JPH09258246A - Wiring board, method of manufacturing the same, and liquid crystal device including the wiring board - Google Patents

Abstract

(57) Abstract: [PROBLEMS] To improve adhesion between a metal wiring and a substrate and to achieve stable conduction between the metal wiring and a transparent electrode. A metal wiring (8) formed under a transparent electrode (9)
On the glass substrate 6, a first layer 11 made of a metal having good adhesion to the substrate 6, a second layer 12 made of a low-resistance metal on the first layer 11, and a second layer Since the third layer made of a metal for preventing the oxidation of the second layer 12 is sequentially formed on the layer 12, the adhesion between the metal wiring 8 and the glass substrate 6 is improved, and the metal Stable conduction between the wiring 8 and the transparent electrode 9 can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board, particularly a wiring board having a transparent electrode formed on a metal wiring, a method for manufacturing the wiring board, and a liquid crystal element having the wiring board.

[0002]

2. Description of the Related Art TN (Twisted Nematic) and STN (Sutured Nematic)
In a liquid crystal device such as a per Twisted Nematic (Twisted Nematic) type, a transparent electrode formed on a glass substrate has conventionally been provided with ITO (In).
dium TinOxide) film is commonly used.

Since the above-mentioned ITO film forming the transparent electrode has a high resistance value, the delay of the applied voltage waveform has become a problem with the recent increase in the display area and the definition. In particular, the liquid crystal element using the ferroelectric liquid crystal has a narrow cell gap of 1 to 3 μm, so that the delay of the voltage waveform is remarkable. It is also possible to form a thick transparent electrode in order to reduce the resistance value, but if the film thickness is made thick, it takes time to form the film, the cost is high, and the transparency is deteriorated. there were.

In order to solve such a problem, an electrode substrate has been proposed in which a transparent electrode having a small film thickness is provided side by side to form a metal wiring having a low resistance value (for example, Japanese Unexamined Patent Publication No. HEI-2)
-63019). The electrode substrate disclosed in this publication is one in which a metal wiring is embedded with a transparent insulator, and a transparent electrode such as an ITO film is formed on the metal wiring having a metal pattern exposed on the surface.

When manufacturing an electrode substrate having the above-mentioned structure, an electrode substrate having a structure in which a transparent resin is used as an insulating material for filling and flattening between metal wirings has been proposed (for example, JP-A-6-347810). Issue).

When an electrode substrate (wiring substrate) is manufactured by forming such a low-resistivity metal wiring on a base glass substrate which constitutes a transparent electrode, conventionally, for example, FIGS.
The manufacturing method as shown in FIG.

First, a predetermined amount of UV (ultraviolet) curing resin 102 is dropped on a smooth transparent template 101 surface by a quantifying jig (not shown) (see FIG. 10A). next,
A glass substrate 104 on which metal wiring 103 having a film thickness of about 1 μm is previously formed is placed on a template 101 on which the UV curing resin 102 is dropped, and the UV curing resin 102 is sandwiched with the metal wiring 103 facing the template 101. Contact (Fig. 1
0 (b)). The metal wiring 103 can be formed, for example, by forming a metal film layer of copper or the like on the glass substrate 104 by a sputtering method or the like and then patterning by a photolithography method. Next, the template 101 and the glass substrate 104
A pair of objects sandwiching the UV curable resin 102 with the press machine 10
5 and pressurize the template 101 and the glass substrate 104 into close contact (see FIG. 11A). At this time, the UV curing resin 102 is removed from the surface of the metal wiring 103 or an extremely thin resin is used so that the transparent electrode such as an ITO film and the metal wiring 103 contact with each other in a later step to maintain the electrical conductivity. The template 101 and the glass substrate 104 are strongly and uniformly adhered to the entire surface of the substrate so that the remaining amount remains.

Next, in order to cure the UV curable resin 102, an integrated product of the template 101 and the glass substrate 104 is taken out from the press machine 105 and UV is applied from the template 101 side.
The (UV) light 106 is irradiated to cure the UV curable resin 102 (see FIG. 11B).

Next, the template 1 is removed by a releasing jig (not shown).
The glass substrate 104 and the UV curable resin 102 are separated from 01 (see FIGS. 11C and 11D), and an ITO film is formed on the UV curable resin 102 so as to make electrical contact with the metal wiring 103. An electrode substrate (wiring substrate) 100 in which a transparent electrode 107 is formed and a UV curable resin 102 is embedded.
Was obtained (see FIG. 11 (e)).

[0010]

By the way, an electrode substrate (wiring substrate) manufactured by the above-described conventional manufacturing method.
In 100, Cu (copper), which has the smallest volume resistance value of 2 to 10 × 10 ⁻⁸ Ωm, is generally used as the metal of the metal wiring 103. The metal wiring 103 made of copper is
It is the most economical because the film thickness can be set thinner and the material cost is lower than when other metals are used.

However, when copper is used as the metal wiring 103, the metal wiring 103 made of copper has a small adhesion to the glass substrate 104, and therefore, FIG.
In the releasing step shown in (d), the glass substrate 104 is removed when the integrated body of the glass substrate 104 and the UV curable resin 102 is released from the template 101 by a releasing jig (not shown).
Therefore, the metal wiring 103 may be peeled off, and the yield of the obtained electrode substrate (wiring substrate) 100 may be significantly reduced.

Further, the copper forming the metal wiring 103 is a metal that is easily oxidized, and IT is used in the step shown in FIG.
When the transparent electrode 107 such as an O film is formed on the metal wiring 103, by the surface oxidation of copper forming the metal wiring 103,
There is a problem that stable electrical conduction with the transparent electrode cannot be obtained.

In view of the above, the present invention is a wiring which can improve the adhesion between the metal wiring and the substrate on which the metal wiring is formed, and can achieve stable conduction between the metal wiring and the transparent electrode formed thereon. An object of the present invention is to provide a substrate, a method for manufacturing the substrate, and a liquid crystal device including the wiring substrate.

[0014]

In order to solve the above problems, a metal wiring having a wiring pattern on a surface of a substrate and a resin filled between the metal wiring with substantially the same thickness as the metal wiring. And a transparent electrode formed on the resin so as to be in electrical contact with the metal wiring, wherein the metal wiring is made of a metal having good adhesion to the substrate. A first layer, a second layer made of a low resistance metal on the first layer, and a third layer made of a metal for preventing the oxidation of the second layer on the second layer in this order. It is characterized in that it is formed into a multilayer structure.

Also, a first step of forming metal wiring on the substrate, a second step of filling a resin between the metal wirings, and a third step of irradiating the resin with light to cure the resin. ,
A fourth step of forming the transparent electrode on the resin so as to make electrical contact with the metal wiring, in the first step, the substrate is formed on the substrate in the first step. A first layer made of a metal having good adhesion is formed, a second layer made of a low-resistance metal is formed on the first layer, and a second layer made of the second layer is formed on the second layer. It is characterized in that the metal wiring having a multi-layered structure is formed by forming a third layer made of a metal for preventing oxidation.

Further, in a liquid crystal element in which a liquid crystal is sandwiched between a pair of electrode substrates arranged to face each other, at least one of the electrode substrates is a substrate and a metal having a wiring pattern on the substrate surface. A wire and a resin filled between the metal wires to have substantially the same thickness as the metal wires;
A transparent electrode formed on the resin so as to be in electrical contact with the metal wiring, the metal wiring on the substrate, a first layer made of a metal having good adhesion to the substrate, A multi-layer structure in which a second layer made of a low resistance metal and a third layer made of a metal for preventing the oxidation of the second layer are sequentially formed on the first layer and the second layer. It is characterized by

[0017]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic sectional view showing a liquid crystal element provided with a wiring board according to a first embodiment of the present invention. The liquid crystal element 1 is provided with electrode substrates 3a and 3b, which are a pair of wiring substrates arranged facing each other between the polarizing plates 2a and 2b, and the electrode substrates 3a and 3b are granular spacers 4 having a uniform diameter. A predetermined cell gap (for example, 1.5 μm)
A chiral smectic liquid crystal 5 which is a ferroelectric liquid crystal having bistability against an electric field is injected between them and sealed by a seal member (not shown).

The electrode substrates (wiring substrates) 3a and 3b are glass substrates 6a and 6b, and UV (ultraviolet) curing resin 7 which is an insulating film on the glass substrates 6a and 6b (the electrode substrate 3b side is not shown). The metal wirings 8a and 8b having a three-layer structure embedded therein and the transparent electrodes 9a and 9b formed of the ITO film and formed on the metal wirings 8a and 8b and in electrical contact with the metal wirings 8a and 8b. Each is configured.
Alignment films 10a and 10b are formed on the transparent electrodes 9a and 9b, respectively.

Metal wiring 8a, 8 of each electrode substrate 3a, 3b
b and the transparent electrodes 9a and 9b are respectively formed in stripes and arranged in a simple matrix, and pixels are formed at the intersections thereof.

The glass substrates 6a and 6b have a thickness of about 1 mm, which is often used for liquid crystal substrates, and may be made of a common material such as soda glass (blue plate glass), and both surfaces are polished to have a high degree of parallelism. Those are preferable.

The UV curable resin 7 is a mixture of UV curable resin monomers, oligomers and photoinitiators, and may be of any polymerization type such as acryl type, epoxy type, ene / thiol type, etc. It is necessary to have heat resistance, chemical resistance, and cleaning resistance that can withstand the ITO sputter film forming process and the alignment film baking process. For example, those obtained by introducing a heat-resistant molecular structure into the reactive oligomer which is the main component, and those obtained by increasing the crosslink density by a polyfunctional monomer are preferable.

The UV curable resin 7 is irradiated with UV (ultraviolet) light. However, other than the UV curable resin, it is possible to use a resin which is cured by irradiation with visible light or infrared light.

The metal wirings 8a and 8b have underlying layers 11a and 11b formed on the glass substrates 6a and 6b, low resistance metal layers 12a and 12b formed thereon, and protective layers 13a and 13b formed thereon. It has a three-layer structure.

As the underlayers 11a and 11b, for example, T
i (titanium), Mo (molybdenum), W (tungsten), Al (aluminum), Ta (tantalum), Ni
A thin film made of a metal such as (nickel) having good adhesion to the glass substrates 6a and 6b, or an alloy thereof is preferably used. Further, as the low resistance metal layers 12a and 12b, for example, thin films made of low resistance Cu (copper) are preferably used. Further, as the protective layers 13a and 13b, for example, a high melting point metal such as Mo (molybdenum), Ta (tantalum), W (tungsten), Ti (titanium), or a thin film functioning as an antioxidant film made of an alloy thereof is used. It is preferably used.

Next, the electrode substrate 3 of the liquid crystal element 1 described above
A method of manufacturing the wiring board according to the present embodiment applied to a and 3b will be described with reference to FIGS.

First, for example, 500 liters of Mo (molybdenum) having good adhesion to the glass substrate 6 is sputtered on the entire surface of the transparent glass substrate 6 having a size of 300 × 310 mm and a thickness of 1.1 mm and polished on both sides. After forming the underlayer 11 with a film thickness of about 1 μm, a low resistance Cu (copper) film with a film thickness of about 1 μm is formed thereon by, for example, a sputtering method to form the low resistance metal layer 12. On top of that, Ta which functions as an antioxidant film is formed by, for example, a sputtering method.
(Tantalum) is deposited to a thickness of about 500Å to form a protective layer 1
3 was formed (see FIG. 2 (a)).

Next, by the photolithography method,
A photoresist (not shown) is applied to the entire surface of the protective layer 13 by a spin coating method so as to have a thickness of about 2 μm, prebaked, and a photomask (not shown) having a desired pattern is used to expose an exposure device (for example, Canon ) Manufactured by the company, trade name: MPA-1500), for example, 80 mmJ / c
Exposure with m ² energy, photomask (not shown)
Is developed and post-baked to form a photoresist pattern (not shown), which is then subjected to etching treatment with an etching solution to form a stripe-shaped base layer 11 having a width of 20 μm and a pitch of 320 μm on the glass substrate 6, and a low resistance. The metal wiring 8 composed of three layers of the metal layer 12 and the protective layer 13 was patterned (see FIG. 2B).

Next, on the surface of the smooth and transparent template 14,
A UV (ultraviolet) curing resin (for example, a resin consisting of 50 parts by weight of pentaerythritol triacrylate, 50 parts by weight of neopentyl glycol diacrylate, and 2 parts by weight of 1-hydroxycyclohexyl phenyl ketone) 7 is quantified with a jig (not shown). A predetermined amount is dropped (see FIG. 2C), and the glass substrate 6 having the metal wiring 8 shown in FIG. 2B formed on the template 14 on which the UV curable resin 7 is dropped.
With the metal wiring 8 side facing the template 14 so as to sandwich the UV curable resin 7 (see FIG. 2D).

Next, a predetermined pressure (for example, pressing pressure 3
Tons) to bring them into close contact with each other (FIG. 3 (a))
reference). At this time, in order to keep the transparent electrode such as an ITO film and the metal wiring 8 in contact with each other in a later process to maintain the conductivity, UV
The cured resin 7 is removed from the surface of the metal wiring 8, or the template 14 and the glass substrate 6 are strongly and uniformly adhered to the entire surface of the substrate so that the resin remains in an extremely thin thickness.

After that (for example, after about 10 minutes), UV light (for example, four 100 w high-pressure mercury lamps) was applied to the integrated glass substrate 6 and template 14 removed from the press 15 from the template 14 side. The UV curing resin 7 is cured by irradiating the UV light 16 emitted from the configured ultraviolet lamp (see FIG. 3B).

The press 1 for pressing the UV curable resin 7
As 4, a press machine using a hydraulic cylinder or an air cylinder, a roll press machine, or the like can be used. In addition, when pressure is applied by the press machine 14, UV is applied by heating through an electric heater or a heating fluid.
The clay of the cured resin 7 decreases and spreads well on the glass substrate 6.

Next, the template 1 is released by a releasing jig (not shown).
The glass substrate 6 and the UV curable resin 7 are separated from the glass substrate 4 (see FIGS. 3C and 3D), and the metal wiring 8 is electrically connected to the UV curable resin 7 so that the metal wiring 8 is electrically connected to the metal wiring 8. A transparent electrode 9 made of, for example, an ITO film having a width of 300 μm is formed by sputtering in accordance with the pattern and patterned, and an alignment film (not shown) is formed on the transparent electrode 9, and a wiring substrate (electrode of the liquid crystal element 1 of FIG. 1 is formed. 3 (corresponding to the substrates 3a and 3b) was obtained (see FIG. 4).

Then, two of these wiring boards 3 are prepared and arranged so as to face each other, and they are bonded together with a cell gap of about 1.5 μm, and a chiral smectic liquid crystal is injected between them, whereby the liquid crystal element 1 shown in FIG. 1 is obtained. Obtained.

As described above, in this embodiment, the metal wiring 8 has three layers of the underlayer 11, the low-resistance metal layer 12, and the protective layer 13, and the lower surface of the glass substrate 6 having good adhesion to the glass substrate 6. Strata (Mo (molybdenum) film in this embodiment) 1
1 is formed, and a protective layer (Ta (tantalum) film in this embodiment) 13 functioning as an antioxidant film is formed on the low resistance metal layer (Cu (copper) film in this embodiment) 12 of the intermediate layer. With this structure, when the glass substrate 6 and the UV curable resin 7 are separated from the template 14 by a releasing jig (not shown) in the releasing step shown in FIGS. 3C and 3D. ,
Peeling between the glass substrate 6 and the underlying layer 11 of the metal wiring 8 was suppressed, and the yield could be significantly improved.

Further, by forming the protective layer 13 functioning as an antioxidant film on the low resistance metal layer 12 of the metal wiring 8, stable conduction between the metal wiring 8 and the transparent electrode 9 can be obtained.

Further, the liquid crystal element 1 provided with the wiring substrate 3 (corresponding to the electrode substrates 3a and 3b of the liquid crystal element 1 in FIG. 1) having the metal wiring 8 has the glass substrates 6a and 6b and the metal wiring 8a. , 8b are suppressed from being peeled off, and the metal wiring 8
Since a and 8b and the transparent electrodes 9a and 9b are stably conducted, high-quality display can be performed.

Further, this liquid crystal element 1 has a transparent electrode 9a,
Due to the structure in which the metal wirings 8a and 8b are provided underneath 9b, the resistance value of the electrode is reduced, so that the ferroelectric liquid crystal (chiral smectic liquid crystal in this embodiment) is formed.
The delay of the voltage waveform can be reduced even by using.

Further, this liquid crystal element 1 has metal wiring 8a,
Since it is not necessary to increase the film thickness of the transparent electrodes 9a and 9b due to the provision of the 8b, the transparent electrodes 9a and 9b are not perceived and the transparent electrodes 9a and 9b are not recognized.

For comparison with the above-described embodiment, when the protective layer 13 of the metal wiring 8 is formed of Al (aluminum) instead of Ta (tantalum), the protective layer 13 is formed between the protective layer 13 and the transparent electrode 9 on the protective layer 13. A wiring with poor continuity was confirmed at. This is because Al (aluminum) is oxidized and Al ₂ O ₃ appears on the surface.
It is considered that this is due to the formation of the non-conductive film.

When a non-oxidizing metal such as Au (gold) or Pt (platinum) is used as the protective layer 13, Au (gold)
Is a low resistance metal layer (Cu (copper) film in this embodiment) 12
Adhesion is difficult, and Au (gold) and Pt (platinum) require a special etchant for patterning, which complicates the etching process and is not efficient.

Further, when Cr (chrome) is used as the underlayer 11 and the protective layer 13, Cr (chrome) requires a special waste liquid treatment device because the etching waste liquid generated during patterning is toxic. And, the cost becomes high.

From the above, the metals used for the underlayer 11 are Mo (molybdenum) and Ti as described above.
(Titanium), W (tungsten), Al (aluminum), Ta (tantalum), Ni (nickel), or alloys thereof are suitable, and the metal used for the protective layer 13 is Ta (tantalum) as described above. , Mo (molybdenum), W (tungsten), Ti (titanium), or alloys thereof are suitable.

FIGS. 5 (a) and 5 (b) show the electrode substrates 3a, 3 of the above-described liquid crystal element 1 according to the second embodiment of the present invention.
3 is a schematic view of a wiring board applied to b.

In this embodiment, as shown in FIG. 5A, the entire surface of a transparent glass substrate 6 having a size of 300 × 310 mm and a thickness of 1.1 mm and having both sides polished, for example, a glass by a sputtering method. A metal (for example, Mo) having good adhesion to the substrate 6 is formed to a film thickness of about 500 Å to form the underlayer 11, and the metal (for example, Mo) for the underlayer 11 and the underlayer are formed thereon. The metal (for example, Cu) of the low-resistance metal layer 12 formed on 11 is simultaneously sputtered by, for example, a sputtering method to form a first mixing layer 17 with a film thickness of about 500 Å, and then the first mixing layer 17 is formed. On the mixing layer 17, the low resistance metal layer 12 is formed by depositing a low resistance metal (eg, Cu) with a film thickness of about 1 μm by, for example, a sputtering method.

Next, a metal (for example, Cu) of the low resistance metal layer 12 and a metal (for example, Ta) of the protective layer 13 are simultaneously sputtered on the low resistance metal layer 12 by, for example, a sputtering method to obtain 500 Å. After the second mixing layer 18 is formed to a film thickness of about the same, the second mixing layer 1 is formed.
A metal (for example, Ta) that functions as an anti-oxidation film is formed on the film 8 by sputtering, for example, to a film thickness of about 500 Å to form the protective layer 13.

After that, through a step similar to that of the first embodiment, a metal composed of the underlayer 11, the first mixing layer 17, the low resistance metal layer 12, the second mixing layer 18 and the protective layer 13 is formed. The wiring 19 is embedded with the UV curable resin 7, the transparent electrode 9 and the alignment film (not shown) are formed on the metal wiring 19, and the wiring board (the electrode substrates 3a, 3a of the liquid crystal element 1 of FIG. 1) is formed.
20 (corresponding to b) was obtained (see FIG. 5 (b)).

As described above, in this embodiment, in addition to the effects obtained in the first embodiment, the interface between the underlying layer 11 and the low resistance metal layer 12 of the metal wiring 19 and the low resistance metal layer 12 are obtained.
By the structure in which the first mixing layer 17 and the second mixing layer 18 in which the elements constituting the respective interfaces are mixed are formed on the interface between the protective layer 13 and the protective layer 13, in the releasing step as in the first embodiment, When the integrated body of the glass substrate 6 and the UV curable resin 7 is peeled from the template 14 by a releasing jig (not shown), the base layer 11 of the glass substrate 6 and the metal wiring 19,
Since the low resistance metal layer 12 and the protective layer 13 were in good contact with each other via the first mixing layer 17 and the second mixing layer 18, no peeling was observed at each interface.

FIGS. 6 (a) and 6 (b) show the electrode substrates 3a, 3 of the above-described liquid crystal element 1 according to the third embodiment of the present invention.
3 is a schematic view of a wiring board applied to b.

In this embodiment, for example, the size is 300 × 3.
An unsaturated metal oxide film layer 21 having a film thickness of about 500 Å is formed on the entire surface of a transparent glass substrate 6 having a thickness of 10 mm and a thickness of 1.1 mm by double-side polishing (see FIG. 6).
(See (a)), and similarly to the first embodiment, an underlayer 11, a low resistance metal layer 12, and a protective layer 13 are formed thereon by, for example, sputtering, and a width of 20 μm is formed by a photolithography etching method.
A metal wiring 22 having a three-layer structure was prepared by patterning a stripe shape having a pitch of m and a pitch of 320 μm.

The metal oxide film 21 is made of, for example, Mo, Ti, T.
It was formed by a reactive sputtering method in which a, Ni, W, or an alloy thereof was used as a sputtering target and sputtering was performed in plasma in which oxygen was mixed in Ar gas.

After that, through the same steps as those in the first embodiment, the metal wiring 22 is embedded with the UV curable resin 7, the transparent electrode 9 and the alignment film (not shown) are formed on the metal wiring 22, and the wiring is formed. Substrate (electrode substrates 3a, 3b of the liquid crystal element 1 of FIG. 1
(Corresponding to the above) was obtained (see FIG. 6 (b)).

As described above, in this embodiment, due to the structure in which the metal oxide film 21 is formed between the glass substrate 6 and the metal wiring 22, in addition to the effects obtained in the first embodiment, the glass substrate 6 side is provided. Reflection of external light incident from the interface between the glass substrate 6 and the metal wiring 22 could be greatly reduced by the metal oxide film 21. At this time, the light reflectance at the interface between the glass substrate 6 and the metal wiring 22 was measured and found to be 10%.
It was reduced below. Further, since the liquid crystal element provided with this wiring board (corresponding to the electrode substrates 3a and 3b of the liquid crystal element 1 of FIG. 1) 23 can reduce the reflection of external light by the metal oxide film 21 of the metal wiring 22, The display quality can be improved.

7 (a), 7 (b) and 7 (c) show manufacturing steps of a wiring board applied to the electrode boards 3a and 3b of the liquid crystal element 1 according to the fourth embodiment of the present invention. It is shown schematically.

In this embodiment, the underlying layer 11 and the low resistance metal layer 1 are formed on the glass substrate 6 as in the first embodiment.
2. The protective layer 13 is formed by sputtering, for example, and is patterned into a stripe shape having a width of 20 μm and a pitch of 320 μm by a photolithographic etching method to form a metal wiring 8 having a three-layer structure, and then the metal wiring 8 on the glass substrate 6 is formed. A pigment-based color filter 24 including red (R), green (G), and blue (B) pixels is formed between them by a photolithographic etching method to have a film thickness of about 1 μm (FIG. 7).
(A)).

Thereafter, in the same process as in the first embodiment, the UV curable resin 7 is filled between the metal wirings 8 on the color filter 24 and cured (see FIG. 7B), and the metal wirings 8 are formed. Width of 300μ
m, a transparent electrode 9 made of an ITO film having a pitch of 320 μm is formed by sputtering, and an alignment film (not shown) is formed on the transparent electrode 9 to form a wiring substrate (on the electrode substrates 3a and 3b of the liquid crystal element 1 of FIG. 1). 25 was obtained (corresponding) (FIG. 7).
(C)).

As described above, according to this embodiment, the first wiring board 25 having the color filter function is also provided.
In the same manner as in the above embodiment, the metal wiring 8 has a three-layer structure of the underlayer 11, the low resistance metal layer 12, and the protective layer 13, and the glass substrate 6
An underlayer (Mo (molybdenum) film in this embodiment) 11 having good adhesion to the glass substrate 6 is formed on the surface of, and a low resistance metal layer (Cu (copper) film in this embodiment) 12 as an intermediate layer is formed.
With a structure in which a protective layer (Ta (tantalum) film in the present embodiment) 13 that functions as an anti-oxidation film is formed on the template plate by a releasing jig (not shown) as in the first embodiment. When the integrated body of the glass substrate 6 and the UV curable resin 7 is peeled from the substrate 14, the underlayer 11 of the glass substrate 6 and the metal wiring 8
It was possible to suppress the peeling from the substrate and to significantly improve the yield.

Further, by forming the protective layer 13 functioning as an anti-oxidation film on the low resistance metal layer 12 of the metal wiring 8, stable conduction between the metal wiring 8 and the transparent electrode 9 can be obtained.

The color filter 24 can be formed by a printing method, a sublimation transfer method, or an ink jet method other than the photolithographic etching method.

Further, as shown in the second embodiment, the metal wiring 8 is formed at the interface between the underlayer 11 and the low resistance metal layer 12 and at the interface between the low resistance metal layer 12 and the protective layer 13, respectively. The first mixing layer and the second mixing layer may be formed by mixing the elements constituting the interface of
As shown in the above embodiment, a metal oxide film may be formed between the glass substrate 6 and the metal wiring 8.

FIGS. 8A, 8B and 8C show a manufacturing process of a wiring substrate applied to the electrode substrates 3a and 3b of the liquid crystal element 1 described above according to the fifth embodiment of the present invention. It is shown schematically.

In this embodiment, first, a hydrophilic acrylic ink receiving layer (color filter layer) 26 is formed on the glass substrate 6 used in the first embodiment, for example, by spin coating to form a 0.8 μm film. After being formed to a thickness, an ink-jet printer for color filters (not shown) is used to form an aqueous dye ink for color filters, for example, with a width of 3
A color filter 27 is formed by driving the ink into the ink receiving layer 26 at a pitch of 00 μm and a pitch of 320 μm, and then heating at 200 ° C. for 30 minutes for curing treatment (FIG. 8A).
reference).

Then, on the color filter 27, as in the first embodiment, the underlayer 11 and the low resistance metal layer 1 are formed.
2. The protective layer 13 was formed by sputtering, for example, and patterned by a photolithographic etching method in a stripe shape having a width of 20 μm and a pitch of 320 μm to produce a metal wiring 8 having a three-layer structure (see FIG. 8A).

Then, in the same process as in the first embodiment, the UV curable resin 7 is filled between the metal wirings 8 on the color filter 27 and cured (see FIG. 8B), and the metal wirings 8 are formed. A transparent electrode 9 made of, for example, an ITO film having a width of 300 μm and a pitch of 320 μm is formed by sputtering in accordance with the wiring pattern and patterned, and an alignment film (not shown) is formed on the transparent electrode 9 to form a wiring substrate (the liquid crystal element of FIG. 1). 28 (corresponding to the electrode substrates 3a and 3b of No. 1) was obtained (FIG. 8C).
reference).

As described above, according to the present embodiment, the wiring board 28 having the metal wiring 8 on the color filter 27.
In the same manner as in the first embodiment, the metal wiring 8 has a three-layer structure of the underlayer 11, the low resistance metal layer 12, and the protective layer 13, and the underlayer having good adhesion to the glass substrate 6 is provided on the surface of the glass substrate 6. (Mo (molybdenum) film in this embodiment) 11
To form an intermediate low resistance metal layer (in this embodiment, C
Due to the structure in which the protective layer (Ta (tantalum) film in the present embodiment) 13 functioning as an anti-oxidation film is formed on the u (copper) film 12, in the mold release step as in the first embodiment, When the glass substrate 6 and the UV curable resin 7 are separated from the template 14 by a releasing jig (not shown), the glass substrate 6 and the underlying layer 11 of the metal wiring 8 are prevented from being separated, and the yield is improved. We were able to achieve a significant improvement in

Further, by forming the protective layer 13 functioning as an antioxidant film on the low resistance metal layer 12 of the metal wiring 8, stable conduction between the metal wiring 8 and the transparent electrode 9 can be obtained.

9 (a), 9 (b) and 9 (c) show the manufacturing process of the wiring substrate applied to the electrode substrates 3a and 3b of the liquid crystal device 1 according to the sixth embodiment of the present invention. It is shown schematically.

In this embodiment, a color filter 27 is formed on the ink receiving layer (color filter layer) 26 on the glass substrate 6 used in the first embodiment in the same manner as in the fifth embodiment. Further, a color filter protective layer (for example, a polyamide-based transparent coating agent) 29 was formed on its surface by spin coating and baking to a film thickness of about 0.5 μm. After that, as in the first embodiment, the underlayer 1 is formed on the color filter protective layer 29.
1. The low resistance metal layer 12 and the protective layer 13 were formed by sputtering, for example, and patterned by a photolithographic etching method in a stripe shape having a width of 20 μm and a pitch of 320 μm to produce a metal wiring 8 having a three-layer structure (see FIG. See a)).

Then, in the same process as in the first embodiment, the UV curable resin 7 is filled between the metal wirings 8 on the color filter 27 and hardened (see FIG. 9B), and the metal wirings 8 are formed. A transparent electrode 9 made of, for example, an ITO film having a width of 300 μm and a pitch of 320 μm is formed by sputtering in accordance with the wiring pattern and patterned, and an alignment film (not shown) is formed on the transparent electrode 9 to form a wiring substrate (the liquid crystal element of FIG. 1). 1 (corresponding to the electrode substrates 3a and 3b) 30 was obtained (FIG. 8C).
reference).

As described above, according to the present embodiment, even in the wiring board 30 having the metal wiring 8 on the color filter protection layer 29 of the color filter 27, the metal wiring 8 is formed under the same condition as in the first embodiment. Formation 11, low resistance metal layer 1
2. A three-layer structure of the protective layer 13 is formed, and a base layer (Mo (molybdenum) film in this embodiment) 11 having good adhesion to the glass substrate 6 is formed on the surface of the glass substrate 6, and a low resistance metal of the intermediate layer is formed. A protective layer (Ta in the present embodiment) functioning as an antioxidant film is formed on the layer (Cu (copper) film in the present embodiment) 12.
Due to the structure in which the (tantalum) film 13 is formed, in the releasing step as in the first embodiment, the glass plate 6 and the UV curing resin 7 are removed from the template 14 by the releasing jig (not shown).
It was possible to suppress the peeling between the glass substrate 6 and the underlying layer 11 of the metal wiring 8 when peeling the integrated body, and to significantly improve the yield.

Further, by forming the protective layer 13 functioning as an anti-oxidation film on the low resistance metal layer 12 of the metal wiring 8, stable conduction between the metal wiring 8 and the transparent electrode 9 can be obtained.

Further, the color filter protective layer 29 formed on the color filter 27 can prevent the color filter 27 from being discolored by an etching solution such as an acid when the metal wiring 8 is formed by the photolithographic etching method. .

Furthermore, in each of the fourth to sixth embodiments described above, as shown in the second embodiment, the interface between the underlying layer 11 of the metal wiring 8 and the low resistance metal layer 12, and the low resistance. At the interface between the metal layer 12 and the protective layer 13, a first mixing layer and a second mixing layer may be formed in which the elements forming the respective interfaces are mixed, and further, as shown in the third embodiment. Thus, a metal oxide film may be formed between the glass substrate 6 and the metal wiring 8.

[0074]

As described above, according to the present invention,
The metal wiring is formed on the substrate by a first layer made of a metal having good adhesion to the substrate, a second layer made of a low-resistance metal on the first layer, and a second layer formed on the second layer. Since the third layer made of a metal for preventing the oxidation of the second layer is sequentially formed to have a multilayer structure, the substrate and the metal wiring are well adhered to each other, and stable conduction between the metal wiring and the transparent electrode is provided. It is possible to provide a wiring board that can achieve the above.

Further, according to the method for manufacturing a wiring board of the present invention, the first layer made of a metal having good adhesion to the substrate is formed on the substrate, and the low resistance film is formed on the first layer. A second layer of metal is formed, and the second layer is formed on the second layer.
By forming a third layer made of a metal for preventing the oxidation of the above layer to form a metal wiring having a multi-layered structure, the substrate and the metal wiring are well adhered to each other, the yield is improved, and the metal wiring is transparent. Stable conduction with the electrodes can be achieved.

Further, according to the liquid crystal element provided with the wiring substrate according to the present invention, the substrate and the metal wiring are well adhered to each other, and the metal wiring and the transparent electrode are stably conducted, so that the quality is high. The display can be done.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing a liquid crystal element including a wiring board according to a first embodiment of the present invention.

2A and 2B are views for explaining the method of manufacturing the wiring board according to the first embodiment, where FIG. 2A is a view showing a film forming process of a metal layer for forming a metal wiring, and FIG. The figure which shows the metal wiring which is formed in Figure, (c) the figure which shows the state where the UV hardening resin is dripped onto the mold board, (d) the state which sandwiches the UV hardening resin on the mold board with the baseplate where the metal wiring is formed FIG.

FIG. 3 is a diagram for explaining the method of manufacturing the wiring board according to the first embodiment, in which (a) is a U sandwiched between the board and the template.
The figure which shows the state which presses V hardening resin with the press machine,
(B) is a figure which shows the state which irradiates UV light to UV curing resin, (c), (d) is a figure which shows the state which peeled the template from the metal wiring of a board | substrate.

FIG. 4 shows a first obtained by forming a transparent electrode on a metal wiring.
FIG. 6 is a diagram showing a wiring board according to the embodiment of FIG.

5A and 5B are views for explaining a method of manufacturing a wiring board according to a second embodiment, FIG. 5A is a diagram showing a film forming process of a metal layer for forming metal wiring, and FIG. 5B is a metal wiring. The figure which shows the wiring board which concerns on 2nd Embodiment obtained by forming a transparent electrode on it.

6A and 6B are views for explaining a method for manufacturing a wiring board according to a third embodiment, FIG. 6A is a diagram showing a metal layer forming process for forming a metal wiring, and FIG. 6B is a metal wiring. The figure which shows the wiring board which concerns on 3rd Embodiment obtained by forming a transparent electrode on it.

7A and 7B are views for explaining a method of manufacturing a wiring board according to a fourth embodiment, FIG. 7A shows a state in which a color filter is formed between metal wirings, and FIG. 7B is a color filter. The figure which shows the state which filled up UV hardening resin on it and hardened | cured, (c) is a figure which shows the wiring board which concerns on 4th Embodiment obtained by forming a transparent electrode on UV hardening resin.

8A and 8B are views for explaining a method of manufacturing a wiring board according to a fifth embodiment, FIG. 8A shows a state in which metal wiring is formed on a color filter, and FIG. The figure which shows the state which filled with UV curable resin and hardened | cured, and (c) is a figure which shows the wiring board which concerns on 5th Embodiment obtained by forming a transparent electrode on UV curable resin.

FIG. 9 is a view for explaining the method of manufacturing the wiring board according to the sixth embodiment, FIG. 9A is a view showing a state in which metal wiring is formed on the color filter via a color filter protective layer; (B) is a diagram showing a state in which a UV curable resin is filled on the color filter protective layer and cured, and (c) is UV.
The figure which shows the wiring board which concerns on 6th Embodiment obtained by forming a transparent electrode on hardened resin.

10A and 10B are views for explaining a method for manufacturing a wiring board according to a conventional example, in which FIG. 10A is a view showing a state in which a UV curable resin is dropped on a template, and FIG. 10B is a board having metal wiring formed thereon. The figure which shows the state which pinches | interposes UV hardening resin on a template.

11A and 11B are views for explaining a method for manufacturing a wiring board according to a conventional example, FIG. 11A is a view showing a state where a UV curing resin is pressed by a template by a press machine, and FIG. To U
The figure which shows the state which irradiates V light, (c) and (d) the figure which shows the state which peeled the template from the metal wiring of the baseplate,
(E) is a figure which shows the wiring board which concerns on the prior art example obtained by forming a transparent electrode on a metal wiring.

[Explanation of symbols]

1 liquid crystal element 3, 3a, 3b, 20, 23, 25, 28, 30
Electrode substrate (wiring substrate) 5 Chiral smectic liquid crystal (liquid crystal) 6, 6a, 6b Glass substrate (substrate) 7 UV curable resin (resin) 8, 8a, 8b Metal wiring 9, 9a, 9b Transparent electrode 10a, 10b Alignment film 11 , 11a, 11b Underlayer 12, 12a, 12b Low resistance layer 13, 13a, 13b Protective layer 14 Template 15 Press machine 16 UV light (light) 17 First mixing layer (mixing layer) 18 Second mixing layer ( Mixing layer) 24,27 Color filter 26 Ink receiving layer 29 Color filter protective layer

Claims (41)

[Claims] 1. A metal wiring having a wiring pattern formed on a surface of a substrate, a resin filled between the metal wirings with substantially the same thickness as the metal wirings, and electrically contacting the metal wirings on the resin. A transparent electrode formed in accordance with the present invention, wherein the metal wiring is formed on the substrate by a first layer made of a metal having good adhesion to the substrate, and a low resistance is formed on the first layer. A wiring board, wherein a second layer made of a metal and a third layer made of a metal for preventing the oxidation of the second layer are sequentially formed on the second layer to form a multilayer structure. . 2. The first layer comprises Mo, Ti, W, Al,
The wiring board according to claim 1, which is formed of either Ta, Ni, or an alloy thereof. 3. The wiring board according to claim 1, wherein the second layer is formed of Cu or an alloy thereof. 4. The third layer comprises Mo, Ti, W, Ta,
The wiring board according to claim 1, which is formed of either Ni or an alloy thereof. 5. An interface between the first layer and the second layer,
The wiring board according to any one of claims 1 to 4, wherein a mixing layer in which an element forming each interface is mixed is formed at an interface between the second layer and the third layer. 6. The wiring board according to claim 1, wherein an unsaturated metal oxide film containing oxygen is formed between the substrate and the first layer of the metal wiring. . 7. The wiring board according to claim 1, wherein a color filter is arranged between the metal wirings. 8. The wiring board according to claim 1, further comprising a color filter disposed between the board and the first layer of the metal wiring. 9. The wiring board according to claim 8, wherein a color filter protective layer for protecting the color filter is formed between the color filter and the first layer of the metal wiring. 10. The wiring board according to claim 1, wherein the substrate is a glass substrate. 11. The wiring board according to claim 1, wherein the transparent electrode is an ITO film. 12. The wiring board according to claim 1, wherein the resin is an ultraviolet curable resin. 13. A first step of forming metal wiring on a substrate, a second step of filling a resin between the metal wirings, and a third step of irradiating the resin with light to cure the resin. ,
A fourth step of forming the transparent electrode on the resin so as to be in electrical contact with the metal wiring, the method including the steps of: A first layer made of a metal having good adhesiveness is formed, a second layer made of a metal having a low resistance is formed on the first layer, and the second layer is further formed.
A third metal layer overlying the second metal layer to prevent oxidation of the second layer
And forming the metal wiring having a multi-layered structure. 14. The first layer is Mo, Ti, W, A
The method for manufacturing a wiring board according to claim 13, wherein the wiring board is formed of any one of 1, 1, Ta, Ni, or an alloy thereof. 15. The method of manufacturing a wiring board according to claim 13, wherein the second layer is formed of Cu or an alloy thereof. 16. The third layer comprises Mo, Ti, W, T
The method for manufacturing a wiring board according to claim 13, wherein the wiring board is formed of a, Ni, or an alloy thereof. 17. A mixing layer in which an element forming each interface is mixed is provided at an interface between the first layer and the second layer and at an interface between the second layer and the third layer. The method for manufacturing a wiring board according to claim 13, which is formed respectively. 18. The wiring board according to claim 13, wherein an unsaturated metal oxide film containing oxygen is formed between the substrate and the first layer of the metal wiring. Manufacturing method. 19. The method for manufacturing a wiring board according to claim 13, wherein a color filter is arranged between the metal wirings. 20. The method of manufacturing a wiring board according to claim 13, wherein a color filter is arranged between the substrate and the first layer of the metal wiring. 21. The method of manufacturing a wiring board according to claim 20, wherein a color filter protective layer for protecting the color filter is formed between the color filter and the first layer of the metal wiring. 22. The method of manufacturing a wiring board according to claim 13, wherein the substrate is a glass substrate. 23. The method of manufacturing a wiring board according to claim 13, wherein the transparent electrode is an ITO film. 24. The method of manufacturing a wiring board according to claim 13, wherein the resin is an ultraviolet curable resin. 25. The method of manufacturing a wiring board according to claim 13, wherein the light is ultraviolet light. 26. In a liquid crystal device comprising a pair of electrode substrates arranged so as to face each other with a liquid crystal sandwiched therebetween, at least one of the electrode substrates is a substrate, and a metal having a wiring pattern on the substrate surface. Wirings, a resin filled between the metal wirings to have substantially the same thickness as the metal wirings, and a transparent electrode formed on the resin so as to be in electrical contact with the metal wirings, Metal wiring on the substrate, a first layer made of a metal having good adhesion to the substrate, a second layer made of a low-resistance metal on the first layer, and a second layer formed on the second layer. A liquid crystal element, wherein a third layer made of a metal that prevents oxidation of the second layer is sequentially formed to have a multilayer structure. 27. The first layer comprises Mo, Ti, W, A
27. The liquid crystal device according to claim 26, which is formed of any one of 1, Ta, Ni, or an alloy thereof. 28. The liquid crystal device according to claim 26, wherein the second layer is formed of Cu or an alloy thereof. 29. The third layer comprises Mo, Ti, W, T
27. The liquid crystal element according to claim 26, which is formed of either a, Ni, or an alloy thereof. 30. At the interface between the first layer and the second layer, and at the interface between the second layer and the third layer, a mixing layer in which an element constituting each interface is mixed is provided. 30. The liquid crystal element according to claim 26, which is formed respectively. 31. The liquid crystal device according to claim 26, wherein an unsaturated metal oxide film containing oxygen is formed between the substrate and the first layer of the metal wiring. . 32. The liquid crystal device according to claim 26, wherein a color filter is arranged between the metal wirings. 33. The liquid crystal element according to claim 26, wherein a color filter is arranged between the substrate and the first layer of the metal wiring. 34. The liquid crystal element according to claim 33, wherein a color filter protective layer for protecting the color filter is formed between the color filter and the first layer of the metal wiring. 35. The liquid crystal device according to claim 26, wherein the substrate is a glass substrate. 36. The liquid crystal device according to claim 26, wherein the transparent electrode is an ITO film. 37. The liquid crystal element according to claim 26, wherein the resin is an ultraviolet curable resin. 38. The liquid crystal device according to claim 26, wherein the liquid crystal is a ferroelectric liquid crystal. 39. The liquid crystal device according to claim 38, wherein the ferroelectric liquid crystal is a chiral smectic liquid crystal. 40. The liquid crystal device according to claim 26, wherein an alignment film is formed on the transparent electrode. 41. The liquid crystal device according to claim 26, wherein the transparent electrodes and the metal wirings of each electrode substrate are arranged in a simple matrix.