JPH08288326A - Method and mold for resin encapsulation of electronic parts - Google Patents

Abstract

(57) [Abstract] [Purpose] To efficiently and reliably prevent resin burrs that occur during resin encapsulation molding of a printed circuit board 3 that has flexibility and has large variations in thickness. [Constitution] Depth A of the setting recess 4 of the printed circuit board 3
Is formed to be slightly shallower than the minimum value t of the thickness of the printed circuit board, the peripheral edge portion 11 of the printed circuit board 3 is locked to the locking portion 4a provided on the bottom of the recess 4, and the locking portion is further An elastic support member 9 elastically supports the bottom of the printed circuit board 3 except for the area locked by 4a. Then, in this state, the locking portion 4 at the bottom of the recess is subjected to a predetermined mold clamping pressure by the upper and lower molds 1 and 2.
The bottom peripheral edge portion 11 of the printed circuit board 3 locked to a is strongly pressed to form the compression elastic deformation portion 12, and between the bottom peripheral edge portion 11 of the printed circuit board and the locking portion 4a of the recess, and A gap is prevented from being formed between the upper peripheral edge of the printed circuit board and the mold surfaces of the molds 1 and 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin encapsulation molding method and a resin encapsulation method for encapsulating an electronic component such as an IC formed on a flexible plate member made of plastic or the like with a resin material. The present invention relates to improvement of a static-molding die.

[0002]

2. Description of the Related Art Conventionally, resin molding of an electronic component mounted on a lead frame has been performed by a transfer molding method. This method uses a mold for resin molding. Usually, it is performed as follows.

That is, the fixed upper die and the movable lower die in the above-mentioned molding die are heated to the resin molding temperature by a heating means, and the upper and lower dies are opened. Next, the lead frame on which the electronic parts are mounted is supplied and set at a predetermined position on the mold surface of the lower mold, and the resin material is supplied into the lower mold pot. Next, the lower mold is moved upward to clamp the upper and lower molds. At this time, the electronic component and the lead frame around it are to be fitted and set in both upper and lower cavities opposite to each other in the upper and lower molds, and the resin material in the pot is heated and sequentially heated. It will be melted. Next, when the resin material in the pot described above is pressed by the plunger and the molten resin material is injected and filled into the upper and lower cavities through the transfer passage, the electronic components in the upper and lower cavities and the peripheral portion thereof are filled. The lead frame is sealed in a resin-molded molded body that is molded according to the shapes of the cavities. Therefore, after the required time required for curing the molten resin material has elapsed, the upper and lower molds are opened, and the resin sealing molded body in both the cavities and the cured resin in the lead frame and the transfer passage are removed. Are released by ejector pins provided on both the molds.

By the way, the above-mentioned lead frame has
Usually, a metal one is used, but a printed circuit board called a so-called PC board has been proposed as an alternative to the metal lead frame. This printed circuit board can be used for the transfer mold as described above in the same manner as the conventional metal lead frame. For example, (1) of FIG.
As shown in (2) and (2), in the mold including the fixed upper mold 50 and the movable lower mold 51, first, the printed circuit board 53 is supplied to the setting recess 52 provided in the mold surface of the lower mold 51. Clamp the upper and lower molds 50 and 51 together,
An electronic component (not shown) mounted on the upper surface of 53 is fitted and set in the cavity 54 provided in the upper die 50, and then the molten resin material is passed through the transfer passage 55 provided in the upper die 50 to be in the cavity 54. By injecting and filling in the above, the electronic component mounted on the upper surface of the printed circuit board 53 can be sealed in the resin-sealed molded bodies 56 and 59 molded in accordance with the shape of the cavity 54.

[0005]

However, this type of printed circuit board has the following problems. That is, the printed circuit board 53 generally has a variation in thickness (range of thickness), and the setting of the depth D of the recess 52 depends on the average value of the thickness of the printed circuit board 53. Because of this, the difference between the depth D of the recess and the thickness of the printed circuit board 53 may inevitably increase. Therefore, both types
In the mold clamping state of the molds 50 and 51, the molten resin material enters the gap formed between the molds 50 and 51 due to the difference between the depth D of the recess 52 and the thickness of the printed circuit board 53. As a result, there is a serious adverse effect that resin burrs are generated.

For example, as shown in FIG. 5A, when the thickness of the printed circuit board 53a is the maximum value H,
When the molds 50 and 51 are clamped with a normal predetermined mold clamping pressure, a gap is formed between the mold surfaces of the molds 50 and 51. Therefore, if resin molding is performed in this state, the molten resin material enters the gaps between the mold surfaces, and resin burrs 57 are generated. In order to prevent this, for example, both types 50.5
To increase the mold clamping pressure in Step 1 above the specified mold clamping pressure so that there is no gap between the mold surfaces of both molds, use a printed circuit board.
There may be a serious problem that an excessive mold clamping pressure is applied to the surface of 53a and the electronic circuit arranged on the surface is cut off.

For example, as shown in FIG. 5 (2), when the thickness of the printed circuit board 53b is the minimum value h and the molds 50 and 51 are closed, the supply set A gap is formed between the upper surface of the printed circuit board 53b and the mold surface of the upper mold 50. Therefore, if resin molding is performed in this state, the molten resin material enters the gaps between the mold surfaces, and resin burrs 58 are generated. Furthermore,
In this case, since the resin burr 58 is formed, the thickness of the resin sealing molding 59 molded in the cavity 54 is increased by an amount corresponding to the thickness of the resin burr 58. There is a problem that said.

Accordingly, the present invention provides a printed circuit board which is supplied and set between upper and lower dies, and when the upper and lower dies are clamped at a normal predetermined clamping pressure, the printed circuit board is horizontally placed. By elastically supporting the upper and lower molds and the upper surface of the printed circuit board, it is ensured that the upper and lower molds are aligned with each other, so that the above-mentioned gap is not formed between the upper and lower molds. An object of the present invention is to provide a resin sealing molding method and a resin sealing molding die capable of preventing formation.

Further, according to the present invention, when the upper and lower molds are clamped by a usual predetermined mold clamping pressure, the entire flexible printed circuit board is not excessively pressed, Prevents harmful effects such as disconnection of the electronic circuit mounted on the printed circuit board, and ensures that the printed circuit board is securely and properly placed between the upper and lower molds by pressing a required portion of the peripheral edge of the printed circuit board. It is an object of the present invention to provide a resin encapsulation molding method and a resin encapsulation molding die that can be supplied and set to a mold.

[0010]

According to the present invention, there is provided a resin sealing molding method for an electronic component, which solves the above-mentioned technical problem, by using a mold in which an upper mold and a lower mold are opposed to each other. A printed circuit board on which electronic components are mounted is supplied to a recess provided on the mold surface of each of the upper and lower molds, and the electronic components mounted on the printed circuit board are mounted on the molds of both types when the molds of both the molds are clamped. Set in the cavity provided on the surface, in this state,
A printed circuit fitted and set in the cavity by supplying a resin material into a pot provided in the mold to be heated and melted, and injecting and filling the molten resin material into the cavity through a transfer passage. What is claimed is: 1. A resin sealing molding method for an electronic component, which comprises molding an electronic component on a board by resin molding, wherein the depth of the recess for setting the printed circuit board is slightly smaller than the minimum value of the thickness of the printed circuit board. A step of setting the shape of the printed circuit board to be shallow, a step of locking the bottom of the printed circuit board to a locking portion provided at the bottom of the setting recess, and a printed circuit excluding a range locked by the locking portion. A step of elastically supporting the printed circuit board for supporting the bottom of the board with required elasticity; and, at the time of clamping the upper and lower dies, at the predetermined clamping pressure of the two dies, the locking portion of the set recess bottom. The bottom of the printed circuit board locked to Is characterized in that a step of strongly pressing.

Further, a metal mold for resin-sealing molding of an electronic component according to the present invention for solving the above-mentioned technical problem includes an upper mold, a lower mold arranged to face the upper mold, and upper and lower molds thereof. For setting a printed circuit board with electronic components mounted on the mold surface, a cavity provided on the mold surface facing the setting recess, and for transferring a molten resin material connected to the cavity. The printed circuit board is fitted and set in the cavities provided on the mold surfaces of both molds when the mold for resin sealing molding of the electronic component having the passage is clamped, and provided in the mold in this state. The resin material is supplied into the pot and heated and melted, and
An electronic component on a printed circuit board fitted and set in the cavity by injecting and filling the molten resin material into the cavity through a transfer passage. The depth of the set recess is formed to be slightly shallower than the minimum value of the thickness of the printed circuit board, and the set recess is fitted in the set recess. A locking portion for locking the bottom of the circuit board is formed, and the set recess supports the bottom of the printed circuit board with a required elasticity except for a range locked by the locking portion. The present invention is characterized in that the printed circuit board is provided with an elastic support member.

Further, according to the present invention, there is provided a resin sealing mold for an electronic component, wherein an opening is formed at the bottom of the recess for setting the printed circuit board, and the printed circuit board is formed in the opening. An elastic member is provided for fitting the elastic support member slidably and for elastically pushing the elastic support member toward the setting recess side of the printed circuit board. And a locking portion for the printed circuit board.

Further, in the resin encapsulation molding die for an electronic component according to the present invention, an opening is formed at the bottom of the setting recess of the printed circuit board, and the printed circuit board is formed in the opening. An elastic member that slidably fits the elastic support member and that elastically pushes the elastic support member toward the setting recess side of the printed circuit board is provided. It is characterized in that a locking portion of the printed circuit board is formed at a position.

[0014]

According to the present invention, the depth of the recess for setting a printed circuit board is formed to be slightly shallower than the minimum value of the thickness of the printed circuit board, and the bottom of the printed circuit board is set to the recess for the setting. And the bottom of the printed circuit board is supported with required elasticity except for the area locked by the locking portion. , The bottom of the printed circuit board, which is locked to the locking portion at the bottom of the setting recess, is strongly pressed by a predetermined clamping pressure. That is, when the upper and lower molds are clamped in such a state, the mold surface of the upper mold moves relatively downward and the printed circuit board is pushed into the setting recess while maintaining its horizontal state. Further, the central portion of the printed circuit board that does not engage with the engaging portion is pushed into the lower opening portion against the elasticity of the elastic supporting member, but the other bottom portion is engaged with the engaging portion of the recess. Since this portion is strongly pressed and deformed by the locking portion by a predetermined mold clamping pressure by both molds, eventually, between the bottom portion of the printed circuit board and the locking portion of the recess, and It is possible to reliably prevent a gap from being formed between the upper peripheral edge (front surface peripheral edge) of the printed circuit board and the mold surfaces of both molds. Therefore, as a result,
Resin outflow during resin molding can be efficiently and reliably prevented.

According to the present invention, there is provided a printed circuit board provided with an elastic support member for supporting the bottom of the printed circuit board with a required elasticity except for the area locked by the locking portion. Therefore, even if the printed circuit board is formed of a soft material, for example, it is possible to prevent adverse effects such as the central portion of the printed circuit board being elastically deformed by resin pressure injected into the cavity. Can be.

[0016]

The present invention will be described in detail below with reference to the drawings of the embodiments. 1 (1) and 1 (2) show a main part of a resin-sealing mold for an electronic component according to the present invention and a main part of a printed circuit board fitted and set in the mold. FIG. 2 shows a state in which another printed circuit board is fitted to the mold shown in FIG. FIG. 3 shows another embodiment of the mold of the present invention. FIG. 4 shows a lower mold surface of the mold corresponding to FIG.

The resin encapsulation molding die for electronic parts shown in (1) and (2) of FIG. 1 is composed of a fixed upper die 1 and a movable lower die 2 facing the upper die 1. There is. The lower mold 2 is provided with a setting recess 4 for supplying and setting the printed circuit board 3, and the depth A of the setting recess 4 is a minimum value of the thickness of the printed circuit board 3 (see FIG. 2 is set to be slightly shallower than the reference t). The printed circuit board 3 is made of plastic, for example, B
A flexible plate-shaped member made of T resin or the like, which is configured as a single layer or a plurality of layers (laminated plates) and has a required electronic circuit on its surface. ing. The upper mold 1 is provided with a cavity 6 for sealing and molding the electronic component 5 mounted on the printed circuit board 3, and the upper and lower molds (1 and 2) are closed at the time of clamping. The electronic component 5 is fitted and set in the cavity 6. The upper die 1 is provided with a transfer passage 7 for transferring the molten resin material into the cavity 6. Although not shown, a single or a plurality of resin material supply pots are provided in the upper mold 1 and / or the lower mold 2 and a resin molding pot is provided in the pot. A pressure plunger is fitted,
By heating and melting the resin material in the pot and pressurizing the same with the plunger, the molten resin material in the pot can be injected and filled into the predetermined cavity 6 through the transfer passage 7. It is provided as follows.

The setting recess 4 of the printed circuit board 3 is provided with a locking portion 4a for locking the bottom peripheral edge of the printed circuit board 3 fitted and set in the setting recess. Further, the set recess 4 has an elastic support member 9 of the printed circuit board 3 for supporting the bottom of the printed circuit board 3 with required elasticity except for the area locked by the locking portion 4a. It is arranged.

An opening 8 is formed inside the engaging portion 4a at the bottom of the setting recess 4 along the peripheral shape of the engaging portion 4a. In addition, the elastic support member 9 of the printed circuit board 3 is provided in the opening 8.
Is fitted so as to be slidable in the vertical direction, and further, the compression spring elastically pushes the elastic support member 9 toward the setting recess 4 side (upward direction) of the printed circuit board 3. Other suitable elastic members 10 are provided. Therefore, the elastic support member 9 is provided so as to be elastically pushed toward the setting recess 4 by the elastic member 10. Further, the front end surface (upper end surface) 9a of the elastic support member is a two-type
It is formed horizontally so as to be parallel to the PL surface of (1.2), and therefore, the printed circuit board 3 mounted on the tip surface 9a of the elastic supporting member is elastically supported while being horizontally supported. It is provided so that you can

As described above, the setting recess 4 of the printed circuit board 3 has the locking portion 4a for locking the bottom peripheral edge of the printed circuit board 3 fitted and set in the setting recess 4.
Further, the set recess 4 has an elastic support of the printed circuit board 3 for supporting the bottom of the printed circuit board 3 with a required elasticity except for a range locked by the locking portion 4a. A member 9 is provided. The depth A of the setting recess 4 of the printed circuit board 3 is set to be slightly smaller than the minimum value (t) of the thickness of the printed circuit board 3. Therefore, the printed circuit board 3 is set in the setting recess 4.
Is fitted, the peripheral portion (bottom peripheral portion) 11 of the printed circuit board 3 is locked by the locking portion 4a of the recess 4 and the printed circuit board excluding the range locked by the locking portion 4a. The bottom of the board 3, ie, the printed circuit board 3 that does not engage with the locking portion 4a
Is in a state of being elastically supported by the elastic support member 9. Then, when the upper and lower molds (1 and 2) are clamped in this state, the mold surface of the upper mold 1 is relatively moved downward, and the printed circuit board 3 is maintained in a horizontal state, and the setting recess 4 is held. Will be pushed inside. However, at this time, the central portion of the printed circuit board 3 that does not engage with the locking portion 4a is pushed into the lower opening 8 against the elasticity of the elastic support member 9 (elastic member 10). Edge part (bottom part) 11
Is locked by the locking portion 4a of the recess 4 so that this portion is locked by the locking portion 4a by a predetermined mold clamping pressure of both dies (1.2).
Because it is strongly pressed and deforms to become the compression elastic deformation part 12,
There is no gap between the periphery of the printed circuit board 3 and the locking portion 4a of the recess 4. Further, the front surface (upper surface) side of the printed circuit board 3 is, as described above, the upper and lower mold (1
・ Because it is pressed against the mold surface of the upper mold 1 by the predetermined mold clamping pressure by 2), the surface of the printed circuit board 3 and the both molds
There is no gap between the mold surfaces of (1 ・ 2).

Hereinafter, a case where the electronic component mounted on the printed circuit board is molded with a resin using a printed circuit board having a maximum thickness will be described with reference to FIG. First, as shown in FIG. 1A, in the open state of the upper and lower molds (1 and 2), the printed circuit board 3 on which the electronic components 5 are mounted is fitted into the recess 4 of the lower mold 2 and As shown in Fig. 1 (2), the molds (1 and 2) are clamped with normal mold clamping pressure.
At this time, the printed circuit board 3 is larger than the depth A of the recess 4.
Since the thickness T of (3a) is large, as described above,
When the printed circuit board 3 is fitted to the
Of the printed circuit board 3 that is not engaged with the locking portion 4a is elastically supported by the elastic supporting member 9. State. The printed circuit board 3 is pushed into the recess 4 while maintaining the horizontal state by the die surface of the upper die 1 which moves relatively downward, and the portion which is not engaged with the engaging portion 4a is elastic. The peripheral edge portion 11 of the printed circuit board 3 which is pushed into the lower opening 8 against the elasticity of the support member 9 and which is locked by the locking portion 4a has a predetermined shape by both molds (1, 2). The mold clamping pressure causes the printed circuit board 3 to be deformed by being strongly pressed by the locking portion 4a to become the compression elastic deformation portion 12.
There is no gap between the peripheral edge of the recess and the locking portion 4a of the recess 4. The surface (upper surface) of the printed circuit board 3
Since the side is pressed against the mold surface of the upper mold 1 by a predetermined mold clamping pressure by the upper and lower molds (1, 2), the surface of the printed circuit board 3 and the mold surface of both molds (1, 2) are There is no gap between them. Next, in the state described above, the resin material is supplied into the pot of the mold to be heated and melted, and the molten resin material is injected and filled into the cavity 6 through the transfer passage 7. The electronic component 5 mounted on the printed circuit board 3 can be resin-molded. At this time, a gap is formed between the peripheral edge of the printed circuit board 3 and the locking portion 4a of the recess 4 and between the surface of the printed circuit board 3 and the mold surface of both molds (1 and 2). Since it is not performed, it is possible to efficiently and reliably prevent the occurrence of resin burrs at the time of resin sealing molding.

As shown in FIG. 2, in the resin encapsulation molding of the electronic component when the thickness of the printed circuit board is the minimum value t, substantially the same as the case of the resin encapsulation molding described above. You can That is, as shown in FIG. 2, except for the difference in the thickness of the printed circuit board 3 (3b), other setting conditions and the like are substantially the same as in the case of the resin encapsulation molding described above. The circuit board 3b may be fitted in the lower mold recess 4 and the two molds (1, 2) may be clamped with a normal mold clamping pressure to carry out a normal resin sealing molding. At this time, the locked state of the printed circuit board 3b by the locking portion 4a of the recess 4 and the elastically supported state of the elastic support member 9 are the same as in the case of the resin sealing molding described above. In addition, the peripheral portion 11 of the printed circuit board is attached to the locking portion 4
By pressing against a and forming the compression elastic deformation portion 12,
The fact that no gap is formed between the peripheral edge portion 11 and the locking portion 4a, and that no gap is formed between the surface of the printed circuit board 3b and the mold surfaces of both molds (1 and 2) are described above. In this state, the molten resin material is injected and filled into the cavity 6 through the transfer passage 7 in this state. It is possible to obtain substantially the same operation and effect as in the case of the resin sealing molding described above.

The locking portion 4a of the recess 4 described above may be formed as a full-peripheral locking portion for locking the entire peripheral edge of the printed circuit board. As shown in (1), a necessary or necessary portion on the entire periphery of the printed circuit board peripheral portion may be formed as a locking portion having a shape for locking each of them separately.

The mold shown in FIGS. 3 and 4 includes an upper mold 20 and a lower mold.
The lower die 21 is provided with a setting recess 22 for fitting and setting a printed circuit board 30 (30a) on which an electronic component 29 is mounted, and a bottom surface of the recess 22 is provided on the lower surface of the recess 22. Locking portions 22 each having a shape that locks each required or required portion on the entire peripheral edge of the printed circuit board 30a separately.
a is provided for each. Necessary or required locations on the entire periphery of the printed circuit board 30 include, for example, a portion of the transfer passage 24 for injecting the molten resin material into the upper mold cavity 23, as shown in FIG. And the corresponding position.

The configuration of the mold shown in FIGS. 3 and 4 is basically the same as that of the mold shown in FIG. 1. In each of the figures, reference numeral 25 denotes an opening, and reference numeral 26 denotes Support members
Reference numeral 27 indicates an elastic member, reference numeral 31 indicates a peripheral portion of the printed circuit board 30a, and reference numeral 32 indicates a compression elastic deformation portion.

FIG. 3 shows a case where the support member 26 shown in FIG. 3 is provided with an appropriate stopper 28 for restricting the elastic pushing by the elastic member 27. That is, when the support member 26 is elastically pushed upward by the elastic member 27, the tip surface 26a of the support member 26 can be stopped at the same position as the bottom surface position of the recess 22. Also, the elastic pressing force of the elastic member 27 is not applied to the printed circuit board 30a via the support member 26 more than necessary.

Further, even if the printed circuit board is formed of a soft material, the bottom of the printed circuit board except for the area where the printed circuit board is locked by the locking portion of the setting recess is provided by an elastic supporting member having a required elasticity. Because it was configured to support,
It is possible to prevent the bottom portion of the printed circuit board from being elastically deformed downward due to the resin pressure applied to the molten resin material injected and filled in the cavity.

Further, the present invention is not limited to the above-mentioned printed circuit board, and in accordance with the gist of the present invention, it has flexibility and has a plate shape having a large difference between the maximum value and the minimum value of the thickness. It can be used as a member.

Since the resin material used for this type of resin encapsulation molding has high adhesiveness to the printed circuit board, it is convenient for resin encapsulation molding of electronic parts mounted on the printed circuit board. However, conversely, there is a problem that the peeling work is troublesome when the cured resin, which is unnecessary as a product, is peeled from the printed circuit board. That is, at the time of resin molding, the transfer passage 24 (the gate 24a and the runner 24) for injecting the molten resin material into the cavity 23 is formed.
Although the molten resin material is also cured in b), the cured resin is unnecessary as a product and must be removed from the printed circuit board. Therefore, in order to easily remove the cured resin that is unnecessary for the above-mentioned products, the surface portion of the printed circuit board to which such a cured resin adheres,
For example, a gold plating layer 33, a Teflon layer, a silicon layer, or the like having low adhesion to the cured resin may be applied.

The present invention is not limited to the above-mentioned embodiments, and can be arbitrarily and appropriately modified and selected as necessary within the scope of the gist of the present invention. Is.

[0031]

According to the present invention, between the bottom portion of the printed circuit board and the locking portion of the setting recess of the printed circuit board, and the upper peripheral edge of the printed circuit board and the mold surfaces of both molds. Since it is possible to reliably prevent the formation of a gap between the two, it is possible to efficiently and surely prevent the resin from flowing out during resin molding. Therefore, it is possible to provide a resin encapsulation molding method and a resin encapsulation molding die that can eliminate the above-mentioned conventional adverse effects and efficiently and reliably prevent the formation of resin burrs. It has excellent practical effects as mentioned above.

Further, according to the present invention, when the upper and lower molds are clamped by the usual predetermined mold clamping pressure, the entire flexible printed circuit board is not excessively pressed. It is possible to reliably eliminate the conventional harmful effects such as disconnection of the electronic circuit attached to the product, and to mold this type of product with high quality and high reliability. It is effective.

[Brief description of drawings]

FIG. 1 is a longitudinal sectional view showing a main part of a mold for resin sealing molding of an electronic component according to the present invention and a main part of a printed circuit board fitted and set in the mold. ) Indicates the mold open state.
(2) shows a mold clamping state of the mold and a case where the thickness of the printed circuit board is the maximum value.

FIG. 2 is a longitudinal sectional view showing a state in which another printed circuit board is fitted to the mold corresponding to FIG. 1, wherein the mold is in a clamped state, and the thickness of the printed circuit board is a minimum value. Is shown.

FIG. 3 is a vertical cross-sectional view showing another embodiment of the mold according to the present invention, showing a state where the printed circuit board is fitted into the mold and the mold is clamped.

FIG. 4 is a plan view showing a state in which a printed circuit board is supplied and set on a lower mold surface of the mold corresponding to FIG. 3;

FIG. 5 is a longitudinal sectional view showing a main part of a conventional resin molding die, showing a state of clamping after resin molding, and
FIG. 5 (1) shows the case where the thickness of the printed circuit board is the maximum value, and FIG. 5 (2) shows the case where the thickness of the printed circuit board is the minimum value.

[Explanation of symbols]

 1.20 upper die 2.21 lower die 3.3a.3b.30.30a printed circuit board 4.22 recess for set 4a.22a locking part 5.29 electronic parts 6.23 cavity 7.24 transfer passage 8.25 Opening 9.26 Supporting member 9a.26a Tip surface 10.27 Elastic member 11.31 Peripheral edge 12.32 Compressive elastic deformation part 24a Gate 24b Runner 28 Stopper 33 Gold plating layer A Depth t Minimum value T Thickness Sa

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display area // B29L 31:34

Claims (4)

[Claims] 1. A printed circuit board in which electronic components are mounted in recesses provided in the upper and lower mold surfaces by using a mold in which an upper mold and a lower mold are arranged to face each other. At the time of closing the mold, the electronic components mounted on the printed circuit board are fitted and set in the cavities provided on the mold surfaces of the two molds, and in this state, the resin material is placed in the pot provided on the mold. By supplying and heating and melting, and by injecting and filling the molten resin material into the cavity through a transfer passage,
What is claimed is: 1. A method of resin-sealing an electronic component, wherein an electronic component on a printed circuit board fitted and set in the cavity is resin-molded, wherein the depth of the setting recess of the printed circuit board is set to the printed circuit board. Setting a shape that is slightly shallower than the minimum thickness of the board, locking the bottom of the printed circuit board to a locking part provided at the bottom of the setting recess, and the locking part An elastic supporting step of the printed circuit board for supporting the bottom portion of the printed circuit board with a required elasticity except the range locked by the above, and at the time of clamping the upper and lower molds with a predetermined mold clamping pressure of the both molds,
Strongly pressing the bottom of the printed circuit board locked in the locking portion of the bottom of the setting recess. 2. An upper mold, a lower mold opposed to the upper mold,
A recess for setting a printed circuit board on which electronic components are mounted provided on the mold surfaces of the upper and lower molds, a cavity provided on the mold surface facing the recess for setting, and a molten resin which is connected to the cavity. The printed circuit board is fitted and set in a cavity provided in a mold surface of both molds at the time of mold clamping of a resin sealing molding die of an electronic component having a material transfer passage, and in this state, A printed circuit board fitted and set in a cavity by supplying a resin material into a pot provided in a mold, heating and melting the resin material, and injecting and filling the molten resin material into the cavity through a transfer passage. The above electronic component is a mold for resin sealing molding, wherein the depth of the recess for setting the printed circuit board is formed to be slightly shallower than the minimum value of the thickness of the printed circuit board. , A locking portion for locking the bottom of the printed circuit board fitted and set in the setting recess is formed, and further, the printed circuit board excluding a range locked by the locking portion is formed in the setting recess. The present invention is characterized in that an elastic supporting member for a printed circuit board for supporting the bottom of the board with a required elasticity is provided, and a resin sealing mold for electronic components. 3. An opening is formed at the bottom of the recess for setting a printed circuit board, and an elastic support member of the printed circuit board is slidably fitted in the opening, and the elastic support member is provided. An elastic member that elastically pushes toward the setting recess side of the printed circuit board is provided, and furthermore, a locking portion of the printed circuit board is formed on the entire periphery of the opening. The mold for resin-sealing molding of an electronic component according to claim 2. 4. An opening is formed at the bottom of the recess for setting a printed circuit board, and the elastic supporting member of the printed circuit board is slidably fitted in the opening, and the elastic supporting member is provided. An elastic member that elastically pushes the printed circuit board toward the setting recess side of the printed circuit board, and further, a locking portion of the printed circuit board is formed at a required position on the periphery of the opening. The mold for resin sealing molding of an electronic component according to claim 2, wherein: