JPH08293673A - Manufacture of multilayer board - Google Patents
Manufacture of multilayer boardInfo
- Publication number
- JPH08293673A JPH08293673A JP10146395A JP10146395A JPH08293673A JP H08293673 A JPH08293673 A JP H08293673A JP 10146395 A JP10146395 A JP 10146395A JP 10146395 A JP10146395 A JP 10146395A JP H08293673 A JPH08293673 A JP H08293673A
- Authority
- JP
- Japan
- Prior art keywords
- core material
- layer core
- layer
- multilayer board
- pressed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000011162 core material Substances 0.000 claims abstract description 62
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000011889 copper foil Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- 238000000465 moulding Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 5
- 239000002966 varnish Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 abstract description 7
- 229910052802 copper Inorganic materials 0.000 abstract description 6
- 239000010949 copper Substances 0.000 abstract description 6
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 abstract description 3
- 239000003365 glass fiber Substances 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 description 8
- 238000007254 oxidation reaction Methods 0.000 description 8
- 238000005530 etching Methods 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、内層コア材及び外層コ
ア材を使用した多層板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer board using an inner core material and an outer core material.
【０００２】[0002]
【従来の技術】従来、多層板はインピーダンスコントロ
ール、最外絶縁厚み公差等、板厚に係わる要求が厳しく
なっている。そのため、多層化を図る際に所望の板厚を
得るための１つの方法として、より多くのコア材を使用
して板厚の精度を確保する多層板の製造方法が行われて
きた。2. Description of the Related Art Conventionally, the requirements for the thickness of multilayer boards such as impedance control and outermost insulation thickness tolerance have become strict. Therefore, as one method for obtaining a desired plate thickness when achieving a multilayer structure, a method for manufacturing a multilayer plate has been performed in which more core materials are used to ensure plate thickness accuracy.
【０００３】この多層板の製造方法としては、図３に示
す層構成を有するものがあった。この図２は、従来の６
層からなる多層板の製造方法を説明するための層構成を
示す断面図である。この図を利用して従来の多層板の製
造方法を説明する。As a method of manufacturing this multilayer board, there has been one having a layer structure shown in FIG. This FIG. 2 shows the conventional 6
It is sectional drawing which shows the laminated constitution for demonstrating the manufacturing method of the multilayer board which consists of layers. A conventional method for manufacturing a multilayer board will be described with reference to this drawing.
【０００４】まず初めに、例えば、両面銅張積層板に信
号層パターン、電源層パターン、グランドパターン等の
各所定のパターンを形成して内層コア材１を形成する。
また、両面銅張積層板の片面に信号層パターン、電源層
パターン、グランドパターン等の所定の回路パターン４
を形成して外層コア材２を形成する。First, each inner layer core material 1 is formed by forming predetermined patterns such as a signal layer pattern, a power layer pattern, and a ground pattern on a double-sided copper clad laminate.
Further, a predetermined circuit pattern 4 such as a signal layer pattern, a power layer pattern, a ground pattern, etc. is formed on one surface of the double-sided copper clad laminate.
To form the outer core material 2.
【０００５】次に、上記表裏に回路パターン４が形成さ
れた内層コア材１の上下に、たとえばガラス布などの基
材にエポキシ樹脂などの樹脂ワニスを含浸したプリプレ
グ３を所要枚数重ねるとともに、外層コア材２をその両
側に重ね、これを加熱加圧成形することによって多層板
を得ている。Next, a required number of prepregs 3 obtained by impregnating a base material such as glass cloth with a resin varnish such as epoxy resin are stacked on the upper and lower sides of the inner core material 1 having the circuit patterns 4 formed on the front and back surfaces thereof, and the outer layer. The core material 2 is overlapped on both sides of the core material 2 and heat-pressed to obtain a multilayer board.
【０００６】この多層板の製造方法において、内層コア
材１は片面粗化銅箔８が使用されているが、プリプレグ
３との接着強度を高めるために、この片面粗化銅箔８の
回路パターン４が形成された表面を酸化処理により酸化
処理面１０を形成し表面を粗化している。また、外層コ
ア材２は最外層となる銅箔には片面粗化銅箔８を使用
し、内層コア材１側にはプリプレグ３との接着強度を高
めるために両面粗化銅箔９を使用している。In this method for manufacturing a multilayer board, the inner layer core material 1 uses a roughened copper foil 8 on one side. To increase the adhesive strength with the prepreg 3, the circuit pattern of the roughened copper foil 8 on one side is used. The surface on which No. 4 is formed is oxidized to form an oxidation-treated surface 10 to roughen the surface. Further, the outer layer core material 2 uses a single-sided roughened copper foil 8 for the outermost copper foil, and the inner layer core material 1 side uses a double-sided roughened copper foil 9 to increase the adhesive strength with the prepreg 3. are doing.
【０００７】ところが、この両面粗化銅箔９は片面粗化
銅箔８に比べてコストが高く、表面が保護処理されてい
ないので取扱に手間がかかっていた。つまり、この粗化
面は光沢面に比べ酸化し易いため、ラミネート及び回路
形成の際、表面の酸化物を取り除く、酸洗いを実施して
いた。However, this double-sided roughened copper foil 9 is more expensive than the single-sided roughened copper foil 8 and its surface is not protected so that it takes time to handle. That is, since the roughened surface is more easily oxidized than the glossy surface, pickling is performed to remove oxides on the surface during lamination and circuit formation.
【０００８】[0008]
【発明が解決しようとする課題】本発明は上記の問題を
鑑みてなされたもので、その目的とするところは、内層
コア材及び外層コア材を用いて多層板を容易に且つ効率
よく製造することができる多層板の製造方法を提供する
ことにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to easily and efficiently manufacture a multilayer board using an inner core material and an outer core material. It is an object of the present invention to provide a method for manufacturing a multilayer board that can be manufactured.
【０００９】[0009]
【課題を解決するための手段】本発明の請求項１に係る
多層板の製造方法は、酸化処理された内層コア材１の上
下に、基材に樹脂ワニスを含浸したプリプレグ３を介し
て酸化処理された外層コア材２を重ねて被圧体５とし、
この被圧体５を鏡面板６の間に挟み、加熱加圧成形して
多層板を形成することを特徴とする。According to a first aspect of the present invention, there is provided a method for producing a multilayer board, wherein oxidation is carried out above and below an oxidation-treated inner layer core material 1 through a prepreg 3 having a base material impregnated with a resin varnish. The treated outer layer core material 2 is overlapped to form a body 5 to be pressed,
The pressure-sensitive body 5 is sandwiched between mirror-finished plates 6 and heat-pressed to form a multilayer plate.
【００１０】また、本発明の請求項２に係る多層板の製
造方法は、上記請求項１の加熱加圧成形の際に、被圧体
５と鏡面板６との間にカバーシート７を挿入し、加熱加
圧成形することを特徴とする。Further, in the method for manufacturing a multilayer board according to claim 2 of the present invention, the cover sheet 7 is inserted between the body 5 to be pressed and the mirror-finished plate 6 in the heat and pressure molding according to claim 1. And heat and pressure molding.
【００１１】また、本発明の請求項３に係る多層板の製
造方法は、上記請求項２で使用されるカバーシート７が
銅箔で、被圧体５に面する側に粗化面を配して加熱加圧
成形することを特徴とする。Further, in the method for manufacturing a multilayer board according to claim 3 of the present invention, the cover sheet 7 used in claim 2 is a copper foil, and a roughened surface is arranged on the side facing the body 5 to be pressed. And heat and pressure molding is performed.
【００１２】[0012]
【作用】本発明に係る多層板の製造方法によると、表面
を酸化処理して得られた内層コア材と外層コア材をプリ
プレグを介して重ね合わせて被圧体とし、この被圧体を
鏡面板の間に挟み、加熱加圧成形して多層板を形成する
ので、コア材の表面に同種の銅箔を貼着して、同じ加工
工程で内層コア材及び外層コア材を形成することができ
る。また、上記被圧体を加熱加圧成形するので、内層コ
ア材と外層コア材を同様にして形成することができる。According to the method for producing a multilayer board according to the present invention, the inner core material and the outer core material obtained by oxidizing the surfaces are superposed on each other via a prepreg to form a pressure body, and the pressure body is a mirror surface. Since it is sandwiched between plates and heat-pressed to form a multilayer plate, the same kind of copper foil can be attached to the surface of the core material to form the inner core material and the outer core material in the same processing step. Further, since the above-mentioned pressed body is heated and pressed, the inner layer core material and the outer layer core material can be formed in the same manner.
【００１３】また、加熱加圧成形の際に、被圧体と鏡面
板との間にカバーシートを挿入することにより、プリプ
レグやコア材の端面より飛散するレジン粉の最外層への
付着を防止することができる。このカバーシートは、耐
熱性に優れたものが使用され、トリアセテート樹脂やポ
リフッ化ビニル樹脂等の樹脂で形成された離形シート、
又は、銅やアルミニウム等で形成された金属箔が使用さ
れる。In addition, by inserting a cover sheet between the body to be pressed and the mirror surface plate at the time of heat and pressure molding, it is possible to prevent the resin powder scattered from the end surfaces of the prepreg and the core material from adhering to the outermost layer. can do. As this cover sheet, one having excellent heat resistance is used, and a release sheet formed of a resin such as triacetate resin or polyvinyl fluoride resin,
Alternatively, a metal foil formed of copper, aluminum or the like is used.
【００１４】また、上記カバーシートが銅箔で、被圧体
に面する側に粗化面を配して加熱加圧成形することによ
り、加熱加圧成形によりプリプレグより流出した樹脂が
この銅箔の粗化面に付着し、多層板と銅箔を一体化する
ことができる。Further, the cover sheet is a copper foil, and a roughened surface is arranged on the side facing the body to be pressure-molded, and the resin is discharged from the prepreg by the heat-pressure molding. It can be attached to the roughened surface of and the multilayer board and the copper foil can be integrated.
【００１５】本発明で使用される外層コア材は、内層コ
ア材を形成する方法と同様にして形成されるもので、所
要枚数のプリプレグを重ね合わせ、その上下に銅箔を配
して加熱加圧成形し、得られた積層板の表面をエッチン
グ処理して回路を形成することにより得ることができ
る。さらに、この積層板の表面の銅箔を酸化処理するこ
とにより多層板の材料として使用することができる。The outer core material used in the present invention is formed in the same manner as the method for forming the inner core material. A required number of prepregs are superposed, and copper foils are arranged on the upper and lower sides of the prepregs and heated. It can be obtained by pressure molding and etching the surface of the obtained laminated plate to form a circuit. Further, the copper foil on the surface of this laminated plate can be used as a material for a multilayered plate by oxidizing it.
【００１６】上記銅箔には電解銅箔の片面粗化銅箔が使
用され、コア材を形成する際にプリプレグに対向する面
に粗化面、外側に光沢面を配して貼着されている。As the above copper foil, a one-sided roughened copper foil of an electrolytic copper foil is used. When a core material is formed, a roughened surface is placed on the surface facing the prepreg and a glossy surface is placed on the outer side. There is.
【００１７】また上記酸化処理としては、ブラウンオキ
サイド処理、ブラックオキサイド処理（黒化処理）等の
化学処理が施される。この酸化処理で形成された酸化処
理面は、内層コア材、及び外層コア材のプリプレグに相
対する面に形成されるものはプリプレグとの接着強度を
増すために、また、多層板の最外層に配せられるもの
は、多層板を形成したのち除去される。As the oxidation treatment, a chemical treatment such as brown oxide treatment or black oxide treatment (blackening treatment) is applied. The oxidation treated surface formed by this oxidation treatment is formed on the surface of the inner layer core material and the outer layer core material facing the prepreg to increase the adhesive strength with the prepreg, and also on the outermost layer of the multilayer board. What is placed is removed after forming the multilayer board.
【００１８】以下、本発明を一実施例について詳細に説
明する。The present invention will be described in detail below with reference to an embodiment.
【００１９】[0019]
実施例１ 厚さ１００μｍのガラス布の基材（日東紡社製：ＷＥＡ
１１６Ｅ）にエポキシ樹脂を含浸し、乾燥して樹脂が半
硬化したプリプレグ３を２枚重ね合わせ、さらに、その
両側に７０μｍの片面粗化銅箔８を重ね合わせて鏡面板
間に挟み、一対の熱盤間に配し、温度１８０℃、圧力４
０ｋｇ／ｃｍ2 で９０分加熱加圧して、厚さ０．２ｍｍ
の両面銅張積層板を得た。Example 1 100 μm thick glass cloth substrate (Nittobo Co., Ltd .: WEA)
116E) is impregnated with an epoxy resin, and two prepregs 3 in which the resin is semi-cured by drying are overlapped, and further, a 70 μm single-sided roughened copper foil 8 is overlapped and sandwiched between mirror-finished plates. Placed between hot plates, temperature 180 ℃, pressure 4
Heated and pressurized at 0 kg / cm 2 for 90 minutes, thickness 0.2 mm
A double-sided copper clad laminate was obtained.
【００２０】さらに、この両面銅張積層板をエッチング
処理を施して回路パターン４を形成し、この回路パター
ン４に黒化処理を施して酸化処理面１０を形成し、内層
コア材１、及び、外層コア材２を形成した。Further, this double-sided copper-clad laminate is subjected to an etching treatment to form a circuit pattern 4, and the circuit pattern 4 is subjected to a blackening treatment to form an oxidation-treated surface 10, and the inner core material 1 and The outer core material 2 was formed.
【００２１】そして、図１に示す如く、得られた内層コ
ア材１の上下に厚さ０．１５ｍｍの上記プリプレグ３を
複数枚重ね、さらに、外層コア材２をその外側にそれぞ
れ重ね合わせた被圧体５を、対を成す鏡面板６の間に挟
み、この対を成す鏡面板６で挟持した被圧体５の複数組
を一対の熱盤間に挟んで、温度１７０℃、８０分間、圧
力５ｋｇ／ｃｍ2 で５分間印加、圧力４０ｋｇ／ｃｍ2
で７５分間印加して加熱加圧成形を行い６層の多層板を
得た。Then, as shown in FIG. 1, a plurality of the above-mentioned prepregs 3 having a thickness of 0.15 mm are laminated on the upper and lower sides of the obtained inner layer core material 1, and further, the outer layer core material 2 is laminated on the outer side thereof. The pressure body 5 is sandwiched between a pair of mirror surface plates 6, and a plurality of sets of pressure bodies 5 sandwiched by the pair of mirror surface plates 6 are sandwiched between a pair of heating plates, and the temperature is 170 ° C. for 80 minutes. Apply pressure 5kg / cm 2 for 5 minutes, pressure 40kg / cm 2
Was applied for 75 minutes to perform heat and pressure molding to obtain a 6-layer multilayer plate.
【００２２】実施例２ 上記実施例１と同様にして、両面銅張積層板形成し、さ
らに、この両面銅張積層板をエッチング処理を施して回
路パターン４を形成し、この回路パターン４に黒化処理
を施して酸化処理面１０を形成して内層コア材１、及
び、外層コア材２を形成した。Example 2 In the same manner as in Example 1 above, a double-sided copper-clad laminate was formed, and then this double-sided copper-clad laminate was etched to form a circuit pattern 4, and the circuit pattern 4 was black. Then, the inner surface core material 1 and the outer core material 2 were formed by forming the oxidation-treated surface 10 by chemical treatment.
【００２３】そして、図２に示す如く、得られた内層コ
ア材１の上下に厚さ０．１５ｍｍの上記プリプレグ３を
複数枚重ね、さらに、外層コア材２をその外側にそれぞ
れ重ね合わせた被圧体５を形成し、この被圧体５の上下
にカバー銅箔７ａを重ね合わせ、対を成す鏡面板６の間
に挟み、この対を成す鏡面板６で挟持した被圧体５の複
数組を一対の熱盤間に挟んで、温度１７０℃、８０分
間、圧力５ｋｇ／ｃｍ2で５分間印加、圧力４０ｋｇ／
ｃｍ2 で７５分間印加して加熱加圧成形を行い６層の多
層板を得た。Then, as shown in FIG. 2, a plurality of the above-mentioned prepregs 3 having a thickness of 0.15 mm are laminated on the upper and lower sides of the obtained inner layer core material 1, and further, the outer layer core material 2 is laminated on the outer side thereof. A plurality of pressure bodies 5 are formed by forming the pressure body 5, superposing the cover copper foils 7a on the upper and lower sides of the pressure body 5, sandwiching them between the pair of mirror surface plates 6 and sandwiching between the pair of mirror surface plates 6. The pair is sandwiched between a pair of heating plates, and the temperature is 170 ° C. for 80 minutes, and the pressure is 5 kg / cm 2 for 5 minutes, and the pressure is 40 kg /
Application was carried out at 75 cm 2 for 75 minutes to perform heat and pressure molding to obtain a 6-layer multilayer plate.
【００２４】比較例１ 実施例１と同様にして、厚さ０．２ｍｍの両面銅張積層
板を形成し、この両面銅張積層板にエッチング処理を施
し、さらに、エッチング処理で形成された回路パターン
４に黒化処理を施して信号回路及び電源回路、接地回路
に酸化処理面１０を有する内層コア材１を形成した。Comparative Example 1 In the same manner as in Example 1, a double-sided copper-clad laminate having a thickness of 0.2 mm was formed, the double-sided copper-clad laminate was subjected to etching treatment, and further the circuit formed by the etching treatment. The pattern 4 was blackened to form the inner core material 1 having the oxidized surface 10 on the signal circuit, the power supply circuit and the ground circuit.
【００２５】また、プリプレグ３を２枚重ね合わせ、一
方の面に７０μｍの片面粗化銅箔８、他方の面に７０μ
ｍの両面粗化銅箔９を重ね合わせて鏡面板６の間に挟
み、一対の熱盤間に配し、温度１８０℃、圧力４０ｋｇ
／ｃｍ2 で９０分加熱加圧して、厚さ０．２ｍｍの両面
銅張積層板を得た。Further, two prepregs 3 are superposed on each other, one surface of the one-side roughened copper foil 8 having a thickness of 70 μm and the other surface having a thickness of 70 μm.
m double-sided roughened copper foils 9 are superposed and sandwiched between mirror surface plates 6 and placed between a pair of hot plates, temperature 180 ° C., pressure 40 kg.
It was heated and pressed at 90 / cm 2 for 90 minutes to obtain a double-sided copper clad laminate having a thickness of 0.2 mm.
【００２６】そして、図３に示す如く、得られた内層コ
ア材１の上下に厚さ０．１５ｍｍの上記プリプレグ３を
複数枚重ね、さらに、外層コア材２をその外側にそれぞ
れ重ね合わせた被圧体５を形成した。この外層コア材２
は両面粗化銅箔９が貼着された面をプリプレグ３に対向
する面にして配されている。この被圧体５を対を成す鏡
面板６の間に挟み、この対を成す鏡面板６で挟持した被
圧体５の複数組を一対の熱盤間に挟んで、温度１７０
℃、８０分間、圧力５ｋｇ／ｃｍ2 で５分間印加、圧力
４０ｋｇ／ｃｍ2 で７５分間印加して加熱加圧成形を行
い６層の多層板を得た。Then, as shown in FIG. 3, a plurality of the above prepregs 3 having a thickness of 0.15 mm are laminated on the upper and lower sides of the obtained inner layer core material 1, and further, the outer layer core material 2 is laminated on the outer side thereof. The pressure body 5 was formed. This outer core material 2
Is arranged with the surface to which the double-sided roughened copper foil 9 is attached facing the prepreg 3. The pressure target body 5 is sandwiched between a pair of mirror surface plates 6, and a plurality of sets of the pressure bodies 5 sandwiched between the pair of mirror surface plates 6 are sandwiched between a pair of heating plates, and a temperature of 170
A 6-layer multi-layer plate was obtained by applying 80 ° C., a pressure of 5 kg / cm 2 for 5 minutes, and a pressure of 40 kg / cm 2 for 75 minutes for heat and pressure molding.
【００２７】上記実施例１〜実施例２を、比較例１の生
産性、及び、外層コア材２のコストをそれぞれ１００と
して評価した。また、得られた６層の多層板を目視検査
により打こん不良率を測定し、表１に記した。The above Examples 1 and 2 were evaluated with the productivity of Comparative Example 1 and the cost of the outer core material 2 being 100, respectively. Further, the punching failure rate of the obtained 6-layered multilayer board was measured by visual inspection, and the results are shown in Table 1.
【００２８】[0028]
【表１】 表１の結果に示す如く、実施例１及び実施例２では生産
性が１２０％になり、外層コア材２のコストが８５％で
形成することができる。[Table 1] As shown in the results of Table 1, in Examples 1 and 2, the productivity is 120%, and the cost of the outer core material 2 can be 85%.
【００２９】また、実施例２に示す如く、カバー銅箔を
使用することにより打こん不良率を軽減することが確認
できた。また、このようにカバー銅箔の粗化面を多層板
側にすることにより、このカバー銅箔が多層板と接着
し、周囲を切断する外形加工工程まで最外層の回路パタ
ーン４を保護することができる。Also, as shown in Example 2, it was confirmed that the use of the cover copper foil reduces the punching failure rate. Further, by making the roughened surface of the cover copper foil on the side of the multilayer board in this way, the cover copper foil adheres to the multilayer board and protects the outermost circuit pattern 4 until the outer shape processing step of cutting the periphery. You can
【００３０】また、内層回路パターン４をＸ線透過装置
を使用して計測、確認する際には、全面がカバー銅箔で
覆われているので、Ｘ線の反射成分と透過成分を多層板
の全面に均一にすることができ、誤差が少なく、信頼性
の高い計測結果を得ることができる。When the inner layer circuit pattern 4 is measured and confirmed by using an X-ray transmission device, the entire surface is covered with the cover copper foil. It is possible to make the entire surface uniform and to obtain highly reliable measurement results with little error.
【００３１】[0031]
【発明の効果】本発明の多層板の製造方法によると、内
層回路となる回路パターンを酸化処理した内層コア材と
表面の回路パターンを酸化処理した外層コア材を形成
し、この内層コア材の上下に基材に樹脂ワニスを含浸し
たプリプレグを介して外層コア材を重ねて被圧体とし、
この被圧体を鏡面板で挟持して、加熱加圧成形して多層
板を形成するので、内層コア材を形成するのと同様にし
て外層コア材を形成する事が可能になり、容易に内層コ
ア材及び外層コア材を形成して生産性を向上することが
でき、さらに、コストの軽減を図ることができる。ま
た、多層板を加熱加圧成形する際に、多層板を形成する
被圧体と鏡面板との間にカバー銅箔を挿入することによ
り、端面より飛散するレジン粉による打コン不良の発生
を防ぎ、不良率を軽減することができる。According to the method for manufacturing a multilayer board of the present invention, an inner layer core material obtained by oxidizing a circuit pattern to be an inner layer circuit and an outer layer core material obtained by oxidizing a surface circuit pattern are formed. The outer core material is overlaid on top and bottom via a prepreg in which a resin varnish is impregnated into the base material to form a body to be pressed,
Since the pressure-sensitive body is sandwiched by mirror-finished plates and heat-pressed to form a multilayer plate, it is possible to form the outer-layer core material in the same manner as the inner-layer core material is formed. By forming the inner layer core material and the outer layer core material, the productivity can be improved and the cost can be reduced. In addition, when heat-pressing a multilayer board, inserting a cover copper foil between the pressure-sensitive body forming the multilayer board and the mirror-finished board prevents the occurrence of defective tapping due to resin powder scattered from the end surface. It is possible to prevent and reduce the defective rate.
【図１】本発明に係る多層板の製造方法の一実施例を示
す多層板の層構成を示す断面図である。FIG. 1 is a cross-sectional view showing a layer structure of a multilayer board showing an embodiment of a method for manufacturing a multilayer board according to the present invention.
【図２】本発明に係る多層板の製造方法の他の一実施例
を示す多層板の層構成を示す断面図である。FIG. 2 is a cross-sectional view showing a layer structure of a multilayer board showing another embodiment of the method for manufacturing a multilayer board according to the present invention.
【図３】従来の多層板の製造方法を示す多層板の層構成
を示す断面図である。FIG. 3 is a cross-sectional view showing a layer structure of a multilayer board showing a conventional method for manufacturing a multilayer board.
１ 内層コア材 ２ 外層コア材 ３ プリプレグ ４ 回路パターン ５ 被圧体 ６ 鏡面板 ７ カバーシート ８ 片面粗化銅箔 ９ 両面粗化銅箔 １０ 酸化処理面 1 Inner layer core material 2 Outer layer core material 3 Prepreg 4 Circuit pattern 5 Pressed body 6 Mirror surface plate 7 Cover sheet 8 Roughened copper foil on one side 9 Roughened copper foil on both sides 10 Oxidized surface
Claims (3)
理した内層コア材１と表面の回路パターン４を酸化処理
した外層コア材２を形成し、この内層コア材１の上下に
基材に樹脂ワニスを含浸したプリプレグ３を介して外層
コア材２を重ねて被圧体５とし、この被圧体５を鏡面板
６で挟持して、加熱加圧成形して多層板を形成すること
を特徴とする多層板の製造方法。1. An inner layer core material 1 in which a circuit pattern 4 to be an inner layer circuit is oxidized and an outer layer core material 2 in which a circuit pattern 4 on the surface is oxidized are formed, and a resin is used as a base material above and below the inner layer core material 1. The outer layer core material 2 is laminated via a prepreg 3 impregnated with varnish to form a pressure-receiving body 5, and the pressure-receiving body 5 is sandwiched between mirror-like plates 6 and heat-pressed to form a multilayer plate. And a method for manufacturing a multilayer board.
に、被圧体５と鏡面板６との間にカバーシート７を挿入
して加熱加圧成形することを特徴とする多層板の製造方
法。2. A multi-layer board characterized in that, in the heat and pressure molding according to claim 1, a cover sheet 7 is inserted between the body to be pressed 5 and the mirror surface plate 6 to perform the heat and pressure molding. Manufacturing method.
箔で、被圧体５に面する側に粗化面を配して加熱加圧成
形することを特徴とする多層板の製造方法。3. The method for producing a multilayer board, wherein the cover sheet 7 according to claim 2 is a copper foil, and a roughened surface is arranged on the side facing the pressure-receiving body 5 and the surface is heat-pressed. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10146395A JPH08293673A (en) | 1995-04-25 | 1995-04-25 | Manufacture of multilayer board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10146395A JPH08293673A (en) | 1995-04-25 | 1995-04-25 | Manufacture of multilayer board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08293673A true JPH08293673A (en) | 1996-11-05 |
Family
ID=14301411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10146395A Pending JPH08293673A (en) | 1995-04-25 | 1995-04-25 | Manufacture of multilayer board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08293673A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7172925B2 (en) | 2002-12-09 | 2007-02-06 | Noda Screen Co., Ltd. | Method for manufacturing printed wiring board |
| CN110769593A (en) * | 2019-11-27 | 2020-02-07 | 珠海元盛电子科技股份有限公司 | A kind of FPC multi-layer board pressure transmission structure and FPC multi-layer board pressing method |
-
1995
- 1995-04-25 JP JP10146395A patent/JPH08293673A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7172925B2 (en) | 2002-12-09 | 2007-02-06 | Noda Screen Co., Ltd. | Method for manufacturing printed wiring board |
| CN110769593A (en) * | 2019-11-27 | 2020-02-07 | 珠海元盛电子科技股份有限公司 | A kind of FPC multi-layer board pressure transmission structure and FPC multi-layer board pressing method |
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