on the head and the head. The contact area with the substrate is limited, and the degree of nonuniformity of the temperature distribution on the substrate surface can be reduced to such an extent that the resist sensitivity is not affected. According to the invention of claim 4, the cross-sectional shape of the head of the pin supporting the substrate is substantially trapezoidal or semi-circular.
For this reason, the contact area between the pin and the substrate is limited and does not affect the temperature distribution of the substrate.

Further, if the distance between the substrate placed on the head of the hot plate and the heating surface of the hot plate is less than 0.2 mm, the pin has a non-uniform temperature distribution on the substrate surface due to the deflection of the substrate. Is likely to occur. On the contrary, if the distance between the substrate and the heating surface of the hot plate exceeds 0.5 mm, the radiant heat is not evenly transferred from the heating surface of the hot plate to the substrate. However, in the hot plate type proximity bake furnace according to claim 7 of the present invention, the substrate placed on the head of the hot plate and the heating surface of the hot plate are held at a distance of 0.2 mm to 0.5 mm. Since the height of the head of the pin is set so that the non-uniformity of heat transferred to the substrate surface is unlikely to occur. Further, the pin used in the furnace, below the head of the pin, is provided with a locking portion that is partially bent or bulged to be locked to the hot plate, thereby making it difficult to come out of the hot plate, The stability of the pins that come into contact with the substrate is obtained when the substrate is loaded and unloaded. According to the invention of claim 5, since the pin is provided with the locking portion,
It becomes difficult for the pin to come out of the hot plate, and it is possible to prevent the pin from coming off due to contact with the substrate carried in and out of the head of the pin.

According to the sixth aspect of the present invention, the pin used in the hot plate type proximity bake furnace has a substrate placed on the head of the hot plate and a heating surface of the hot plate of 0.2 mm to. Since the distance is set to 0.5 mm, the radiant heat can be uniformly transferred from the heating surface of the hot plate to the substrate. Therefore, it is difficult for the temperature distribution to be uneven on the substrate surface.

According to the seventh aspect of the present invention, the pins used in the hot plate type proximity bake furnace have a contact area between the head of each pin supporting the substrate and the substrate placed on the head. Is 0.008 to 0.2 square mm. For this reason, the contact area between the pin and the substrate is limited and does not affect the temperature distribution of the substrate.

With such a structure, there is no occurrence of scratches on the back surface of the substrate due to the pins that have been generated in the conventional hot plate type proximity bake furnace, and unlike the conventional vacuum adsorption type bake furnace, glass is used. It is possible to prevent the occurrence of scratches on the heating surface of the hot plate due to dust adhering to the back surface of the substrate, and unevenness and scratches formed on the back surface of the glass substrate. Therefore, the scratches formed on the surface of the heating surface are not transferred to the back surface of the substrate, and the photoresist applied to the end surface of the substrate is not scattered. Therefore,
It is possible to significantly reduce defects due to scratches on the back surface of the substrate and defects due to dust, and it is possible to improve the process yield by using a hot plate type proximity bake furnace.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view of a hot plate type proximity bake furnace according to an embodiment of the present invention.

FIG. 2 is a front view of a proximity pin used in the proximity bake furnace of FIG.

FIG. 3 is used in the proximity bake furnace of FIG.
It is a front view of a proximity pin different from FIG.

FIG. 4 is a diagram comparing the relationship between tensile strength and temperature between Vespel and other synthetic resins.

FIG. 5 is a diagram comparing the limit PV value in a non-lubricated state between Vespel and other synthetic resins.

FIG. 6 is a schematic cross-sectional view of a conventional vacuum adsorption type baking furnace.

FIG. 7 is a schematic sectional view of a proximity bake furnace using a conventional proximity pin.

FIG. 8 is a front view of a pin corresponding to FIG. 2, showing another embodiment of the proximity pin used in the proximity bake furnace of the present invention.

FIG. 9 shows still another embodiment of the proximity pin used in the proximity bake furnace of the present invention, FIG.
It is a front view of a pin corresponding to.

[Explanation of symbols]

 1 Hot Plate Proximity Bake Furnace 2 Heater 3 3 Soaking Plate (Constituting Heating Surface) 4 Hot Plate 5 Glass Substrate 6, 6a Proximity Pin 7 Shaft 7a Bending 7b Bulging 8 Eight 8a Top

[Procedure amendment]

[Submission date] March 28, 1995

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 3

[Correction method] Change

[Correction content]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0008

[Correction method] Change

[Correction content]

Therefore, the inventor of the present application examined the material of the pin 16 itself, and polytetrafluoroethylene (PT) was used as an alternative to the stainless proximity pin.
An attempt was made to manufacture and use a proximity pin of FE). However, there is a problem in that the head of the proximity pin, that is, the contact portion that supports the substrate 5 is deformed due to repeated loading and unloading of the substrate 5 under high temperature (110 to 200 ° C.). Further, a proximity pin made of a mixture of PTFE and glass or graphite at a ratio of 15 to 25% by weight was manufactured and tried to be used. However, even with this, sufficient heat resistance and abrasion resistance could not be obtained. Furthermore, transfer to the mating material, charging occurs,
In particular, in the case of a glass substrate, it caused a defect. Therefore, it is urgently desired to prevent the back surface of the substrate from being scratched by the pins.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Change

[Correction content]

[0012]

[ Chemical 1 ] The polyimide resin is, for example,
For example, pyromellitic anhydride and 4,4′-oxydiani
An example is phosphorus. As a particularly preferred wholly aromatic polyimide resin, commercially available "Vespel" SP-
1, SP-21 or SP-211 (trade name of DuPont) can be used. The wholly aromatic polyimide resin may contain 3 to 20%, preferably 8 to 15% of graphite or fluororesin. Further, in this pin, it is preferable that the cross-sectional shape of the head supporting the substrate is substantially trapezoidal or semi-circular. Further, it is preferable that the pin includes a locking portion below the head thereof, which is partially bent or bulged to be locked to the hot plate, thereby making it difficult to pull out from the hot plate.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0016

[Correction method] Change

[Correction content]

When this pin is a molded article made of wholly aromatic polyimide resin such as Vespel, it has heat resistance, abrasion resistance, creep characteristics, electrical characteristics , vacuum characteristics , non-transferability and
And excellent in antistatic property , especially in terms of heat resistance,
It can be used continuously at 260 ° C and intermittently at 480 ° C. In terms of creep characteristics, 260 ° C, 186kg
Only 0.6% of creep at 1000 hours / cm ²
It is suppressed to.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0020

[Correction method] Change

[Correction content]

A hot plate 4 is provided on the surface of the soaking plate 3.
A plurality of proximity pins 6 for supporting the glass substrate 5 conveyed above from the back surface are installed. The pin 6 is a Vespel molded product. In addition, Vespel is
Made from acid anhydride and 4,4'-oxydianiline
It is a thing. The above-mentioned pin 6 shown in FIGS. 2 and 3.
Is composed of a shaft portion 7 and a head portion 8, and the shaft portion 7 is inserted into an opening portion 9a of a vacuum suction pipe 9 formed in the hot plate 4, respectively.

[Procedure correction 6]

[Document name to be amended] Statement

[Name of item to be corrected] 0022

[Correction method] Change

[Correction content]

The shaft portion 7 of the pin 6 has a diameter of 0.8 mm to
It is formed of a cylinder having a length of 1.0 mm and a length of 10 mm to 15 mm. The head 8 has a substantially trapezoidal cross section, that is, it is formed as a truncated cone. The height of the head 8 is
0.2 mm to 2 mm, preferably 0.2 mm to 0.5 m
m, the diameter of the bottom surface is 1.5 mm to 2.0 mm , and the diameter of the upper surface (crown portion 8a) is 0.05 mm to 0.25 mm.

[Procedure Amendment 7]

[Document name to be amended] Statement

[Name of item to be corrected] 0023

[Correction method] Change

[Correction content]

The pin 6a shown in FIG. 3 is composed of a shaft portion 7 similar to the pin 6. Head 8 of pin 6a
Is formed of a spherical zone having a substantially semicircular cross section. Head 8
Has a height of 0.2 mm to 2 mm, preferably 0.2 mm
~ 0.5 mm, the bottom bottom diameter is 1.5 mm ~
2.0 mm, diameter of top surface (crown 8a) is 0.05 mm
To 0.25 mm. In addition, the shaft portion 7 may be not only a cylinder but also a prism. Further, the cross section of the cylinder may be an ellipse.

[Procedure Amendment 8]

[Document name to be amended] Statement

[Name of item to be corrected] 0032

[Correction method] Change

[Correction content]

If the distance between the back surface of the substrate 5 placed on the pins 6 and 6a and the heat equalizing plate 2 is less than 0.2 mm, the deflection of the substrate 5 causes uneven temperature distribution on the substrate 5. Cheap. On the contrary, the distance between the back surface of the substrate 5 and the heat equalizing plate 2 is 2 mm.
If it exceeds, the radiant heat is not uniformly transmitted from the soaking plate 2 to the substrate 5. However, since the pins 6 and 6a are set to hold the back surface of the substrate 5 and the heat equalizing plate 2 at a distance of 0.2 mm to 2 mm , the radiant heat from the heat equalizing plate 3 to the substrate 5 is made uniform. It can be transmitted, and the temperature nonuniformity hardly occurs on the substrate 5.

[Procedure Amendment 9]

[Document name to be amended] Statement

[Correction target item name] 0035

[Correction method] Change

[Correction content]

Further, by using the proximity pins 6 and 6a integrally formed by Vespel, it is possible to prevent the back surface of the substrate 5 from being damaged by the conventional proximity pin 16 made of stainless steel. Therefore, the yield of the substrate 5 can be significantly improved. In addition, Vespel shaped proximity pins 6,6a
Has mechanical strength at high temperature, corrosion resistance, abrasion resistance , non-transferability, and antistatic property that cannot be obtained by PTFE, so that the labor for maintenance and replacement can be reduced.

[Procedure Amendment 10]

[Document name to be amended] Statement

[Correction target item name] 0036

[Correction method] Change

[Correction content]

As shown in FIG. 5, the Vespel has 15% of "Vespel SP-1" which is a normal resin.
Include "Vespel SP-21" containing graphite and "Vespel SP-211" containing 15% graphite and 10% PTFE, and both can be used as a material for molding the proximity pin of the present invention. , "Vespel SP-1" and "Vespel SP-21" are preferable, and "Vespel SP-1" is particularly preferable. "Vespel SP
−1 ″ has a high friction limit PV value, and can further suppress damage due to friction of the substrate 5.

[Procedure Amendment 11]

[Document name to be amended] Statement

[Correction target item name] 0042

[Correction method] Change

[Correction content]

Pyromellitic anhydride and 4,4'-Oki
Since it is made of polyisid resin made of sidianiline, it is superior to synthetic resins such as PTFE and MC nylon in heat resistance, abrasion resistance, creep characteristics, electrical characteristics and vacuum characteristics. Since it has mechanical strength under high temperature, corrosion resistance, and abrasion resistance, the back surface of the substrate is not scratched, and maintenance and replacement of pins can be reduced.

[Procedure Amendment 12]

[Document name to be amended] Statement

[Correction target item name] 0044

[Correction method] Change

[Correction content]

Further, if the distance between the substrate placed on the head of the hot plate and the heating surface of the hot plate is less than 0.2 mm, the pin has a non-uniform temperature distribution on the substrate surface due to the deflection of the substrate. Is likely to occur. On the contrary, when the distance between the substrate and the heating surface of the hot plate exceeds 2 mm , the radiant heat is not uniformly transferred from the heating surface of the hot plate to the substrate. However, in the hot plate type proximity bake furnace according to claim 7 of the present invention, the substrate placed on the head of the hot plate and the heating surface of the hot plate are set to 0.
Since the height of the head portion of the pin is set so as to be held at a distance of 2 mm to 2 mm , unevenness of heat transferred to the substrate surface is unlikely to occur. Further, the pin used in the furnace, below the head of the pin, is provided with a locking portion that is partially bent or bulged to be locked to the hot plate, thereby making it difficult to come out of the hot plate, The stability of the pins that come into contact with the substrate is obtained when the substrate is loaded and unloaded. According to the invention of claim 5, since the pin is provided with the locking portion, it is difficult for the pin to come out of the hot plate, and the pin is prevented from coming off due to contact with the substrate carried in and out of the head of the pin. it can.

[Procedure Amendment 13]

[Document name to be amended] Statement

[Name of item to be corrected] 0045

[Correction method] Change

[Correction content]

According to the sixth aspect of the present invention, the pin used in the hot plate type proximity bake furnace has a substrate placed on the head of the hot plate and a heating surface of the hot plate of 0.2 mm to. Since the distance is set to 2 mm, the radiant heat can be uniformly transmitted from the heating surface of the hot plate to the substrate. Therefore, it is difficult for the temperature distribution to be uneven on the substrate surface.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Shinichi Nakajima, 22-22 Nagaike-cho, Abeno-ku, Osaka-shi, Osaka Prefecture, Sharp Corporation (72) Akira Yokoyama, 1174, Hakoda-cho, Maebashi, Gunma Prefecture

Claims (8)

[Claims] 1. A hot plate type proximity bake oven, which has a plurality of heads for projecting from the heating surface of the hot plate and provided on the heating surface and supporting the substrate,
A pin that holds the substrate placed on the head and the heating surface of the hot plate at a distance that allows proximity bake, and the pin is made of synthetic resin. A pin used for a baking oven. 2. A pin used in a hot plate type proximity bake furnace according to claim 1, wherein the synthetic resin is a wholly aromatic polyimide resin. 3. A wholly aromatic polyimide resin is represented by the following formula: The pin used in the hot plate type proximity bake furnace according to claim 2. 4. A pin used in a hot plate type proximity bake furnace according to claim 1, 2 or 3, wherein the cross-sectional shape of the head supporting the substrate is substantially trapezoidal or semicircular. 5. The pin is provided with a locking portion below the head portion thereof, which is bent or bulged in part to be locked to the hot plate, thereby making it difficult to come off from the hot plate. A pin used in the hot plate type proximity bake furnace according to 2, 3, or 4. 6. A hot plate type proximity bake furnace, comprising a plurality of heating plate protruding from the heating surface, the head having a head for supporting the substrate, and being mounted on the head. A hot plate type proximity bake furnace, which is provided with pins for holding the substrate to be heated and the heating surface of the hot plate at a distance capable of proximity bake, and the pins are made of synthetic resin. 7. The hot plate type proximity bake furnace according to claim 6, wherein the pin holds the substrate placed on the head of the pin and the heating surface of the hot plate at a distance of 0.2 to 0.5 mm. . 8. The contact area between the head of each pin supporting the substrate and the substrate placed on the head is 0.008 to 0.2.
The hot plate type proximity bake furnace according to claim 6, which has a square mm.