JPH08297151A - Semiconductor device inspecting handler - Google Patents

Abstract

PURPOSE: To provide an inspecting handier used for selecting electrical characteristics in the manufacturing process of a TAB type semiconductor device. CONSTITUTION: Many sets of probe needles 8 are diagonally fixed to a base substrate 6 on one face of the base substrate 6 made of an insulating member so that the idle ends of the probe needles 8 of each set are nearly on a straight line at prescribed intervals, and electrode pads 6d electrically connected to the probe needles 8 are formed on the other face of the base substrate 6. The idle ends of the probe needles 8 are brought into electric and elastic contact with the electrodes of semiconductor devices, and the probe needles 8 are connected to an external measuring device via contact pieces 10 kept in contact with the electrode pads 6d in this semiconductor device inspecting hander. A reinforcing plate 14 nearly equal to the base substrate 6 in diameter and opened with through holes 14b to be inserted with the elastic contact pieces 10 is fixed to the face of the base substrate 6 where the electrode pads 6d are formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection handler used for selecting electrical characteristics in the process of manufacturing a TAB type semiconductor device.

[0002]

2. Description of the Related Art In a semiconductor device, electrical characteristics are measured in a manufacturing process, grades are selected based on the result, and quality is judged, and only good products are shipped. Here, as the semiconductor device having several hundred electrodes, the TAB structure shown in FIGS. 4 and 5 is usually used. In the figure, reference numeral 1 designates a long insulating tape which is provided with feed holes 1a and 1a along both sides thereof, and rectangular through holes 1b are provided in the middle thereof at predetermined intervals in the longitudinal direction. ing. Reference numeral 2 denotes a conductive pattern formed by etching a conductive foil laminated on the insulating tape 1, and includes an inner lead 2a extending in the through hole 1b and an outer lead 2b externally connected. This insulating tape 1 and conductive pattern 2
The TAB tape 3 is composed of the above laminated body. 4 is through hole 1
2B shows a semiconductor pellet which is disposed in b and has a large number of electrodes 4a formed on its upper surface.

The electrodes 4a of the semiconductor pellets 4 and the inner leads 2a are positioned and polymerized and electrically connected to each other to form a semiconductor device intermediate structure 5 (hereinafter simply referred to as an intermediate structure). If necessary, the surface of the semiconductor pellet 4 of the intermediate structure 5 is moisture-proofed by resin coating, and each semiconductor device is electrically measured to determine whether it is good or bad, and the defective product is cut and removed, and only the good product is wound on the reel. Insulation tape 1
Then, it is punched into a predetermined shape and mounted on a liquid crystal display device or the like. An example of the inspection handler for the intermediate structure 5 will be described with reference to FIGS. 6 and 7. In the figure, 6 is an insulating member, for example, glass epoxy resin having a thickness of 3.5 mm and a diameter of 2
A base substrate of about 00 mm with a rectangular through hole 6 in the center
The holes a and 6a are arranged in parallel. Reference numeral 7 denotes a ceramic rectangular support plate having through holes 7a, 7a formed at portions corresponding to the through holes 6a, 6a, and fixed to the surface of the pace substrate 6 by adhesion.

Reference numeral 8 denotes one surface (upper surface) of the base substrate 6.
A large number of probe needles arranged in 6b. The probe needles are made of a material having excellent wear resistance and elastic force, such as tungsten, and are formed in a taper shape toward the tip. The intermediate portions are arranged on a line and are inclined with respect to the base substrate 6, and the inclined intermediate portions are supported by the support plate 7. The free end 8a of the probe needle 8 is seen through the through hole 6a. Reference numeral 9 is a base block provided with a projecting wall 9a that supports the peripheral edge of the base substrate 6, and 10 is a contactor that is erected inside the projecting wall 9a of the base block 9, and is the other surface (lower surface) of the base substrate 6. Probe needle 8 through a conductive pattern (not shown) that is elastically contacted with 6c and penetrates through base substrate 6 to electrically connect front and back surfaces 6b and 6c thereof.
Is electrically connected to Further, the contact 10 is connected to an external power source for measurement and a measuring device.

The handler 11 is arranged below a predetermined position on the moving path of the intermediate structure 5 which is guided and moved by a guide mechanism (not shown), and the intermediate structure 5 and the handler 11 are arranged.
And move up and down relatively and separate from each other. Also intermediate structure 5
The electrode (conductive pattern) and the probe needle 8 are located above the
A pressing block 12 is arranged to press the intermediate structure 5 in a state where the free end 8a and the free end 8a are overlapped with each other to sink the probe needle 8 to a predetermined depth. The operation of the handler 11 will be described below. First, the semiconductor pellet 4 of the intermediate structure 5 is stopped at a predetermined position, the free end 8a of the probe needle 8 of the handler 11 is brought close to the electrode of the intermediate structure 5, and the television camera (not shown) is made through the through hole 6a of the base substrate 6. By observing the positions of the outer lead 2b and the free end 8a, the handler 11 and the intermediate structure 5 are brought closer to each other and the probe needle free end 8a is brought into contact with the outer lead 2b.

Then, from this contact surface, for example, 100 μm
The intermediate structure 5 is pushed down by the pressing block 12 so that the free end 8a of the probe needle 8 sinks to a predetermined depth, and the probe needle 8 is caused to have an elastic force.
Ensure contact with, and make contact resistance as low as possible. In this way, with the electrical connection between the external measuring device and the intermediate structure 5 completed, the measuring device is operated to perform measurement, and the quality of the intermediate structure 5 is determined based on the result. When the measurement is completed, the pressing block 12 is raised, the probe needle 8 is separated from the intermediate structure 5, the intermediate structure 5 is moved by a predetermined pitch, the next semiconductor pellet is positioned at a predetermined position, and the above operation is repeated. The handler 11 prepares a base substrate 6 on which the probe needles 8 are fixed according to the conductive pattern arrangement structure and dimensions of the intermediate structure 5, selects the base substrate 6 corresponding to the intermediate structure 5 to be measured, and selects the base block 10. It is attached by exchanging with and is compatible with various intermediate structures 5.

As an example, in the case of a semiconductor device for driving a liquid crystal display device, 30 to 40 lines are provided on the input side and about 20 lines are provided on the output side.
0 conductive patterns are formed, and from the viewpoint of mountability in a liquid crystal display device, the input / output outer leads are, for example, 60
They are arranged on parallel straight lines separated by mm. In such a handler for a semiconductor device, the probe needles 8 are also arranged correspondingly. However, the probe needles 8 on the output side, which have a large number, have the free ends 8a arranged in a staggered manner and the adjacent probe needles 8, 8 are arranged. I try not to short circuit.

[0008]

By the way, the handler 11 further generates the elastic force by further pressing the probe needle 8 from the contact surface with the intermediate structure 5, thereby increasing the contact pressure and decreasing the contact resistance. , Probe needle 8
If the contact pressure per one is several 10 to 100 g,
In the case of the semiconductor device for a liquid crystal display device, a pressure of 300 to 1000 g is applied to the input side probe needle, and a pressure of 2 kg to 20 kg is applied to the output side probe needle, respectively, and these forces are applied to the probe of the base substrate 6. Takes over the needle fixing part. On the other hand, since the large number of probe needles 8 are divided into two groups and arranged in parallel to each other, the above-mentioned pressing force non-uniformly presses the base substrate 6 and causes the center portion of the base substrate 6 to be inclined and deformed, thereby forming the probe needles 8. There is a problem that the base substrate 6 remains deformed by repeated contact with the electrodes of the intermediate structure 5 and by repeated use.

Therefore, in the case where the number of probe needles 8 is large and the probe needles 8 are unevenly arranged on the base substrate 6,
As shown in FIG. 8, a reinforcing plate 13 as a reinforcing member is fixed to the back surface of the base substrate 6. The reinforcing plate 13 is made of high-tensile stainless steel having a thickness of about 5 mm.
A through hole 13a is formed in the through hole 6a of the base substrate 6, and is fixed to the central portion of the base substrate 5 by screwing or the like so as not to obstruct the contact 10. This allows
The amount of deformation with respect to the peripheral portion of the central portion of the base substrate 6 is 10
Although it was possible to reduce the size from about 0 μm to about 20 to 30 μm and the effect as a reinforcing member was confirmed, the deformation was large on the output side where the number of probes was large, and therefore the output side probe needle 8
The contact pressure may decrease and the contact resistance may increase, and since the current flowing through the probe needle on the output side is large, the voltage drop due to the contact resistance may affect the measurement results. Was wanted.

Therefore, the applicant has proposed that when the probe needle 8 contacts the intermediate structure 5, the reinforcing plate 13 is locked by an external locking member to suppress deformation.
(See Japanese Patent Application No. 6-203554) As a result, the reinforcing plate 13 is locked by the locking member and is maintained in the parallel state, so that the warp of the base substrate 6 can be prevented. However, in the intermediate structure 5 having a larger number of electrodes, it is necessary to add the contact 10 correspondingly, and when the contact 10 is added, the probe needle 8 is not in contact with the intermediate structure 5 and the base substrate 6 Becomes a state where the peripheral portion is pushed up, and if the arrangement of the contacts 10 is biased, the base substrate 6 tilts, and it is difficult to keep the reinforcing plate 13 and the locking member in a parallel state. There is a problem in that the base substrate 6 tilts and the contact state of the probe needle 8 varies due to contact with and separation from the base plate 6. Further, the contactor 1 electrically connected to the probe needle 8.
The number of 0 is determined according to the intermediate structure 5 having the most probe needles 8 and is arranged along the peripheral edge of the base block 8. However, when the number of probes exceeds 200, the contact 10 is moved to the base block 8 Must be arranged in multiple layers from the outer circumference to the inner side, and there is also a problem that the base substrate having a small number of probe needles is deformed by the pressing force received from the contact 10 although a reinforcing member is not required. It was

[0011]

SUMMARY OF THE INVENTION The present invention has been proposed for the purpose of solving the above-mentioned problems. A plurality of probe needles, one set of a plurality of sets, are provided on one surface of a base substrate made of an insulating member. Of the probe needles are arranged in a straight line at a predetermined interval and fixed obliquely with respect to the base substrate, and electrode pads electrically connected to the probe needles are formed on the other surface of the base substrate. For testing a semiconductor device, the free end of each probe needle is electrically and elastically contacted with the electrode of the semiconductor device, and the probe needle is connected to an external measuring device through an elastic contactor abutting against the electrode pad. In the handler, a reinforcing plate having a through hole through which an elastic contact is inserted and having a diameter substantially the same as that of the base substrate is fixed to the electrode pad forming surface of the base substrate. To provide a use handler.

[0012]

By the means for solving the above problems, the strength of the entire base substrate can be improved, so that the base substrate can be prevented from warping against the pressing force applied from both sides of the base substrate, and the measurement failure due to the variation of the contact pressure of the probe needle can be prevented. .

[0013]

Embodiments of the present invention will be described below with reference to FIGS. 1 and 2. In the figure, 5 is an intermediate structure, 6 is a base substrate,
Reference numeral 7 is a support plate, and 8 is a probe needle. In the respective details, the same parts as those in FIG. In the figure, 14 is a reinforcing plate according to the present invention, having a diameter substantially the same as that of the base substrate 6, a through hole 14a for observing the free end of the probe needle 8 and the electrode position of the intermediate structure 5 through the base substrate 6, and the base substrate. The through hole 14b through which the elastic contact 10 abutting on the electrode pad 6d of 6 is inserted and is fixed to the electrode pad forming surface of the base substrate 6. The reinforcing plate 14 is, for example, a stainless steel plate with a thickness of about 3 mm, and has holes 14 for attaching to the base substrate at the periphery.
c is drilled in several places.

Further, the through hole 14b through which the contact 10 is inserted is divided into a plurality of arcs in the peripheral edge of the reinforcing plate 14. The base substrate 6 to which the reinforcing plate 14 is fixed is attached to the base block 9, and the contact 10 makes elastic contact with the electrode pad of the base substrate 6 to connect the probe needle 8 to a measuring device including an external power source. Even if the elastic contactor 10 has to be additionally installed to support the intermediate structure 5 having a large number of electrodes, the base plate 6 fixed to the base block 9 is flat because the entire surface of the base plate is reinforced by the reinforcing plate 14. Even if the probe needle 8 contacts the intermediate structure 5 and an excessive force is applied to the base substrate 6 during measurement, the reinforcing plate 14 that covers the entire surface of the base substrate 6 prevents bending deformation. To be done. As described above, the semiconductor device inspection handler according to the present invention can prevent the base substrate from being deformed against a biased force applied from both sides. Therefore, the electrical connection between the probe needle 8 and the intermediate structure 5 can be surely performed, and the accuracy can be improved. You can measure.

Further, since the contact pressure of each probe needle 8 can be made uniform, the wear of the probe needle 8 is not uneven, the life of the probe needle 8 can be extended, and accurate measurement can be performed over a long period of time. Also, a base substrate having a diameter of about 200 mm corresponds to the number of electrodes of about 200, but when the number of electrodes exceeds 400, the diameter of 400 to 500 is obtained.
It is necessary to use a base substrate of mm, and the present invention can bring a remarkable effect to the base substrate having such a large diameter. FIG. 3 shows a modification of the present invention. In the figure, the same symbols as in FIG. 1 indicate the same items. In the figure, reference numeral 15 is a reinforcing plate fixed to the back surface of the base substrate 6, and although it is partially shown in the illustrated example, a large number of honeycomb-shaped through holes 15a are formed on the entire surface.

The through hole 15a is set to have a diameter through which at least one elastic contact 10 is inserted, and the through hole 6a through which the free end 8a of the probe needle 8 of the base substrate 6 is seen has a large number of light transmitting windows. The diameter is set so as to be divided.
Since the reinforcing plate 15 has a large number of through holes 15a formed therein, the reinforcing plate 15 is light, and by forming the through holes into a honeycomb shape, sufficient strength can be obtained even if the thickness between the through holes 15a is small.
The strength of the base substrate 6 can be maintained and the weight can be reduced. The present invention is not limited to the above-described embodiment, and for example, the through hole 1
5a is not limited to a honeycomb shape, but may be a triangle, a circle, a rhombus, a parallelogram, or the like. Further, the openings, which are the through holes 14a and 15a of the reinforcing plates 14 and 15, may be provided with an inward annular flange or a cylindrical portion in the axial direction at the periphery thereof to improve the strength.

[0017]

As described above, according to the present invention, since the entire surface of the base substrate is reinforced by the reinforcing plate to improve its strength,
Even if an excessive force is applied to uneven positions on both sides of the base substrate, the base substrate can be prevented from being deformed, and the probe needle height positions can be prevented from varying. The electrodes of the structure can be brought into contact with each other with a uniform contact pressure, and the wear of the probe needle can be made uniform, so that accurate measurement can be performed over a long period of time.

[Brief description of drawings]

FIG. 1 is a side sectional view of a semiconductor device inspection handler showing an embodiment of the present invention.

FIG. 2 is a plan view showing a reinforcing plate used in FIG. 1 handler.

FIG. 3 is a plan view of a reinforcing plate showing a modified example of the present invention.

FIG. 4 is a perspective view showing a TAB type semiconductor device intermediate structure.

5 is a side sectional view of the intermediate structure shown in FIG.

FIG. 6 is a side sectional view of a handler used to inspect the electrical characteristics of the intermediate structure.

FIG. 7 is a top view of FIG. 6 handler.

FIG. 8 is a side sectional view of a main part of a handler using a base substrate reinforced by a reinforcing plate.

[Explanation of symbols]

 6 Base Board 8 Probe Needle 10 Elastic Contact 11 Handler 14 Reinforcement Plate 14b Through Hole 15 Reinforcement Plate 15a Through Hole

Claims (3)

[Claims] 1. A base substrate made of an insulating member, on one surface of which a plurality of sets of a large number of probe needles are set, and the free ends of the probe needles of each set are arranged in a substantially straight line at predetermined intervals, and the base is formed. An electrode pad that is electrically connected to each probe needle is formed on the other surface of the base substrate while tilted and fixed to the substrate, and the free end of each probe needle electrically and elastically contacts the electrode of the semiconductor device. Let
In a semiconductor device inspection handler, which is connected to an external measuring device via an elastic contactor that is in contact with the electrode pad, an elastic contact having a diameter substantially the same as that of the base substrate is made on the electrode pad formation surface of the base substrate. A handler for inspecting a semiconductor device, wherein a reinforcing plate having a through hole through which a child is inserted is fixed. 2. The handler for inspecting a semiconductor device according to claim 1, wherein the reinforcing plate is provided with a large number of through holes having a honeycomb shape. 3. The handler for inspecting a semiconductor device according to claim 1, wherein a reinforcing portion is formed on a peripheral edge of the through hole of the reinforcing plate.