JPH09175592A - Cover tape for packing electronic part - Google Patents
Cover tape for packing electronic partInfo
- Publication number
- JPH09175592A JPH09175592A JP7338791A JP33879195A JPH09175592A JP H09175592 A JPH09175592 A JP H09175592A JP 7338791 A JP7338791 A JP 7338791A JP 33879195 A JP33879195 A JP 33879195A JP H09175592 A JPH09175592 A JP H09175592A
- Authority
- JP
- Japan
- Prior art keywords
- cover tape
- ethylene
- unsaturated carboxylic
- weight
- carboxylic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012856 packing Methods 0.000 title 1
- 229920000554 ionomer Polymers 0.000 claims abstract description 22
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000005977 Ethylene Substances 0.000 claims abstract description 17
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229920001577 copolymer Polymers 0.000 claims abstract description 17
- 229910052700 potassium Inorganic materials 0.000 claims abstract description 17
- 239000011591 potassium Substances 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 14
- 238000003851 corona treatment Methods 0.000 claims abstract description 10
- 229920001684 low density polyethylene Polymers 0.000 claims abstract description 9
- 239000004702 low-density polyethylene Substances 0.000 claims abstract description 9
- 229920000573 polyethylene Polymers 0.000 claims abstract description 9
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims abstract description 8
- 230000004913 activation Effects 0.000 claims abstract description 4
- 150000005846 sugar alcohols Polymers 0.000 claims abstract description 3
- 238000007789 sealing Methods 0.000 claims description 13
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 abstract description 7
- 239000002253 acid Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000002216 antistatic agent Substances 0.000 description 4
- 229910001414 potassium ion Inorganic materials 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 238000006386 neutralization reaction Methods 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 101100160821 Bacillus subtilis (strain 168) yxdJ gene Proteins 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 150000001733 carboxylic acid esters Chemical class 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 229920001038 ethylene copolymer Polymers 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229920001567 vinyl ester resin Polymers 0.000 description 2
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- XLYMOEINVGRTEX-ARJAWSKDSA-N Ethyl hydrogen fumarate Chemical compound CCOC(=O)\C=C/C(O)=O XLYMOEINVGRTEX-ARJAWSKDSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- NPYPAHLBTDXSSS-UHFFFAOYSA-N Potassium ion Chemical compound [K+] NPYPAHLBTDXSSS-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- XLYMOEINVGRTEX-UHFFFAOYSA-N fumaric acid monoethyl ester Natural products CCOC(=O)C=CC(O)=O XLYMOEINVGRTEX-UHFFFAOYSA-N 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012968 metallocene catalyst Substances 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000012748 slip agent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、チップ型電子部品
を収納する収納空所を連続的に点在させた紙製キャリア
テープ用のカバーテープに関する。さらに詳しくは、該
キャリアテープ台紙にヒートシールした場合に、密封性
と易剥離性に優れ、剥離したときに台紙が毛羽立ちしな
い非帯電性のカバーテープに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cover tape for a carrier tape made of paper in which storage cavities for storing chip-type electronic components are continuously scattered. More specifically, the present invention relates to a non-chargeable cover tape which is excellent in hermeticity and easy peeling property when heat-sealed to the carrier tape mount, and the mount does not fluff when peeled off.
【0002】[0002]
【従来の技術】トランジスター、ダイオード、ICなど
のチップ型電子部品は、その製造後、保管や輸送時の汚
染を防止し、電子回路基板への装着を容易に行いうるよ
うに、収納空所を有するキャリアテープに収納される。
このようなキャリアテープの構造の一つとして、台紙に
連続的に点在するくり抜き部を設け、台紙の一方にバッ
クテープを接着させてくり抜き部を収納空所とし、そこ
にチップ型電子部品を収納させたのち、カバーテープを
接着させて密封するものが知られている。2. Description of the Related Art Chip type electronic components such as transistors, diodes and ICs are provided with storage cavities so that they can be easily attached to electronic circuit boards after their manufacture to prevent contamination during storage and transportation. It is stored in the carrier tape that it has.
As one of the structures of such a carrier tape, a mount portion is provided with continuous cutouts, and a back tape is adhered to one of the mounts to form the cutout portion as a storage space. It is known that a cover tape is adhered and sealed after being stored.
【0003】このようなカバーテープとして、第一に、
輸送やカバーテープ剥離時などにおける静電気発生に基
づく電子部品の損傷をさけるために、非帯電性に優れる
ものが求められている。さらにカバーテープは、台紙と
のシール性が優れる一方で容易に剥離することが求めら
れている。そしてカバーテープを剥離した場合、電子部
品に塵埃が付着しないように台紙が毛羽立ちしないこと
も求められている。As such a cover tape, firstly,
In order to prevent damage to electronic parts due to static electricity generated during transportation or peeling of a cover tape, a material having excellent antistatic property is required. Further, the cover tape is required to be easily peeled off while having excellent sealability with the mount. When the cover tape is peeled off, it is also required that the backing paper does not fluff so that dust does not adhere to the electronic components.
【0004】低密度ポリエチレンやエチレン・不飽和エ
ステル共重合体に、粘着付与剤と低分子型有機帯電防止
剤を配合したものは、適度な接着力と非帯電性を有して
おり、カバーテープ材料としてかなり優れたものである
といえるが、帯電防止剤のブリードアウトに基づく台紙
への接着力や帯電防止性能の経時的変化が懸念されてい
る。A low density polyethylene or an ethylene / unsaturated ester copolymer blended with a tackifier and a low molecular weight organic antistatic agent has a suitable adhesive force and antistatic property, and is a cover tape. It can be said that the material is considerably excellent, but there is concern that the adhesive force to the mount and the antistatic performance change over time due to the bleed-out of the antistatic agent.
【0005】[0005]
【発明が解決しようとする課題】そこで本発明者らは、
帯電防止性能が長期に持続し、台紙への密封性、易剥離
性に優れ、かつ台紙から剥離した場合にも台紙が毛羽立
ちしないようなカバーテープ材料につき検討を行った。
その結果、下記積層構成のカバー材料が上記性状を備え
ていることを見いだすに至り、本発明に到達した。SUMMARY OF THE INVENTION Accordingly, the present inventors
We investigated cover tape materials that have long-lasting antistatic performance, excellent sealability to a backing paper, and easy peeling properties, and that the backing paper does not fluff when peeled from the backing paper.
As a result, they have found that the cover material having the following laminated structure has the above-mentioned properties, and have reached the present invention.
【0006】[0006]
【課題を解決するための手段】本発明は、基材層に、必
要に応じ中間層を介し、低密度ポリエチレン及びエチレ
ン・不飽和エステル共重合体から選ばれるエチレン重合
体(A)70〜90重量部と非帯電性カリウムアイオノ
マー(B)30〜10重量部とからなるシール層を積層
してなり、該シール層が活性化処理されていることを特
徴とする電子部品包装用カバーテープに関する。According to the present invention, an ethylene polymer (A) 70 to 90 selected from low density polyethylene and an ethylene / unsaturated ester copolymer is provided in a base material layer, if necessary with an intermediate layer interposed therebetween. The present invention relates to a cover tape for packaging electronic parts, characterized in that a seal layer comprising 30 parts by weight of a non-charged potassium ionomer (B) and 30 parts by weight of the non-charged potassium ionomer is laminated, and the sealing layer is activated.
【0007】[0007]
【発明の実施の形態】本発明においては、カバーテープ
のシール層に、低密度ポリエチレン及びエチレン・不飽
和エステル共重合体から選ばれるエチレン重合体(A)
70〜90重量部、好ましくは75〜85重量部と非帯
電性カリウムアイオノマー(B)30〜10重量部、好
ましくは25〜15重量部の組成物が用いられる。BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, an ethylene polymer (A) selected from low-density polyethylene and an ethylene / unsaturated ester copolymer is used for a seal layer of a cover tape.
A composition of 70 to 90 parts by weight, preferably 75 to 85 parts by weight and 30 to 10 parts by weight, preferably 25 to 15 parts by weight of a non-charged potassium ionomer (B) is used.
【0008】上記エチレン重合体(A)としては、低密
度ポリエチレンまたはエチレン・不飽和エステル共重合
体を用いることができる。低密度ポリエチレンは、密度
が0.900〜0.935g/cm3 、好ましくは0.
905〜0.930g/cm3 のもので、高圧法によっ
て得られるもの、あるいは中・低圧法によってエチレン
と炭素数4以上のα−オレフィンと共重合することによ
って得られるものでもよい。後者の方法の代表的なもの
は、高活性チタン触媒あるいはメタロセン触媒を使用し
て、液相あるいは気相で共重合する方法であり、このよ
うな方法はすでによく知られている。As the ethylene polymer (A), low density polyethylene or ethylene / unsaturated ester copolymer can be used. The low density polyethylene has a density of 0.900 to 0.935 g / cm 3 , and preferably a density of 0.9.
It may be 905 to 0.930 g / cm 3 and may be obtained by a high pressure method, or may be obtained by copolymerizing ethylene and an α-olefin having 4 or more carbon atoms by a medium or low pressure method. A typical example of the latter method is a method in which a highly active titanium catalyst or a metallocene catalyst is used for copolymerization in a liquid phase or a gas phase, and such a method is already well known.
【0009】また、エチレン・不飽和エステル共重合体
としては、例えば不飽和エステル含量が1〜30重量
%、好ましくは5〜20重量%のものである。ここに不
飽和エステルとしては、酢酸ビニルのようなビニルエス
テル、アクリル酸メチル、アクリル酸エチル、アクリル
酸イソブチル、アクリル酸nブチル、メタクリル酸メチ
ル、メタクリル酸イソブチルなどの不飽和カルボン酸エ
ステルを例示することができる。The ethylene / unsaturated ester copolymer has an unsaturated ester content of 1 to 30% by weight, preferably 5 to 20% by weight. Examples of the unsaturated ester include vinyl esters such as vinyl acetate, unsaturated carboxylic acid esters such as methyl acrylate, ethyl acrylate, isobutyl acrylate, n-butyl acrylate, methyl methacrylate and isobutyl methacrylate. be able to.
【0010】エチレン重合体(A)としてはまた、19
0℃、2160g荷重におけるメルトフローレートが、
0.1〜200g/10分、特に1〜50g/10分の
ものが好ましい。As the ethylene polymer (A), 19
The melt flow rate at 0 ° C. and 2160 g load is
0.1 to 200 g / 10 minutes, particularly 1 to 50 g / 10 minutes are preferable.
【0011】シール層に用いられる非帯電性カリウムア
イオノマー(B)は、エチレンと不飽和カルボン酸、ま
たは更に任意成分として他の単量体とからなるエチレン
共重合体の一部または全部がカリウムで中和されたカリ
ウムアイオノマーであって、シール層に充分な非帯電性
を付与するもの、例えば23℃、30%RHにおける表
面抵抗率が1013Ω以下、好ましくは1012Ω以下とな
るようなものである。このような非帯電性カリウムアイ
オノマーは、シール層中に非帯電性向上に効果的な添加
剤の配合の有無によっても異なるが、不飽和カルボン酸
含量と中和度を適当な範囲に調整することによって得る
ことができる。ここに不飽和カルボン酸としては、アク
リル酸、メタクリル酸、無水マレイン酸、マレイン酸モ
ノエチルなどを例示できるが、とくにアクリル酸または
メタクリル酸が好ましい。また共重合成分となりうる上
記他の単量体としては、上述したビニルエステルや不飽
和カルボン酸エステルを代表例として挙げることができ
る。このような他の単量体は、上記共重合体中、例えば
0〜30重量%の割合で含有することができる。The uncharged potassium ionomer (B) used in the seal layer is a part or all of the ethylene copolymer consisting of ethylene and an unsaturated carboxylic acid or, as an optional component, another monomer, which is potassium. Neutralized potassium ionomer which imparts sufficient antistatic property to the sealing layer, for example, a surface resistivity at 23 ° C. and 30% RH of 10 13 Ω or less, preferably 10 12 Ω or less. It is a thing. Such a non-chargeable potassium ionomer varies depending on whether or not an additive effective for improving the non-charge property is blended in the seal layer, but the unsaturated carboxylic acid content and the degree of neutralization should be adjusted to an appropriate range. Can be obtained by Examples of the unsaturated carboxylic acid include acrylic acid, methacrylic acid, maleic anhydride, monoethyl maleate and the like, but acrylic acid or methacrylic acid is particularly preferable. Examples of the other monomer which can be a copolymer component include the above-mentioned vinyl ester and unsaturated carboxylic acid ester as representative examples. Such another monomer can be contained in the copolymer at a ratio of, for example, 0 to 30% by weight.
【0012】非帯電性カリウムアイオノマーとしては、
平均酸含量の異なる2種以上のエチレン・不飽和カルボ
ン酸共重合体をカリウムイオンにより中和して得られた
アイオノマーを用いるのが好ましい。そのようなアイオ
ノマーの1例として、例えば平均酸含量が10〜30重
量%、好ましくは11〜20重量%である酸含量の異な
る2種以上の共重合体、例えば最高酸含量のものと最低
酸含量のものの酸含量の差が1重量%以上、好ましくは
2〜20重量%異なる2種以上のエチレン・不飽和カル
ボン酸共重合体の、カリウムイオンによる平均中和度が
60%以上、好ましくは70%以上の混合アイオノマー
である。この場合、平均酸含量の少ないものを用いる場
合には、多価アルコールのような非帯電性向上剤を併用
することが望ましい。他の例としては、酸含量が13〜
30重量%、好ましくは15〜25重量%のエチレン・
不飽和カルボン酸共重合体のカリウムイオンによる中和
度が60%以上、好ましくは70%以上のものである。
この場合も酸含量の少ないものを用いる場合は、非帯電
性向上剤を用いるのが好ましい。As the non-charged potassium ionomer,
It is preferable to use an ionomer obtained by neutralizing two or more kinds of ethylene / unsaturated carboxylic acid copolymers having different average acid contents with potassium ions. One example of such an ionomer is, for example, two or more kinds of copolymers having different acid contents having an average acid content of 10 to 30% by weight, preferably 11 to 20% by weight, for example, the highest acid content and the lowest acid content. Of two or more kinds of ethylene / unsaturated carboxylic acid copolymers having a difference in acid content of 1 wt% or more, preferably 2 to 20 wt%, the average degree of neutralization with potassium ions is 60% or more, preferably It is a mixed ionomer of 70% or more. In this case, when using one having a low average acid content, it is desirable to use an antistatic agent such as a polyhydric alcohol together. As another example, an acid content of 13-
30% by weight, preferably 15-25% by weight of ethylene
The unsaturated carboxylic acid copolymer has a degree of neutralization with potassium ions of 60% or more, preferably 70% or more.
Also in this case, it is preferable to use a non-static property improver when using a compound having a low acid content.
【0013】シール層には、エチレン重合体(A)と非
帯電性カリウムアイオノマー(B)に加え、種々の添加
剤を配合することができる。このような添加剤として、
例えば、グリセリン、トリメチロールプロパン、ペンタ
エリスリトール、ポリエチレングリコールのような非帯
電性向上剤、酸化防止剤、各種安定剤、スリップ剤、着
色剤などを挙げることができる。非帯電性向上剤は、例
えば0.1〜5重量%、とくに0.2〜3重量%の割合
で配合すると効果的である。The seal layer may contain various additives in addition to the ethylene polymer (A) and the non-charged potassium ionomer (B). As such an additive,
Examples thereof include antistatic agents such as glycerin, trimethylolpropane, pentaerythritol and polyethylene glycol, antioxidants, various stabilizers, slip agents and colorants. The antistatic property improver is effectively added, for example, in a proportion of 0.1 to 5% by weight, particularly 0.2 to 3% by weight.
【0014】本発明のカバーテープは、基材に、中間層
を介しまたは介さずに、上記組成物からなるシール層を
形成し、シール層を活性化処理させたものである。基材
としては機械的強度の優れた熱可塑性樹脂が好ましく、
例えばポリプロピレン、ポリエチレンテレフタレート、
ナイロン6、ナイロン66などの二軸延伸フィルムが好
適な材料である。また任意に使用される中間層として
は、基材とシール層の接着性を向上させるもの、例えば
シール層の1成分であるエチレン重合体として先に例示
したものを挙げることができる。The cover tape of the present invention is one in which a seal layer made of the above composition is formed on a base material with or without an intermediate layer, and the seal layer is activated. The base material is preferably a thermoplastic resin having excellent mechanical strength,
For example, polypropylene, polyethylene terephthalate,
Biaxially oriented films such as nylon 6 and nylon 66 are suitable materials. Examples of the optionally used intermediate layer include those that improve the adhesiveness between the base material and the seal layer, such as those exemplified above as the ethylene polymer which is one component of the seal layer.
【0015】カバーテープにおける各層の厚みは任意で
あるが、例えば基材が1〜200μm、とくに10〜5
0μm、中間層が0〜50μm、とくに10〜30μ
m、シール層が5〜100μm、とくに10〜50μm
の範囲とするのが好ましい。このようなカバーテープ
は、公知の積層方法によって得ることができる。例えば
基材上にシール層を押出ラミネートする方法、基材上に
中間層とシール層を共押出ラミネートする方法などを挙
げることができる。Although the thickness of each layer in the cover tape is arbitrary, for example, the base material has a thickness of 1 to 200 μm, particularly 10 to 5
0 μm, intermediate layer 0 to 50 μm, especially 10 to 30 μm
m, the sealing layer is 5 to 100 μm, especially 10 to 50 μm
It is preferable to set it in the range. Such a cover tape can be obtained by a known laminating method. For example, a method of extrusion laminating a seal layer on a substrate, a method of co-extrusion laminating an intermediate layer and a seal layer on a substrate, and the like can be mentioned.
【0016】上記のようにして得られる積層物をそのま
まカバーテープとして用いると、台紙への接着強度が小
さすぎ、密封性に劣る。このシール層を活性化処理する
ことにより、台紙への適度な接着力を付与するととも
に、台紙から剥離した場合に、台紙の毛羽立ちを防止す
ることができる。活性化処理としては、コロナ処理、オ
ゾン処理などがあるが、コロナ処理が最も簡便で好まし
い。コロナ処理条件としては、例えば5ワット/m2 /
分以上、好ましくは10〜200ワット/m2 /分の放
電量とするのが好ましい。If the laminate obtained as described above is used as it is as a cover tape, the adhesive strength to the mount is too small and the sealing property is poor. By activating the seal layer, it is possible to impart an appropriate adhesive force to the mount and prevent fuzz of the mount when peeled from the mount. Examples of the activation treatment include corona treatment and ozone treatment, but corona treatment is the most simple and preferable. The corona treatment condition is, for example, 5 watt / m 2 /
It is preferable that the discharge amount is not less than min, preferably 10 to 200 watt / m 2 / min.
【0017】[0017]
【発明の効果】本発明のカバーテープは、電子部品包装
用キャリアテープとして優れた性質を有する。すなわち
連続的に点在するようなくり抜き部を設けた台紙にバッ
クテープを接着することにより得られる電子部品収納用
空所を連設したキャリアテープに、電子部品を収納した
のち、これを密封するためのカバーテープとして用いた
場合、本発明のカバーテープは非帯電性に優れるので、
静電気障害による電子部品の損傷を防止することができ
る。上記台紙は樹脂コートされたものであり、このよう
な台紙に本発明のカバーテープをヒートシールした場合
に、広い温度範囲でかつ適度なシール強度でシールで
き、シール強度の経時低下もないので、密封性が優れる
とともに、剥離も容易に行うことができる。また剥離時
にカバーテープが綺麗に剥がれ、台紙の毛羽立ちを起こ
すこともない。The cover tape of the present invention has excellent properties as a carrier tape for packaging electronic parts. That is, after storing electronic components in a carrier tape in which electronic component storage cavities are continuously provided, which is obtained by adhering a back tape to a mount provided with cutout portions that are continuously scattered, this is sealed. When used as a cover tape for, since the cover tape of the present invention is excellent in antistatic property,
It is possible to prevent damage to electronic components due to electrostatic damage. The mount is resin-coated, and when the cover tape of the present invention is heat-sealed to such a mount, it can be sealed in a wide temperature range and with an appropriate seal strength, and the seal strength does not deteriorate with time. It has excellent sealing properties and can be easily peeled off. In addition, the cover tape peels off neatly during peeling, and the fuzz of the mount does not occur.
【0018】[0018]
【実施例】実施例において使用した積層体の各層に使用
した材料の種類、ラミネート加工条件、コロナ処理条
件、積層体のヒートシール強度測定法等は以下の通りで
ある。EXAMPLES The types of materials used for the layers of the laminates used in the examples, the laminating conditions, the corona treatment conditions, the heat seal strength measuring method for the laminates, etc. are as follows.
【0019】1.積層体材料 (1)基材層:二軸延伸ポリプロピレンフィルム(東セ
ロ(株)製、OPU−1、厚さ20μm)1. Laminated Material (1) Base Material Layer: Biaxially Stretched Polypropylene Film (TOPU Cell Corporation, OPU-1, Thickness 20 μm)
【0020】(2)中間層:低密度ポリエチレン(三井
石油化学工業(株)製、ミラソン16、MFR=4g/
10分)(2) Intermediate layer: low-density polyethylene (Mitsui Petrochemical Industry Co., Ltd., Mirason 16, MFR = 4 g /
10 minutes)
【0021】(3)シール層樹脂 下記(a)(b)(c) からなる組成物 (a) エチレン・酢酸ビニル共重合体(酢酸ビニル含量1
0重量%、MFR9g/10分) ・・・・8
0重量% (b) 非帯電性カリウムアイオノマー 下記2種類のエチレン・メタクリル酸共重合体 メタクリル酸含量15重量%、MFR 60g/10
分 メタクリル酸含量10重量%、MFR 40g/10
分 の1/1混合物をカリウムイオンにより83モル%中和
したアイオノマー・・・・19重量%、 (c) グリセリン ・・・・・1重量% とからなる組成物(MFR=8g/10min)(3) Seal layer resin Composition comprising the following (a) (b) (c) (a) Ethylene / vinyl acetate copolymer (vinyl acetate content 1
0% by weight, MFR 9g / 10 minutes) ... 8
0% by weight (b) Non-charged potassium ionomer Two types of ethylene / methacrylic acid copolymers below: Methacrylic acid content 15% by weight, MFR 60 g / 10
Min Methacrylic acid content 10% by weight, MFR 40g / 10
A composition consisting of an ionomer obtained by neutralizing 83% by mole of a 1/1 mixture of potassium ion with 19% by weight and (c) glycerin with 1% by weight (MFR = 8 g / 10 min).
【0022】 2.ラミネート加工条件 装置 モダンマシナリー社製 押出機 65mmφ L/D=28 スクリュー スリーステージタイプ CR=4.78 ダイ インナーディッケルタイプ ダイ開口 0.8×500mm エアーギャップ 120mm ダイ設定温度 230℃ ライン速度 80m/分2. Laminating conditions Equipment Modern Machinery Extruder 65mmφ L / D = 28 Screw Three Stage Type CR = 4.78 Die Inner Deckel Type Die Aperture 0.8 × 500mm Air Gap 120mm Die Setting Temperature 230 ℃ Line Speed 80m / min
【0023】3.コロナ処理条件 装置 春日電機(株)製コロナ表面処理機 コロナ電圧 160V 電流 10A ライン速度 40m/分 コロナ処理密度 60W・分/m2 3. Corona treatment condition device Corona surface treatment machine manufactured by Kasuga Electric Co., Ltd. Corona voltage 160V Current 10A Line speed 40m / min Corona treatment density 60W ・ min / m 2
【0024】 4.ヒートシール強度測定法 シール対象基材 キャリアテープ用紙(本州製紙(株)製、HJキャリアテー プ用紙、580g/m2 ) シール条件 シール圧力 0.2MPa シール時間 0.5秒 シールバー 10×300mm 引張試験 引張速度 300mm/分 剥離角度 180度 試験片幅 5mm[0024] 4. Heat seal strength measurement method Substrate to be sealed Carrier tape paper (Honshu Paper Co., Ltd., HJ carrier tape paper, 580 g / m 2 ) Sealing conditions Seal pressure 0.2 MPa Sealing time 0.5 seconds Seal bar 10 × 300 mm Tensile Test Tensile speed 300 mm / min Peeling angle 180 degrees Specimen width 5 mm
【0025】[0025]
【実施例】基材として20μm厚の前記(1)のPP二
軸延伸フィルム、中間層として20μm厚に押出ラミネ
ートした前記(2)の低密度ポリエチレン、シール層と
して30μm厚に押出ラミネートした前記(3)のエチ
レン共重合体/カリウムアイオノマー組成物を用い、前
記ラミネート加工条件により三層構成フィルムを作成し
た。EXAMPLE A PP biaxially stretched film of (1) having a thickness of 20 μm as a substrate, a low-density polyethylene of (2) extruded and laminated to have a thickness of 20 μm as an intermediate layer, and a extrusion layer having a thickness of 30 μm as a sealing layer ( Using the ethylene copolymer / potassium ionomer composition of 3), a three-layer constitution film was prepared under the above-mentioned laminating conditions.
【0026】この三層構成フィルム及び、そのシール層
に前記条件にてコロナ処理を施したものについて、キャ
リアテープ用紙(本州製紙(株)製)とヒートシール
し、ヒートシール強度を測定した。結果を表1に示す。
本発明のコロナ処理を施した三層構成フィルムはキャリ
アテープ用紙に対するヒートシール強度がコロナ処理を
施さないものに比べて約2倍にまで向上し、なおかつそ
の強度が経時的に低下しないとの結果が得られた。また
剥離時にはカバーテープがきれいに剥がれ、台紙の毛羽
立ちを起こすこともなかった。This three-layered film and its seal layer, which had been subjected to corona treatment under the above conditions, were heat-sealed with a carrier tape paper (manufactured by Honshu Paper Co., Ltd.) and the heat-sealing strength was measured. The results are shown in Table 1.
As a result, the heat-sealing strength of the corona-treated three-layered film of the present invention against carrier tape paper was improved to about twice as much as that without corona treatment, and the strength did not decrease with time. was gotten. Moreover, the cover tape was peeled off neatly at the time of peeling, and no fuzz of the mount was caused.
【0027】[0027]
【表1】 [Table 1]
フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 B65D 73/02 B65D 73/02 B Continuation of the front page (51) Int.Cl. 6 Identification number Office reference number FI technical display location B65D 73/02 B65D 73/02 B
Claims (5)
密度ポリエチレン及びエチレン・不飽和エステル共重合
体から選ばれるエチレン重合体(A)70〜90重量部
と非帯電性カリウムアイオノマー(B)30〜10重量
部とからなるシール層を積層してなり、該シール層が活
性化処理されていることを特徴とする電子部品包装用カ
バーテープ。1. An uncharged potassium ionomer containing 70 to 90 parts by weight of an ethylene polymer (A) selected from low-density polyethylene and an ethylene / unsaturated ester copolymer in a base material layer, if necessary with an intermediate layer interposed therebetween. (B) A cover tape for packaging electronic parts, comprising a sealing layer comprising 30 to 10 parts by weight, the sealing layer being activated.
が、平均不飽和カルボン酸含有量が10〜30重量%で
あって、不飽和カルボン酸含有量の異なる2種以上のエ
チレン・不飽和カルボン酸共重合体のアイオノマーであ
る請求項1記載のカバーテープ。2. An uncharged potassium ionomer (B)
Is an ionomer of two or more kinds of ethylene / unsaturated carboxylic acid copolymers having an average unsaturated carboxylic acid content of 10 to 30% by weight and different in unsaturated carboxylic acid content. tape.
和カルボン酸含有量が13〜30重量%のエチレン・不
飽和カルボン酸共重合体のアイオノマーである請求項1
または2に記載のカバーテープ。3. The non-chargeable potassium ionomer is an ionomer of an ethylene / unsaturated carboxylic acid copolymer having an unsaturated carboxylic acid content of 13 to 30% by weight.
Or the cover tape according to 2.
5重量%の割合で配合されてなる請求項1〜3のいずれ
かに記載のカバーテープ。4. The sealing layer contains polyhydric alcohol in an amount of 0.1 to 10.
The cover tape according to any one of claims 1 to 3, wherein the cover tape is blended at a ratio of 5% by weight.
記載のカバーテープ。5. The activation treatment is a corona treatment.
The listed cover tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7338791A JPH09175592A (en) | 1995-12-26 | 1995-12-26 | Cover tape for packing electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7338791A JPH09175592A (en) | 1995-12-26 | 1995-12-26 | Cover tape for packing electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09175592A true JPH09175592A (en) | 1997-07-08 |
Family
ID=18321512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7338791A Pending JPH09175592A (en) | 1995-12-26 | 1995-12-26 | Cover tape for packing electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09175592A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004094258A1 (en) * | 2003-04-24 | 2004-11-04 | Dai Nippon Printing Co., Ltd. | Electronic part taping packaging cover tape |
| JP2009019063A (en) * | 2007-06-11 | 2009-01-29 | Du Pont Mitsui Polychem Co Ltd | Thermoplastic resin film |
| JP2011063662A (en) * | 2009-09-15 | 2011-03-31 | Du Pont Mitsui Polychem Co Ltd | Sealant material, cover tape, and packaging body for transporting electronic component |
| JP2012012032A (en) * | 2010-06-29 | 2012-01-19 | Asahi Kasei Chemicals Corp | Cover tape |
| WO2013070340A1 (en) | 2011-11-07 | 2013-05-16 | E. I. Du Pont De Nemours And Company | Method to form an aqueous dispersion of an ionomer-polyolefin blend |
| WO2016129567A1 (en) * | 2015-02-09 | 2016-08-18 | 三井・デュポンポリケミカル株式会社 | Adhesive resin and easily releasable film |
| KR20170044661A (en) * | 2014-08-15 | 2017-04-25 | 덴카 주식회사 | Cover film and electronic component packaging employing same |
-
1995
- 1995-12-26 JP JP7338791A patent/JPH09175592A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004094258A1 (en) * | 2003-04-24 | 2004-11-04 | Dai Nippon Printing Co., Ltd. | Electronic part taping packaging cover tape |
| JPWO2004094258A1 (en) * | 2003-04-24 | 2006-07-13 | 大日本印刷株式会社 | Cover tape for taping packaging of electronic parts |
| JP4500769B2 (en) * | 2003-04-24 | 2010-07-14 | 大日本印刷株式会社 | Cover tape for taping packaging of electronic parts |
| JP2009019063A (en) * | 2007-06-11 | 2009-01-29 | Du Pont Mitsui Polychem Co Ltd | Thermoplastic resin film |
| JP2011063662A (en) * | 2009-09-15 | 2011-03-31 | Du Pont Mitsui Polychem Co Ltd | Sealant material, cover tape, and packaging body for transporting electronic component |
| JP2012012032A (en) * | 2010-06-29 | 2012-01-19 | Asahi Kasei Chemicals Corp | Cover tape |
| WO2013070340A1 (en) | 2011-11-07 | 2013-05-16 | E. I. Du Pont De Nemours And Company | Method to form an aqueous dispersion of an ionomer-polyolefin blend |
| US8841379B2 (en) | 2011-11-07 | 2014-09-23 | E I Du Pont De Nemours And Company | Method to form an aqueous dispersion of an ionomer-polyolefin blend |
| KR20170044661A (en) * | 2014-08-15 | 2017-04-25 | 덴카 주식회사 | Cover film and electronic component packaging employing same |
| CN106604816A (en) * | 2014-08-15 | 2017-04-26 | 电化株式会社 | Cover film and electronic component packaging employing same |
| WO2016129567A1 (en) * | 2015-02-09 | 2016-08-18 | 三井・デュポンポリケミカル株式会社 | Adhesive resin and easily releasable film |
| CN107207927A (en) * | 2015-02-09 | 2017-09-26 | 三井—杜邦聚合化学株式会社 | Adhesive resin and release performance film |
| JPWO2016129567A1 (en) * | 2015-02-09 | 2017-11-16 | 三井・デュポンポリケミカル株式会社 | Adhesive resin and easily peelable film |
| CN107207927B (en) * | 2015-02-09 | 2019-05-10 | 三井—杜邦聚合化学株式会社 | Adhesive resin and easily peelable film |
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