JPH09107167A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH09107167A JPH09107167A JP7288039A JP28803995A JPH09107167A JP H09107167 A JPH09107167 A JP H09107167A JP 7288039 A JP7288039 A JP 7288039A JP 28803995 A JP28803995 A JP 28803995A JP H09107167 A JPH09107167 A JP H09107167A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- epoxy resin
- glass cloth
- laser
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000003822 epoxy resin Substances 0.000 claims abstract description 45
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 45
- 239000004744 fabric Substances 0.000 claims abstract description 37
- 239000011521 glass Substances 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 claims description 24
- 229920001721 polyimide Polymers 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract description 71
- 239000012790 adhesive layer Substances 0.000 abstract description 16
- 238000007747 plating Methods 0.000 abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052802 copper Inorganic materials 0.000 abstract description 5
- 239000010949 copper Substances 0.000 abstract description 5
- 238000007772 electroless plating Methods 0.000 abstract description 4
- 238000009413 insulation Methods 0.000 abstract 3
- 238000007493 shaping process Methods 0.000 abstract 1
- 238000000354 decomposition reaction Methods 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000011410 subtraction method Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板の製造
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board.
【０００２】[0002]
【従来の技術】従来のサブトラクト工法に基くプリント
配線板の製造方法を図３を用いて説明する。（ａ）図は
銅張り積層板２１であり両側に銅箔２２が接着されてい
る。（ｂ）図に示す如く、銅張り積層板２１の両側をエ
ッチング処理して内層回路２３を形成し、次いで（ｃ）
図に示す如く、内層回路２３を形成した銅張り積層板２
１の両側にガラスクロスを含むエポキシ樹脂からなる絶
縁層２４を形成する。2. Description of the Related Art A method of manufacturing a printed wiring board based on a conventional subtraction method will be described with reference to FIG. (A) The figure shows a copper-clad laminate 21 having copper foils 22 bonded to both sides. (B) As shown in the figure, both sides of the copper clad laminate 21 are etched to form the inner layer circuit 23, and then (c).
As shown in the figure, the copper-clad laminate 2 on which the inner layer circuit 23 is formed
An insulating layer 24 made of an epoxy resin containing glass cloth is formed on both sides of 1.
【０００３】次に（ｄ）図に示す如く、ガラスクロスを
含むエポキシ樹脂からなる絶縁層２４上にエポキシ樹脂
よりなる接着剤層２５を形成し、次に、（ｅ）図に示す
如く、ＣＯ2レーザー又は ＹＡＧレーザーで非貫通穴２
６を形成する。次いで非貫通穴２６の内壁に附着したス
ミアを除去するデスミア処理として、３０〜４０℃の
ＣｒＯ3液の中に非貫通穴２６の形成を終った銅張り積
層板２１を１０〜３０分浸漬後、ＣｒＯ3液 より銅張り
積層板２１を取り出し、水洗いを行う操作を３回行う。Next, as shown in FIG. 3D, an adhesive layer 25 made of epoxy resin is formed on the insulating layer 24 made of epoxy resin containing glass cloth. Then, as shown in FIG. 2 laser or YAG laser with non-through hole 2
6 is formed. Then, as a desmear treatment for removing the smear attached to the inner wall of the non-through hole 26, 30 to 40 ° C.
After a copper-clad laminate 21 in which finished the formation of non-through hole 26 in the CrO 3 solution immersion 10-30 minutes, removed copper-clad laminate 21 from CrO 3 solution, three times an operation of performing washing.
【０００４】次にデスミア処理が終了した銅張り積層板
２１の両側に形成された接着剤層２５の上に外層回路を
形成する以外の部分に銅めっきが附着しない様（ｆ）図
に示す如くエポキシ樹脂からなるめっきレジスト２７を
形成し、次に無電解めっきにて外層回路２８を形成する
と同時に非貫通穴にめっきを行い非貫通導通穴２９を形
成する。次に（ｇ）図に示す如く、めっきレジスト２７
を除去し、プリント配線板を製作する。Next, to prevent copper plating from adhering to the portions other than the outer layer circuits formed on the adhesive layers 25 formed on both sides of the copper clad laminate 21 after the desmear treatment, as shown in FIG. A plating resist 27 made of an epoxy resin is formed, and then an outer layer circuit 28 is formed by electroless plating, and at the same time, a non-through hole is plated to form a non-through conductive hole 29. Next, as shown in FIG.
Is removed and a printed wiring board is manufactured.
【０００５】[0005]
【発明が解決しようとする課題】従来のプリント配線板
の製造方法は図３（ｅ）図に示す如く、非貫通穴２６は
ＣＯ2レーザー又はＹＡＧレーザー用いる方法がある
が、従来使用しているＣＯ2レーザーはパルス幅が１０
-1〜１０0秒 と長いものを使用していた。その理由は、
ガラスクロスを含むエポキシ樹脂からなる絶縁層２４に
含まれるガラスクロスの分解温度が６３５℃と高いため
であるが １０-1〜１０0秒とパルス幅の長い ＣＯ2レー
ザーを用いるとガラスクロスを含むエポキシ樹脂からな
る絶縁層２４の温度が上昇して非貫通穴２９の加工が容
易になる反面図４に示す如く、ガラスクロスを含むエポ
キシ樹脂からなる絶縁層２４が炭化し非貫通穴２９の上
面４２および内壁４１にスミアが発生しやすい。As shown in FIG. 3 (e), the conventional method for manufacturing a printed wiring board includes a method of using a CO 2 laser or a YAG laser for the non-through holes 26, which is conventionally used. CO 2 laser has a pulse width of 10
-1 it had been using 10 0 seconds and the long ones. The reason is,
Although the decomposition temperature of the glass cloth contained in the insulating layer 24 made of an epoxy resin containing a glass cloth is for 635 ° C. and higher with 10 -1 to 10 0 sec and long CO using the glass cloth 2 laser pulse widths While the temperature of the insulating layer 24 made of epoxy resin rises to facilitate the processing of the non-through holes 29, as shown in FIG. 4, the insulating layer 24 made of epoxy resin containing glass cloth is carbonized and the upper surface of the non-through holes 29 is carbonized. Smear is likely to occur on the inner wall 42 and the inner wall 41.
【０００６】このデスミア処理を行うため、３０〜４０
℃の ＣｒＯ3液の中に非貫通穴２６を形成した銅張り積
層板２１を１０〜３０分後、ＣｒＯ3液 より銅張り積層
板２１を取り出す作業を３回行っているため、デスミア
処理工程の時間短縮に限界があった。また、ＣＯ2 の有
効最小穴径は１００μｍが限界で１００μｍより有効最
小穴径が小さく出来ないため従来品以上の配線板の高密
度化がむずかしい。[0006] In order to perform the desmear process, 30 to 40
° C. CrO 3 solution non-through hole 26 formed was after copper-clad laminate 21 10-30 minutes in the, since three times the work of taking out the copper-clad laminate 21 from CrO 3 solution, a desmear treatment step There was a limit to the time reduction. In addition, since the effective minimum hole diameter of CO 2 is 100 μm and the effective minimum hole diameter cannot be made smaller than 100 μm, it is difficult to increase the density of the wiring board more than the conventional product.
【０００７】次にＹＡＧレーザーを用いて非貫通穴２６
を開ける場合は、ＣＯ2 レーザーに比較してスミアは少
いが、図５に示す如く、非貫通穴２６の上面４２および
内壁４１にスミア４３が発生し、このスミア４３を除去
するためＣＯ2 レーザーと同様のデスミア処理を行わな
ければならずまた有効最小穴径も１００μｍと大きく、
有効最小穴径が１００μｍ以下に出来ない。Next, a non-through hole 26 is formed by using a YAG laser.
When opening, the smear is less than that of the CO 2 laser, but as shown in FIG. 5, a smear 43 is generated on the upper surface 42 and the inner wall 41 of the non-through hole 26, and the CO 2 is removed to remove the smear 43. Desmear treatment similar to laser must be performed, and the effective minimum hole diameter is as large as 100 μm.
The effective minimum hole diameter cannot be 100 μm or less.
【０００８】[0008]
【課題を解決するための手段】本発明はかかる問題点を
解決するため、図１に示す如く、銅張り積層板２１をエ
ッチングして内層回路２２を形成し、この銅張り積層板
２１の両側にガラスクロスを含まないエポキシ樹脂から
なる絶縁層５１を形成し、このガラスクロスを含まない
エポキシ樹脂からなる絶縁層５１の上に接着剤層２５を
形成し、図１（ｅ）図に示す如く接着剤層２５とガラス
クロスを含まないエポキシ樹脂からなる絶縁層５１を貫
通し内層回路２３に達する非貫通穴２６をパルス幅が１
０-4〜１０-8秒の 短パルスＣＯ2レーザーを使用してあ
けた後、図１（ｆ）図に示す如く接着剤層２５の上に外
層回路２８を形成する以外の部分に銅めっきが附着しな
い様エポキシ樹脂からなるめっきレジスト２７を形成
し、次に無電解めっきにて外層回路２８を形成すると同
時に非貫通穴にめっきを行い非貫通導通穴２９を形成す
る。次いで図１（ｇ）図に示す如く、めっきレジスト２
７を除去しプリント配線板を製作する。In order to solve the above problems, the present invention, as shown in FIG. 1, etches a copper-clad laminate 21 to form an inner layer circuit 22. Both sides of the copper-clad laminate 21 are etched. An insulating layer 51 made of epoxy resin containing no glass cloth is formed on the insulating layer 51, and an adhesive layer 25 is formed on the insulating layer 51 made of epoxy resin not containing glass cloth, as shown in FIG. The pulse width of the non-through hole 26 penetrating the adhesive layer 25 and the insulating layer 51 made of epoxy resin containing no glass cloth and reaching the inner layer circuit 23 is 1
After drilling using a short pulse CO 2 laser of 0 −4 to 10 −8 seconds, copper plating is performed on a portion other than forming an outer layer circuit 28 on the adhesive layer 25 as shown in FIG. 1 (f). A plating resist 27 made of an epoxy resin is formed so as not to adhere to it, and then an outer layer circuit 28 is formed by electroless plating, and at the same time, a non-through hole is formed by plating the non-through hole. Then, as shown in FIG.
7 is removed and a printed wiring board is manufactured.
【０００９】本発明は、 従来、分解温度が６３５℃と高いガラスクロスを含
んだエポキシ樹脂からなる絶縁層２４の代りに、分解温
度が３２７℃と低いガラスクロスを含まないエポキシ樹
脂からなる絶縁層５１を用いることによりエネルギーの
小さいパルス幅１０-4〜１０-8秒の 短パルスＣＯ2レー
ザーの使用が可能となり短時間で非貫通穴を明けられる
ためガラスクロスを含まないエポキシ樹脂からなる絶縁
層５１の温度上昇が少ないため非貫通穴２９部分のスミ
アが皆無となり、デスミア処理工程がいらなくなった。According to the present invention, an insulating layer made of an epoxy resin having a low decomposition temperature of 327 ° C. is used instead of the insulating layer 24 made of an epoxy resin containing a glass cloth having a high decomposition temperature of 635 ° C. By using 51, it is possible to use a short-pulse CO 2 laser with a pulse width of 10 −4 to 10 −8 seconds having a small energy, and a non-through hole can be opened in a short time, so that an insulating layer made of an epoxy resin containing no glass cloth. Since the temperature rise of 51 was small, smear was eliminated in the non-through hole 29 portion, and the desmearing process was unnecessary.
【００１０】 また従来のパルス幅１０-1〜１０0秒
のＣＯ2レーザーでの有効最小穴径が１００μｍであっ
たものが、パルス幅１０-4〜１０-8秒の 短パルスＣＯ2
レーザーを用いることにより有効最小穴径が４０μｍに
することが出来、配線の高密度化が可能になった。Further those effective minimum hole diameter of a CO 2 laser of a conventional pulse width 10 -1 to 10 0 sec was 100μm is, short pulse CO 2 pulse width of 10 -4 to 10 -8 seconds
By using a laser, the effective minimum hole diameter can be set to 40 μm, and the wiring density can be increased.
【００１１】なお、ガラスクロスを含まないエポキシ樹
脂からなる絶縁層５１はガラスクロスを含まないポリイ
ミド樹脂からなる絶縁層を用いてもよい。The insulating layer 51 made of epoxy resin containing no glass cloth may be an insulating layer made of polyimide resin containing no glass cloth.
【００１２】[0012]
【作用】本発明は、工程の短縮や配線の高密度化を行う
もので、内層回路の両側にガラスクロスを含まないエポ
キシ樹脂からなる絶縁層５１を形成し、このガラスクロ
スを含まないエポキシ樹脂からなる絶縁層５１上にエポ
キシ樹脂からなる接着剤層２５を形成し、この接着剤層
２５をガラスクロスを含まないエポキシ樹脂からなる絶
縁層５１を貫通し内層回路２３に達する非貫通穴２６を
パルス幅１０-4〜１０-8秒の 短パルスＣＯ2レーザーを
使用しあけるもので、スミア処理が不要になるととも
に、非貫通穴２６の有効最小穴径を４０μｍと小さくす
ることが出来るため配線の高密度化が可能になった。According to the present invention, the number of steps is shortened and the wiring density is increased. An insulating layer 51 made of epoxy resin containing no glass cloth is formed on both sides of the inner layer circuit, and the epoxy resin containing no glass cloth is formed. An adhesive layer 25 made of an epoxy resin is formed on an insulating layer 51 made of, and a non-through hole 26 that penetrates the adhesive layer 25 made of an epoxy resin containing no glass cloth and reaches the inner layer circuit 23 is formed. A short pulse CO 2 laser with a pulse width of 10 -4 to 10 -8 seconds is used for the opening, and smearing is not required, and the effective minimum hole diameter of the non-through hole 26 can be reduced to 40 μm for wiring. It has become possible to increase the density.
【００１３】[0013]
【実施例】本発明の実施例を図１により説明する。
（ａ）図は銅張り積層板２１であり両側に銅箔２２が接
着されている。（ｂ）図に示す如く、銅張り積層板２１
の両側に内層回路２３を形成する部分にエポキシ樹脂か
らなるパターンレジストを塗布し、次にレジストを塗布
した銅張り積層板２１を４０〜６０℃の塩化第２銅エッ
チングで６０〜１２０秒間、浸漬した後、取出し水洗を
行い内層回路２３を形成する。An embodiment of the present invention will be described with reference to FIG.
(A) The figure shows a copper-clad laminate 21 having copper foils 22 bonded to both sides. (B) As shown in FIG.
A pattern resist made of epoxy resin is applied to both sides of the inner layer circuit 23, and the resist-coated copper-clad laminate 21 is dipped in cupric chloride etching at 40 to 60 ° C. for 60 to 120 seconds. After that, it is taken out and washed with water to form the inner layer circuit 23.
【００１４】次いで内層回路２３を形成した銅張り積層
板２１の両側に（ｃ）図に示す如く、ガラスクロスを含
まないエポキシ樹脂からなる絶縁層５１を形成する。な
お、この絶縁層はガラスクロスを含まないポリイミドか
らなる絶縁層を使用してもよい。次にガラスクロスを含
まないエポキシ樹脂からなる絶縁層５１上に（ｄ）に示
す如く、外層回路２８とガラスクロスを含まないエポキ
シ樹脂からなる絶縁層５１の接着強度を高めるためエポ
キシ樹脂からなる接着剤層２５を形成する。Next, as shown in FIG. 3C, an insulating layer 51 made of epoxy resin containing no glass cloth is formed on both sides of the copper-clad laminate 21 on which the inner layer circuit 23 is formed. As the insulating layer, an insulating layer made of polyimide containing no glass cloth may be used. Next, as shown in (d), an epoxy resin adhesive is applied to the outer layer circuit 28 and the epoxy resin insulating layer 51 not containing glass cloth to enhance the adhesive strength on the insulating layer 51 made of epoxy resin not containing glass cloth. The agent layer 25 is formed.
【００１５】なお、ガラスクロスを含まないエポキシ樹
脂からなる絶縁層５１は、エポキシ樹脂と無機（０．１
〜３μｍのゴム粒）または有機（マイカ、クレー）の混
合物の充填剤からなる。次いで、パルス幅１０-4〜１０
-8秒の 短パルスＣＯ2レーザーを使用し、（ｅ）図に示
す如く、エポキシ樹脂からなる接着剤層２５とガラスク
ロスを含まないエポキシ樹脂からなる絶縁層５１を貫通
し、内層回路２３に達する非貫通穴２６を明ける。The insulating layer 51 made of epoxy resin containing no glass cloth is made of epoxy resin and inorganic (0.1
˜3 μm rubber particles) or organic (mica, clay) mixture filler. Then, the pulse width is 10 −4 to 10
-By using a short pulse CO 2 laser for 8 seconds, as shown in FIG. 8E, the adhesive layer 25 made of epoxy resin and the insulating layer 51 made of epoxy resin containing no glass cloth are penetrated to the inner layer circuit 23. The non-through hole 26 that reaches is opened.
【００１６】次に、非貫通穴２６を明けた後、接着剤層
２５上に外層回路２８を形成する以外の部分に（ｆ）図
に示す如く、エポキシ樹脂からなるめっきレジスト２７
塗布した後、無電解めっきにて外層回路２８を形成する
と同時に非貫通穴にもめっきを行い非貫通導通穴２９を
形成する。次いで、（ｇ）に示す如く、エポキシ樹脂か
らなるめっきレジスト２７を３０〜４０℃の温度で１〜
３％のＮａＯＨ溶液に２〜３分浸漬しめっきレジスト２
７を除去してプリント配線板を製造する。Next, after forming the non-through holes 26, a plating resist 27 made of an epoxy resin is formed on a portion other than the outer layer circuit 28 formed on the adhesive layer 25 as shown in FIG.
After coating, the outer layer circuit 28 is formed by electroless plating, and at the same time, the non-through holes are also plated to form the non-through conductive holes 29. Then, as shown in (g), the plating resist 27 made of an epoxy resin is heated at a temperature of 30 to 40 ° C. for 1 to
Plating resist 2 after immersion in 3% NaOH solution for 2-3 minutes
7 is removed to produce a printed wiring board.
【００１７】[0017]
【発明の効果】本発明のプリント配線板は以上の様に製
造されるので以下に記載する特有な効果を奏する。非貫
通穴２６をあけるためにエネルギーの小さなパルス幅１
０-4〜１０-8秒の短パルスＣＯ2レーザー を使用するた
め、図２に示す如く非貫通穴２６の内壁４１や非貫通穴
上面４２にスミアが皆無となり、デスミア処理が不必要
になり、工数が従来の１／３となった。Since the printed wiring board of the present invention is manufactured as described above, it has the following unique effects. Pulse width 1 with small energy to open non-through hole 26
Since a short pulse CO 2 laser of 0 −4 to 10 −8 seconds is used, smear does not exist on the inner wall 41 of the non-through hole 26 or the upper surface 42 of the non-through hole as shown in FIG. 2, and desmear treatment is unnecessary. The number of man-hours has been reduced to 1/3 that of the conventional one.
【００１８】また、従来１００μｍ以下の有効最小穴径
を製作するのが不可能であったが、本発明の 短パルス
ＣＯ2レーザーを使用することにより有効最小穴径を４
０μｍとすることが出来配線板の高密度化が図られた。
表１に本発明の効果と従来例を一覧表にて示す。 Although it has been impossible to produce an effective minimum hole diameter of 100 μm or less, it is possible to reduce the effective minimum hole diameter to 4 by using the short pulse CO 2 laser of the present invention.
It was possible to set the thickness to 0 μm, and the density of the wiring board was increased.
Table 1 shows a list of effects of the present invention and conventional examples.
【図１】本発明の製造工程を示す断面図であり、（ａ）
図は、銅張り積層板の断面図。（ｂ）図は、内層回路を
形成した断面図。（ｃ）図は、内層回路上に絶縁層を形
成した断面図。（ｄ）図は、絶縁層上に接着剤層を形成
した断面図。（ｅ）図は、非貫通穴をあけた断面図。
（ｆ）図は、レジストおよび外層回路を形成した断面
図。（ｇ）図は、本発明のプリント配線板の断面図。FIG. 1 is a cross-sectional view showing a manufacturing process according to the present invention, and FIG.
The figure is a cross-sectional view of a copper-clad laminate. FIG. 4B is a cross-sectional view in which an inner-layer circuit is formed. FIG. 6C is a sectional view in which an insulating layer is formed on the inner layer circuit. (D) is a sectional view in which an adhesive layer is formed on the insulating layer. (E) is a cross-sectional view with a non-through hole.
FIG. 6F is a sectional view in which a resist and an outer layer circuit are formed. (G) is a sectional view of the printed wiring board of the present invention.
【図２】本発明の非貫通穴の形状を示す断面図。FIG. 2 is a sectional view showing the shape of a non-through hole according to the present invention.
【図３】従来品の製造工程を示す断面図であり、（ａ）
図は、銅張り積層板の断面図。（ｂ）図は、内層回路を
形成した断面図。（ｃ）図は、内層回路上に絶縁層を形
成した断面図。（ｄ）図は、絶縁層上に接着剤層を形成
した断面図。（ｅ）図は、非貫通穴を開けた断面図。
（ｆ）図は、めっきレジストおよび外層回路を形成した
断面図。（ｇ）図は、従来品のプリント配線板の断面
図。FIG. 3 is a cross-sectional view showing a manufacturing process of a conventional product, and FIG.
The figure is a cross-sectional view of a copper-clad laminate. FIG. 4B is a cross-sectional view in which an inner-layer circuit is formed. FIG. 6C is a sectional view in which an insulating layer is formed on the inner layer circuit. (D) is a sectional view in which an adhesive layer is formed on the insulating layer. (E) is a sectional view in which a non-through hole is opened.
(F) is a sectional view in which a plating resist and an outer layer circuit are formed. (G) The figure is a cross-sectional view of a conventional printed wiring board.
【図４】従来品の非貫通穴をＹＡＧレーザーをあけた形
状を示す断面図。FIG. 4 is a cross-sectional view showing a shape of a conventional product in which a YAG laser is opened in a non-through hole.
【図５】従来品の非貫通穴をパルス幅１０-1〜１０0秒
のＣＯ2レーザーであけた形状を示す断面図。5 is a sectional view showing a shape opened the non-through hole of the conventional product at a CO 2 laser with a pulse width 10 -1 to 10 0 sec.
２１…銅張り積層板、 ２２…銅箔、 ２３…内層回
路、２４…ガラスクロスを含むエポキシ樹脂からなる絶
縁層、 ２５…接着剤層、２６…非貫通穴、 ２７…め
っきレジスト、 ２８外層回路、２９…非貫通穴導通
穴、 ４１…内壁、 ４２…非貫通穴上面、４３…スミ
ア、 ５１…ガラスクロスを含まないエポキシ樹脂から
なる絶縁層。21 ... Copper-clad laminate, 22 ... Copper foil, 23 ... Inner layer circuit, 24 ... Insulating layer made of epoxy resin containing glass cloth, 25 ... Adhesive layer, 26 ... Non-through hole, 27 ... Plating resist, 28 Outer layer circuit , 29 ... Non-through hole conduction hole, 41 ... Inner wall, 42 ... Non-through hole upper surface, 43 ... Smear, 51 ... Insulating layer made of epoxy resin containing no glass cloth.
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成８年１０月８日[Submission date] October 8, 1996
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００５[Correction target item name] 0005
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００５】[0005]
【発明が解決しようとする課題】従来のプリント配線板
の製造方法は図３（ｅ）図に示す如く、非貫通穴２６は
ＣＯ２レーザー又はＹＡＧレーザー用いる方法がある
が、従来使用しているＣＯ２レーザーはパルス幅が１０
−１〜１００秒と長いものを使用していた。その理由
は、ガラスクロスを含むエポキシ樹脂からなる絶縁層２
４に含まれるガラスクロスの分解温度が６３５℃と高い
ためであるが１０−１〜１００秒とパルス幅の長いＣＯ
２レーザーを用いるとガラスクロスを含むエポキシ樹脂
からなる絶縁層２４の温度が上昇して非貫通穴２６の加
工が容易になる反面図５に示す如く、ガラスクロスを含
むエポキシ樹脂からなる絶縁層２４が炭化し非貫通穴２
６の上面４２および内壁４１にスミアが発生しやすい。As shown in FIG. 3 (e), a conventional method for manufacturing a printed wiring board has a method of using a CO 2 laser or a YAG laser for the non-through hole 26, which is conventionally used. CO 2 laser has a pulse width of 10
-1 it had been using 10 0 seconds and the long ones. The reason is that the insulating layer 2 made of epoxy resin containing glass cloth
Decomposition temperature of the glass cloth contained in 4 is for 635 ° C. and higher is 10 -1 to 10 0 sec and the pulse width long CO
When two lasers are used, the temperature of the insulating layer 24 made of epoxy resin containing glass cloth rises to facilitate the processing of the non-through holes 26 , but as shown in FIG. 5 , the insulating layer 24 made of epoxy resin containing glass cloth is used. Is carbonized and non-through hole 2
Smear is likely to occur on the upper surface 42 of 6 and the inner wall 41.
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００７[Correction target item name] 0007
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００７】次にＹＡＧレーザーを用いて非貫通穴２６
を開ける場合は、ＣＯ２レーザーに比較してスミアは少
いが、図４に示す如く、非貫通穴２６の上面４２および
内壁４１にスミア４３が発生し、このスミア４３を除去
するためＣＯ２レーザーと同様のデスミア処理を行わな
ければならずまた有効最小穴径も１００μｍと大きく、
有効最小穴径が１００μｍ以下に出来ない。Next, a non-through hole 26 is formed by using a YAG laser.
When opening the, smears compared to CO 2 lasers small, as shown in FIG. 4, the smear 43 is generated on the upper surface 42 and the inner wall 41 of the non-through hole 26, CO 2 to remove the smears 43 Desmear treatment similar to laser must be performed, and the effective minimum hole diameter is as large as 100 μm.
The effective minimum hole diameter cannot be 100 μm or less.
【手続補正３】[Procedure 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００９[Correction target item name] 0009
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００９】本発明は、 従来、分解温度が６３５℃と高いガラスクロスを含
んだエポキシ樹脂からなる絶縁層２４の代りに、分解温
度が３２７℃と低いガラスクロスを含まないエポキシ樹
脂からなる絶縁層５１を用いることによりエネルギーの
小さいパルス幅１０−４〜１０−５秒の短パルスＣＯ２
レーザーの使用が可能となり短時間で非貫通穴を明けら
れるためガラスクロスを含まないエポキシ樹脂からなる
絶縁層５１の温度上昇が少ないため非貫通穴２６部分の
スミアが皆無となり、デスミア処理工程がいらなくなっ
た。According to the present invention, the insulating layer 24 made of epoxy resin having a low decomposition temperature of 327 ° C. is used instead of the insulating layer 24 made of an epoxy resin containing a glass cloth having a high decomposition temperature of 635 ° C. By using 51, a short pulse CO 2 having a small energy pulse width of 10 −4 to 10 −5 seconds
Since the laser can be used and the non-through hole can be opened in a short time, the temperature rise of the insulating layer 51 made of epoxy resin containing no glass cloth is small, so that the smear at the non-through hole 26 portion is eliminated, and the desmear treatment process is unnecessary. lost.
【手続補正４】[Procedure amendment 4]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】符号の説明[Correction target item name] Explanation of sign
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【符号の説明】 ２１…銅張り積層板、 ２２…銅箔、 ２３…内層回
路、２４…ガラスクロスを含むエポキシ樹脂からなる絶
縁層、 ２５…接着剤層、２６…非貫通穴、 ２７…め
っきレジスト、 ２８外層回路、２９…非貫通導通穴、
４１…内壁、 ４２…非貫通穴上面、４３…スミア、
５１…ガラスクロスを含まないエポキシ樹脂からなる
絶縁層[Explanation of Codes] 21 ... Copper-clad laminate, 22 ... Copper foil, 23 ... Inner layer circuit, 24 ... Insulating layer made of epoxy resin containing glass cloth, 25 ... Adhesive layer, 26 ... Non-through hole, 27 ... Plating Resist, 28 outer layer circuit, 29 ... Non-through conductive hole ,
41 ... inner wall, 42 ... non-through hole upper surface, 43 ... smear,
51 ... Insulating layer made of epoxy resin containing no glass cloth
【手続補正５】[Procedure Amendment 5]
【補正対象書類名】図面[Document name to be amended] Drawing
【補正対象項目名】全図[Correction target item name] All figures
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【図１】 FIG.
【図２】 [Fig. 2]
【図３】 [Figure 3]
【図４】 FIG. 4
【図５】 ─────────────────────────────────────────────────────
[Figure 5] ────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成８年１０月１４日[Submission date] October 14, 1996
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１８[Correction target item name] 0018
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００１８】また、従来１００μｍ以下の有効最小穴径
を製作するのが不可能であったが、本発明の短パルスＣ
Ｏ２レーザーを使用することにより有効最小穴径を４０
μｍとすることが出来配線板の高密度化が図られた。表
１に本発明の効果と従来例を一覧表にて示す。 Although it has been impossible to manufacture an effective minimum hole diameter of 100 μm or less, the short pulse C of the present invention is used.
The use of an O 2 laser allows the effective minimum hole diameter to be 40
It was possible to achieve a high density wiring board. Table 1 shows a list of effects of the present invention and conventional examples.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 岡村 寿郎 栃木県芳賀郡二宮町大字久下田1065 (72)発明者 横山 博義 栃木県芳賀郡二宮町大字久下田1065 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Toshiro Okamura 1065 Kushita, Ninomiya-machi, Haga-gun, Tochigi Prefecture (65) (72) Hiroyoshi Yokoyama 1065 Kushita, Ninomiya-cho, Haga-gun, Tochigi Prefecture
Claims (3)
を形成し、該銅張り積層板の両側に絶縁層を形成し、前
記絶縁層に非貫通穴をレーザーであけ、この絶縁層上に
外層回路を形成し、該非貫通穴にめっき処理をして非貫
通導通穴を形成してなるプリント配線板の製造方法にお
いて、前記絶縁層がガラスクロスを含まないエポキシ樹
脂を用い、前記レーザーとして 短パルスＣＯ2レーザー
を用い、非貫通穴を開けることを特徴とするプリント配
線板の製造方法。1. An internal circuit is formed by etching a copper-clad laminate, insulating layers are formed on both sides of the copper-clad laminate, and a non-through hole is laser-drilled in the insulating layer. In a method for manufacturing a printed wiring board in which an outer layer circuit is formed and the non-through holes are plated to form non-through conductive holes, the insulating layer is made of epoxy resin containing no glass cloth, and the laser is short. A method for manufacturing a printed wiring board, characterized in that a non-through hole is formed using a pulsed CO 2 laser.
ーが１０-4〜１０-8秒のパルス幅であるプリント配線板
の製造方法。2. The method for manufacturing a printed wiring board according to claim 1, wherein the short pulse CO 2 laser has a pulse width of 10 −4 to 10 −8 seconds.
を含まないポリイミド樹脂であるプリント配線板の製造
方法。3. The method for manufacturing a printed wiring board according to claim 1, wherein the insulating layer is a polyimide resin containing no glass cloth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7288039A JP2773710B2 (en) | 1995-10-09 | 1995-10-09 | Manufacturing method of multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7288039A JP2773710B2 (en) | 1995-10-09 | 1995-10-09 | Manufacturing method of multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09107167A true JPH09107167A (en) | 1997-04-22 |
| JP2773710B2 JP2773710B2 (en) | 1998-07-09 |
Family
ID=17725045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7288039A Expired - Lifetime JP2773710B2 (en) | 1995-10-09 | 1995-10-09 | Manufacturing method of multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2773710B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0969707A3 (en) * | 1998-06-30 | 2000-11-22 | Matsushita Electric Works, Ltd. | Multilayer printed wiring board and method for manufacturing same |
| WO2001089756A1 (en) * | 2000-05-23 | 2001-11-29 | Sumitomo Heavy Industries, Ltd. | Laser drilling method |
| DE19824225B4 (en) * | 1997-07-28 | 2008-08-21 | Matsushita Electric Works, Ltd., Kadoma | Method for producing a printed circuit board |
| US7602822B2 (en) | 2004-09-28 | 2009-10-13 | Hitachi Via Mechanics, Ltd | Fiber laser based production of laser drilled microvias for multi-layer drilling, dicing, trimming of milling applications |
| KR20250010678A (en) | 2022-06-30 | 2025-01-21 | 다이요 홀딩스 가부시키가이샤 | Circuit board and method for manufacturing the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3723201B1 (en) | 2004-10-18 | 2005-12-07 | 独立行政法人食品総合研究所 | Method for producing microsphere using metal substrate having through hole |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02500891A (en) * | 1987-09-03 | 1990-03-29 | ディジタル イクイプメント コーポレーション | Drilling equipment and method |
| JPH0613488A (en) * | 1992-06-24 | 1994-01-21 | Fuji Film Micro Device Kk | Circuit and its manufacture board |
| JPH08243771A (en) * | 1995-01-11 | 1996-09-24 | Shinozaki Seisakusho:Kk | Method and device for perforating printed circuit board by pulse laser beam |
| JPH08323488A (en) * | 1995-05-31 | 1996-12-10 | Shinozaki Seisakusho:Kk | Drilling method for printed circuit board by laser beam |
-
1995
- 1995-10-09 JP JP7288039A patent/JP2773710B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02500891A (en) * | 1987-09-03 | 1990-03-29 | ディジタル イクイプメント コーポレーション | Drilling equipment and method |
| JPH0613488A (en) * | 1992-06-24 | 1994-01-21 | Fuji Film Micro Device Kk | Circuit and its manufacture board |
| JPH08243771A (en) * | 1995-01-11 | 1996-09-24 | Shinozaki Seisakusho:Kk | Method and device for perforating printed circuit board by pulse laser beam |
| JPH08323488A (en) * | 1995-05-31 | 1996-12-10 | Shinozaki Seisakusho:Kk | Drilling method for printed circuit board by laser beam |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19824225B4 (en) * | 1997-07-28 | 2008-08-21 | Matsushita Electric Works, Ltd., Kadoma | Method for producing a printed circuit board |
| EP0969707A3 (en) * | 1998-06-30 | 2000-11-22 | Matsushita Electric Works, Ltd. | Multilayer printed wiring board and method for manufacturing same |
| US6326559B1 (en) | 1998-06-30 | 2001-12-04 | Matsushita Electric Works, Ltd. | Multilayer printed wiring board and method for manufacturing same |
| KR100361701B1 (en) * | 1998-06-30 | 2002-11-22 | 마츠시다 덴코 가부시키가이샤 | Multilayer printed wiring board and method for manufacturing same |
| US6671949B2 (en) | 1998-06-30 | 2004-01-06 | Matsushita Electric Works, Ltd. | Multilayer printed wiring board and method for manufacturing same |
| CN100346680C (en) * | 1998-06-30 | 2007-10-31 | 松下电工株式会社 | Multilayer printed wiring board and method for mfg. same |
| WO2001089756A1 (en) * | 2000-05-23 | 2001-11-29 | Sumitomo Heavy Industries, Ltd. | Laser drilling method |
| US7602822B2 (en) | 2004-09-28 | 2009-10-13 | Hitachi Via Mechanics, Ltd | Fiber laser based production of laser drilled microvias for multi-layer drilling, dicing, trimming of milling applications |
| US8121155B2 (en) | 2004-09-28 | 2012-02-21 | Hitachi Via Mechanics, Ltd. | Fiber laser based production of laser drilled microvias for multi-layer drilling, dicing, trimming or milling applications |
| KR20250010678A (en) | 2022-06-30 | 2025-01-21 | 다이요 홀딩스 가부시키가이샤 | Circuit board and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2773710B2 (en) | 1998-07-09 |
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