JPH08321705A - High frequency transmission line and manufacturing method thereof - Google Patents
High frequency transmission line and manufacturing method thereofInfo
- Publication number
- JPH08321705A JPH08321705A JP7127930A JP12793095A JPH08321705A JP H08321705 A JPH08321705 A JP H08321705A JP 7127930 A JP7127930 A JP 7127930A JP 12793095 A JP12793095 A JP 12793095A JP H08321705 A JPH08321705 A JP H08321705A
- Authority
- JP
- Japan
- Prior art keywords
- conductor film
- plate
- inductor element
- transmission line
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
- Filters And Equalizers (AREA)
Abstract
(57)【要約】
【目的】 製造の手間を要さず、コンパクトかつ低損失
の高周波伝送線路を提供する。
【構成】 マイクロストリップ伝送線路を構成するスト
リップ導体層１を、絶縁膜１１とこれを挟んで上下に位
置する上側導電膜１２および下側導電膜１３とで構成す
る。下側導電膜１３により、渦巻き状に成形されたスパ
イラルインダクタ素子１４と、これの中心部に位置して
インダクタ素子１４の内周端１４１に接続された板状電
極１５を形成する。また、上側導電膜１２により、絶縁
膜１１を介して板状電極１５に対向しキャパシタ素子を
構成する板状電極１６を形成する。
(57) [Abstract] [Purpose] To provide a compact and low-loss high-frequency transmission line that does not require manufacturing. [Structure] A strip conductor layer 1 that constitutes a microstrip transmission line is composed of an insulating film 11 and an upper conductive film 12 and a lower conductive film 13 that are located above and below with the insulating film 11 interposed therebetween. The lower conductive film 13 forms the spiral inductor element 14 formed in a spiral shape and the plate electrode 15 located at the center of the spiral inductor element 14 and connected to the inner peripheral end 141 of the inductor element 14. Further, the upper conductive film 12 forms the plate electrode 16 that faces the plate electrode 15 with the insulating film 11 in between and forms a capacitor element.
Description
【０００１】[0001]
【産業上の利用分野】本発明は高周波伝送線路に関し、
特にインダクタ素子とキャパシタ素子からなるフィルタ
を設けた積層型平面伝送線路の構造改良に関する。BACKGROUND OF THE INVENTION The present invention relates to a high frequency transmission line,
In particular, it relates to a structure improvement of a laminated planar transmission line provided with a filter including an inductor element and a capacitor element.
【０００２】[0002]
【従来の技術】図６には集中定数型のフィルタを設けた
積層型平面伝送線路の代表例として、マイクロストリッ
プ伝送線路の分解斜視図を示す。図において、高周波が
伝送される誘電体基板３には下面全面に導体膜２が形成
されてアース導体層となっており、一方、上記誘電体基
板３の上面には、高周波伝播方向（図の左右方向）へ互
いに間隔をおいて、渦巻き状に成形されたスパイラルイ
ンダクタ素子１４、矩形の板状電極１５´、およびリー
ド線１８が導体膜により形成されている（図８）。2. Description of the Related Art FIG. 6 shows an exploded perspective view of a microstrip transmission line as a typical example of a laminated flat transmission line provided with a lumped constant type filter. In the figure, a conductor film 2 is formed on the entire lower surface of a dielectric substrate 3 to which a high frequency is transmitted to form a ground conductor layer, while on the upper surface of the dielectric substrate 3, a high frequency propagation direction (see FIG. Spiral-shaped spiral inductor elements 14, rectangular plate-shaped electrodes 15 ', and lead wires 18 are formed of a conductor film at intervals in the left-right direction (FIG. 8).
【０００３】前記インダクタ素子１４の外周端１４２は
線路の長手方向へ屈曲してリード部となっており、ま
た、板状電極１５´の角部からは線状のリード部１５１
が突出している。これらインダクタ素子１４、板状電極
１５´、リード線１８は、前記導体膜２と同一材を誘電
体基板３の上面全面に形成した後、所定形状にエッチン
グして形成される。The outer peripheral end 142 of the inductor element 14 is bent in the longitudinal direction of the line to form a lead portion, and a linear lead portion 151 extends from the corner of the plate electrode 15 '.
Is protruding. The inductor element 14, the plate electrode 15 ', and the lead wire 18 are formed by forming the same material as the conductor film 2 on the entire upper surface of the dielectric substrate 3 and then etching it into a predetermined shape.
【０００４】前記インダクタ素子１４等を覆って絶縁膜
１１が形成され、この絶縁膜１１上に間隔をおいて、リ
ード線１７と、前記板状電極１５´よりも大きい板状電
極１６´が形成されている（図９）。そして、上記リー
ド線１７の両端は、図７に示すように、上記絶縁膜１１
に貫通形成されたスルーホール１１１を経て、誘電体基
板３上の前記インダクタ素子１４の内周端１４１と板状
電極１５´のリード部１５１にそれぞれ接続されて、両
者を結んでいる。An insulating film 11 is formed so as to cover the inductor element 14 and the like, and a lead wire 17 and a plate electrode 16 'larger than the plate electrode 15' are formed on the insulating film 11 at intervals. (Fig. 9). Then, as shown in FIG. 7, both ends of the lead wire 17 have the insulating film 11
Through the through-hole 111 formed through, the inner peripheral end 141 of the inductor element 14 on the dielectric substrate 3 and the lead portion 151 of the plate-shaped electrode 15 'are respectively connected to connect them.
【０００５】また、前記板状電極１６´はその一端部
が、絶縁膜１１の端縁に沿って下方へ屈曲して、前記誘
電体基板３上面のリード線１８に至り、これに接続され
ている。Further, one end of the plate electrode 16 'is bent downward along the edge of the insulating film 11 to reach the lead wire 18 on the upper surface of the dielectric substrate 3 and connected thereto. There is.
【０００６】[0006]
【発明が解決しようとする課題】ところで、上記従来の
伝送線路では、絶縁膜へのスルーホールの形成等が製造
の手間を増大させる原因になるとともに、インダクタ素
子とキャパシタ素子を多段で設けようとすると設置面積
の増大が避けられず、コンパクト化が困難であった。By the way, in the above-mentioned conventional transmission line, formation of through-holes in the insulating film increases the manufacturing labor, and the inductor element and the capacitor element are provided in multiple stages. Then, an increase in the installation area is unavoidable, and it is difficult to make it compact.
【０００７】また、近年、通信回路の低損失化等の観点
から、伝送線路の導体膜を超伝導材で構成することが試
みられているが、前記スルーホールや絶縁膜端縁での段
付きに応じた導体膜の屈曲成形は超伝導材では困難であ
り、リード線や板状電極に損失の大きいＡｕ等の金属材
を使用しているため、低損失化の効果が減殺されてい
た。In recent years, it has been attempted to form the conductor film of the transmission line from a superconducting material in order to reduce the loss of the communication circuit. It is difficult for the superconducting material to bend and form the conductor film according to the above, and since the metal material such as Au having a large loss is used for the lead wire and the plate electrode, the effect of reducing the loss is diminished.
【０００８】本発明はこのような課題を解決するもの
で、製造の手間を要さず、コンパクトかつ低損失の高周
波伝送線路と、その製造方法を提供することを目的とす
る。The present invention solves such a problem, and an object of the present invention is to provide a high-frequency transmission line that is compact and has low loss, and a method for manufacturing the same, which does not require manufacturing labor.
【０００９】[0009]
【課題を解決するための手段】本発明は上記目的を達成
するため、請求項１に記載の発明においては、積層型平
面伝送線路を構成する導体層（１）を、絶縁膜（１１）
とこれを挟んで上下に位置する上側導体膜（１２）およ
び下側導体膜（１３）とで構成し、前記上側導体膜（１
２）および下側導体膜（１３）の一方により、インダク
タ素子（１４）とこれの一端（１４１）に接続された一
の板状電極（１５）とを形成するとともに、前記上側導
体膜（１２）および下側導体膜（１３）の他方により、
前記絶縁膜（１１）を介して前記一の板状電極（１５）
に対向してキャパシタ素子を構成する他の板状電極（１
６）を形成する。In order to achieve the above object, the present invention provides, in the invention as set forth in claim 1, the conductor layer (1) which constitutes the laminated planar transmission line, and the insulating film (11).
And an upper conductor film (12) and a lower conductor film (13) which are located above and below with this in between, and the upper conductor film (1
The inductor element (14) and one plate electrode (15) connected to one end (141) of the inductor element (14) are formed by one of 2) and the lower conductor film (13), and the upper conductor film (12) is formed. ) And the other of the lower conductor films (13),
The one plate electrode (15) through the insulating film (11)
Another plate-shaped electrode (1
6) is formed.
【００１０】請求項２に記載の発明においては、積層型
平面伝送線路を構成する導体層を、絶縁膜とこれを挟ん
で上下に位置する上側導体膜（１２）および下側導体膜
（１３）とで構成し、インダクタ素子（１４）およびこ
れの一端に接続された一の板状電極（１５）と、前記絶
縁膜（１１）を介して前記一の板状電極（１５）に対向
してキャパシタ素子を構成する他の板状電極（１６）と
を、前記上側導体膜（１２）および下側導体膜（１３）
により交互に高周波伝播方向へ複数形成して、前記イン
ダクタ素子（１４）の他端（１４２）に、当該インダク
タ素子（１４）の直前ないし直後に位置してインダクタ
素子（１４）と同一の導体膜（１２、１３）により形成
された前記他の板状電極（１６）を接続する。According to the second aspect of the invention, the conductor layers constituting the laminated planar transmission line are formed of an insulating film and an upper conductor film (12) and a lower conductor film (13) which are located above and below the insulating film. And an inductor element (14) and a plate electrode (15) connected to one end of the inductor element (14) and the plate electrode (15) opposed to the plate electrode (15) through the insulating film (11). The other plate-shaped electrode (16) forming the capacitor element is connected to the upper conductor film (12) and the lower conductor film (13).
Are alternately formed in the high frequency propagation direction, and the same conductor film as that of the inductor element (14) is located at the other end (142) of the inductor element (14) immediately before or after the inductor element (14). The other plate-like electrode (16) formed by (12, 13) is connected.
【００１１】請求項３に記載の発明では、請求項１又は
２に記載の高周波伝送線路において、前記インダクタ素
子は渦巻き状に成形されたスパイラルインダクタ素子
（１４）であり、当該スパイラルインダクタ素子（１
４）の中心部に前記一の板状電極（１５）を形成して、
これに前記スパイラルインダクタ素子（１４）の内周端
（１４１）を接続する。According to a third aspect of the present invention, in the high frequency transmission line according to the first or second aspect, the inductor element is a spiral inductor element (14) formed in a spiral shape, and the spiral inductor element (1
4) Forming the one plate electrode (15) at the center of
The inner peripheral end (141) of the spiral inductor element (14) is connected to this.
【００１２】請求項４に記載の発明においては、高周波
が伝送される誘電体基板（３）の板面全面に下側導体膜
（１３）を形成する工程と、押さえ用基板（４）の板面
全面に前記上側導体膜（１２）を形成する工程と、前記
下側導体膜（１３）および上側導体膜（１２）の一方を
エッチングして、インダクタ素子（１４）とこれの一端
に接続される一の板状電極（１５）を形成する工程と、
前記下側導体膜（１３）および上側導体膜（１２）の他
方をエッチングして、他の板状電極（１６）を形成する
工程と、前記誘電体基板（３）の板面と前記押さえ用基
板（４）の板面とを絶縁膜を介して互いに圧着して、前
記絶縁膜（１１）を介して対向する前記一の板状電極
（１５）と他の板状電極（１６）によりキャパシタ素子
を構成する工程とからなる。In the invention of claim 4, the step of forming the lower conductor film (13) on the entire plate surface of the dielectric substrate (3) through which high frequency is transmitted, and the plate of the pressing substrate (4) Forming the upper conductor film (12) on the entire surface, and etching one of the lower conductor film (13) and the upper conductor film (12) to connect to the inductor element (14) and one end thereof. Forming one plate-shaped electrode (15),
A step of etching the other of the lower conductor film (13) and the upper conductor film (12) to form another plate-shaped electrode (16); and the plate surface of the dielectric substrate (3) and the pressing member. The plate surface of the substrate (4) is pressure-bonded to each other via an insulating film, and the one plate electrode (15) and the other plate electrode (16) facing each other via the insulating film (11) form a capacitor. And a step of forming an element.
【００１３】なお、上記各手段のカッコ内の符号は、後
述する実施例記載の具体的手段との対応関係を示すもの
である。The reference numerals in parentheses of the above-mentioned means indicate the correspondence with the concrete means described in the embodiments described later.
【００１４】[0014]
【発明の作用効果】請求項１に記載の発明によれば、イ
ンダクタ素子とこれの一端に接続された一の板状電極、
および他の板状電極が、絶縁膜を挟んだ上側導体膜およ
び下側導体膜のいずれかの平面内で形成される。したが
って、従来のようなスルーホールを設ける必要がないか
ら、製造の手間が大幅に軽減されるとともに、膜に屈曲
部を生じないから、前記各導体膜を超伝導材で構成する
ことができ、線路の低損失化が実現される。According to the invention of claim 1, the inductor element and one plate-like electrode connected to one end of the inductor element,
And another plate electrode is formed in a plane of either the upper conductor film or the lower conductor film sandwiching the insulating film. Therefore, since it is not necessary to provide a through hole as in the conventional case, the manufacturing labor is greatly reduced, and since the film does not have a bent portion, each of the conductor films can be made of a superconducting material, Realization of low line loss.
【００１５】請求項２に記載の発明によれば、インダク
タ素子とキャパシタ素子よりなる多段のフィルタが簡易
に製造される。請求項３に記載の発明によれば、インダ
クタ素子を渦巻き状に成形したスパイラルインダクタ素
子として、その中心部にキャパシタ素子を構成する板状
電極を配したから、フィルタ形状をコンパクトなものに
できる。According to the second aspect of the present invention, the multistage filter including the inductor element and the capacitor element can be easily manufactured. According to the third aspect of the present invention, the spiral inductor element is formed by spirally forming the inductor element, and the plate-shaped electrode forming the capacitor element is arranged at the center of the spiral inductor element. Therefore, the filter shape can be made compact.
【００１６】請求項４に記載の発明によれば、絶縁膜を
挟んで位置する上側導体膜および下側導体膜が、それぞ
れ誘電体基板および押さえ基板の板面上に形成されるか
ら、特に導体膜を超伝導材で構成した場合に良好な膜質
を得ることができる。According to the fourth aspect of the invention, the upper conductor film and the lower conductor film, which are located with the insulating film interposed therebetween, are formed on the plate surfaces of the dielectric substrate and the pressing substrate, respectively. Good film quality can be obtained when the film is made of a superconducting material.
【００１７】[0017]
【実施例】以下、本発明を図に示す実施例について説明
する。 （第１実施例）図１は本発明をマイクロストリップ伝送
線路に適用した場合の線路断面図、図２はその分解斜視
図である。図の左右方向へ高周波が伝播する約５００μ
ｍ厚の誘電体基板３には、下面全面にＹＢＣＯ等の超伝
導材の導体膜２が形成されてアース導体層となってい
る。Embodiments of the present invention will be described below with reference to the drawings. (First Embodiment) FIG. 1 is a sectional view of a line when the present invention is applied to a microstrip transmission line, and FIG. 2 is an exploded perspective view thereof. Approximately 500μ in which high frequency is propagated in the horizontal direction of the figure
A conductor film 2 of a superconducting material such as YBCO is formed on the entire lower surface of the m-thick dielectric substrate 3 to form a ground conductor layer.
【００１８】前記誘電体基板３の上面には、ＹＢＣＯ等
の超伝導材の導体膜１３により、細線を矩形の渦巻き状
としたスパイラルインダクタ素子１４が形成され（図
３）、このスパイラルインダクタ素子１４の中心部に矩
形の板状電極１５が形成されて、これにスパイラルイン
ダクタ素子１４の内終端１４１が接続されている。スパ
イラルインダクタ素子１４の外周端１４２は誘電体基板
３の長手方向へ屈曲してリード部となっている。On the upper surface of the dielectric substrate 3, there is formed a spiral inductor element 14 having a thin wire in a rectangular spiral shape by a conductor film 13 made of a superconducting material such as YBCO (FIG. 3). A rectangular plate-shaped electrode 15 is formed in the center of the, and the inner end 141 of the spiral inductor element 14 is connected to this. The outer peripheral end 142 of the spiral inductor element 14 is bent in the longitudinal direction of the dielectric substrate 3 to form a lead portion.
【００１９】スパイラルインダクタ素子１４の上面には
一定厚（２〜３μｍ）でポリイミド等の絶縁膜１１が全
面に形成され、この絶縁膜１１の上面には、前記板状電
極１５に対向して、これとほぼ同形のＹＢＣＯ等の超伝
導材の導体膜よりなる矩形の板状電極１６が形成されて
（図４）、キャパシタ素子を構成している。前記板状電
極１６の角部からは、前記スパイラルインダクタ素子１
４のリード部１４１とは反対方向へリード部１６１が延
びている。上記板状電極１６の上面には、前記誘電体基
板３と同形の、誘電体製の押さえ用基板４が圧接してい
る。An insulating film 11 of polyimide or the like having a constant thickness (2 to 3 μm) is formed on the entire surface of the spiral inductor element 14, and the upper surface of the insulating film 11 is opposed to the plate electrode 15 and A rectangular plate-shaped electrode 16 made of a conductor film of a superconducting material such as YBCO having substantially the same shape is formed (FIG. 4) to form a capacitor element. From the corner of the plate electrode 16, the spiral inductor element 1
The lead portion 161 extends in a direction opposite to the lead portion 141 of No. 4. A dielectric pressing substrate 4 having the same shape as the dielectric substrate 3 is pressed against the upper surface of the plate electrode 16.
【００２０】これらスパイラルインダクタ素子１４、キ
ャパシタ素子を構成する板状電極１５、１６、絶縁膜１
１、および押さえ用基板４により、ストリップ導体層１
が構成されている。なお、前記各リード部１４２、１６
１には公知の方法で同軸ケーブルが接続されて、外部信
号の入出力がなされる。このような構造のマイクロスト
リップ線路の製造は以下のように行う。The spiral inductor element 14, the plate electrodes 15 and 16 constituting the capacitor element, and the insulating film 1
1 and the pressing substrate 4, the strip conductor layer 1
Is configured. In addition, each of the lead portions 142, 16
A coaxial cable is connected to 1 by a known method to input / output an external signal. The microstrip line having such a structure is manufactured as follows.
【００２１】すなわち、誘電体基板２の上下面全面に導
体膜２、１３を形成した後、上面の導体膜１３を所定形
状にエッチングして、前記スパイラルインダクタ素子１
４および板状電極１５を成形する。その後、上記スパイ
ラルインダクタ素子１４および板状電極１５を覆って、
蒸着等により前記絶縁膜１１を堆積する。一方、押さえ
基板４の下面全面に導体膜１２を形成し、この導体膜１
２を所定形状にエッチングして前記板状電極１６とす
る。そして、この押さえ基板４を、前記絶縁膜１１の上
から圧着する。That is, after forming the conductor films 2 and 13 on the entire upper and lower surfaces of the dielectric substrate 2, the conductor film 13 on the upper surface is etched into a predetermined shape to form the spiral inductor element 1.
4 and the plate electrode 15 are formed. After that, the spiral inductor element 14 and the plate electrode 15 are covered,
The insulating film 11 is deposited by vapor deposition or the like. On the other hand, the conductor film 12 is formed on the entire lower surface of the pressing substrate 4, and the conductor film 1 is formed.
2 is etched into a predetermined shape to form the plate electrode 16. Then, the pressing substrate 4 is pressure-bonded onto the insulating film 11.
【００２２】このような構造のストリップ伝送線路によ
れば、スパイラルインダクタ素子１４と、これの中心部
に位置する板状電極１５、１６によって構成されるキャ
パシタ素子とにより、伝送線路中にフィルタがコンパク
トに形成される。また、従来のように、絶縁膜にスルー
ホールを形成する必要がないから、製造の手間が大きく
軽減される。そして、スパイラルインダクタ素子や板状
電極をいずれも誘電体基板あるいは押さえ基板の平面内
に形成しているから、スルーホールや絶縁膜端縁の段付
きによる導体膜の屈曲が生じず、導体膜を全て超伝導材
で構成することが可能となって、伝送損失の大幅な低減
が可能となる。According to the strip transmission line having such a structure, the spiral inductor element 14 and the capacitor element constituted by the plate electrodes 15 and 16 located at the center of the spiral inductor element 14 make the filter compact in the transmission line. Is formed. Further, unlike the conventional case, it is not necessary to form a through hole in the insulating film, so that the manufacturing labor is greatly reduced. Since the spiral inductor element and the plate electrode are both formed in the plane of the dielectric substrate or the pressing substrate, the conductor film is not bent due to the stepping of the through hole or the edge of the insulating film, and the conductor film is formed. Since it is possible to use all superconducting materials, it is possible to significantly reduce transmission loss.
【００２３】なお、本実施例のストリップ伝送線路の製
造方法としては、前記押さえ用基板を使用せず、前記絶
縁膜１１をＣｅＯ2 等で構成して、その上に上記導体膜
１２を蒸着等で積層形成した後、これを所定形状にエッ
チングして板状電極１６としても良い。 （第２実施例）図５には、上記第１実施例におけるフィ
ルタを、高周波伝播方向へ多段に設けた場合を示す。図
において、誘電体基板３の上面には導体膜１３により、
中心部に板状電極１５を配したスパイラルインダクタ素
子１４と板状電極１６とが交互に形成され、中間位置の
スパイラルインダクタ素子１４の外周端１４２は、高周
波伝播方向の直前に位置する板状電極１６に接続されて
いる。In the method of manufacturing the strip transmission line of this embodiment, the insulating film 11 is made of CeO 2 or the like without using the pressing substrate, and the conductor film 12 is vapor-deposited thereon. It is also possible to form the plate-shaped electrode 16 by laminating and forming it and then etching this into a predetermined shape. (Second Embodiment) FIG. 5 shows a case in which the filters in the first embodiment are provided in multiple stages in the high frequency propagation direction. In the figure, the conductor film 13 is formed on the upper surface of the dielectric substrate 3
The spiral inductor element 14 and the plate electrode 16 having the plate electrode 15 arranged in the center are alternately formed, and the outer peripheral end 142 of the spiral inductor element 14 at the intermediate position is located immediately before the high frequency propagation direction. It is connected to 16.
【００２４】一方、絶縁膜１１上にも、スパイラルイン
ダクタ素子１４と板状電極１５とが、誘電体基板３上の
ものとは前後に位置をずらして交互に形成してあり、各
スパイラルインダクタ素子１４の外周端１４２はそれぞ
れ直前に位置する板状電極１６に接続されている。そし
て、前記絶縁膜１１を介した上下の板状電極１５、１６
は互いに対向してそれぞれキャパシタ素子を構成し、全
体として高周波伝播方向へ４段のフィルタが形成されて
いる。On the other hand, the spiral inductor element 14 and the plate electrode 15 are alternately formed on the insulating film 11 so as to be displaced from the one on the dielectric substrate 3 in the front-rear direction. The outer peripheral ends 142 of 14 are respectively connected to the plate-like electrodes 16 located immediately before. Then, the upper and lower plate-shaped electrodes 15 and 16 with the insulating film 11 interposed therebetween.
Each of which constitutes a capacitor element facing each other, and as a whole, four stages of filters are formed in the high frequency propagation direction.
【００２５】このように、フィルタを高周波伝播方向へ
多段で設ける場合に、本発明の高周波伝送線路によれ
ば、全体の長さが短くなってコンパクト化が実現される
とともに、スルーホール形成の手間が削減され、かつ超
伝導材導体膜の使用による損失低減が図られて、より大
きな効果が得られる。なお、伝送線路のコンパクト化を
図るためには、上記各実施例に示す如く、インダクタ素
子としてスパイラル形状のものを使用するのが有利であ
るが、他の形状のインダクタ素子を使用することもでき
る。As described above, when the filters are provided in multiple stages in the high-frequency propagation direction, the high-frequency transmission line of the present invention shortens the overall length and realizes compactness, and the labor of forming the through holes. Is reduced, loss is reduced by using the superconducting material conductor film, and a greater effect is obtained. In order to make the transmission line compact, it is advantageous to use a spiral inductor element as shown in each of the above embodiments, but inductor elements of other shapes can also be used. .
【００２６】また、上記各実施例におけるインダクタ素
子および各板状電極の形成位置を、実施例とは反対側の
導体膜にしても良い。本発明の適用対象はマイクロスト
リップ伝送線路に限られず、積層型の平面伝送線路に広
く利用することができる。In addition, the formation positions of the inductor element and each plate electrode in each of the above-described embodiments may be the conductor film on the opposite side of the embodiment. The application target of the present invention is not limited to the microstrip transmission line, and can be widely used for a laminated planar transmission line.
【図１】本発明の第１の実施例に係る、伝送線路の垂直
断面図である。FIG. 1 is a vertical sectional view of a transmission line according to a first embodiment of the present invention.
【図２】本発明の第１の実施例に係る、伝送線路の分解
斜視図である。FIG. 2 is an exploded perspective view of a transmission line according to the first embodiment of the present invention.
【図３】本発明の第１の実施例に係る、伝送線路を構成
する誘電体基板上の平面図である。FIG. 3 is a plan view on a dielectric substrate that constitutes a transmission line according to the first embodiment of the present invention.
【図４】本発明の第１の実施例に係る、伝送線路を構成
する絶縁膜上の平面図である。FIG. 4 is a plan view on an insulating film forming a transmission line according to the first embodiment of the present invention.
【図５】本発明の第２の実施例に係る、伝送線路の分解
斜視図である。FIG. 5 is an exploded perspective view of a transmission line according to a second embodiment of the present invention.
【図６】従来例に係る、伝送線路の分解斜視図である。FIG. 6 is an exploded perspective view of a transmission line according to a conventional example.
【図７】従来例に係る、伝送線路の垂直断面図である。FIG. 7 is a vertical cross-sectional view of a transmission line according to a conventional example.
【図８】従来例に係る、伝送線路を構成する誘電体基板
上の平面図である。FIG. 8 is a plan view on a dielectric substrate that constitutes a transmission line according to a conventional example.
【図９】従来例に係る、伝送線路を構成する絶縁膜上の
平面図である。FIG. 9 is a plan view of an insulating film forming a transmission line according to a conventional example.
１…ストリップ導体層、１１…絶縁膜、１２…上側導体
膜、１３…下側導体膜、１４…インダクタ素子、１４１
…一端（内周端）、１４２…他端（外周端）、１５…一
の板状電極、１６…他の板状電極。DESCRIPTION OF SYMBOLS 1 ... Strip conductor layer, 11 ... Insulating film, 12 ... Upper conductor film, 13 ... Lower conductor film, 14 ... Inductor element, 141
One end (inner peripheral end), 142 ... The other end (outer peripheral end), 15 ... One plate electrode, 16 ... Other plate electrode.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｐ 11/00 4230−5Ｅ Ｈ０１Ｆ 15/00 Ｄ Ｈ０３Ｈ 7/01 7922−5Ｅ Ｈ０１Ｇ 4/40 ３２１Ａ ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical display location H01P 11/00 4230-5E H01F 15/00 D H03H 7/01 7922-5E H01G 4/40 321A
Claims (4)
を、絶縁膜とこれを挟んで上下に位置する上側導体膜お
よび下側導体膜とで構成し、 前記上側導体膜および下側導体膜の一方により、インダ
クタ素子とこれの一端に接続された一の板状電極とを形
成するとともに、 前記上側導体膜および下側導体膜の他方により、前記絶
縁膜を介して前記一の板状電極に対向してキャパシタ素
子を構成する他の板状電極を形成したことを特徴とする
高周波伝送線路。1. A conductor layer constituting a laminated planar transmission line is composed of an insulating film and an upper conductor film and a lower conductor film which are located above and below the insulating film, and the upper conductor film and the lower conductor film. One side forms the inductor element and one plate-like electrode connected to one end thereof, and the other side of the upper conductor film and the lower conductor film forms the one plate-like electrode through the insulating film. A high-frequency transmission line, characterized in that another plate-shaped electrode constituting a capacitor element is formed so as to face the electrode.
を、絶縁膜とこれを挟んで上下に位置する上側導体膜お
よび下側導体膜とで構成し、 インダクタ素子およびこれの一端に接続された一の板状
電極と、前記絶縁膜を介して前記一の板状電極に対向し
てキャパシタ素子を構成する他の板状電極とを、前記上
側導体膜および下側導体膜により交互に高周波伝播方向
へ複数形成して、 前記インダクタ素子の他端に、当該インダクタ素子の直
前ないし直後に位置してインダクタ素子と同一の導体膜
により形成された前記他の板状電極を接続したことを特
徴とする高周波伝送線路。2. A conductor layer forming a laminated planar transmission line is composed of an insulating film and an upper conductor film and a lower conductor film which are located above and below the insulating film and are connected to an inductor element and one end thereof. Another plate-shaped electrode and another plate-shaped electrode facing the one plate-shaped electrode via the insulating film to form a capacitor element are alternately high-frequency by the upper conductor film and the lower conductor film. A plurality is formed in the propagation direction, and the other plate-like electrode formed of the same conductor film as that of the inductor element is connected to the other end of the inductor element, which is located immediately before or after the inductor element. And high frequency transmission line.
れたスパイラルインダクタ素子であり、当該スパイラル
インダクタ素子の中心部に前記一の板状電極を形成し
て、これに前記スパイラルインダクタ素子の内周端を接
続したことを特徴とする請求項１又は２に記載の高周波
伝送線路。3. The inductor element is a spiral inductor element formed in a spiral shape, and the one plate-shaped electrode is formed in a central portion of the spiral inductor element, and an inner peripheral end of the spiral inductor element is formed on the one plate electrode. The high-frequency transmission line according to claim 1, wherein the high-frequency transmission line is connected.
面に下側導体膜を形成する工程と、 押さえ用基板の板面全面に前記上側導体膜を形成する工
程と、 前記下側導体膜および上側導体膜の一方をエッチングし
て、インダクタ素子とこれの一端に接続される一の板状
電極を形成する工程と、 前記下側導体膜および上側導体膜の他方をエッチングし
て、他の板状電極を形成する工程と、 前記誘電体基板の板面と前記押さえ用基板の板面とを絶
縁膜を介して互いに圧着して、前記絶縁膜を介して対向
する前記一の板状電極と他の板状電極によりキャパシタ
素子を構成する工程とからなることを特徴とする高周波
伝送線路の製造方法。4. A step of forming a lower conductor film on the entire plate surface of a dielectric substrate through which high frequencies are transmitted, a step of forming the upper conductor film on the entire plate surface of a pressing substrate, and the lower conductor. A step of etching one of the film and the upper conductor film to form one plate-like electrode connected to the inductor element and one end thereof, and etching the other of the lower conductor film and the upper conductor film, and And a plate surface of the dielectric substrate and the plate surface of the pressing substrate are pressure-bonded to each other via an insulating film, and the one plate-shaped electrode facing each other via the insulating film. A method of manufacturing a high-frequency transmission line, comprising the step of forming a capacitor element with an electrode and another plate-shaped electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7127930A JPH08321705A (en) | 1995-05-26 | 1995-05-26 | High frequency transmission line and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7127930A JPH08321705A (en) | 1995-05-26 | 1995-05-26 | High frequency transmission line and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08321705A true JPH08321705A (en) | 1996-12-03 |
Family
ID=14972160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7127930A Pending JPH08321705A (en) | 1995-05-26 | 1995-05-26 | High frequency transmission line and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08321705A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002542609A (en) * | 1999-04-13 | 2002-12-10 | テレフオンアクチーボラゲツト エル エム エリクソン（パブル） | Tunable microwave device |
| JP2004087524A (en) * | 2002-08-22 | 2004-03-18 | Nec Corp | Circuit board and electronic apparatus employing it |
| JP2010500844A (en) * | 2006-08-22 | 2010-01-07 | イー．エム．ダブリュ．アンテナ カンパニー リミテッド | Transmission line |
| US7667951B2 (en) | 2005-11-17 | 2010-02-23 | Tdk Corporation | Electronic component |
| JP2012519448A (en) * | 2009-03-02 | 2012-08-23 | イーエムダブリュ カンパニー リミテッド | Multiband and wideband antenna using metamaterial and communication apparatus including the same |
| US8717125B2 (en) | 2006-10-30 | 2014-05-06 | Emw Co., Ltd. | Transmission line with left-hand characteristics including an interdigital capacitor with partially overlapping fingers |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62132309A (en) * | 1985-12-04 | 1987-06-15 | 株式会社村田製作所 | Lc complex component |
| JPS62195905A (en) * | 1986-02-24 | 1987-08-29 | Masaaki Koshikumo | United lc resonance circuit |
| JPH02256207A (en) * | 1989-03-29 | 1990-10-17 | Murata Mfg Co Ltd | Lc composite component |
-
1995
- 1995-05-26 JP JP7127930A patent/JPH08321705A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62132309A (en) * | 1985-12-04 | 1987-06-15 | 株式会社村田製作所 | Lc complex component |
| JPS62195905A (en) * | 1986-02-24 | 1987-08-29 | Masaaki Koshikumo | United lc resonance circuit |
| JPH02256207A (en) * | 1989-03-29 | 1990-10-17 | Murata Mfg Co Ltd | Lc composite component |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002542609A (en) * | 1999-04-13 | 2002-12-10 | テレフオンアクチーボラゲツト エル エム エリクソン（パブル） | Tunable microwave device |
| JP2004087524A (en) * | 2002-08-22 | 2004-03-18 | Nec Corp | Circuit board and electronic apparatus employing it |
| US7667951B2 (en) | 2005-11-17 | 2010-02-23 | Tdk Corporation | Electronic component |
| JP2010500844A (en) * | 2006-08-22 | 2010-01-07 | イー．エム．ダブリュ．アンテナ カンパニー リミテッド | Transmission line |
| JP4815535B2 (en) * | 2006-08-22 | 2011-11-16 | イーエムダブリュ カンパニー リミテッド | Transmission line |
| US8232853B2 (en) | 2006-08-22 | 2012-07-31 | Emw Co., Ltd. | Transmission line with left-hand characteristics including a spiral inductive element |
| US8717125B2 (en) | 2006-10-30 | 2014-05-06 | Emw Co., Ltd. | Transmission line with left-hand characteristics including an interdigital capacitor with partially overlapping fingers |
| JP2012519448A (en) * | 2009-03-02 | 2012-08-23 | イーエムダブリュ カンパニー リミテッド | Multiband and wideband antenna using metamaterial and communication apparatus including the same |
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