JPH0884217A - Mounting structure for solid-state image sensor in image reading device - Google Patents

Abstract

(57) [Summary] [Object] An object of the present invention is to provide a mounting structure for a solid-state image sensor in an image reading apparatus in which a substrate on which the solid-state image sensor is mounted is less likely to warp due to heat or the like. [Structure] A main body to which an imaging lens 2 is fixed, a substrate 5, to which a solid-state image pickup device 1 is attached, and an auxiliary member 6 to which the substrate is attached are provided. The auxiliary member and the substrate are arranged in this order. The main body 7 and the auxiliary member 6 are connected by the connecting portions 22 and 23 which can be adjusted in the six axis directions. The board mounting portion 61 of the auxiliary member 6 is located outside of the connecting portions 22 and 23 of the main body 7 and the auxiliary member 6 with the mounting position of the solid-state imaging device 1 as a reference, and arranged on the left and right with the solid-state imaging device 1 as the center. To do.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a solid-state image pickup device in an image reading apparatus for reading an optical image by using the solid-state image pickup device, and is used as an image reading portion of a facsimile, a copying machine, a scanner or the like. is there.

[0002]

2. Description of the Related Art An apparatus for reading an optical image using a solid-state image pickup device, as shown in FIG. 12, forms an image of an object 3 on a solid-state image pickup device 1 via an imaging lens 2 and reads it. In addition, the solid-state image pickup device 1 includes a one-line solid-state image pickup device in which a plurality of minute photoelectric conversion elements (hereinafter, simply referred to as pixels, each having a size of several μm × several μm) are arranged in a line. It is used.

In such an image reading apparatus, the line image formed by the image forming lens 2 is positioned on the solid-state image pickup device 1 and the optical characteristics (focus, magnification) are read with a predetermined required accuracy. , The image forming lens 2 and the pixel line 4 of the solid-state image sensor 1 of one line are shown in FIG.
It is necessary to finely move in the directions of the five axes of z, β and γ to adjust the position. In addition, 26 in the figure is an optical axis. More recently, in order to read a color image, as shown in FIG.
Red (hereinafter, simply referred to as R), Green (hereinafter,
Simply called G. ), Blue (hereinafter, simply referred to as B)
In some cases, the solid-state imaging device 1a of 3 lines 4a, 4b, and 4c in which pixels having a peak of spectral sensitivity are arranged in three columns for R, G, and B is used.

In this case, in addition to the adjustment in the 5 axis directions described above, the 3-line solid-state image pickup device 1 is also operated in the α direction shown in FIG.
Since there is a degree of freedom with respect to the position of a, adjustment in the total of 6 axis directions is required. Usually, such a solid-state image sensor 1
The position adjustment accuracy of a is required to be several μm in each of the 6 axis directions, and it is particularly indispensable to achieve this request when the solid-state imaging device 1a is fixed after the position adjustment as described above. In addition, it is a technique for preventing the position of the solid-state image sensor 1a from being displaced.

This is because even if the position is adjusted with a high degree of accuracy, the position may need to be adjusted again if the position shifts when fixed.
This is because, when the separable fixing method is used, the part must be disposed of, and the position adjustment time becomes long and the cost becomes high.

Conventionally, fixing with screws has been widely used for this fixing, but the amount of positional deviation is several hundred μm.
Since it is too large, such as several tens of μm, many attempts have been made to fix it with an adhesive, which is said to cause a smaller amount of positional deviation than fixing with screws. For fixing with this adhesive,
There are roughly two methods, one is a method in which the adhered parts are in contact with each other, and the other is a method in which there is a gap in the adhered parts. The former is called close adhesion and the latter is called filling adhesion.

Various solid-state image pickup device fixing methods to which this close adhesion is applied have been proposed, and one of them is disclosed in Japanese Patent Laid-Open No. 62-139466, where the position of the solid-state image pickup device is adjusted even if the position of the solid-state image pickup device is adjusted. A complicated mechanism is provided on the side of the image reading device so that they always come into contact with each other. In such a method, not only the position adjustment itself of the solid-state image pickup device becomes complicated, but also a position adjustment mechanism which is not necessary for the original function of reading an image in the image reading apparatus must be provided. This requires a large amount of parts that are not necessary for the function, which is one of the reasons for the high cost. In addition, since there are many movable parts in the adjusting mechanism, there are inevitably many adhesion points, and there is also a disadvantage that displacement due to adhesion also increases.

Further, in the case of the method proposed in Japanese Patent Laid-Open No. 268263/1987, the contact portion for adhering and fixing the solid-state image pickup device is not formed by a complicated mechanism, which is costly. Although it is not a cause, the solid-state imaging device is brought into contact with and adhered to a part of the image reading device, and the contact portion between the two may be at a predetermined position, but if they are misaligned, they are brought into contact with each other. Since it is not possible to position the solid-state image pickup device by itself, a washer is placed between the two to perform adjustment and adhesion. However, with such a means, it is difficult to perform position adjustment of a level of several μm quickly and with high precision, and a washer must be prepared for each adjustment, which makes it difficult to cope with mass production. is there.

The problem common to the above two proposals is that the adherends are in contact with each other, but they are not completely in close contact with each other and have a gap of about several hundred μm or less. However, due to the surface tension and the density peculiar to the adhesive, or the relationship between the gaps described above, the adhesive sometimes fills the inside of the fixed member due to the capillary phenomenon. For this reason, depending on the filling state, it may cause displacement of the fixed member during curing of the adhesive, or when using a photo-curable adhesive, the interior of the fixed member is not irradiated with light and is uncured. A part remains, and even if the position is at a predetermined position during adjustment and fixing, there is a problem in that curing later progresses due to a thermal change or the like and a position shift occurs.

On the other hand, various fixing methods of a solid-state image pickup device to which filling adhesion is applied have been proposed, and one of them is proposed in Japanese Patent Laid-Open No. 61-118707. This method is provided with a complicated mechanism that enables the position adjustment of the solid-state image pickup device, and the solid-state image pickup device has a fixed side member and an abutting portion, and the adhesion is performed by adhering the abutting portion. Instead, a portion having a gap that is not in contact is filled with an adhesive to be adhered and fixed. This method has the same drawback as the above-mentioned Japanese Patent Laid-Open No. 62-139466, which contributes to the high cost, and has a contact point between the solid-state image sensor and the fixed-side member in addition to the adhesion point.
In particular, since the screw and the elastic body are contact members here, the screw loosens due to vibration or thermal change, or the elastic body vibrates or plastically deforms to apply an external force to the solid-state image sensor, and the position of the solid-state image sensor is changed. There was a case where it caused a gap.

Usually, in the case of filling and adhering, when it is desired to set the adhesive strength and the positional deviation due to the adhesive to a predetermined value without variation,
It is necessary to uniformly fill the space between the adhered portions with an adhesive to form an arbitrary shape and to reduce the amount of the adhesive as much as possible. In order to uniformly fill the adhesive with this method, it is better to use an adhesive having a low viscosity. However, as shown in FIG. 15, unless the gap E between the mounting plate 38 and the solid-state image sensor 1 is narrowed,
The adhesive flows into the gap E. However, even if the gap E is narrowed, the adhesive may flow into the gap due to a capillary phenomenon, and when a photo-curable adhesive is used,
Light is not radiated to this gap portion and an uncured portion remains, and even if the position is at a predetermined position during adjustment and fixation, curing progresses later due to a thermal change, etc. It may lead to misalignment.

In addition, this method has a problem that the amount of the adhesive required is too large in view of the area where the adhesive contacts the adherend, which increases the displacement of the solid-state image pickup device and the cost of the adhesive. There are also problems.

On the other hand, Nikkei Mechanical (1992.6.29 P
The method of fixing a solid-state image sensor proposed in AGE88) does not have a position adjusting mechanism for the solid-state image sensor, so that it does not lead to high cost as in JP-A-62-139466 and the adherend Since it is composed of a cylindrical hole and a cylindrical pin, a wide adhesive area is secured with a small amount of adhesive, which leads to an improvement in adhesive strength and a reduction in displacement.

However, even in this method, if the gap between the cylindrical hole and the cylindrical pin is not reduced, the adhesive will flow downward. However, if the gap is too narrow, there is a problem that the adhesive will not easily enter the gap, and when a photo-curing adhesive is used, it will be difficult for light to penetrate to the bottom, and the adhesive will be completely cured. It takes a long time to carry out the process, or an uncured portion remains, which leads to a problem that the solid-state image sensor is displaced like the other methods described above.

Therefore, the present applicant has filed Japanese Patent Application No. 6-9173.
No. 3 provides a mounting method and a mounting structure for a solid-state image sensor in an image reading apparatus in which the solid-state image sensor can be assembled with high precision and in which positional displacement is less likely to occur thereafter.

[0016]

However, even in the mounting structure of the solid-state image pickup device in the image reading apparatus provided by the applicant of the present invention, if the position of the substrate mounting portion of the auxiliary member is not taken into consideration, the light with respect to the solid-state image pickup device is not detected. The substrate in the orthogonal direction may be warped by the action of heat or the like, and the solid-state image sensor may be displaced.

Therefore, an object of the present invention is to provide a mounting structure for a solid-state image sensor in an image reading apparatus in which the substrate on which the solid-state image sensor is mounted is less likely to warp due to heat or the like.

[0018]

The present invention has a main body to which an imaging lens is fixed, a substrate to which a solid-state image sensor is attached, and an auxiliary member to which the substrate is attached. The main body, the auxiliary member, and the substrate are arranged in this order in the traveling direction of
In the mounting structure of a solid-state image sensor in an image reading device, wherein the main body and the auxiliary member are connected by a connecting portion that can be adjusted in six axial directions, the substrate mounting portion of the auxiliary member is
It is characterized in that it is located outside of the joint between the main body and the auxiliary member with reference to the mounting position of the solid-state image sensor, and on the left and right with respect to the solid-state image sensor.

Further, in the mounting structure of the solid-state image pickup device in the image reading apparatus according to the present invention, the substrate has a hole, and the connecting portion between the main body and the auxiliary member is located at the hole. Is characterized by.

Further, the mounting structure of the solid-state image pickup device in the image reading apparatus according to the present invention is characterized in that the substrate is detachable from the substrate mounting portion of the auxiliary member.

Further, in the mounting structure of the solid-state image pickup device in the image reading apparatus according to the present invention, the coupling portion is composed of a protrusion / hole portion provided in the main body and a hole / projection portion provided in the auxiliary member. In addition, the adhesive is filled in the gap formed by the protrusion and the hole so that the volume of the adhesive is equal to or less than the volume of the gap.

[0022]

Since the present invention is configured as described above, the mounting of the solid-state image pickup device is performed by first mounting the substrate on which the solid-state image pickup device is mounted to the auxiliary member, and then fixing the auxiliary lens to the imaging lens. The main body is connected to the main body by the connecting part, and the auxiliary member is moved so that the image of the imaging lens is accurately positioned at the solid-state image sensor, and when the predetermined position is reached, the connecting part is bonded. Position. In this structure, since the board mounting portion of the auxiliary member is located outside the connecting portion between the main body and the auxiliary member with reference to the mounting position of the solid-state image sensor, and is on the left and right with respect to the solid-state image sensor, after positioning and fixing There is little possibility that the substrate will warp due to the action of heat or the like, and there is no risk of displacement of the solid-state image sensor.

Further, since the hole portion of the substrate is located at the joint portion of the main body and the auxiliary member, it is easy to fill the joint portion with the adhesive through the hole portion of the substrate, and it is easy to adjust the six axes. .

Further, since the substrate is detachable from the substrate mounting portion of the auxiliary member, only the substrate of the solid-state image pickup device can be detached and reused.

Since the amount of the adhesive is smaller than the volume of the gap in the joint between the main body and the auxiliary member, the adhesive does not stick out from the surface of the joint. Therefore, there is no problem that the substrate is attached with an adhesive or the like and does not come off when the substrate is removed from the auxiliary member.

[0026]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view showing an embodiment of an image reading apparatus according to the present invention. 2 is the substrate in FIG.
An exploded perspective view of the auxiliary member and the main body portion as viewed from the back side,
3 is a perspective view of the assembled state of FIG. 1, and FIG. 4 is a view showing a cross section taken along the line AA of the image reading apparatus shown in FIG. As shown in the figure, a solid-state image sensor (hereinafter referred to as CCD) 1 is soldered to a substrate 5, and the substrate 5 is fixed by a screw 19 using a substrate mounting portion 61 of an auxiliary member 6. There is. At that time, to ensure fixation,
A spring washer 18 and a flat washer 17 are fitted to the screw 19.

The auxiliary member 6 having a rigidity higher than that of the substrate 5 is used, and the auxiliary member 6 is used at the time of positioning adjustment described later.
When the auxiliary member 6 is chucked by the image forming jig, it is less likely to be distorted.

The auxiliary member 6 is fixed to the main body 7 with an adhesive. Specifically, the hole 22 provided in the auxiliary member 6
And the protrusion 23 provided on the main body 7 form a joint, and the protrusion 23 of the main body 7 is inserted into the hole 22 of the joint, and the adhesive 24 is applied thereto as shown in FIG. It is fixed.
A hole portion 51 is provided in the substrate 5 where the joint portion is located, and since the joint portion is bonded through the hole portion 51, it is easy to fill the adhesive and the 6-axis Is easy to adjust. The board mounting portion 61 of the auxiliary member 6 is located closer to the CCD 1 than the connecting portions 22 and 23 of the main body 7 and the auxiliary member 6.
It is located outside with reference to the mounting position of
Since it is provided on the left and right with the center as the center, there is little possibility that the substrate 5 warps due to the action of heat or the like after positioning and fixing.
The structure is such that displacement of the CD 1 is unlikely to occur.

Further, the main body 7 has a V block portion 25, the imaging lens 2 is placed in this portion, a lens pressing leaf spring 9 is arranged from above, and a screw 8 is tightened to form an image. The lens 2 is fixed. Further, an optical filter holding member 13 is fixed to the main body 7 with screws 20, and the optical filter holding member 13 has R, G, B
Filter 1 for adjusting the spectral transmittance of light to a predetermined value
2 is fixed with screws 21 using an optical filter holding plate 11. The main body 7 includes a flat washer 14 and a spring washer 15.
It is fixed to the main body mounting member 10 by means of screws 16 through. Further, the main body mounting member 10 is fixed to the main body of the image reading apparatus (not shown).

Next, the image reading apparatus of this embodiment is replaced with the CCD 1
The procedure of adjusting the position of the imaging lens 2 and the procedure of fixing the same will be described. First, the imaging lens 2 is fixed to the main body 7 with the screw 8 via the lens pressing leaf spring 9. Further, in this state, it is fixed to the main body mounting member 10 with the screw 16 via the flat washer 14 and the spring washer 15. Next, in this assembled state, it is mounted on the image forming jig shown in FIG. In this image forming jig, an image reading device support member 27 and a light source chart support member 31 are arranged on a surface plate 32. On the light source chart support member 31, a chart glass 30, a light source 29,
A light source reflector 28 is installed.

On the surface of the chart glass 30, there is formed a chart capable of detecting optical characteristics, such as focus, magnification and deflection of the optical axis.
It is possible with this image forming jig to illuminate the chart glass 30 with the light reflected by the light source reflection plate 28. Therefore, by mounting the assembly member on the image reading device supporting member 27, the chart image is imaged through the imaging lens 2.

The substrate 5 to which the CCD 1 is soldered and fixed is fixed to an auxiliary member 6 with a screw, and the auxiliary member 6 is held by a CCD chuck portion (not shown). Furthermore, x,
Means (not shown) that can move in the 6-axis directions of y, z, α, β, and γ are incorporated. Since the auxiliary member 6 is formed of a member having higher rigidity than the substrate 5, CC
Distortion is less likely to occur even when gripped by the D chuck portion, and the influence on the substrate 5 is extremely small as compared with the case where the substrate 5 is directly gripped. Further, the main body 7 fixing the imaging lens 2 is held by a main body chuck portion (not shown) having a moving means in the optical axis 26 direction. Therefore, the chart image is photoelectrically converted by the CCD 1, and the data is used to calculate the optical characteristics such as focus, magnification, deflection of the optical axis, and the like, so that the optical characteristics have predetermined required values. The above-mentioned CCD chuck part and the main body chuck part are moved to adjust the position.

After this position adjustment is completed, fixing is performed. On the surface plate 32, the adhesive applicator 34 and the nozzle 3 are provided.
3, an adhesive application jig composed of the UV light irradiation unit 35, the applicator irradiation unit switching unit 37 and the adhesive application unit support base 36 is provided, and the auxiliary member 6 is provided by this adhesive application jig. A UV curable adhesive is applied to the joint formed by the hole 22 and the protrusion 23 of the main body 7, and then the applicator irradiation unit switching unit 37 is actuated so that the light emitted from the UV light irradiation unit 35 is emitted. The UV light irradiator 35 so that the UV light irradiates the joint portion.
To cure the adhesive. The adhesive may be applied before adjusting the position, and then the position may be adjusted and the adhesive may be cured.

Next, the structure of this connecting portion which is also an adhesive portion will be described. FIG. 6 shows an enlarged view of the joint portion, and FIG. 7 shows a sectional view of the joint portion. The auxiliary member 6 is formed with a hole portion 22 which is an adhered portion, and the protrusion portion 23 formed on the main body 7 is inserted into the hole portion 22.
The shape of the gap at the adhered portion formed by both of these is a tubular shape with a non-uniform width, the width on the side on which the adhesive 24 is injected and applied is wide, and the width on the side on which the adhesive 24 flows out is wide. It is getting narrower. That is, as shown in FIG. 7, a hole portion 22 having a tapered portion 22a and a straight portion 22b,
It is formed by a taper portion 23a and a rod-shaped projection portion 23 having a straight portion 23b, and portions 22b and 23b each having a constant diameter are provided at opposing positions.

Here, the hole 22 is formed in the auxiliary member 6,
The main body 7 has the projection 23 and forms a gap for adhesion, but on the contrary, the projection is formed on the auxiliary member 6 and the hole is formed on the main body 7 to form the above-mentioned gap. You may do it.

Next, the behavior of the adhesive 24 when the adhesive 24 is applied to the above-mentioned gap will be described. As shown in FIG. 8, the applied adhesive 24 has a frictional drag force D with respect to the surface tension T peculiar to the adhesive agent and a weight P of the adhesive agent, a drag force with respect to the pressure inside the adhesive agent not shown, and a gap portion. The adhesive 24 does not flow downward due to a mechanical balance due to the lowermost widths A and A ′, the density of the adhesive 24, and the like.
By changing the inclination of the tapered portion of the gap and further widening the B and B'portions, the force of the adhesive 24 flowing downward is further reduced. This is because the frictional drag force D due to the weight of the adhesive agent 24 increases, and the surface tension T generated in the wider gap portion increases. As a result, the range of restrictions on the adhesive 24 such as viscosity and weight is widened.

Next, a method of applying the adhesive 24 will be described. As shown in FIG. 9, the nozzles 33 mounted on the adhesive application jig are applied close to each other from above the gap 22 formed by the hole 22 of the auxiliary member 6 and the protrusion 23 of the main body 7.
At this time, in order to apply the adhesive evenly as quickly as possible in the circumferential direction of the gap, it is ideal to arrange many nozzle tip portions 33a in the circumferential direction of the gap. FIG. 10 shows a sectional view of the nozzle tip portion 33a. Also,
Since it is possible to widen B and B ′ in FIG. 8 according to the diameter of the nozzle tip portion 33a, it is very easy to apply, and it is advantageous that there are few coating mistakes even when performing automatic application.

Next, a method of curing the adhesive will be described.
Since the adhesive 24 used here is an ultraviolet curable adhesive, ultraviolet rays 39 are irradiated from above the adhesive application section by the UV light irradiation section 35 shown in FIG. 5 to cure the adhesive 24. The curing of the adhesive 24 proceeds from the surface on the side where the ultraviolet ray 39 is irradiated. In this case, since irradiation is performed from the central axis direction of the adhesive-applying tubular gap, the curing of the adhesive 24 proceeds in this direction. When the adhesive 24 hardens, a force is generated by contracting, and in this case, this force acts in the direction normal to the central axis of the tubular gap portion and yet in the circumferential direction of the tubular gap portion. Since this acts almost uniformly, this force is canceled and x, x of the auxiliary member 6
Almost no displacement occurs in the y direction. Note that FIG.
In the above, the irradiation is performed from the upper side in the central axis direction of the tubular gap portion, but even if the irradiation is performed from the lower side, the same effect is obtained with respect to the above-mentioned positional deviation.

Further, since there is a taper portion in the adhesive-applying tubular gap portion, when the adhesive is hardened, a force may also act in the z direction to move the auxiliary member 6 in the z direction. In this case, as shown in FIG. 7, if the tubular gap portion has a straight portion, ultraviolet rays are radiated from below, and the straight portion is cured to shrink the adhesive in the z, x, and y directions. It can be fixed in a state where the generated force hardly acts on the auxiliary member 6, and it is irradiated again from above,
When the main curing is performed, the curing can be completed with almost no displacement. Further, when irradiation is performed from above, the wider B and B ′ shown in FIG. 8 are, the easier the ultraviolet rays reach the lowermost part of the gap portion, and the shorter the time for curing all the applied adhesive 24. In addition, the protrusion 2 that constitutes this gap
It is also possible to shorten the curing speed of the adhesive by using a transparent material for 3, or forming a reflective film (for example, Al, Ni, etc.) on the surface forming the gap.

Next, the materials of the adhesive 24 and the adhered member used here will be described. Normally, in such filling bonding, the adhesive and the adherend member are completely in close contact, so if thermal expansion due to heat change occurs, peeling of the joint,
Since problems such as cracking of the member occur, it is possible to improve reliability against heat by making the linear expansion coefficient of the adhesive and that of the member to be adhered similar to each other.

In the above embodiment, the bonding between the auxiliary member 6 and the main body 7 was adhered by applying an adhesive. However, the protrusion 23 of the connecting portion should be melted and adhered to the hole 22. You may

[0042]

The effects of the present invention will be described below for each claim. According to the first aspect, since the board mounting portion of the auxiliary member is located outside of the connecting portion between the main body and the auxiliary member with reference to the mounting position of the solid-state image sensor, and is on the left and right with respect to the solid-state image sensor. After the positioning and fixing, the substrate is less likely to warp due to the action of heat or the like, and there is no risk of displacement of the solid-state image sensor.

According to the second aspect, since the hole is provided in the substrate corresponding to the position where the joint between the main body and the auxiliary member is located, it is easy to fill the adhesive into the joint through the hole in the substrate. And, it is easy to adjust 6 axes.

According to the third aspect of the present invention, since the board is configured to be detachable from the board mounting portion of the auxiliary member,
Only the substrate with the solid-state image sensor attached can be removed and reused.

According to the present invention, the connecting portion is constituted by the protrusion / hole provided on the main body and the hole / projection provided on the auxiliary member, and the gap formed by the protrusion and the hole. Since the portion is filled with the adhesive so that the volume is equal to or less than the volume of the gap portion, the adhesive does not protrude from the surface of the joint portion. for that reason,
Adhesive or the like is attached to the substrate so that it does not come off when the substrate is removed from the auxiliary member.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an embodiment of the present invention.

FIG. 2 is an exploded perspective view of a substrate, an auxiliary member, and a main body portion in FIG. 1 viewed from the back side.

3 is an assembled perspective view of the embodiment of FIG.

4 is a cross-sectional view taken along the line AA of FIG.

FIG. 5 is an explanatory diagram of position adjustment by an image forming jig.

FIG. 6 is a perspective view of a coupling portion.

FIG. 7 is a cross-sectional view of a joint portion.

FIG. 8 is a diagram illustrating the behavior of the adhesive when the adhesive is applied to the gap portion of the joint portion.

FIG. 9 is a diagram showing a state in which an adhesive is applied.

FIG. 10 is a cross-sectional view of a nozzle tip portion.

FIG. 11 is a diagram of irradiating ultraviolet rays to cure the adhesive.

FIG. 12 is a schematic diagram of an apparatus that performs image reading using a solid-state image sensor.

13 is an explanatory diagram showing a position adjustment direction of the solid-state imaging device in FIG.

FIG. 14 is a diagram showing a relationship between a solid-state image sensor and pixel lines.

FIG. 15 is a diagram illustrating a problem caused by a gap.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 CCD (solid-state image sensor) 2 Imaging lens 5 Substrate 6 Auxiliary member 7 Main body 10 Main body mounting member 22 Hole 23 Protrusion 24 Adhesive 33 Nozzle 34 Adhesive applicator 35 UV light irradiator 61 Substrate mounting

Claims (4)

[Claims] 1. A main body to which an imaging lens is fixed, a substrate to which a solid-state image sensor is attached, and an auxiliary member to which the substrate is attached, and these are the main body and the auxiliary member in the light traveling direction. In the mounting structure of the solid-state image sensor in the image reading apparatus, wherein the main body and the auxiliary member are connected by a connecting portion that is adjustable in six axial directions, the substrate mounting portion of the auxiliary member is A mounting structure for a solid-state image sensor in an image reading apparatus, which is located outside of a connecting portion of a main body and the auxiliary member with reference to a mounting position of the solid-state image sensor, and on the left and right with respect to the solid-state image sensor. 2. The solid-state imaging device in an image reading apparatus according to claim 1, wherein the substrate has a hole, and a connecting portion between the main body and the auxiliary member is located at the hole. Mounting structure. 3. The mounting structure for a solid-state image sensor in an image reading apparatus according to claim 1, wherein the substrate is configured to be removable from a substrate mounting portion of the auxiliary member. 4. A protrusion / a protrusion provided on the main body, wherein the connecting portion is provided.
It is composed of a hole and a hole / projection provided in the auxiliary member, and an adhesive is filled in a gap formed by the projection and the hole so that the volume of the adhesive is equal to or less than the volume of the gap. Structure for mounting a solid-state image pickup element in an image reading apparatus that operates.