JPH08479B2 - IC card manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to an IC in which an IC module is embedded or mounted.
The present invention relates to a card manufacturing method, and more particularly, to improvement of a bonding portion between an IC module and a card body.

[Conventional technology]

A plan view and a sectional configuration view of an IC card having an IC module inside are shown in FIGS. 4 and 5. In the figure, 1 is
IC card, 2 is an IC module, 2a is an external connection terminal of the IC module 2, 4 is an opaque core sheet (resin sheet) in which the IC module 2 is embedded, 3 and 5 are transparent surface protection sheets (made of resin) Sheet) and 6 are adhesives. Also,
FIG. 6 shows another example of the sectional structure, and the same reference numerals as those in FIG. 5 denote the same parts.

Thus, in the conventional IC card, the IC module 2
In the case of embedding or mounting the card in the card body, the card body having a multi-layer structure is provided with a recess in which the IC module 2 is fitted, and the bottom of the IC module 2 and the cross section of the recess of the card body are covered with an adhesive or an adhesive sheet 6. I try to glue it through. As a result, the molding was performed so that the entire thickness was substantially uniform.

This will be described in more detail. First, the IC card body to which the IC module 2 is attached is made of, for example, a hard vinyl chloride resin sheet material, and the surface corresponding to the card outer surface of the core sheet 4 made of an opaque sheet material, The card design is painted by silk screen printing or offset printing. Then, the core sheet 4 is laminated on both sides with thin protective transparent sheets 3 and 5 and integrated by heating and pressure molding to form a card. In this process, the card body is provided with a recess into which the IC module 2 is fitted, and after the card body is manufactured, the IC module 2 is adhered to the recess with the adhesive 6, or the IC module is embedded in the card body. A concave portion is provided, the IC module 2 is embedded in the concave portion with an adhesive, and these are integrally heat-pressed to manufacture an IC card.

[Problems to be solved by the invention]

In such a configuration, the card body and the IC module 2
The adhesive sheet 6 having the same size as that of the bottom surface of the IC module 2 provided on the card body is used for the adhesion with the. In this case, there is no problem if the volume of the recess of the card body and the volume of the IC module 2 and the adhesive 6 are exactly the same, but if the volume of the recess of the card body is large or the depth is deep, Problems such as insufficient pressure for bonding the IC module 2 during heating and pressure molding, and depression of the IC module portion from the card surface (see FIG. 8 (a)) occur. Even if the card is finished on a uniform surface, the sheet material of the card body outside the recess will partially flow into the module during heating and pressure molding, and as a result, the core sheet on the back of the IC module of the card The printed design moves locally, resulting in local distortion of the card design. On the contrary, when the volume of the recessed portion provided in the card body or the depth of the recessed portion is smaller than that of the IC module 2 and the adhesive material 6, the IC module 2 pops out from the surface of the card, and FIG. As shown in b), the IC module part becomes thicker than other parts of the card. For this reason, a large pressure is partially received during heating and pressure molding, and the core sheet on the back of the IC module is extruded locally, and as a result, the design printed on the core sheet on the back of the IC module is also localized. It causes deformation and makes the appearance of the card unsightly.

The present invention has been made in view of the above points, and an object of the present invention is to solve the above-mentioned problems and to obtain a method for manufacturing an IC card that can obtain a highly reliable bonded structure.

[Means for solving problems]

A method of manufacturing an IC card according to the present invention is provided with a through hole into which the IC module is fitted in a resin sheet in which the IC module is embedded or mounted, and a portion of the remaining sheet where the bottom surface of the IC module abuts. , A part of the area that will become the card body, and an area that is wider than the cross section of the through hole, is coated with a fluid adhesive, these sheets are stacked and the IC module is fitted into the through hole. Then, they are integrally molded.

[Action]

According to the present invention, when the IC module is bonded to the card body, the area where the IC module abuts is a part of the area to be the card body, and the area is wider than the through-hole cross section in which the IC module is embedded. Since a fluid adhesive is applied, if there is a gap between the IC module and the card body, the above-mentioned mounting agent quickly enters from this peripheral portion toward this gap, and if the IC module is large, The adhesive quickly flows out between the sheet having the through holes and the sheet with which the bottom surface of the module abuts, thereby preventing the card body material from being locally deformed.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional configuration diagram of an IC card manufactured according to an embodiment of the present invention. As shown in this figure, the card body manufactured according to this embodiment has a multilayer structure of a hard vinyl chloride resin sheet material, and has a total of 6 layers including a transparent surface sheet 2 layers 3 and 5 and an opaque core sheet 4 layers 4a to 4d. It is composed of. FIG. 2 is an exploded perspective view of the IC card, wherein 7 is a through hole for fitting the IC module 2 and 6 is an adhesive coating layer.

Next, a method of manufacturing this IC card will be described. First,
The first layer 3 to the fourth layer where the IC module 2 is mounted
Common through hole 7 where IC module 2 is fitted in layers up to 4c
To provide. And the bottom of the IC module 2 comes into contact with the fifth
An epoxy resin in a B-stage state is applied as an adhesive layer 6 to a portion of the layer 4d which is in contact with the IC module 2. Here, the adhesive layer 6 is a through hole 7 into which the IC module 2 is fitted.
Is applied over a larger area than the bottom area of the IC module 2. Next, the sheets are stacked in the state as shown in FIG. 3, the IC module 2 is fitted into the through hole 7 so that the external terminals 2a thereof are the outer surface of the card, and heated at 130 ° C. for 5 minutes according to a conventional method. , Pressure molding is performed to perform integral molding.

In this embodiment, since the adhesive is applied in a wider range than the bottom surface of the IC module 2 in the B stage or in the heat-sensitive state, the volume or thickness of the IC module 2 is smaller than that of the recess formed by the through hole 7. If it is smaller than that, the adhesive 6 between the sheet materials flows into the IC module mounting portion by heating and pressing, as shown in FIG.
On the contrary, when the volume or thickness of the IC module 2 is large,
As shown in FIG. 7 (b), it does not flow out over a wide area, and as a result, the card body material is not locally deformed or moved. Therefore, the thicknesses of the IC card body and the IC module mounting portion are equalized, the card material on the back of the IC module of the card body can be prevented from being deformed, and the deformation of the design can be prevented.

Further, in the conventional example, when the adhesive sheet is inserted between the IC module and the card main body, it is necessary to consider bending, warping, etc. of the adhesive sheet, but in this example, the adhesive layer is applied in advance. Therefore, it is not necessary to consider such a thing, and a highly reliable adhesive structure can be easily obtained.

In the above embodiment, an example of using the epoxy resin applied in a B-stage shape as the adhesive layer is shown. This is before the hard vinyl chloride sheet, which is the material of the card body, is self-fused at the time of heating and pressure molding. Needless to say, any heat-sensitive adhesive or any other thermosetting adhesive may be applied as long as it is an adhesive that can be moved to. Needless to say, it is convenient for stacking the card bodies that the surface of the adhesive layer is tack-free after application.

In addition, the adhesive may be a thermosetting resin adhesive that becomes B stage by UV irradiation, and the adhesive may be irradiated with UV to be B stage before the sheets are superposed during the manufacturing process. Good.

Further, in the above embodiment, the case where the card main body has six layers has been described, but this is not particularly limited as long as it has a structure of three layers or more.

〔The invention's effect〕

As described above, according to the present invention, at the time of bonding the IC module and the card body, the adhesive layer is in contact with the bottom surface of the IC module, is a part of the area to be the card body, and the IC module is embedded. The adhesive having fluidity is applied over a larger area than the cross section of the through hole, and the adhesive layer is also provided between the sheet materials. The local deformation of the card sheet material due to the mismatch in the mounting volume and height of the IC module mounting part and the height of the IC module can be reduced by the rapid movement of the above adhesive, and the design is not significantly distorted. Moreover, there is an effect that workability and reliability of adhesion can be improved.

[Brief description of drawings]

FIG. 1 is a sectional configuration diagram of an IC card manufactured according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of the IC card, and FIG. 3 is a diagram for explaining a method of manufacturing the IC card. FIG. 4 is a plan view of a general IC card, FIG. 5 is a sectional configuration diagram of a conventional IC card, FIG. 6 is a sectional configuration diagram of another conventional IC card, and FIGS. 8A and 8B are diagrams for explaining the function and effect of the present invention, and FIGS. 8A and 8B are diagrams for explaining problems of the conventional IC card. 2 …… IC module, 3,5 …… Surface protection sheet, 4a-4d
...... Opaque core sheet, 6 ... Adhesive coating layer, 7 ... IC
Through hole for module mounting. The same reference numerals in the drawings indicate the same or corresponding parts.

Claims (4)

[Claims] 1. A method of manufacturing an IC card having an IC module therein, wherein the card body is composed of a plurality of resin sheets, and
Part of the area that will become the card body in the step of providing through holes for IC module fitting in the resin sheet in the part where the IC module is embedded, and in the part where the bottom surface of the IC module of the remaining sheet contacts And a step of applying an adhesive having fluidity over a region wider than the cross section of the through hole, and stacking all of these sheets on the through hole.
A method for manufacturing an IC card, comprising: a step of fitting an IC module; and a step of heating and pressing these to integrally mold them. 2. The method of manufacturing an IC card according to claim 1, wherein the adhesive is a heat-sensitive adhesive. 3. The adhesive according to claim 1, wherein the adhesive is a thermosetting resin in a B-stage state.
IC card manufacturing method. 4. The adhesive is a thermosetting resin which is brought into a B-stage state by irradiation with ultraviolet rays, and after the adhesive is applied, the adhesive is irradiated with ultraviolet rays. A method of manufacturing an IC card according to claim 1.