JPH08330886A - Surface mounted piezoelectric device - Google Patents

Abstract

PURPOSE: To reduce the variation of frequencies caused by thermal stress by fixing only one end of a quartz resonator piece to a base by way of conductive adhesive so as to one-side-fix the quartz resonator tilted to the upper surface of the base. CONSTITUTION: A metallization wiring 8 on the upper and lower surfaces of both end parts of the platelike base 2 made from insulated material. Then the quartz resonator piece 3 forming an electrode film as a device piece is mounted on the upper surface of the base 2 in the state of tilting to the base 2 by 3 deg. to 30 deg.. In addition the part of the electrode film of the lower end of the quartz resonator piece 3 and the part of the metallization wiring 8 are fixed to each other through the conductive adhesive 7. As the quartz resonator piece 3 is tilted, the upper end of the vibrating part of the crystal resonator piece 3 is prevented from coming into contact with the base 2. Thereby this device is not influenced easily by thermal stress due to the difference of the coefficients of thermal expansion between the device piece and the base to reduce the variation of the frequency caused by thermal stress.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface-mounted piezoelectric device in which the frequency change due to temperature change is reduced.

[0002]

2. Description of the Related Art In a surface mount type crystal oscillator, a crystal oscillator piece is placed on a ceramic base and sealed with a metal cap or a ceramic cap. Then, in order to keep the package price low, as shown in FIG. 51, the box-shaped ceramic cap 1 is placed on the single plate base 2.
It is common to use a covered package.

There are the following three structures for fixing the crystal unit on the single plate base 2. FIG. 52 shows a surface-mount type crystal resonator of both ends fixing type. As shown in the figure, the crystal oscillator piece 3 having the electrode film 4 has a pair of fixing electrodes 5.
Each electrode film 4 is placed on top of each other with both ends supported.
Is connected to the fixing electrode 5. FIG. 53 shows a direct mounting type surface mount type crystal unit. Base 2 as shown
The crystal oscillator piece 3 is directly placed on the metal film, and the electrode film 4 and the metallized wiring 8 are bonded to each other via the conductive adhesive 7. It is connected to the. FIG. 54 shows a single-sided fixed type surface mount type crystal unit. As shown in the figure, the crystal oscillator piece 3 is placed over the fixed part 9 and the pillow part 10 on the base 2, and the respective electrode films 4 and the metallized wiring via the conductive adhesive 7 applied only on the left side in the figure. 8 is connected, and the crystal unit 3 and the pillow portion 10 are not bonded.

[0004]

However, since the ceramics and the crystal piece have different coefficients of thermal expansion, the both-end fixing type and the direct-mounting type surface mount type crystal resonators are not strained due to temperature change. As a result, thermal stress is generated on the crystal element, and in addition to the original frequency change due to temperature change, frequency change due to thermal stress also occurs. Therefore, it has a great influence on the frequency-temperature characteristic. Further, since the fixing electrode and the like are attached to the base, the structure of the base becomes complicated and the number of manufacturing processes increases.

Therefore, an object of the present invention is to provide a surface mount type piezoelectric device which solves the above problems.

[0006]

[Means for Solving the Problems] The structure of the present invention for attaining such an object is to arrange a device piece on the surface of a flat plate base made of ceramics while inclining the device piece, and to electrically connect the lower end of the device piece. Characterized in that it is fixed to the metallized wiring on the base via a conductive adhesive, or a fixing convex part for fixing one end of the device piece and a pillow part for mounting the other end are integrally formed on the surface of the base. The device is characterized in that one end of a device piece with the other end placed on the base is fixed to the metallized wiring on the fixing convex portion via a conductive adhesive, or a concave portion is formed near the center of the base and the upper surface of the base is formed. Characterized in that a metallized wiring is formed on the metallized wiring, one end of the device piece mounted so as to bridge the position of the recess is fixed to the metallized wiring, and the other end is mounted on the base. A pair of metallized wirings are formed on the front and back surfaces of the base, and metallized wirings on both sides are connected by the metallized wiring formed on the side surface of the base, and the cap for covering the base contacts the base. An insulating coating is formed so that at least the periphery of the surface is approximately at the same height, one end of the device piece is fixed to the metallized wiring via a conductive adhesive, and the other end is supported by the insulating coating. Alternatively, a pair of metallized wirings are formed on the front and back surfaces of the base made of an insulating material, and the metallized wirings on both sides are connected by the metallized wirings formed on the side surfaces of the base, and the plated terminals are fixed on the pair of metallized wirings. , The surface of the base, which is the part where the cap for covering the base contacts, In addition, an insulating coating is formed higher than the upper surface of the plated terminal so that the vicinity of the outer periphery is approximately the same height, a cutout is formed in the insulating coating, one end of the device piece is fitted in the cutout, and one end of the device piece is made conductive. Characterized in that it is fixed to a plated terminal with a conductive adhesive and the other end of the inclined device piece is supported by an insulating coating, or a pair of metallized wiring is formed on the front and back surfaces of a base made of an insulating material. At the same time, the metallized wires on both sides are connected to each other through a through hole, the plated terminals are fixed on a pair of metallized wires, and at least the periphery of the surface of the base, which is the part where the cap for contacting the base contacts, is approximately An insulating coating is formed to make them flush, and one end of the device piece is bonded with a conductive adhesive. It is characterized in that it is fixed to a quick terminal and the other end is supported by an insulating coating, or a pair of metallized wiring is formed on the front and back sides of a base made of an insulating material, and metallized wiring on both sides is used as a base. Connection with a through hole that penetrates to the metallized wiring, a plated terminal is fixed on a pair of metallized wiring, one end of the device piece is fixed to the plated terminal via a conductive adhesive, and a plating for supporting the other end of the device piece. The feature is that the pillow part is provided on the base.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a surface mount type crystal resonator as a surface mount type piezoelectric device according to the present invention will be described below in detail with reference to the drawings.

Example 1 First, Example 1 is shown in FIG. As shown in FIG. 1A, metallized wirings 8 are formed on the upper and lower surfaces of both ends of a base 2 made of ceramics. A crystal oscillator piece 3 having an electrode film (not shown) formed thereon is placed on the upper surface of the base 2 in a state of being inclined by 3 to 30 degrees with respect to the base 2, and the electrode film at the lower end of the crystal oscillator piece 3 is placed. And a portion of the metallized wiring 8 are fixed to each other via a conductive adhesive 7. Since the crystal oscillator piece 3 is inclined, the upper end, which is the vibrating portion of the crystal oscillator piece 3, does not come into contact with the base 2.

The surface mount type crystal resonator shown in FIG. 1 (b) has a reinforcing material 1 added to the surface mount type crystal resonator shown in FIG. 1 (a).
1 is fixed. This is provided for the purpose of enhancing the positioning accuracy of the crystal unit 3 and strengthening the fixing of the crystal unit 3 in order to improve the impact resistance of the surface mount type crystal unit against the drop. As the material of the reinforcing material 11, an insulating material such as resin is used.

The surface mount type crystal resonator shown in FIG. 1 (c) has a pillow portion 10 in addition to the surface mount type crystal resonator shown in FIG. 1 (a).
Is integrally formed with the base 2. This is provided to reduce the impact applied to the upper end of the crystal unit piece 3 when the surface mount type crystal unit is dropped.

Second Embodiment Next, a second embodiment is shown in FIG. This is one in which a reinforcing material 11 is further formed on the base 2 of FIG. 1 (c). On the upper surface of the base 2, metallized wiring 8 is arranged as shown in FIG.

Third Embodiment Next, a third embodiment is shown in FIG. In the surface mount type crystal resonator shown in FIG. 3A, a buffer member 5 is interposed between the lower end of the crystal resonator piece 3 and the base 2. The buffer member 5 is formed by bending a metal plate and fixing one side thereof to the base 2 and the other side thereof to the crystal oscillator piece 3. In addition, a pillow portion 10 made of resin or the like is fixed to the base 2 to support the upper end of the crystal unit 3. In such a surface-mount type crystal resonator, since the buffer member 5 plays the role of a spring, it is easy to absorb the shock and is not easily affected by the difference in the coefficient of thermal expansion with the base 2 made of ceramics.

The surface mount type crystal resonator shown in FIG. 3 (b) is obtained by further providing a reinforcing member 11 made of an insulating material such as resin to the surface mount type crystal resonator shown in FIG. 3 (a). is there.

Fourth Embodiment Next, a fourth embodiment is shown in FIG. The surface mount type crystal resonator shown in FIG. 4A has a substantially V-shaped fixing groove 1 previously formed by press working instead of the flat plate-like fixing portion shown so far.
2 and the metallized wiring 8 is also formed in the fixed groove 12, and the crystal resonator piece 3 is formed in the fixed groove 12.
The electrode film portion of the crystal resonator piece 3 and the metallized wiring 8 portion are fixed by the conductive adhesive 7 with the lower end of the crystal oscillator piece 3 inserted. The groove may be a semi-cylindrical shape instead of the V-shape.

The surface mount type crystal resonator shown in FIG. 4B is obtained by further fixing a pillow portion 10 made of an insulating material such as resin to the surface mount type crystal resonator shown in FIG. 4A.

The surface mount type crystal resonator shown in FIG. 4 (c) has a pillow portion 10 of the surface mount type crystal resonator shown in FIG. 4 (b).
Instead of this, the pillow portion 10 is formed integrally with the base 2.

The surface mount type crystal resonator shown in FIG. 4D is the surface mount type crystal resonator shown in FIG. 4B in which the cap 1 is put on and the buffer portion 14 is formed. is there. This is provided to prevent the upper end of the crystal resonator piece 3 from directly colliding with the inner surface of the cap 1 when the surface mount type crystal resonator is dropped. Buffer unit 1
4 is made of a soft resin or the like, and is attached to a position corresponding to the upper end of the crystal oscillator piece 3.

Embodiment 5 Next, Embodiment 5 is shown in FIG. This embodiment is shown in FIG.
The fixing groove 12 shown in (a) is formed on the left and right of the upper surface of the base 2, and the metallized wiring 8 is arranged so that the crystal resonator piece 3 may be fixed in any of the left and right fixing grooves 12. 5 (a).

Embodiment 6 Next, Embodiment 6 is shown in FIG. This embodiment is shown in FIG.
The fixing groove 12 and the pillow portion 10 shown in (c) are formed on the left and right sides of the upper surface of the base 2, and the fixing groove 12 on either side
The metallized wiring 8 is arranged as shown in FIG. 6A so that the crystal unit 3 may be fixed. Since the fixed groove 12, the pillow portion 10, and the metallized wiring 8 are arranged as described above, the left fixed groove 12 and the right pillow portion 10 may be used as shown in FIG. 6B. ,
Alternatively, on the contrary, the right fixing groove 12 and the left pillow portion 10 may be used. In either case, there is an advantage that the pillow portion 10 that is not used as the pillow portion 10 functions as a reinforcing material.

Embodiment 7 Next, Embodiment 7 is shown in FIG. In this embodiment, the fixing portion 15 for fixing the crystal unit 3 and the pillow portion 10 are formed in a state of being integrated with the base 2 and protruding upward by the same height, and Fixing part 15 and pillow part 1 in parallel
The crystal resonator piece 3 mounted on the metal plate 0 is fixed to the metallized wiring 8 of the fixing portion 15 via the conductive adhesive 7.

Example 8 Next, Example 8 is shown in FIG. In this embodiment, the fixed portion 1
As shown in FIG. 8A, the metallized wiring 8 is provided so that any one of 5 and the pillow portion 10 may be used as a fixing portion for fixing the crystal oscillator.

Embodiment 9 Next, Embodiment 9 is shown in FIG. FIG. 9A shows the base 2
A concave portion 16 is formed in the central portion of and the metallized wiring 8 is formed on the upper surface of the base 2. In FIG. 9B, the crystal unit 3 is placed on the base 2 so that only both ends of the crystal unit 3 are supported by the base 2. Only one end of the crystal oscillator piece 3 is fixed to the metallized wiring 8 on the base 2 via the conductive adhesive 7, and the conductive adhesive 7 connects the electrode film 4 and the metallized wiring 8. The fixed part and the pillow part for supporting the crystal unit 3
By forming the concave portion 16, it is inevitably formed, and it is not necessary to form it again.

The surface mount type crystal resonator shown in FIG. 9 (c) has a reinforcing member 11 fixed on the base shown in FIG. 9 (a). This reinforcing material 11 is also made of an insulating material such as resin.

Embodiment 10 Next, Embodiment 10 is shown in FIG. This embodiment is shown in FIG.
The width W of the surface mount crystal resonator is removed by removing a part of the base 2 shown in FIG.
Is a smaller one.

Embodiment 11 Next, Embodiment 11 is shown in FIG. The base 2 shown in FIG. 11A has the metallized wiring 8 arranged so that the crystal resonator piece 3 can be fixed to the base 2 shown in FIG. With this arrangement, the left side of the crystal unit 3 can be fixed as shown in FIG. 11B, or the right side can be fixed.

In the surface mount type crystal resonator shown in FIG. 11 (c), a reinforcing material 11 made of an insulating material such as resin is fixed on the base 2 of the surface mount type crystal resonator shown in FIG. 11 (a). It is a thing. Even if the crystal unit 3 is fixed to either the left or right side of the base 2, the reinforcing material 11 is provided near the fixed portion.
Is located, and plays a role of positioning and reinforcement.

Twelfth Embodiment Next, a twelfth embodiment is shown in FIGS. In this embodiment, as shown in FIG. 12, after the pair of metallized wirings 8 in which the upper surface and the lower surface of the base 2 are connected to each other are formed, the base 2 is formed so that the contact portions of the caps have the same height. An alumina coating 17 as an insulating coating is formed near the periphery of the upper surface of the. When one end of the crystal resonator piece 3 is bonded to the metallized wiring 8 via the conductive adhesive 7 as shown in FIG. 13, the other end of the crystal resonator piece 3 is supported by the alumina coating 17. Since the alumina coating 17 is formed higher than the metallized wiring 8, the crystal unit 3 is supported in an inclined state as shown in FIG. 13B.

Embodiment 13 Next, Embodiment 13 is shown in FIGS. In this embodiment, a notch 17a is formed on the left side of the alumina coating 17 in Example 12, and one end of the crystal oscillator piece 3 is fitted into the notch 17a, so that the crystal oscillator piece 3 can be positioned with high accuracy and the crystal quartz crystal The vibrator piece 3 is firmly fixed. The other structure is the same as that of the twelfth embodiment, and the description thereof is omitted.

Example 14 Next, Example 14 is shown in FIG. In this embodiment, a portion of the alumina coating 17 supporting the crystal oscillator piece 3 in the embodiment 13 is inclined along the lower surface of the crystal oscillator piece 3 to form an inclined pillow portion 17b. Since the contact area between the crystal unit 3 and the alumina coating 17 is large, the drop impact resistance of the surface mount type crystal unit is improved and the height of the surface mount type unit is suppressed and the surface mount type unit is made thinner. . Since the other configurations are the same as those of the thirteenth embodiment, the description thereof will be omitted.

Fifteenth Embodiment Next, a fifteenth embodiment is shown in FIG. In this embodiment, a pillow member 18 made of resin as an insulating material is fixed to the upper surface of the base 2 instead of the inclined pillow portion 17b in the fourteenth embodiment. The pillow member may be made of alumina. The other structure is the same as that of the fourteenth embodiment, and the description thereof is omitted.

Embodiment 16 Next, Embodiment 16 is shown in FIG. In this embodiment, the upper surface of the pillow member 18 in the fifteenth embodiment is tilted along the lower surface of the crystal oscillator piece 3 to form an inclined surface 18a. Also in this embodiment, the drop impact resistance is improved similarly to the fourteenth embodiment. The rest of the configuration is the same as that of the fifteenth embodiment, so the description thereof is omitted.

Example 17 Next, Example 17 is shown in FIGS. In this embodiment, in the twelfth embodiment shown in FIGS. 12 and 13, it is necessary to consider the directivity of the base so that the crystal resonator piece 3 may be fixed to either the left side or the right side of the base 2. The metallized wiring 8 is applied to a non-existing shape. As shown in FIG. 20, depending on the direction of the crystal unit 3, one of the left and right sides of the alumina coating 17 is the crystal unit 3.
The other end supports the other end. The other structure is the same as that of the twelfth embodiment, and the description thereof is omitted.

Example 18 Next, Example 18 is shown in FIGS. In this embodiment, it is not necessary to consider the directionality of the base so that the crystal vibrating piece 3 may be fixed to either the left side or the right side of the base 2 in the thirteenth embodiment shown in FIGS. 14 and 15. Formed with metallized wiring 8 and alumina coating 1
The cutouts 17a are formed on both the left and right sides of No. 7. As shown in FIG. 22, depending on the direction of the crystal unit 3, one of the left and right sides of the alumina coating 17 positions one end of the crystal unit 3 in the vertical and horizontal directions, and the other side of the crystal unit 3. It will support the other end. Since the other configurations are the same as those of the thirteenth embodiment, the description thereof will be omitted.

Example 19 Next, Example 19 is shown in FIG. This embodiment is shown in FIG.
In the fourteenth embodiment shown in FIG. 6, the metallized wiring 8 is formed in a shape that does not require consideration of the directivity of the base so that the crystal vibrating piece 3 may be fixed to either the left side or the right side of the base 2.
In addition, the slanted pillow portions 17b made of alumina coating 17 are formed on both left and right sides to remove the notch portion of the alumina coating. As shown in FIG. 23, depending on the direction of the crystal oscillator piece 3, one of the left and right inclined pillow portions 17b positions one end of the crystal oscillator piece 3 in the left-right direction and the other supports the other end. become. The other structure is the same as that of the fourteenth embodiment, and the description thereof is omitted.

Embodiment 20 Next, Embodiment 20 is shown in FIGS. 24 and 25. This embodiment is different from the embodiment 19 shown in FIG. 23 in that the left and right slanted pillow portions 17b are formed with the notches 17a. As shown in FIG. 25, depending on the direction of the crystal oscillator piece 3, one of the cutouts 17 a on the left and right positions one end of the crystal oscillator piece 3 in the vertical and horizontal directions, and the other inclined pillow portion 17 a.
b will support the other end. The other structure is the same as that of the nineteenth embodiment, and the description thereof is omitted.

Example 21 Next, Example 21 is shown in FIG. This embodiment is shown in FIG.
In the fifteenth embodiment shown in FIG. 7, the metallized wiring 8 is formed in a shape that does not need to take the directionality of the base into consideration so that the crystal vibrating piece 3 may be fixed to either the left side or the right side of the base 2.
And the pillow member 18 is fixed to the left and right sides of the base 2 to remove the notch of the alumina coating 17. As shown in the figure, depending on the orientation of the crystal unit 3,
One of the left and right pillow members 18 positions the one end of the crystal oscillator piece 3 in the left-right direction, and the other pillow member 18 supports the other end. The other structure is the same as that of the fifteenth embodiment, and the description thereof is omitted.

Embodiment 22 Next, Embodiment 22 is shown in FIG. This embodiment is shown in FIG.
In Example 21 shown in FIG. 6, the upper surface of the pillow member 18 is inclined along the lower surface of the crystal oscillator piece 3 to form an inclined surface 18a. The drop impact resistance is improved as compared with Example 21. Since the other configurations are the same as those of the twenty-first embodiment, the description thereof will be omitted.

Embodiment 23 Next, Embodiment 23 is shown in FIGS. This embodiment is different from the embodiment 12 shown in FIGS. 12 and 13 in that the plated terminal 1 is formed on the metallized wiring 8 by plating.
By fixing 9 and fixing the crystal unit 3 to the plated terminal 19, the crystal unit 3 is made parallel to the upper surface of the base 2. Except for the fact that the crystal unit 3 is substantially parallel to the base 2, the other structure is the same as that of the twelfth embodiment, and the description thereof is omitted.

Embodiment 24 Next, Embodiment 24 is shown in FIGS. 30 and 31. This embodiment is the same as the embodiment 17 shown in FIGS.
9 are fixed to each other, and the crystal unit 3 is made parallel to the upper surface of the base 2 by, for example, fixing the crystal unit 3 to the left plated terminal 19 as shown in FIG. The other configuration is the same as that of the twenty-third embodiment, and the description thereof is omitted.

Example 25 Next, Example 25 is shown in FIGS. 32 and 33. This embodiment is different from Embodiment 13 shown in FIGS. 14 and 15 in that the plating terminal 19 is fixed on the metallized wiring 8, the crystal resonator piece 3 is fixed to the plating terminal 19, and the upper surface of the crystal resonator piece 3 is fixed. Alumina coating 17 is formed higher than the above. By making the alumina coating 17 higher than the upper surface of the plated terminal 19, the cutout 17a is formed.
The crystal oscillator piece 3 can be vertically and horizontally positioned by the above, and the crystal oscillator piece 3 is tilted. The other structure is the same as that of the thirteenth embodiment, and the description thereof is omitted.

Embodiment 26 Next, Embodiment 26 is shown in FIG. This embodiment is shown in FIG.
2, in Example 25 shown in FIG. 33, the crystal unit 3
The low pillow portion 17c is formed by lowering the coating height of the portion of the alumina coating 17 that supports the other end of the crystal oscillator piece 3 such that the lower pillow portion 17c is parallel to the upper surface of the base 2. The other structure is the same as that of the twenty-fifth embodiment, and thus the description thereof is omitted.

Embodiment 27 Next, Embodiment 27 is shown in FIGS. 35 and 36. As shown in FIG. 35, two pairs of metallized wirings 8 are formed on the upper and lower surfaces of the base 2 made of ceramics and the base 2 is formed.
The upper and lower metallized wirings 8 are connected to each other through the metallized wirings 8 formed on the side surfaces of the. On the left side of the upper surface of the base 2, the plated terminal 1 by plating on the metallized wiring 8
9 is formed, on the right side of the upper surface, a plating pillow 21 is formed by plating directly on the base 2. Here, the plating pillow 21 may be formed of an insulating material.

Then, as shown in FIG. 36, one end of the crystal resonator piece 3 is joined to the pair of plated terminals 19 via the conductive adhesive 7, and the other end is supported by the plating pillow 21. Also in this embodiment, the alumina coating 17 shown in FIG. 36A is applied so that the contact portions of the cap have the same height.

Example 28 Next, Example 28 is shown in FIGS. 37 and 38. In this embodiment, it is not necessary to consider the directionality of the base so that the crystal vibrating piece 3 may be fixed to either the left side or the right side of the base 2 in the twenty-seventh embodiment shown in FIGS. The metallized wiring 8 is formed in a shape, and a pair of plated terminals 19 are formed on the metallized wiring 8 on the left and right of the base 2. Then, for example, when the left end of the crystal oscillator piece 3 is coupled to the plated terminal 19 as shown in FIG. 38, the right plated terminal 19 supports the right end of the crystal oscillator piece 3. The rest of the configuration is the same as that of the twenty-seventh embodiment, so the description is omitted.

EXAMPLE 29 Next, Example 29 is shown in FIGS. 39 and 40. In this embodiment, the plating pillow 21 is omitted from the embodiment 27 shown in FIGS. 35 and 36, and the alumina coating 17 is used instead.
The other end of the crystal oscillator piece 3 is supported by. In order to make the height of the plating pillow 21 substantially the same as that of FIG.
As shown in 0, the height of the alumina coating 17 is higher than that in the case of Example 27. The rest of the configuration is the same as that of the twenty-seventh embodiment, so the description is omitted.

Embodiment 30 Next, Embodiment 30 is shown in FIGS. 41 and 42. This embodiment is different from Embodiment 27 shown in FIGS. 35 and 36 in that the metallized wirings 8 on the upper and lower surfaces of the base 2 are connected, but instead of forming the metallized wirings 8 on the side surfaces of the base 2, the through holes 20 are formed. Is formed. When the metallized wirings 8 are collectively applied to the base 2, the adjacent bases 2 are electrically connected to each other on the front surface, so that the land pattern on the back surface can be the same as that of the laminated type. The other structure is the same as that of the thirtieth embodiment, and the description thereof is omitted.

Example 31 Next, Example 31 is shown in FIGS. 43 and 44. In this embodiment, the embodiment 28 shown in FIGS. 37 and 38 is replaced with a through hole as in the embodiment 30. Since the other configurations are the same as those of the 28th and 30th embodiments, description thereof will be omitted.

Example 32 Next, Example 32 is shown in FIGS. In this embodiment, the plating pillow 21 is removed from the embodiment 30 shown in FIGS. 41 and 42 and the range of the alumina coating 17 is widened as shown in FIG. It is something that is supported. For this reason, the thickness of the alumina coating 17 is thicker than those in Examples 30 and 31, and since the through hole 20 is covered with the alumina coating 17, the airtightness is increased. The other configuration is the same as that of the thirtieth embodiment, and thus the description thereof is omitted.

Example 33 Next, Example 33 is shown in FIG. This embodiment is shown in FIG.
1, the through hole 20 in Example 30 shown in FIG.
To the center of the base 2 so that the metallized wiring 8 is not formed in the contact portion of the cap, and as a result, an alumina coating for making the contact portion of the cap at the same height is formed as shown in FIG. The formation is omitted. The other structure is the same as that of the thirtieth embodiment, and the description thereof is omitted.

Embodiment 34 Next, Embodiment 34 is shown in FIGS. 49 and 50. This example is the same as example 33 shown in FIGS. 43 and 44 except that the alumina coating is omitted. Since other configurations are the same as those of the examples 31 and 33,
Description is omitted.

Although the surface mount type crystal resonator is shown as an example of the surface mount type piezoelectric device in Examples 1 to 34, it can be applied to the surface mount type filter.

[0052]

As is apparent from the above description, claim 1
According to the surface mount type piezoelectric devices of to 7, since the device piece is inclined with respect to the base and only one side is fixed to the base, it is affected by the thermal stress due to the difference in thermal expansion coefficient between the device piece and the ceramics. It is difficult and contact between the vibrating part of the device piece and the base can be avoided.

According to the surface mount type piezoelectric device of the third and fourth aspects, the recess is formed by press working for fitting the lower end of the device piece together with the base. Therefore, the base becomes inexpensive and the metallization on the base is performed. Wiring is also easy because there is no protrusion.

According to the surface mount type piezoelectric device of the fourth and sixth aspects, since the recesses into which the lower ends of the device pieces are fitted are formed on both sides of the base, the device pieces can be fixed to either side of the base. , It is not necessary to be aware of the direction of the base.

According to the surface mount piezoelectric device of the eighth and ninth aspects, since the fixing convex portion for fixing one end of the device piece and the pillow portion for supporting the other end are formed integrally with the base, they are fixed. It is not necessary to newly attach the convex portion and the pillow portion to the base.

According to the surface mount piezoelectric device of the ninth aspect, since the metallized wiring is formed so that either the fixing convex portion or the pillow portion may be used as the fixing convex portion, the fixing convex portion is formed. The device piece can be fixed to both the base and the pillow, and it is not necessary to be aware of the orientation of the base.

According to the surface mount type piezoelectric device of the tenth and eleventh aspects, since the concave portion is formed at the center of the base, the fixing portion and the pillow portion are consequently formed on both sides of the concave portion. The manufacturing cost of the piezoelectric device is low.
Further, since the metallized wiring arranged on the base is located on the same plane, wiring work is easy.

According to the surface mount type piezoelectric device of the eleventh aspect, since the metallized wiring is formed so that the device piece can be fixed to any portion on both sides of the recess, the fixed portion of the device piece is specified to any one. You do n’t have to
There is no need to recognize the direction of the base.

According to the surface mount piezoelectric device of the twelfth and the eighteenth aspects, since the device piece is supported by the insulating coating, the strain stress due to the difference in the thermal expansion coefficient between the device piece and the base is obtained. There is no influence of. Moreover, since the insulating coating is used as a member for supporting the other end of the device piece, it is not necessary to newly provide it, and the manufacturing cost is low. Furthermore, the insulating coating also functions as a fixing part for fixing one end of the device piece.

According to the surface mount piezoelectric device of the thirteenth, twenty-second and twenty-fifth aspects, the device pieces can be connected to either side of the base, so that it is not necessary to be aware of the orientation of the base.

According to the surface mount type piezoelectric device of the fourteenth aspect, when the pillow members are fixed to both sides of the base, the pillow members on one end side of the device pieces act as stoppers for the device pieces, and the fixing force of the device pieces is increased. It can be strengthened and the positioning accuracy is improved.

According to the surface mount type piezoelectric device of the fifteenth aspect, since the plated terminal and the plating pillow are formed by plating, the height of the surface mount type piezoelectric device can be kept low. Further, since the land pattern can be determined relatively arbitrarily, it is possible to design in consideration of compatibility with other products.

According to the surface mount piezoelectric device of the sixteenth aspect, since the upper surface of the portion supporting the other end of the device piece is inclined along the lower surface of the device piece, the contact area of the device piece becomes large, The drop impact resistance is improved, and the surface mount piezoelectric device can be made thinner.

According to the surface mount type piezoelectric device of the seventeenth aspect, since the notch is formed in the insulating coating,
The positioning accuracy of the device piece is improved and the device piece is firmly fixed.

According to the surface mount piezoelectric device of the nineteenth aspect, since the insulating coating is formed higher than the plated terminal, the function of the cutout portion of the insulating coating causes
It is possible to enhance the fixing force of the device piece and improve the positioning accuracy.

According to the surface-mounted piezoelectric device of the twentieth aspect, since the low pillow portion is formed by lowering the portion of the insulating coating that supports the other end of the device piece, the height of the surface-mounted piezoelectric device is reduced. It can be made low and thin.

According to the surface mount type piezoelectric device of the twenty-first aspect, since the other end of the device piece is supported by the insulating coating, the height of the insulating coating is higher than that of the metallized wiring, and the insulating coating is formed on the through holes. By covering it, airtightness can be improved.

According to the surface-mounted piezoelectric device of the twenty-third aspect, since the plated terminals and the plated pillows are formed by plating, the height of the surface-mounted piezoelectric device can be kept low. Further, when the metallized wiring is collectively applied to the bases, the adjacent bases are electrically connected to each other on the front surface, so that the land pattern on the back surface can be the same as that of the laminated surface-mounted piezoelectric device.

According to the surface mount piezoelectric device of the twenty-fourth aspect, since the conduction between the front and the back of the base is performed by the through holes, the insulating coating for flattening the contact portion with the cap is unnecessary. Further, since the plated terminal and the plated pillow are formed by plating, the height and cost of the surface-mounted piezoelectric device can be kept low.

[Brief description of drawings]

FIG. 1 is a first embodiment of a surface mount type crystal resonator according to the present invention.
FIG.

FIG. 2 is a second embodiment of the surface mount type crystal resonator according to the present invention.
2A is a plan view and FIG. 1B is a front view.

FIG. 3 is a third embodiment of the surface mount type crystal resonator according to the present invention.
FIG.

FIG. 4 is a fourth embodiment of the surface mount type crystal resonator according to the present invention.
FIG.

FIG. 5 is a fifth embodiment of the surface mount type crystal unit according to the present invention.
2A is a plan view and FIG. 1B is a bottom view.

FIG. 6 is a sixth embodiment of the surface mount type crystal unit according to the present invention.
2A is a plan view and FIG. 1B is a front view.

FIG. 7 is a seventh embodiment of the surface mount type crystal unit according to the present invention.
FIG.

FIG. 8: Example 8 of a surface mount type crystal resonator according to the present invention
2A is a plan view and FIG. 1B is a front view.

FIG. 9: Example 9 of a surface mount type crystal resonator according to the present invention
2A is a perspective view of a base, FIG. 3B is a perspective view of a surface mount type crystal resonator to which a crystal resonator piece is fixed, and FIG. 3C is a perspective view of a base showing another example.

10A and 10B relate to Example 10 of a surface mount type crystal resonator according to the present invention, FIG. 10A is a perspective view of a base, and FIG. 10B is a perspective view of a surface mount type crystal resonator to which a crystal resonator piece is fixed.

11A and 11B relate to Example 11 of a surface mount type crystal resonator according to the present invention, FIG. 11A is a perspective view of a base, and FIG. 11B is a perspective view of a surface mount type crystal resonator to which a crystal resonator piece is fixed;
(C) is a perspective view of a base showing another example.

12A and 12B relate to a base of Example 12 of the surface-mount type crystal resonator according to the present invention, FIG. 12A is a plan view, and FIG. 12B is a view taken along the line AA of FIG.

FIG. 13 relates to a base to which a crystal unit is fixed in Example 12 of a surface mount type crystal unit according to the present invention,
(A) is a plan view, (b) is a BB arrow view of (a).

FIG. 14 is a plan view of a base of a surface mount type crystal resonator according to a thirteenth embodiment of the present invention.

FIG. 15 relates to a base to which a crystal unit is fixed in Example 13 of the surface mount type crystal unit according to the present invention,
(A) is a top view, (b) is a CC arrow view of (a).

FIG. 16 relates to a base to which a crystal unit is fixed in Example 14 of the surface-mount type crystal unit according to the present invention,
(A) is a plan view, (b) is a DD arrow view of (a).

FIG. 17 relates to a base to which a crystal unit is fixed in Example 15 of the surface mount type crystal unit according to the present invention,
(A) is a top view, (b) is a EE arrow view of (a).

FIG. 18 relates to a base to which a crystal unit is fixed in Example 16 of the surface mount type crystal unit according to the present invention,
(A) is a top view, (b) is a FF arrow line view of (a).

19A and 19B relate to a base of a surface mount type crystal resonator according to Example 17 of the present invention, FIG. 19A is a plan view, and FIG. 19B is a view taken along the line GG of FIG. 19A.

FIG. 20 relates to a base to which a crystal unit is fixed in Example 17 of the surface-mount type crystal unit according to the present invention,
(A) Plan view, (b) is the HH arrow view of (a).

FIG. 21 is a plan view of a base in Example 18 of the surface-mount type crystal resonator according to the present invention.

FIG. 22 is a plan view of a base to which a crystal resonator piece is fixed in Example 18 of the surface-mount type crystal resonator according to the present invention.

FIG. 23 relates to a base to which a crystal support piece is fixed in Example 19 of the surface-mount type crystal resonator according to the present invention,
(A) is a plan view, (b) is a view taken along the line I-I of (a).

FIG. 24 is a plan view of the base in Example 20 of the surface-mount type crystal resonator according to the present invention.

FIG. 25 relates to a base to which a crystal unit is fixed in Example 20 of the surface-mount type crystal unit according to the present invention,
(A) is a top view, (b) is a JJ arrow view of (a).

FIG. 26 relates to a base to which a crystal unit is fixed in Example 21 of the surface-mount type crystal unit according to the present invention,
(A) is a top view, (b) is a KK arrow line view of (a).

FIG. 27 relates to a base to which a crystal unit is fixed in Example 22 of the surface mount type crystal unit according to the present invention,
(A) is a plan view, (b) is a LL arrow view of (a).

28A and 28B relate to the base of Example 23 of the surface-mount type crystal resonator according to the present invention, FIG. 28A is a plan view, and FIG. 28B is an MM arrow view of FIG.

FIG. 29 relates to a base to which a crystal unit is fixed in Example 23 of the surface mount type crystal unit according to the present invention,
(A) is a plan view, (b) is a NN arrow view of (a).

30A and 30B relate to a base of a surface mount type crystal resonator according to embodiment 23 of the present invention, FIG. 30A is a plan view, and FIG. 30B is a view taken along the line OO of FIG.

FIG. 31 relates to a base to which a crystal unit is fixed in Example 24 of the surface-mount type crystal unit according to the present invention,
(A) is a top view, (b) is a PP arrow view of (a).

FIG. 32 is a plan view of a base of a surface mount type crystal resonator according to a twenty-fifth embodiment of the present invention.

FIG. 33 relates to a base to which a crystal unit is fixed in Example 25 of the surface-mount type crystal unit according to the present invention,
(A) is a plan view, (b) is a Q-Q arrow view of (a).

FIG. 34 relates to a base to which a crystal unit is fixed in Example 26 of the surface-mount type crystal unit according to the present invention,
(A) is a plan view, (b) is a RR arrow view of (a).

FIG. 35 relates to a base of a surface mount type crystal resonator according to embodiment 27 of the present invention, (a) is a plan view, (b) is a front view, (c) is a bottom view, and (d) is a right side view. .

FIG. 36 relates to the base to which the crystal unit is fixed in Example 27 of the surface-mount type crystal unit according to the present invention,
(A) is a plan view and (b) is a front view.

FIG. 37 relates to a base of a surface mount type crystal resonator according to embodiment 28 of the present invention; (a) is a plan view, (b) is a front view, (c) is a bottom view, and (d) is a right side view. .

FIG. 38 relates to a base to which a crystal unit is fixed in Example 28 of the surface-mount type crystal unit according to the present invention,
(A) is a plan view and (b) is a front view.

FIG. 39 relates to a base of a surface mount type crystal resonator according to Example 29 of the invention, (a) is a plan view, (b) is a front view, (c) is a bottom view, and (d) is a right side view. .

FIG. 40 relates to a base to which a crystal unit is fixed in Example 29 of the surface-mount type crystal unit according to the present invention,
(A) is a plan view and (b) is a front view.

FIG. 41 relates to a base of a surface mount type crystal resonator according to embodiment 30 of the present invention, (a) is a plan view, (b) is a front view, (c) is a bottom view, and (d) is a right side view. .

FIG. 42 relates to the base to which the crystal unit is fixed in Example 30 of the surface-mount type crystal unit according to the present invention,
(A) is a plan view and (b) is a front view.

FIG. 43 relates to a base of a surface mount type crystal resonator according to Example 31 of the invention; (a) is a plan view, (b) is a front view, (c) is a bottom view, and (d) is a right side view. .

FIG. 44 relates to the base to which the crystal unit is fixed in Example 31 of the surface-mount type crystal unit according to the present invention,
(A) is a plan view and (b) is a front view.

FIG. 45 relates to a base of a surface mount type crystal resonator according to Example 32 of the invention; (a) is a plan view, (b) is a front view, (c) is a bottom view, and (d) is a right side view. .

FIG. 46 relates to the base to which the crystal unit is fixed in Example 32 of the surface-mount type crystal unit according to the present invention,
(A) is a plan view and (b) is a front view.

FIG. 47 relates to the base of a surface mount crystal oscillator according to Example 33 of the invention, (a) is a plan view, (b) is a front view, (c) is a bottom view, and (d) is a right side view. .

FIG. 48 relates to a base to which a crystal unit is fixed in Example 33 of the surface-mount type crystal unit according to the present invention,
(A) is a plan view and (b) is a front view.

FIG. 49 relates to a base of a surface mount type crystal resonator according to embodiment 34 of the present invention; (a) is a plan view, (b) is a front view, (c) is a bottom view, and (d) is a right side view. .

FIG. 50 relates to the base to which the crystal unit is fixed in Example 34 of the surface-mount type crystal unit according to the present invention,
(A) is a plan view and (b) is a front view.

FIG. 51 is a configuration diagram of a conventional surface mount crystal unit.

52 relates to a base of a surface mount type crystal resonator according to Conventional Example 1, (a) is a plan view, (b) is a front view, and (c).
Is the bottom view.

FIG. 53 relates to a base or the like of a surface-mount type crystal resonator according to Conventional Example 2, (a) is a plan view, (b) is a front view, and (c).
Is the bottom view.

54A and 54B relate to a base and the like of a surface-mount type crystal resonator according to Conventional Example 3, where FIG. 54A is a plan view, FIG. 54B is a front view, and FIG.
Is the bottom view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Cap 2 ... Base 3 ... Crystal oscillator piece 4 ... Electrode film 5 ... Buffer member 7 ... Conductive adhesive 8 ... Metallized wiring 10 ... Pillow part 11 ... Reinforcing material 12 ... Fixing groove 14 ... Buffer part 15 ... Fixing part 16 ... Recessed part 17 ... Alumina coating 17a ... Notch part 17b ... Inclined pillow part 17c ... Low pillow part 18 ... Pillow member 18a ... Inclined surface 19 ... Plated terminal 20 ... Through hole 21 ... Plated pillow

Claims (25)

[Claims] 1. A device piece is arranged on a surface of a flat base made of an insulating material while being inclined, and a lower end of the device piece is fixed to a metallized wiring on the surface of the base through a conductive adhesive. Characteristic surface mount piezoelectric device. 2. The surface-mounted piezoelectric device according to claim 1, wherein the lower end of the device piece is fixed to the metallized wiring on the surface of the base through a buffer member having a bent portion. 3. The surface-mounted piezoelectric device according to claim 1, wherein a recess into which the lower end of the device piece is fitted is formed on the surface of the base. 4. The surface mount type device according to claim 3, wherein recesses for fitting the lower end of the device piece are formed on both sides of the surface of the base, and the metallized wiring is arranged so that the lower end of the device piece can be fitted in any of the recesses. Piezoelectric device. 5. The surface-mounted piezoelectric device according to claim 1, wherein a pillow portion is formed on the surface of the base to support the upper end of the device piece. 6. The surface-mounted piezoelectric device according to claim 4, wherein pillow portions are formed on both sides of the base to support the upper end of the device piece. 7. The surface-mounted piezoelectric device according to claim 1, wherein a buffer portion is formed at a position corresponding to an upper end of the device on an inner surface of the cap to be covered with the base. 8. An integrally formed protrusion on the surface of the base for fixing one end of the device piece and a pillow portion for mounting the other end,
A surface-mounted piezoelectric device characterized in that one end of a device piece having the other end placed on a pillow portion is fixed to a metallized wiring on a fixing convex portion via a conductive adhesive. 9. The surface-mounted piezoelectric device according to claim 8, wherein the metallized wiring is arranged so that both the fixing protrusion and the pillow portion can be used as the fixing protrusion. 10. A recess is formed near the center of the surface of the base, and metallized wiring is formed on the surface of the base.
A surface-mounted piezoelectric device, characterized in that one end of a device piece mounted so as to bridge the position of the recess is fixed to a metallized wiring, and the other end is mounted on a base. 11. The surface-mounted piezoelectric device according to claim 10, wherein the metallized wiring is arranged so that the device piece can be fixed on both bases on both sides of the recess. 12. A pair of metallized wirings are formed on a front surface and a back surface of a base made of an insulating material, and metallized wirings on both surfaces are connected by a metallized wiring formed on a side surface of the base, and a cap for covering the base is provided. An insulating coating is formed so that at least the periphery of the surface of the base, which is in contact with at least the outer periphery, has approximately the same height, and one end of the device piece is fixed to the metallized wiring via a conductive adhesive and the other end is coated with an insulating coating. A surface-mounted piezoelectric device characterized by being supported. 13. The surface-mounted piezoelectric device according to claim 12, wherein metallized wiring is formed so that the device piece can be fixed on either side of the surface of the base. 14. To support the other end of the device piece,
The surface-mounted piezoelectric device according to claim 12, wherein a pillow member is fixed to the base instead of the insulating coating. 15. To support the other end of the device piece,
Form a plated pillow instead of an insulating coating on the base,
The surface-mounted piezoelectric device according to claim 12, wherein a plated terminal is interposed between one end of the device piece and the metallized wiring. 16. The surface-mounted piezoelectric device according to claim 12, 13 or 14, wherein an upper surface of a portion supporting the other end of the device piece is inclined along a lower surface of the device piece. 17. The surface-mounted piezoelectric device according to claim 12, 13 or 14 or 16, wherein a notch for positioning one end of the device piece is formed in the insulating coating. 18. The plating terminal is provided between one end of the device piece and the metallized wiring, and the upper surface of the plating terminal is substantially the same as the height of the insulating coating.
The surface-mounted piezoelectric device according to. 19. A pair of metallized wirings are formed on the front and back surfaces of a base made of an insulating material, and metallized wirings on both sides are connected by metallized wirings formed on the side surfaces of the base, and plated terminals are formed on the pair of metallized wirings. The insulating coating is formed higher than the upper surface of the plated terminal so that at least the periphery of the surface of the base, which is the part where the cap for contacting the base abuts, is made to be at approximately the same height, and the insulating coating has a cutout. It is characterized in that one end of the device piece is fitted into the notch and the one end of the device piece is fixed to the plating terminal with a conductive adhesive, and the other end of the inclined device piece is supported by an insulating coating. Surface mount piezoelectric device. 20. A low pillow portion is formed by lowering only a portion of the insulating coating that supports the other end of the device piece,
20. The device piece and the surface of the base are substantially parallel to each other.
The surface-mounted piezoelectric device according to. 21. A pair of metallized wirings are formed on a front surface and a back surface of a base made of an insulating material, and metallized wirings on both surfaces are connected by through holes penetrating the base, and plated terminals are fixed on the pair of metallized wirings. Then, an insulating coating is formed so that at least the periphery of the surface of the base, which is the part where the cap for covering the base contacts, has approximately the same height, and one end of the device piece is plated with a conductive adhesive. A surface-mounted piezoelectric device, characterized in that it is adhered to and the other end is supported by an insulating coating. 22. The surface-mounted piezoelectric device according to claim 21, wherein metallized wiring is formed so that the device piece can be fixed on either side of the surface of the base. 23. The surface mount piezoelectric device according to claim 21, wherein a plating pillow is formed as a base instead of the insulating coating to support the other end of the device piece. 24. A pair of metallized wirings are formed on a front surface and a back surface of a base made of an insulating material, and metallized wirings on both surfaces are connected by through holes penetrating the bases, and plated terminals are fixed on the pair of metallized wirings. A surface-mounted piezoelectric device is characterized in that one end of the device piece is fixed to a plating terminal via a conductive adhesive and a plating pillow portion for supporting the other end of the device piece is provided on the base. 25. The surface-mounted piezoelectric device according to claim 24, wherein metallized wiring is formed so that the device piece can be fixed on either side of the surface of the base.