JPH09101343A - Contact device for electronic component measuring apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a contact device for electronic component measuring apparatus with improved reliability of measurement by preventing poor connection attributable to a structure in which the probe pin of a measuring part is constituted of only one piece of probe pin. SOLUTION: A measuring section is provided with a moving base 11 and a support base 10 and an auxiliary substrate 101 is provided on the internal surface of the moving base 11. A first probe pin 102 and a second probe pin 103 deviated in position and a wire pattern 16 are arranged on the auxiliary substrate 101. A substrate 100 for contact where a wire pattern 104 is formed is arranged on both lower sides of the support base 10 and connected to a base 2. The structure using two probe pins allows the connection of the probes to the base 2 with the substrate for contact thereby further improving the reliability of measurement.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact device for an electronic component measuring device for measuring an electronic component having a plurality of terminals on both sides, and more particularly, to improve the arrangement structure of probe rows of the electronic component measuring device. The present invention relates to a contact device of an electronic component measuring device that stabilizes the connection by using a contact device.

[0002]

2. Description of the Related Art In recent years, DIP-like electronic parts such as semiconductor integrated circuits and solid-state image pickup devices have been downsized and have a large number of terminals.
Measuring (measuring / inspecting) the electrical characteristics of IP-shaped electronic components is becoming increasingly difficult. A conventional electronic component measuring apparatus for measuring such DIP-like electronic components will be described with reference to FIGS. 2 to 4. In addition, the present invention
Although it is effective when applied to all DIP-like electronic parts,
A solid-state imaging device will be taken as an example of the DIP-like electronic component for description.

First, an outline of a contact device of a conventional electronic component measuring apparatus will be described with reference to FIG. FIG. 2 is a schematic perspective view showing an example of the electronic component measuring device.

In FIG. 2, reference numeral 1 indicates an electronic component measuring device for measuring a solid-state image sensor or the like. The electronic component measuring device 1 includes a base 2 incorporating a measuring circuit (not shown),
On the base, a tray 4 that houses, for example, 50 to 70 solid-state image pickup devices 3, a tray setting unit 5 that installs the tray 4,
The solid-state imaging device 3 is preliminarily heated by a preheating unit 6, a measuring unit 7 as a target portion of the present invention, a light source unit 8 and the like.

Then, the tray 4 for measurement is moved to the preheat section 6 by a moving means (not shown), for example, 45 °.
While being preheated to about C, each of the solid-state image pickup devices 3 for measurement is moved to the measuring unit 7 one by one. Measuring unit 7
Then, as will be described later in detail, the solid-state image pickup device 3 is placed on a support base to be connected to a measurement circuit incorporated inside the base 2, and is moved to the light source unit 8 to start measurement.
Although not shown, the light source unit 8 is provided with a turret (rotary table) provided with a reference light source and a predetermined iris, and the turret irradiates bright and dark light according to the measurement item to automatically measure the solid-state image sensor 3. To do. The solid-state imaging device 3 for which the measurement has been completed is ranked according to the characteristics, and is moved to the tray set unit 5 for each rank.

Next, referring to FIG. 3, an outline of the conventional measuring unit will be described. 3A and 3B are diagrams showing an outline of a contact device of a conventional electronic component measuring device, FIG. 3A is an enlarged perspective view showing a measuring portion, and FIG. 3B is an enlarged sectional view of a probe pin.

As shown in FIG. 3A, a support base 10 for mounting a solid-state image pickup device 3 having a plurality of terminals 9 is arranged in the measuring section of the prior art. A heater (not shown) is built in. A pair of block-shaped movable bases 11 are arranged at positions facing each other with the support base 10 interposed therebetween so as to be movable in the X direction. The movable table 11 has a first probe pin 12 connected to the terminal 9 of the solid-state image sensor 3.

As shown in FIG. 3B, the first probe pin and the second probe pin, which will be described later, urge the tip of the probe pin main body 12a in the Y direction by the compression coil spring 13 or the like to connect the terminals of the solid-state image pickup device. And so on.

Regarding the measuring unit of the prior art, there is a "contact device for an electronic component measuring device" described in Japanese Utility Model Laid-Open No. 4-16367 filed by the applicant of the present invention, and its outline is shown in FIG. I will re-post and explain. 4A and 4B are side views showing details of the measurement unit in the prior application example, FIG. 4A is a side view showing a state in which the movable table is open, and FIG. 4B is a front view of the auxiliary board viewed from the probe pin side. Is.

As shown in FIG. 4 (a), the measuring unit of the prior application has a pair of movable bases 1 at opposite positions with the support base 10 interposed therebetween.
1 is provided, and an arm 14 is attached to the moving table 11. The other end of this arm 14 is connected to an air cylinder (not shown), and the arm 14 is moved by the air cylinder.
It can be moved in any direction. An auxiliary substrate 15 as shown in FIG. 1B is provided on the inner surface of the movable table 11, and the first probe pin 12 and the second probe pin 18 are attached to the auxiliary substrate 15. Since the first probe pin 12 and the second probe pin 18 are worn out, the auxiliary substrate 15 is to be replaced regularly (approximately every month). On the other hand, contact substrates 17 are arranged on both sides of the lower part of the support 10, and the contact substrates 17 are connected to the base 2 in which a measuring circuit (not shown) is incorporated by a predetermined means.

On the auxiliary substrate 15 shown in FIG. 4B, the above-mentioned first probe pin 12 and second probe pin 18 are provided.
Are arranged with a predetermined interval. The first probe pin 12 and the second probe pin 18 are wiring patterns 16
Connected by In addition, the second probe pin 18
Is connected to the contact substrate 17, and is connected to the base 2 described above via the contact substrate 17.

When the solid-state image sensor is measured by the contact device of the electronic component measuring apparatus having such a configuration, the solid-state image sensor 3 is used.
Then, the device is brought to a predetermined position on the support base 10 and measurement is started. After the solid-state imaging device 3 is mounted on the support base 10, the movable base 11 is driven by an air cylinder or the like to move forward while being maintained at a predetermined temperature by a heater built in the support base 10. By contacting the first probe pin 12 with the terminal 9 of the solid-state imaging device 3 and simultaneously connecting the second probe pin 18 to the contact substrate 17, the base 2
Connect to the measurement circuit of. Then, a power supply voltage, a timing pulse, etc. for each measurement item are applied from the measurement circuit of the base 2 and the measurement is performed based on the signal output similarly output from the probe pin 12.

[0013]

As described above, in the contact device of the electronic component measuring apparatus of the prior art, the first probe pin and the second probe pin arranged on the moving table are each configured by one. There is. Therefore, there is a problem in that the connection of the probe pin to the terminal of the electronic component is liable to occur due to variations in the installation on the product or the supporting base, and the reliability of the electronic component measuring device is impaired.

The present invention has been made in consideration of the above points, and provides a contact device for an electronic component measuring apparatus, which prevents connection failure due to a single first probe pin and a second probe pin. It is the one we are trying to provide.

[0015]

In order to solve the above problems, in a contact device for an electronic component measuring apparatus according to the present invention, an electronic component having a plurality of terminals on both sides is provided on a base in which a measuring circuit is incorporated. A support base on which the base is placed, contact substrates that connect to the base on both lower side surfaces of the support base, and a movable base that is movable at positions opposite to each other across the support base. In the contact device of the electronic component measuring device, in which the electronic components are placed, and the movable table is moved toward the support table to measure and inspect the electrical characteristics of the electronic components, the inner surface of each movable table is The first probe row connected to the terminal, the second probe row connected to the contact substrate, and the auxiliary substrate connecting these with a conductive material were used. Then, a plurality of the first probe rows and the second probe rows are arranged to improve the connection reliability.

[0016] Preferably, the arrangement of the first probe row and the second probe row of the movable table is linear in the vertical direction, zigzag in the vertical direction, and vertical with respect to the plane direction of the auxiliary substrate. It is desirable that they are arranged in at least one shape that is oblique to the direction.

According to the contact device of the electronic component measuring apparatus of the present invention, the auxiliary board is provided on the inner surface of the moving base, and the auxiliary board has the first probe row connected to the terminal of the electronic component and the support base. A plurality of second probe rows each connected to the contact substrate were provided. Therefore, the connection portion of the contact device of the electronic component measuring device can be stabilized, and the reliability of measurement of the electronic component can be improved.

The arrangement of the first probe row and the second probe row of the movable table is linear in the vertical direction, zigzag in the vertical direction, and in the vertical direction with respect to the plane direction of the auxiliary substrate. Since they are arranged in at least one shape that is oblique, it is possible to further stabilize the connection portion in the contact device of the electronic component measuring device.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of a contact device for an electronic component measuring apparatus according to the present invention will be described below with reference to FIG.
The same parts as those of the contact device of the conventional electronic component measuring apparatus are designated by the same reference numerals, and the description thereof will be partially omitted. First, the configuration of the contact device of the electronic component measuring device of the present invention will be described. 1A and 1B are side views showing details of a measuring unit of the present invention, FIG. 1A is a side view showing a state in which a movable table is closed, and FIG. 1B is a front view of an auxiliary board viewed from a probe pin side. Yes, (c) is a front view of the contact substrate viewed from the wiring pattern side.

As shown in FIG. 1A, the measuring unit of the present invention is provided with a support base 10 on which the solid-state image pickup device 3 is mounted.
A contact substrate 100 having a wiring pattern 104 made of a conductive material shown in FIG. 1C is installed on both side surfaces of a lower portion of the support table 10 on the moving table side. Also, the contact substrate 1
00 is connected to a measuring circuit (not shown) built in the base 2 by a wiring pattern 104. The portion of the wiring pattern 104 that is connected to the second probe pin 103 is formed as large as possible to ensure stable connection.

A pair of movable bases 11 are arranged at positions facing each other with the support base 10 interposed therebetween, and an arm 14 having the other end connected to an air cylinder (not shown) or the like is attached to the movable base 11. . An auxiliary substrate 101 as shown in FIG. 1B is provided on the inner surface of the movable table 11, and the auxiliary substrate 101 has a structure in which two of them are displaced from each other as a feature of the present invention. The first probe pins 102 are arranged in the horizontal direction at a predetermined interval. The second probe pins 103 are similarly arranged on the first probe pins 102 via the wiring pattern 16 in a structure in which the positions of the two probe pins 103 are offset from each other. The probe pin body is substantially the same as that shown in the prior art. The pin arrangements of the first probe pins 102 and the second probe pins 103 are shown in a zigzag manner as described above, but depending on the terminal shape of the solid-state image pickup element and the like, they may be arranged in a straight line in the vertical direction and an oblique line in the vertical direction. You may. Also, when the terminals of the solid-state image sensor are narrow, the positions of the two are offset from each other.
The entire probe pins 102 may be arranged so as to be further shifted for each terminal.

The operation when the contact device of the electronic component measuring apparatus of the present invention having such a configuration is used for measurement will be described. The measurement is started after the solid-state image sensor is mounted on the support base 10 at a predetermined position by a predetermined operation. A heater is built in the support base 10, and the movable base 11 is driven by an air cylinder to move forward while maintaining a predetermined temperature by the heater. As the movable table 11 advances, the first probe pins 102 of the auxiliary substrate 101 provided on the movable table 11 come into contact with the terminals 9 of the solid-state imaging device 3, and the second probe pins 103 of the wiring pattern of the contact substrate 100. Contact 104. Then, it is connected to the measurement circuit of the base 2 by the wiring pattern 104 of the contact substrate 100.

The solid-state image pickup device 3 is kept at a desired temperature by the above-mentioned heater, and data including various temperature characteristics of the solid-state image pickup device 3 is measured. When the measurement is completed, the movable table 11 is driven by the air cylinder and retracts, and the first probe pin 102 and the second probe pin 103 are separated from the terminal 9 of the solid-state imaging device 3 and the wiring pattern 104 of the contact substrate 100, respectively. Then, the measurement of the solid-state image sensor is completed. Solid-state imaging device 3 that is successively loaded on the support base 10.
On the other hand, the above measurement operation is repeated.

As described above, according to the contact device of the electronic component measuring apparatus of the present invention, the structure is such that two probe pins are displaced from each other. Can also maintain a stable connection. Further, although the auxiliary board is regularly replaced, according to the present invention, the replacement of the auxiliary board is facilitated for the above-mentioned reason, and the replacement period is shortened because the probe pin is composed of two pieces. It can be further extended to increase the facility operation rate.

The present invention is not limited to the above-mentioned embodiment, and various embodiments can be adopted. For example, although the case where the solid-state image sensor is measured is illustrated in the present embodiment, the present invention can be applied not only to the measurement process but also to the adjustment process. Further, it goes without saying that the present invention can be applied to the measurement / adjustment process of semiconductor elements and the like without departing from the spirit of the present invention.

[0026]

As described above, according to the contact device of the electronic component measuring apparatus of the present invention, since the plurality of probe pins arranged on the auxiliary substrate are displaced from each other, the DIP is used. Stable connection between the terminals of the electronic component and the base becomes possible. Therefore, the reliability of measurement can be further improved.

[Brief description of the drawings]

FIG. 1 is a side view showing details of a measuring unit of the present invention,
(A) is a side view showing a state in which the movable table is closed,
(B) is a front view of the auxiliary board as viewed from the probe pin side, and (c) is a front view of the contact board as viewed from the wiring pattern side.

FIG. 2 is a schematic perspective view showing an example of an electronic component measuring device.

3A and 3B are diagrams showing an outline of a contact device of a conventional electronic component measuring device, FIG. 3A is an enlarged perspective view showing a measuring portion, and FIG. 3B is an enlarged sectional view of a probe pin.

4A and 4B are side views showing details of a measuring unit in the prior application example, FIG. 4A is a side view showing a state in which a movable table is open, and FIG. 4B is a front view of an auxiliary board viewed from a probe pin side. It is a figure.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component measuring device 2 Base 3 Solid-state imaging device 7 Measuring unit 9 Terminal 10 Supporting base 11 Moving base 13 Compression coil spring 14 Arm 15, 101 Auxiliary board 16, 104 Wiring pattern 17,100 Contact board 12,102 1st probe pin 18,103 2nd Probe pin

Claims (2)

[Claims] 1. A support base for mounting an electronic component having a plurality of terminals on both sides on a base in which a measuring circuit is incorporated, and contacting sides for connecting to the base on both lower side surfaces of the support base. A substrate and a movable base that is movable at positions facing each other across the support base are placed, the electronic component is placed across the support base, and the movable base is moved toward the support base. A contact device of an electronic component measuring device for measuring electrical characteristics of the electronic component, wherein a first probe row connected to the terminal of the electronic component is provided on an inner surface of each of the moving bases, and the contact substrate. A second probe row that is connected to the second probe row and an auxiliary substrate that further connects these with a conductive material, and a plurality of the first probe row and the second probe row are provided for connection. A contact device for an electronic component measuring device, which is characterized by reliability. 2. The array of the first probe row and the second probe row has a linear shape in a vertical direction, a zigzag shape in a vertical direction, and a vertical direction with respect to a plane direction of the auxiliary substrate. The contact device for an electronic component measuring device according to claim 1, wherein the contact devices are arranged in at least one shape that is oblique.