JPH09135010A - Mounting of bare chip ccd - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate a positioning for mounting a bare chip CCD by a method wherein the bare chip CCD is provided on a substrate and the substrate is positioned to a lens tube. SOLUTION: A substrate 14 provided with a bare chip CCD 13 is butted against (is press-contacted to) the reference surface 11e of an engaging pawl 11b by the elastic force of an elastic member pressed into a lens tube and a positioning in an optical axis direction of the imaging surface of the CCD 13 and a positioning in a fanning direction of the imaging surface are conducted. Then, as the substrate 13 is movable within a prescribed extent on the lens tube 11a, adjustments (an adjustment of the rotation of the CCD 13 and an adjustment of centering of the center of the CCD 13) within a plane intersecting orthogonally the optical axis are conducted in a state of being positioned in the optical axis direction of the imaging surface of the CCD 13 and in the fanning direction. In such a way, by conducting the positionings using the substrate 14, which is large compared with the CCD 13, a positioning of the CCD 13 can be facilitated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bare chip CCD mounting method for mounting a bare chip CCD on a substrate and mounting the substrate on a lens barrel that supports an optical system.

[0002]

2. Description of the Related Art Next, a conventional example will be described with reference to the drawings.
FIG. 23 is a diagram for explaining an example of a mounting structure of a conventional CCD chip enclosed in a package.

In the figure, reference numeral 1 is a lens barrel for supporting an optical system 2. Reference numeral 3 denotes a substrate provided with a package CCD 4, which is attached to the base end of the lens barrel 1. The package CCD 4 is provided with a CCD chip 6 inside a box body 5 made of ceramic or the like with one surface open, and is covered with a glass plate 7 that covers the open surface of the box body 5.
A CCD chip 6 is enclosed in the box body 5.

Reference numeral 8 is an optical filter including a crystal filter and an infrared cut filter. 9 is disposed between the optical filter 8 and the package CCD 4, and the optical filter 8 is pressed against the convex portion 1a provided on the inner cylindrical surface of the lens barrel 1,
It is an elastic member such as rubber or resin for positioning the optical filter 8.

Further, since a closed space composed of the elastic member 9 and the optical filter 8 is formed on the glass plate 7, dust and the like are prevented from adhering to the glass plate 7. The package CCD 4 is supplied to the market in a state where the CCD chip 6 and the box body 5 are positioned. Therefore, CCD chip 6
The positioning with respect to the optical system 2 has been performed by positioning the box body 5, which is easy to position, with respect to the optical system.

[0006]

In recent years, package CCDs have been used.
Instead of 4, it is proposed to supply it to the market in the form of a bare CCD chip (bare chip CCD) 6. No method for attaching such a bare chip CCD to an optical system has been proposed.

The present invention has been made in view of the above problems, and its first object is to provide a bare chip CC which is easy to position.
D is to provide a mounting method. A second object of the present invention is to provide a method for mounting a bare chip CCD in which dust or the like does not adhere to the image pickup surface of the bare chip CCD.

[0008]

A method of mounting a bare chip CCD of the present invention which solves the above-mentioned problems is a bare chip CCD mounting method in which a bare chip CCD is provided on a substrate and the substrate is mounted on a lens barrel supporting an optical system. The positioning of the bare chip is to position the substrate with respect to the lens barrel.

Positioning is easier by using a larger substrate than a bare chip CCD.
Here, the substrate has a through hole and a terminal formed on the periphery of the hole, and the bare chip CCD has an imaging surface facing the open surface of the hole of the substrate and a peripheral edge of the imaging surface. It is desirable to have a terminal formed and connected to a terminal of the substrate, and to seal the gap between the substrate and the bare chip CCD with a filler.

By sealing the gap between the substrate and the bare chip CCD with a filler, it is possible to prevent the entry of dust and the like from the outside of the lens barrel to the inside of the lens barrel, and further to prevent the adhesion of dust and the like to the bare chip CCD. .

The mounting of the substrate and the lens barrel is
At least one of gluing or screwing is desirable. An optical filter may be mounted on the surface of the substrate opposite to the bare chip CCD mounting surface so as to cover the open surface of the hole.

By doing so, a closed space formed by the wall surface of the hole and the optical filter is formed on the image pickup surface of the bare chip CCD, and dust can be prevented from adhering to the image pickup surface of the bare chip CCD.

Further, the distance between the image pickup surface of the CCD and the optical filter can be made shorter than in the case where the conventional package CCD is used, and when the optical filter is a low-pass filter by breaking, the analysis effect becomes large and moire occurs. Can be suppressed.

Furthermore, since the distance between the optical system and the image pickup surface is shortened, the size can be reduced or the degree of freedom in optical design can be increased. An optical filter fitted into the hole may be provided on the surface of the substrate opposite to the bare chip CCD mounting surface.

By doing so, in addition to the above effects,
Positioning of the optical filter itself becomes easy, which contributes to reduction of man-hours and cost. Further, the filter is a laminated structure composed of a plurality of filters, the filter on the substrate side is fitted into the through hole of the substrate, and the filter on the non-substrate side has a stepped structure larger than the hole. Good.

By setting the thickness of the portion fitted into the hole of the optical filter to be shorter than the depth of the hole of the substrate, the optical filter does not hit the image pickup surface of the bare chip CCD, and there is no risk of scratches or deformation on the image pickup surface. .

Further, it is desirable that the bonding is performed over the entire circumference of the lens barrel. By performing the bonding over the entire circumference of the lens barrel, it is possible to prevent dust and the like from entering the lens barrel through the gap between the substrate and the lens barrel.

As a first example of a positioning method in a plane orthogonal to the optical axis of the substrate, there is a method of adjusting the substrate while monitoring an image from the bare chip CCD, and as a second example. Is performed by a positioning structure formed on the lens barrel and the substrate.

Furthermore, the positioning of the bare chip CCD in the optical axis direction and the tilting direction is provided in the lens barrel, the positioning in the optical axis direction is performed, and the substrate is placed on a plane orthogonal to the optical axis. There is a way to hit.

As described above, since the positioning in the optical axis direction and the tilting direction are made to abut, the influence due to a change with time in the method such as adhesion and the expansion and contraction of humidity etc. are reduced. Furthermore, since movement in the optical axis direction is restricted, adjustment (rotation, centering) in a plane orthogonal to the optical axis becomes easy.

As an example of the positioning in the optical axis and the tilt direction, a bare chip of an optical filter is provided on the inner cylindrical surface of the lens barrel.
Providing a locking part where the surface opposite to the CCD and the surface on the opposite side abut,
There is a method of press-fitting an elastic member that comes into contact with the inner cylindrical surface of the lens barrel over the entire circumference between the surface of the optical filter facing the bare chip CCD and the substrate.

By doing so, a closed space composed of the elastic member and the optical filter is formed on the image pickup surface of the bare chip CCD, and dust can be prevented from adhering to the image pickup surface of the bare chip CCD.

Furthermore, the distance between the image pickup surface of the bare chip CCD and the optical filter can be shortened as compared with the case where the conventional package CCD is used, because the box body is not used. When the optical filter is a low-pass filter by folding, The analysis effect is increased, and the occurrence of moire can be suppressed.

Further, such an elastic member is also used in the case of the conventional package CCD as shown in FIG. 23. However, in the case of the conventional example, the structure is such that the package CCD 4 is pressed and contacted. The inner diameter of the elastic member cannot be set large. However, since the elastic member of the method of the present invention presses against the substrate, the inner diameter can be set large. Therefore, the distance between the subject light beam and the inner wall of the elastic member can be increased,
Optical problems (flare, ghost) hardly occur.

As a positioning method, there is a method in which a bare chip CCD having an effective pixel area larger than an area required by an optical system is used and adjustment in a plane orthogonal to the optical axis is not performed.

That is, even if the substrate is roughly mounted on the lens barrel, a bare chip CCD having a large image pickup surface such that an image obtained by the optical system is always formed on the image pickup surface is used, and unnecessary image data is not used. You can decide.

There is also a method in which a focus shift correction circuit is added and position adjustment in the tilt direction is not performed.

[0028]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. (1) First Embodiment Example FIG. 1 is an exploded perspective view of a first embodiment example of the present invention, and FIG.
1 is a view after assembly in FIG. 1, FIG. 3 is a sectional view in the optical axis direction in FIG. 2, FIG. 4 is a view in the direction of arrow A in FIG.
FIG. 3 is a diagram for explaining the attachment of the substrate and bare chip CCD in FIG. 1.

In these drawings, reference numeral 11 denotes a lens barrel having a rectangular cross section for supporting the optical system 12. 14 is a rectangular substrate provided with the bare chip CCD 13. Next, attachment of the bare chip CCD 13 and the substrate 14 will be described with reference to FIG. A through hole 14a is formed in the substrate 14, and a terminal 14b is formed on the peripheral edge of the hole 14a.

On the other hand, the bare chip CCD 13 has an image pickup surface 13a.
Are arranged so as to face the open surface of the hole 14a of the substrate 14. In addition, the terminal 1 of the substrate 14 is provided on the periphery of the imaging surface 13a.
A terminal 13b is formed on the surface 4b, which is connected using the solder 15.

The gap between the substrate 14 and the bare chip CCD 13 is sealed with a filler 16 having an insulating property such as an adhesive. Next, with reference to FIGS. 1 to 4, the bare chip CCD 1
A method of mounting and adjusting the position of the lens barrel 11 and the substrate 14 provided with the lens 3 will be described. A rectangular notch 14b is formed in a substantially central portion of each side of the rectangular substrate 14. on the other hand,
On the end surface 11a of the lens barrel 11, the cutouts 1 of the substrate 14 are formed.
Four engagement claws 11b that can be engaged with 4b are formed.

Each of these engaging claws 11b extends from the end surface 11a in the optical axis direction, is bent toward the optical axis direction from the base portion 11c having a rectangular cross section, and the tip end portion of the base portion 11c, and is opposed to the substrate 14. It is composed of a bent portion 11d. The cross-sectional shape of the base portion 11c is set smaller than the cutout 14b of the substrate 14. Therefore, even when the engaging claw 11b is engaged with the board 14, the board 11b
Is movable within a predetermined range on the end surface 11a of the lens barrel 11.

The surface of the bent portion 11d facing the substrate 14 is the reference surface 11e. The reference surface 11e is a plane orthogonal to the optical axis, and when the substrate 14 on which the bare chip CCD 13 is provided comes into contact, the bare chip CC is formed.
Positioning of the image pickup surface of the D13 in the optical axis direction and tilting direction is performed.

Further, as shown in FIG. 3, in the lens barrel 11,
Optical filters such as crystal filters and infrared cut filters 1
7 are provided. The inner cylinder surface of the lens barrel 11 is provided with a locking portion 11f with which the surface of the optical filter 17 opposite to the surface facing the bare chip CCD 13 abuts, and the surface of the optical filter 17 facing the bare chip CCD 13 and the substrate. An elastic member 18 made of rubber, resin, or the like, which is in contact with the inner cylindrical surface of the lens barrel 11 over the entire circumference, is press-fitted between the elastic member 18 and the elastic member 14.

Next, a method of adjusting the above configuration will be described. The bare chip CCD is driven by the elastic force of the elastic member 18 that is press-fitted.
The substrate 14 provided with 13 is the reference surface 11 of the engaging claw 11b.
Then, the image pickup surface of the bare chip CCD 13 is positioned in the optical axis direction and in the tilting direction.

Next, since the substrate 13 can be moved within a predetermined range on the end surface 11a of the lens barrel 11, the bare chip CCD is used.
With the image pickup surface of 13 being positioned in the optical axis direction and tilted, the adjustment (rotation adjustment, centering adjustment) is performed in a plane orthogonal to the optical axis as shown in FIG. In this rotation adjustment and centering adjustment, a predetermined test pattern is imaged, the image data from the bare chip CCD 13 is displayed on the monitor, and the adjustment is performed.

When these adjustments are completed,
The engaging claw 11b and the substrate 14 are bonded to each other with the adhesive 19. According to the above method, the positioning is facilitated by using the substrate 14 larger than the bare chip CCD 13 for positioning.

Further, due to the elastic force of the elastic member 18 press-fitted, the substrate 14 on which the bare chip CCD 13 is provided abuts (presses) the reference surface 11e of the engaging claw 11b, and the substrate surface of the bare chip CCD 13 in the optical axis direction. With the positioning and the positioning in the tilt direction performed, as shown in FIG.
Adjustment (rotation adjustment, centering adjustment) in a plane orthogonal to the optical axis can be easily performed.

By sealing the gap between the substrate 14 and the bare chip CCD 13 with a filler, dust and the like can be prevented from entering from the outside of the lens barrel 11 into the inside of the lens barrel 11, and further, to the image pickup surface of the bare chip CCD 13. It is possible to prevent adhesion of dust and the like.

Further, since the positioning in the optical axis direction and the tilting direction is made to abut against the reference surface 11e of the substrate 14, the influence due to a change with time in the method of adhesion and the expansion and contraction of humidity etc. is reduced.

Furthermore, a closed space composed of the elastic member 18 and the optical filter 17 is formed on the image pickup surface of the bare chip CCD 13, and it is possible to prevent dust from adhering to the image pickup surface of the bare chip CCD 13.

Further, the distance between the image pickup surface of the bare chip CCD 13 and the optical filter 17 can be shortened as compared with the case where the conventional package CCD is used because the box body is not used, and the optical filter 17 is a low pass filter by breaking. In the case of a filter, the analysis effect becomes large, and the occurrence of moire can be suppressed.

Further, the elastic member 18 in the present embodiment example.
Is also used in the case of the conventional package CCD as shown in FIG. 23, but in the case of the conventional example, the package CCD
Since the structure presses the top, the inner diameter of the elastic member cannot be set large. However, since the elastic member 18 of the present embodiment is pressed against the substrate 14, the inner diameter can be set large. Therefore, the distance between the subject light beam and the inner wall of the elastic member can be increased, and optical problems (flare, ghost) are less likely to occur. (2) Second Embodiment Example Next, a second embodiment example of the present invention will be described with reference to FIG.
FIG. 6 is a configuration diagram of a main part of the second embodiment.
1 to 5 for explaining the first embodiment of the present invention.
The same parts as those of the above are denoted by the same reference numerals, and the description thereof will be omitted.

The difference between this embodiment and the first embodiment is the method of positioning in the plane orthogonal to the optical axis of the substrate. Specifically, in the first embodiment, adjustment (rotation adjustment, centering adjustment) in a plane orthogonal to the optical axis of the substrate 14 is performed by imaging a predetermined test pattern and The image data of was displayed on the monitor and adjusted.

In this embodiment, as shown in FIG.
The base end surface of the lens barrel 11 is a reference surface 11j in the optical axis direction of the substrate 14.
And a horizontal butting protrusion 1 on one side of the base end face.
1h is applied to the upper surface of the base end face in a vertical direction to project the projection 11i.
To form the abutting projections 11h and 11 on the substrate 14.
That is, the notches 14h and 14i that engage with i are formed.

According to this structure, the substrate 14 is pressed against the reference surface 11j of the lens barrel 11 and the substrate 14 is positioned in the optical axis direction.
Is brought into contact with the abutting projection 11h on the base end surface of the lens barrel 11, so that the notch 11i of the substrate 14 is positioned on the base end surface of the lens barrel 11 by positioning the substrate 14 in the horizontal direction.
The substrate 14 is positioned in the vertical direction by abutting on the substrate i, and the notches 14h and 14i of the substrate are engaged with the abutting protrusions 11h and 11i of the lens barrel 11, thereby
Positioning in the rotational direction of 4 is performed respectively.

The present embodiment is not limited to the above embodiment. In the embodiment described above, the lens barrel 1
1 abutment projection 11 in a horizontal direction on one side surface of the base end surface of 1.
Although h is a vertical abutting protrusion 11i formed on the upper surface of the base end face, a horizontal abutting protrusion is formed on the other end face of the lens barrel 11, and a vertical abutting protrusion is formed on the lower surface of the base end face. May be formed.

Further, in the positioning mechanism described above, the center positioning of the substrate 14 can be performed without strict dimensional accuracy of the abutting protrusions 11h, 11i and the notches 14h, 14i.
The image pickup area of the optical system of the lens barrel 11 may be set to be large,
Further, it can be avoided by setting a large image pickup area of the CCD described in a twelfth embodiment described later. (3) Third Embodiment Next, a third embodiment of the present invention will be described with reference to FIG.
FIG. 7 is a configuration diagram of the main part of the third embodiment.
The same parts as those in FIG. 6 for explaining the second embodiment of the present invention are designated by the same reference numerals and the description thereof will be omitted.

The difference between this embodiment and the second embodiment is that two projections 11k and 11l are formed on the lens barrel 11, and the substrate 14 is engaged with the projection 11k of the lens barrel 11. Notch hole 14k and hole 1 that engages with projection 11l of lens barrel 11
This is the point where 11 is formed.

According to the above structure, the substrate 14 is pressed against the reference surface 11j of the lens barrel 11, and the substrate 14 is positioned in the optical axis direction.
4L is fitted to the projections 11k and 11L of the lens barrel 11, thereby positioning on the plane perpendicular to the optical axis of the substrate 14.
(Rotation adjustment, centering adjustment) is performed.

Further, similarly to the second embodiment, in the positioning mechanism described above, the center positioning of the substrate 14 can be performed without strict dimensional accuracy of the abutting protrusions 11h, 11i and the notches 14h, 14i. This can be avoided by setting the image pickup area of the optical system of the lens barrel 11 to be large, or by setting the CCD image pickup area described in a twelfth embodiment described later to be large. (4) Fourth Embodiment Next, a fourth embodiment will be described with reference to FIGS. 8 and 9. FIG. 8 is a sectional configuration diagram of the fourth embodiment, and FIG. 9 is a perspective view of a main part in FIG.

In FIGS. 8 and 9, the same parts as those of FIGS. 1 to 5 of the first embodiment are designated by the same reference numerals,
Their description is omitted. In these figures, the lens barrel 2
The end surface of 1 is a plane orthogonal to the optical axis, and is a reference for positioning the imaging surface of the bare chip CCD 13 in the optical axis direction and in the tilting direction by contacting the substrate 14 on which the bare chip CCD 13 is provided. It is the surface 21a.

Next, a method of adjusting the above configuration will be described. With the substrate 14 provided with the bare chip CCD 13 abutting against the reference surface 21a of the lens barrel 21, that is, the bare chip CCD
Adjustment (rotation adjustment, centering adjustment) in a plane orthogonal to the optical axis is performed in a state where the imaging surface of 13 is positioned in the optical axis direction and tilted. In this rotation adjustment and centering adjustment, a predetermined test pattern is imaged, the image data from the bare chip CCD 13 is displayed on the monitor, and the adjustment is performed.

When these adjustments are completed,
The boundary portion between the lens barrel 21 and the substrate 14 is adhered over the entire circumference with an adhesive 22. According to the above method, the positioning is facilitated by using the substrate 14 larger than the bare chip CCD 13 for positioning.

Further, in a state where the substrate 14 is abutted against the reference surface 21a of the lens barrel 21 and the image pickup surface of the bare chip CCD 13 is positioned in the optical axis direction and in the tilting direction, it is in a plane orthogonal to the optical axis. Can be easily adjusted (rotation adjustment, centering adjustment).

The boundary portion between the lens barrel 21 and the substrate 14 is adhered over the entire circumference by using the adhesive 22, and the gap between the substrate 14 and the bare chip CCD 13 is sealed by the filler. It is possible to prevent dust and the like from entering the lens barrel 11 from the outside, and further to prevent the dust and the like from adhering to the imaging surface of the bare chip CCD 13.

Further, since the positioning in the optical axis direction and the tilting direction is made to abut against the reference surface 21a of the substrate 14, the influence due to a change with time in the method of bonding or the like and the influence of expansion and contraction of humidity etc. are reduced.

Further, the distance between the image pickup surface of the bare chip CCD 13 and the optical filter 17 can be shortened as compared with the case of using the conventional package CCD because the box body is not used, and the optical filter 17 is a low-pass filter by breaking. In the case of a filter, the analysis effect becomes large, and the occurrence of moire can be suppressed. (5) Fifth Embodiment Next, a fifth embodiment will be described with reference to FIG.
FIG. 10 is a sectional view for explaining the fifth embodiment.
In FIG. 10, the same parts as those in FIGS. 1 to 5 of the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

In these figures, the end face of the lens barrel 31 is
Bare chip CCD 13 which is a plane orthogonal to the optical axis
By abutting the substrate 14 provided with, the reference surface 31a is positioned for positioning the imaging surface of the bare chip CCD 13 in the optical axis direction and in the tilting direction. A plurality of female screw holes 31b are formed on the reference surface 31a on the same circumference at substantially the same pitch.

The board 14 is also formed with a hole 14d facing the female screw hole 31b. The hole 14d is an arc-shaped elongated hole having a width larger than the diameter of the female screw hole 31b. Next, a method of adjusting the above configuration will be described. Bare chip
The substrate 14 on which the CCD 13 is provided is attached to the reference surface 31 of the lens barrel 31.
Adjustment in a plane orthogonal to the optical axis in a state of being abutted against a, that is, in a state where the image pickup surface of the bare chip CCD 13 is positioned in the optical axis direction and tilted.
(Rotation adjustment, centering adjustment). This rotation adjustment,
The centering adjustment is performed by imaging a predetermined test pattern and displaying the image data from the bare chip CCD 13 on the monitor.
Make adjustments.

When these adjustments are completed,
The substrate 14 is fixed to the lens barrel 31 using a screw 32 and a spring washer 33 that can be screwed into the female screw hole 31b.
Further, the adhesive 34 is applied to the entire boundary around the boundary between the lens barrel 31 and the substrate 14.

According to the above method, the positioning is facilitated by using the substrate 14 larger than the bare chip CCD 13 for positioning. Also, the substrate 14 is abutted against the reference surface 31a of the lens barrel 31, and with the image pickup surface of the bare chip CCD 13 positioned in the optical axis direction and tilted, adjustment in a plane orthogonal to the optical axis ( Rotation adjustment and centering adjustment) can be easily performed.

The boundary portion between the lens barrel 21 and the substrate 14 is coated with an adhesive 22 over the entire circumference, and the gap between the substrate 14 and the bare chip CCD 13 is sealed with a filler, whereby the lens barrel It is possible to prevent dust and the like from entering the lens barrel 11 from the outside, and further to prevent the dust and the like from adhering to the imaging surface of the bare chip CCD 13.

Further, since the positioning in the optical axis direction and the tilting direction is made to abut against the reference surface 31a of the substrate 14, the influence due to a change with time in the method of bonding or the like and expansion and contraction of humidity or the like are reduced.

Further, the distance between the image pickup surface of the bare chip CCD 13 and the optical filter 17 can be shortened as compared with the case where the conventional package CCD is used because the box body is not used, and the optical filter 17 is a low-pass filter by breaking. In the case of a filter, the analysis effect becomes large, and the occurrence of moire can be suppressed.

The present invention is not limited to the above embodiment. In the above-described embodiment, the substrate 14 and the lens barrel 31 are mounted by screwing the screw 32 into the female screw hole 31b, but the substrate 14 and the lens barrel 31 are mounted using a tapping screw. May be. (6) Sixth Embodiment Next, a sixth embodiment will be described with reference to FIGS. 11 and 12. FIG. 11 is a sectional configuration diagram of the sixth embodiment,
FIG. 12 is a perspective view of the main part in FIG. still,
11 and 12, FIG. 8 of the fourth embodiment example.
The same parts as those of FIG. 9 are designated by the same reference numerals and the description thereof will be omitted.

The difference between this embodiment and the fourth embodiment is that the lens barrel 2 is provided between the optical filter 17 and the substrate 14.
In order to attach the substrate 14 and the lens barrel 21 using the adhesive 42 by press-fitting the elastic member 41 which is in contact with the entire inner wall surface of No. 1, the adhesive 42 is not applied over the entire circumference of the lens barrel, As shown in FIG. 12, the points are limited to the required points (specifically, near the center of each side).

According to the above method, the positioning is facilitated by using the substrate 14 larger than the bare chip CCD 13 for positioning. Also, the substrate 14 is abutted against the reference surface 21a of the lens barrel 21, and with the image pickup surface of the bare chip CCD 13 positioned in the optical axis direction and tilted, adjustment in a plane orthogonal to the optical axis ( Rotation adjustment and centering adjustment) can be easily performed.

Further, by sealing the gap between the substrate 14 and the bare chip CCD 13 with a filler, it is possible to prevent dust and the like from entering from the outside of the lens barrel 11 into the inside of the lens barrel 11, and further to the image pickup surface of the bare chip CCD 13. It is possible to prevent adhesion of dust and the like.

Further, since the positioning in the optical axis direction and the tilting direction is made to abut against the reference surface 21a of the substrate 14, the influence due to the change with time in the bonding method and the expansion and contraction of humidity etc. are reduced.

Furthermore, a closed space composed of the elastic member 41 and the optical filter 17 is formed on the image pickup surface of the bare chip CCD 13, and it is possible to prevent dust from adhering to the image pickup surface of the bare chip CCD 13.

Further, the distance between the image pickup surface of the bare chip CCD 13 and the optical filter 17 can be shortened as compared with the case where the conventional package CCD is used because the box body is not used, and the optical filter 17 is a low-pass filter by breaking. In the case of a filter, the analysis effect becomes large, and the occurrence of moire can be suppressed.

Further, the elastic member 41 in the present embodiment example.
Is also used in the case of the conventional package CCD as shown in FIG. 23, but in the case of the conventional example, the package CCD
Since the structure presses the top, the inner diameter of the elastic member cannot be set large. However, since the elastic member 41 of this embodiment is pressed against the substrate 14, the inner diameter can be set large. Therefore, the distance between the subject light beam and the inner wall of the elastic member can be increased, and optical problems (flare, ghost) are less likely to occur. (7) Seventh Embodiment Next, a seventh embodiment will be described with reference to FIG.
FIG. 13 is a sectional configuration diagram of the seventh embodiment. still,
In FIG. 13, the same parts as those in FIG. 10 of the fifth embodiment are designated by the same reference numerals, and the description thereof will be omitted.

The difference between this embodiment and the fifth embodiment is that the lens barrel 2 is provided between the optical filter 17 and the substrate 14.
The point is that the elastic member 51 that is in contact with the entire circumference of the inner wall surface of No. 1 is press-fitted, and the adhesive is not applied over the entire circumference of the lens barrel as in the fifth embodiment.

According to the above method, the positioning is facilitated by using the substrate 14 larger than the bare chip CCD 13 for positioning. Also, the substrate 14 is abutted against the reference surface 31a of the lens barrel 31, and with the image pickup surface of the bare chip CCD 13 positioned in the optical axis direction and tilted, adjustment in a plane orthogonal to the optical axis ( Rotation adjustment and centering adjustment) can be easily performed.

By sealing the gap between the substrate 14 and the bare chip CCD 13 with a filler, dust and the like can be prevented from entering from the outside of the lens barrel 11 into the inside of the lens barrel 11, and the image pickup surface of the bare chip CCD 13 can be further prevented. It is possible to prevent adhesion of dust and the like.

Furthermore, since the positioning in the optical axis direction and the tilting direction is made to abut against the reference surface 31e of the substrate 14, the influence due to a change with time in the method of bonding and the expansion and contraction of humidity etc. is reduced.

Furthermore, a closed space composed of the elastic member 51 and the optical filter 17 is formed on the image pickup surface of the bare chip CCD 13, and it is possible to prevent dust from adhering to the image pickup surface of the bare chip CCD 13.

Further, the distance between the image pickup surface of the bare chip CCD 13 and the optical filter 17 can be shortened as compared with the case where the conventional package CCD is used because the box body is not used, and the optical filter 17 is a low pass filter by breaking. In the case of a filter, the analysis effect becomes large, and the occurrence of moire can be suppressed.

Further, the elastic member 41 in the present embodiment example.
Is also used in the case of the conventional package CCD as shown in FIG. 23, but in the case of the conventional example, the package CCD
Since the structure presses the top, the inner diameter of the elastic member cannot be set large. However, since the elastic member 41 of this embodiment is pressed against the substrate 14, the inner diameter can be set large. Therefore, the distance between the subject light beam and the inner wall of the elastic member can be increased, and optical problems (flare, ghost) are less likely to occur. (8) Eighth Embodiment Example An eighth embodiment example will be described with reference to FIGS. 14 and 15. FIG. 14 is a sectional configuration diagram of the eighth embodiment, and FIG.
FIG. 15 is a perspective view of FIG. 14. 14 and FIG.
5, the same parts as those in FIG. 5 in the first embodiment are denoted by the same reference numerals and the description thereof will be omitted.

The present embodiment is an optical filter mounting method. That is, the optical filters in the first to seventh embodiments are attached to the inner wall surface of the lens barrel. In this embodiment, as shown in FIGS. 14 and 15, the optical filter 6 is formed on the surface of the substrate 14 opposite to the bare chip CCD mounting surface so as to cover the open surface of the hole 14a.
1 is attached using an adhesive 62.

By doing so, the bare chip CCD 1
A closed space formed by the wall surface of the hole 14a and the optical filter 61 is formed on the image pickup surface of No. 3, and dust can be prevented from adhering to the image pickup surface of the bare chip CCD 13.

Further, the distance between the image pickup surface of the bare chip CCD 13 and the optical filter 61 can be shortened as compared with the case where the conventional package CCD is used, and when the optical filter 61 is a low-pass filter by breaking, the analysis effect becomes large, The occurrence of moire can be suppressed.

Furthermore, since the distance between the optical system and the image pickup surface is shortened, the size can be reduced or the degree of freedom in optical design can be increased. (9) Ninth Embodiment A ninth embodiment will be described with reference to FIGS. 16 and 17. FIG. 16 is a sectional configuration diagram of the ninth embodiment, and FIG.
FIG. 17 is a perspective view of FIG. 16. 16 and 17
5, the same parts as those in FIG. 5 in the first embodiment are denoted by the same reference numerals and the description thereof will be omitted. This embodiment is also a method of attaching an optical filter.

In the present embodiment, as shown in FIGS. 16 and 17, an optical filter 71 fitted into the hole 14a is provided on the surface of the substrate 14 opposite to the bare chip CCD 13 mounting surface.

By doing so, in this way, in addition to the effects of the eighth embodiment, the positioning of the optical filter itself becomes easy, and the number of steps and cost can be reduced. (10) Tenth Embodiment Example A tenth embodiment example will be described with reference to FIGS. 18 and 19. FIG. 18 is a sectional configuration diagram of the tenth embodiment, and FIG. 19 is a perspective view of FIG. 18 and 17, the same parts as those in FIG. 5 in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.
This embodiment is also a method of attaching an optical filter.

The optical filter 81 has a laminated structure composed of a plurality of filters. Therefore, the optical filter 81 on the side of the substrate 14 is fitted into the hole 14a that penetrates the substrate 14, and the optical filter 81 on the side opposite to the substrate has a stepped structure that is larger than the hole 14a.

By doing so, in addition to the effect of the ninth embodiment, the thickness t of the portion of the optical filter 81 fitted into the hole 14a is set shorter than the depth (D) of the hole in the substrate. By doing so, there is no possibility that the optical filter 81 hits the image pickup surface of the bare chip CCD 13 and the image pickup surface is damaged or deformed. (11) Eleventh Exemplary Embodiment An eleventh exemplary embodiment will be described with reference to FIG. FIG.
Reference numeral 0 is a configuration diagram of the eleventh embodiment.

In the figure, 91 is a lens barrel, and 92 is a substrate on which a bare chip CCD 93 is provided. The substrate 92 is provided on the main body of the image pickup apparatus and is movable on a plane perpendicular to the optical axis.

Reference numeral 94 is a spring for biasing the substrate 92 in a horizontal direction on a plane substantially perpendicular to the optical axis, and 95 is a screw for inhibiting the horizontal movement of the substrate 92. 96
Is a spring for urging the substrate 92 in a vertical direction on a plane perpendicular to the optical axis, and 97 is a screw for inhibiting the vertical movement of the substrate 92.

98, 99, 100 are springs for urging the substrate 92 in a tilting direction on a plane perpendicular to the optical axis, and 101, 102, 103 are these springs 98, 99.
The spring 9 is provided so as to face 99 and 100.
A screw that regulates the movement of the substrate 92 lifted by 8,99,100.

Bare chip CCD in such a configuration
The position adjusting method of 93 will be described. First, the position of the substrate 92 on a plane perpendicular to the optical axis is adjusted. Specifically, a predetermined test pattern is photographed using the bare chip CCD 93, and the video right signal from the bare chip CCD 93 is displayed on the monitor 105 via the video signal processing circuit 104. While watching the image of this monitor 105, each screw 95, 97,
Adjust 101, 102, 103 to adjust the tilt and center position.

Next, the lens barrel 91 and the substrate 92 are fixed, and the lens barrel 91 is rotated to adjust the rotation. Finally, the lens barrel rotation stop screw 106 is tightened to complete the adjustment.
As described above, according to the method, the positioning is facilitated by performing the positioning using the substrate 92 larger than the bare chip CCD 93.

In the present embodiment, when the bare chip CCD 93 and the substrate 92 are mounted and the parallelism between them is good, the tilt adjustment is unnecessary and the springs 98, 99,
The 100 and the screws 101, 102, 103 are unnecessary. (12) Twelfth Exemplary Embodiment A twelfth exemplary embodiment will be described with reference to FIG. FIG.
1 is a block diagram of the twelfth embodiment. The eleventh
20, which are the same as those in FIG. 20 for explaining the embodiment, are assigned the same reference numerals and explanations thereof are omitted.

In this embodiment, the bare chip CCD 111 provided on the substrate 110 is the area C required for the optical system.
It has a larger effective pixel area D. According to this method, even if the substrate 110 is roughly attached to the lens barrel,
If a bare chip CCD111 having a large effective pixel area D such that an image obtained by the optical system is always formed on the image pickup surface is used and unnecessary image data is not used, it is orthogonal to the optical axis of the bare chip CCD111. It is possible to eliminate the need for position adjustment in the plane where (13) Thirteenth Embodiment An example of the thirteenth embodiment will be described with reference to FIG. FIG.
2 is a block diagram of the thirteenth embodiment. The 12th
21, which are the same as those in FIG. 21 for explaining the embodiment, are assigned the same reference numerals and explanations thereof are omitted.

Recently, a method of restoring a sharp image from an out-of-focus image or an image deteriorated due to camera shake has been proposed (for example, image restoration by blind deconvolution / Shinichi Komatsu / Waseda University, 1991). The 22nd Conference on Image Engineering of the year).

In this embodiment, the video output of the bare chip CCD 111 is corrected by using the A / D conversion circuit 121 and the focus shift correction circuit 120 using this method. By doing so, even when the bare chip CCD 111 is mounted on the center of the optical axis, even if the tilting direction is roughly rough, the focus shift correction circuit 120 can restore the image degraded by the tilt.

[0098]

As described above, the bare chip CC of the present invention is as described above.
According to the mounting method of D, the positioning is easy by using a larger substrate than the bare chip CCD.

By sealing the gap between the substrate and the bare chip CCD with a filler, it is possible to prevent the entry of dust and the like from the outside of the lens barrel to the inside of the lens barrel, and further to prevent the adhesion of dust and the like to the bare chip CCD. .

By forming an optical filter on the surface of the substrate opposite to the bare chip CCD mounting surface so as to cover the open surface of the hole, the wall surface of the hole and the optical filter are formed on the imaging surface of the bare chip CCD. A closed space is formed to prevent dust from adhering to the image pickup surface of the bare chip CCD.

Further, the distance between the image pickup surface of the CCD and the optical filter can be shortened as compared with the case where the conventional package CCD is used, and when the optical filter is a low-pass filter by folding, the analysis effect becomes large and moire is generated. Can be suppressed.

Furthermore, since the distance between the optical system and the image pickup surface is reduced, the size can be reduced or the degree of freedom in optical design can be increased. Further, by providing an optical filter that fits into the hole on the surface opposite to the bare chip CCD mounting surface of the substrate, in addition to the above effects, the positioning of the optical filter itself becomes easy, reducing the number of steps, Contributes to cost reduction.

Further, the filter has a laminated structure composed of a plurality of filters, the filter on the substrate side is fitted in the through hole of the substrate, and the filter on the non-substrate side has a stepped shape larger than the hole. Due to the structure, by setting the thickness of the part that fits in the hole of the optical filter shorter than the depth of the hole in the substrate, the optical filter hits the image pickup surface of the bare chip CCD, and the image pickup surface is damaged or deformed. There is no fear.

By performing the bonding over the entire circumference of the lens barrel, it is possible to prevent dust and the like from entering the lens barrel through the gap between the substrate and the lens barrel. Further, the positioning of the bare chip CCD in the optical axis direction and the tilting direction is provided in the lens barrel, the positioning in the optical axis direction is performed, and the substrate is abutted on a plane orthogonal to the optical axis. There is a way.

As described above, since the positioning in the optical axis direction and the tilting direction are made to abut, the influence due to a change with time in the method such as adhesion and the expansion and contraction of humidity etc. are reduced. Furthermore, since movement in the optical axis direction is restricted, adjustment (rotation, centering) in a plane orthogonal to the optical axis becomes easy.

As an example of the positioning in the optical axis and the tilt direction, a bare chip of an optical filter is attached to the inner cylindrical surface of the lens barrel.
Providing a locking part where the surface opposite to the CCD and the surface on the opposite side abut,
There is a method of press-fitting an elastic member that comes into contact with the inner cylindrical surface of the lens barrel over the entire circumference between the surface of the optical filter facing the bare chip CCD and the substrate.

By doing so, a closed space composed of the elastic member and the optical filter is formed on the image pickup surface of the bare chip CCD, and dust can be prevented from adhering to the image pickup surface of the bare chip CCD.

Further, the distance between the image pickup surface of the bare chip CCD and the optical filter can be shortened as compared with the case where the conventional package CCD is used, because the box body is not used. When the optical filter is a low-pass filter by folding, The analysis effect is increased, and the occurrence of moire can be suppressed.

Further, such an elastic member is also used in the case of the conventional package CCD as shown in FIG. 23. In the case of the conventional example, however, the structure is such that the package CCD 4 is pressed against the package. The inner diameter of the elastic member cannot be set large. However, since the elastic member of the method of the present invention presses against the substrate, the inner diameter can be set large. Therefore, the distance between the subject light beam and the inner wall of the elastic member can be increased,
Optical problems (flare, ghost) hardly occur.

As a positioning method, there is also a method of using a bare chip CCD having an effective pixel area larger than the area required by the optical system and not performing adjustment in a plane orthogonal to the optical axis.

That is, even if the substrate is roughly mounted on the lens barrel, a bare chip CCD having a large image pickup surface so that an image obtained by the optical system is always formed on the image pickup surface is used, and unnecessary image data is not used. You can decide.

There is also a method in which a focus shift correction circuit is added and position adjustment in the tilt direction is not performed.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a first embodiment example of the present invention.

FIG. 2 is a view after assembly in FIG.

FIG. 3 is a sectional view taken along the optical axis in FIG.

FIG. 4 is a view on arrow A in FIG.

5A and 5B are views for explaining the attachment of the substrate and the bare chip CCD in FIG.

FIG. 6 is a configuration diagram of a main part of a second embodiment example.

FIG. 7 is a configuration diagram of a main part of a third embodiment example.

FIG. 8 is a cross-sectional configuration diagram of a fourth embodiment example.

9 is a perspective view of a main portion in FIG.

FIG. 10 is a cross-sectional configuration diagram of a fifth embodiment example.

FIG. 11 is a cross-sectional configuration diagram of a sixth embodiment example.

12 is a perspective view of a main portion in FIG.

FIG. 13 is a cross-sectional configuration diagram of a seventh embodiment example.

FIG. 14 is a cross-sectional configuration diagram of an eighth embodiment example.

FIG. 15 is a perspective view of FIG.

FIG. 16 is a cross-sectional configuration diagram of a ninth embodiment example.

FIG. 17 is a perspective view of FIG.

FIG. 18 is a cross-sectional configuration diagram of a tenth embodiment.

FIG. 19 is a perspective view of FIG. 18.

FIG. 20 is a configuration diagram of an eleventh exemplary embodiment.

FIG. 21 is a configuration diagram of a twelfth embodiment.

FIG. 22 is a configuration diagram of a thirteenth embodiment.

FIG. 23 is a diagram illustrating an example of a mounting structure of a conventional CCD chip enclosed in a package.

[Explanation of symbols]

 11 lens barrel 13 bare chip CCD 14 substrate

Claims (13)

[Claims] 1. A bare chip CCD mounting method for mounting a bare chip CCD on a substrate and mounting the substrate on a lens barrel for supporting an optical system, the bare chip CCD being positioned by positioning the substrate with respect to the lens barrel. Characteristic bare chip CCD mounting method. 2. The substrate has a through hole and a terminal formed on the periphery of the hole, and the bare chip CCD has an imaging surface facing the open surface of the hole of the substrate and an imaging surface of the imaging surface. The method of mounting a bare chip CCD according to claim 1, further comprising a terminal formed on a peripheral edge and connected to a terminal of the substrate, wherein a gap between the substrate and the bare chip CCD is sealed with a filler. . 3. The bare chip CCD mounting method according to claim 1, wherein the substrate and the lens barrel are attached by at least one of adhesion and screwing. 4. The bare chip CCD according to claim 1, wherein an optical filter is attached to the surface of the substrate opposite to the bare chip CCD mounting surface so as to cover the open surface of the hole. How to install. 5. The method of mounting a bare chip CCD according to claim 1, wherein an optical filter that fits into the hole is provided on a surface of the substrate opposite to a surface on which the bare chip CCD is mounted. . 6. The stepped structure in which the filter has a laminated structure composed of a plurality of filters, the filter on the substrate side is fitted in a hole penetrating the substrate, and the filter on the non-substrate side is larger than the hole. The bare chip CCD mounting method according to claim 4 or 5, wherein the bare chip CCD has a structure. 7. The bare chip CCD mounting method according to claim 1, wherein the bonding is performed over the entire circumference of the lens barrel. 8. The bare chip CCD according to claim 1, wherein the positioning of the substrate in a plane orthogonal to the optical axis adjusts the substrate while monitoring an image from the bare chip CCD. How to install. 9. The mounting of a bare chip CCD according to claim 1, wherein positioning in a plane orthogonal to the optical axis of the substrate is performed by a positioning structure formed on the lens barrel and the substrate. Method. 10. The positioning of the bare chip CCD in the optical axis direction and the tilting direction is performed by positioning the substrate in the lens barrel, the positioning in the optical axis direction being performed, and the substrate being on a plane orthogonal to the optical axis. 2. The bare chip according to claim 1, wherein
How to install the CCD. 11. An inner cylinder surface of the lens barrel is provided with a locking portion with which a surface of the optical filter opposite to a surface opposite to the bare chip CCD abuts, and a surface of the optical filter opposite to the bare chip CCD and the substrate. 11. The bare chip CCD mounting method according to claim 9, wherein an elastic member that is in contact with the inner cylindrical surface of the lens barrel over the entire circumference is press-fitted between the two. 12. The bare chip according to claim 1, wherein a bare chip CCD having an effective pixel area larger than an area required by an optical system is used, and adjustment in a plane orthogonal to an optical axis is not performed. How to install the CCD. 13. A focus shift correction circuit is added, and position adjustment in a tilt direction is not performed.
How to attach the bare chip CCD described.