JPH09285962A - Method and device for adjusting abrasive grain ejecting amount of grinding wheel - Google Patents
Method and device for adjusting abrasive grain ejecting amount of grinding wheelInfo
- Publication number
- JPH09285962A JPH09285962A JP10086696A JP10086696A JPH09285962A JP H09285962 A JPH09285962 A JP H09285962A JP 10086696 A JP10086696 A JP 10086696A JP 10086696 A JP10086696 A JP 10086696A JP H09285962 A JPH09285962 A JP H09285962A
- Authority
- JP
- Japan
- Prior art keywords
- amount
- grindstone
- abrasive grains
- protrusion
- adjusting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006061 abrasive grain Substances 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims description 26
- 238000000227 grinding Methods 0.000 title abstract description 7
- 230000003287 optical effect Effects 0.000 claims abstract description 7
- 230000001678 irradiating effect Effects 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 28
- 230000001788 irregular Effects 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 238000003754 machining Methods 0.000 abstract 1
- 238000003801 milling Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 4
- 238000006552 photochemical reaction Methods 0.000 description 3
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 229920000491 Polyphenylsulfone Polymers 0.000 description 2
- 239000004954 Polyphthalamide Substances 0.000 description 2
- 238000002679 ablation Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920006375 polyphtalamide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、樹脂性のボンドを
使用した砥石の砥粒突き出し量の調節方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for adjusting the protrusion amount of abrasive grains of a grindstone using a resinous bond.
【０００２】[0002]
【従来の技術】従来技術における砥石の砥粒突き出し量
調整方法は、砥粒よりも柔らかく、ボンドよりも堅い材
料でできたドレッサーを、回転させた砥石の研削面に当
て、ボンドを除去していた。2. Description of the Related Art In the prior art, the method for adjusting the amount of protrusion of abrasive grains of a grindstone is to remove a bond by applying a dresser made of a material softer than the abrasive grain and harder than a bond to the grinding surface of a rotated grindstone. It was
【０００３】[0003]
【発明が解決しようとする課題】この前記の砥石の砥粒
突き出し量調整方法では、ある程度砥粒も除去されるほ
か、砥粒の突き出し量の調節をすることは困難である。In this method for adjusting the amount of protrusion of the abrasive grains of the grindstone, the abrasive grains are removed to some extent, and it is difficult to adjust the amount of protrusion of the abrasive grains.
【０００４】本発明の目的は、上記課題を解決して、ボ
ンドのみを除去し、砥粒の突き出し量の調節を可能にす
る砥石の砥粒突き出し量調整方法を提供することであ
る。An object of the present invention is to solve the above problems and provide a method for adjusting the amount of protrusion of abrasive grains of a grindstone, which removes only the bond and makes it possible to adjust the amount of protrusion of abrasive grains.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
に、本発明の砥石の砥粒突き出し量調整方法は、下記記
載の構成を採用する。In order to achieve the above object, the method of adjusting the amount of protrusion of abrasive grains of a grindstone of the present invention employs the following constitution.
【０００６】樹脂性のボンドを使用した砥石の砥粒突き
出し量調整方法において、砥石を回転させながら紫外線
レーザーを砥石表面に照射することにより樹脂ボンドの
みを除去し、砥粒を突き出させる。また、樹脂ボンドの
除去量は、レーザーの照射エネルギー・照射数・照射時
間を可変することにより、サブミクロンオーダーで調節
すること、すなわち砥粒の突き出し量をサブミクロンオ
ーダーで調節することができることを特徴とする。以上
の方法を実施する砥石の砥粒突き出し量調整装置は、少
なくとも砥石を回転させる砥石回転駆動装置、レーザー
を照射するためのレーザー発振器・光学系、およびそれ
らを制御する制御装置から構成されている。In the method of adjusting the amount of protrusion of the abrasive grains of a grindstone using a resinous bond, only the resin bond is removed by irradiating the surface of the grindstone with an ultraviolet laser while rotating the grindstone to cause the abrasive grains to protrude. Also, the amount of resin bond removed can be adjusted on the submicron order, that is, the protrusion amount of abrasive grains can be adjusted on the submicron order by varying the laser irradiation energy, irradiation number, and irradiation time. Characterize. The abrasive grain protrusion amount adjusting device of the grindstone for carrying out the above method is composed of at least a grindstone rotating drive device for rotating the grindstone, a laser oscillator / optical system for irradiating a laser, and a control device for controlling them. .
【０００７】レーザー発振器から出たレーザー光線は、
ミラー等の光学系を通り砥石表面に照射される。照射さ
れた砥石表面の樹脂ボンドは、光化学反応によって分子
結合が切断され、アブレーション現象により除去され
る。この際、レーザーの照射エネルギー・照射数・照射
時間を可変することにより、樹脂ボンドの除去量を調節
することができ、所望する砥粒の突き出しを得ることが
できる。The laser beam emitted from the laser oscillator is
The surface of the grindstone is irradiated through an optical system such as a mirror. The resin bond on the surface of the irradiated grindstone is removed by the ablation phenomenon because the molecular bond is cut by the photochemical reaction. At this time, the amount of resin bond removed can be adjusted by varying the laser irradiation energy, the number of irradiations, and the irradiation time, and the desired protrusion of the abrasive grains can be obtained.
【０００８】[0008]
【発明の実施の形態】以下図面を用いて本発明の実施例
における砥石の砥粒突き出し量調整方法を説明する。図
１は本発明の実施例における砥石の砥粒突き出し量調整
装置の構成を示した図であり、図２は本発明の実施例に
おける砥石の砥粒突き出し量調整方法の説明図であり、
図３は本発明の実施例における砥石の砥粒突き出し量調
整方法のレンズにより照射エネルギーを上げた場合の説
明図であり。図４は本発明の実施例における砥石の砥粒
突き出し量調整方法での樹脂ボンド除去の際に起きる除
去工程の説明図であり、図５は本発明の実施例における
凹凸形状の総型砥石の一例を示した図であり、図６は本
発明の実施例における砥石の砥粒突き出し量調整方法で
のレーザー光線の照射エネルギー０．５Ｊ／ｃｍ2の時
の照射数に対する樹脂材料の除去量のグラフである。図
７は本発明の実施例における砥石の砥粒突き出し量調整
方法でのレーザー光線の照射エネルギー１．０Ｊ／ｃｍ
2の時の照射数に対する樹脂材料の除去量のグラフであ
る。以下、図１と図２と図３と図４と図５と図６と図７
を交互に参照して説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for adjusting the amount of protrusion of abrasive grains of a grindstone in an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a configuration of an abrasive grain protrusion amount adjusting device for a grindstone in an embodiment of the present invention, and FIG. 2 is an explanatory diagram of an abrasive grain protrusion amount adjusting method for a grindstone in an embodiment of the present invention,
FIG. 3 is an explanatory diagram when the irradiation energy is increased by the lens of the method for adjusting the amount of protrusion of the abrasive grains of the grindstone in the embodiment of the present invention. FIG. 4 is an explanatory diagram of a removing step that occurs during resin bond removal in the method of adjusting the amount of protrusion of abrasive grains of a grindstone according to the embodiment of the present invention, and FIG. FIG. 6 is a diagram showing an example, and FIG. 6 is a graph of the removal amount of the resin material with respect to the irradiation number when the irradiation energy of the laser beam is 0.5 J / cm 2 in the method for adjusting the protrusion amount of the abrasive grains of the grindstone in the example of the present invention. Is. FIG. 7 is a laser beam irradiation energy of 1.0 J / cm 2 in the method for adjusting the amount of protrusion of the abrasive grains of the grindstone in the example of the present invention.
6 is a graph of the amount of resin material removed with respect to the number of irradiations in the case of 2 . Hereinafter, FIG. 1, FIG. 2, FIG. 3, FIG. 4, FIG. 5, FIG.
Will be described alternately.
【０００９】図１に示すように、レーザー発振器１から
出たレーザー光線２は、ミラー３等の光学系を通り砥石
表面に照射される。As shown in FIG. 1, a laser beam 2 emitted from a laser oscillator 1 passes through an optical system such as a mirror 3 and is applied to the surface of a grindstone.
【００１０】レーザー発振器１は、レーザー制御装置６
と接続しており、レーザー光線２の照射エネルギー・照
射数・照射時間をコントロールすることができる。The laser oscillator 1 includes a laser control device 6
It is possible to control the irradiation energy of the laser beam 2, the number of irradiations, and the irradiation time.
【００１１】砥石４はモータ５に接続しており、回転す
るようになっている。また、モータ５にはモータ制御装
置７が接続いており、モータ５の回転数を制御できるよ
うになっている。The grindstone 4 is connected to a motor 5 so as to rotate. A motor controller 7 is connected to the motor 5 so that the number of rotations of the motor 5 can be controlled.
【００１２】レーザー制御装置６とモータ制御装置７は
それぞれ総合制御装置８に接続しており、総合制御装置
８によってそれぞれ制御される。The laser control device 6 and the motor control device 7 are respectively connected to a general control device 8 and controlled by the general control device 8.
【００１３】図２に示すように、レーザー光線２が砥石
表面に照射することにより、樹脂ボンド９のみが除去さ
れ、砥粒１０が突き出る。As shown in FIG. 2, by irradiating the surface of the grindstone with the laser beam 2, only the resin bond 9 is removed and the abrasive grains 10 are projected.
【００１４】図３に示すように、光学系にレンズ１２加
えることにより、レーザー光線２の照射エネルギーを増
幅し、１回の除去量を増やすことも可能である。As shown in FIG. 3, by adding a lens 12 to the optical system, it is possible to amplify the irradiation energy of the laser beam 2 and increase the removal amount for one time.
【００１５】図４に示すように、樹脂ボンドの除去工程
は、次のように進行する。まずレーザー光線２が樹脂ボ
ンド９に照射されると樹脂ボンド９はレーザー光線２を
吸収し、光化学反応によって樹脂ボンド９を構成する高
分子の化学結合を切断する。その後アブレーションと言
われる現象により、樹脂ボンド９を構成する高分子は重
合体（ポリマー）から単量体（モノマー）へと変化し、
体積膨張によって飛散し除去される。As shown in FIG. 4, the resin bond removing process proceeds as follows. First, when the resin beam 9 is irradiated with the laser beam 2, the resin bond 9 absorbs the laser beam 2 and breaks the chemical bond of the polymer constituting the resin bond 9 by a photochemical reaction. Then, due to a phenomenon called ablation, the polymer constituting the resin bond 9 is changed from a polymer (polymer) to a monomer (monomer),
Scattered and removed by volume expansion.
【００１６】この砥石の砥粒突き出し量調整方法は、レ
ーザー光線２の照射したところのみ除去されるので、図
５で示すような凹凸形状の総型砥石１３でも通常砥石１
４と同じように凹凸形状に沿って、同量だけ除去するこ
とができる。In this method for adjusting the amount of protrusion of the abrasive grains of the grindstone, only the portion irradiated with the laser beam 2 is removed.
Similar to step 4, the same amount can be removed along the uneven shape.
【００１７】樹脂ボンドに使用する樹脂材料としては、
ポリサルホン・ポリエーテルサルホン・ポリフェニルサ
ルホン・ポリフタルアミド・ポリカーボネート・ポリイ
ミド・ポリエステル・エポキシ・ポリウレタン・アクリ
ルが挙げられる。The resin material used for the resin bond is
Examples include polysulfone, polyether sulfone, polyphenyl sulfone, polyphthalamide, polycarbonate, polyimide, polyester, epoxy, polyurethane, and acrylic.
【００１８】図６，７は上記に示した樹脂材料のうち、
ポリサルホン・ポリエーテルサルホン・ポリフェニルサ
ルホン・ポリフタルアミド・ポリカーボネートの５つの
樹脂材料について実験を行った結果である。レーザーは
波長２４８ｎｍのＫｒＦエキシマレーザーを使用した。
照射条件としては、発振周波数５０Ｈｚ、照射エネルギ
ー０．５，１．０Ｊ／ｃｍ2、照射数を１０，５０，１
００，１５０，２００Ｓｈｏｔ（ショット）での各樹脂
材料の除去量を求めた。図６，７のグラフから、レーザ
ー光線２の照射数と除去量が比例関係にあること、１回
の照射でサブミクロンオーダーの加工ができることが確
認できた。今回確認できなかった樹脂材料についても、
波長１９３ｎｍのＡｒＦエキシマレーザーや波長３０８
ｎｍのＸｅＣｌエキシマレーザーを使用することによ
り、サブミクロンオーダーの加工が可能である。6 and 7 show the resin materials shown above.
These are the results of experiments conducted on five resin materials: polysulfone, polyethersulfone, polyphenylsulfone, polyphthalamide, and polycarbonate. The laser used was a KrF excimer laser having a wavelength of 248 nm.
The irradiation conditions are as follows: oscillation frequency 50 Hz, irradiation energy 0.5, 1.0 J / cm 2 , irradiation number 10, 50, 1
The amount of each resin material removed at 00, 150, and 200 Shots (shots) was determined. From the graphs of FIGS. 6 and 7, it was confirmed that the irradiation number of the laser beam 2 and the removal amount are in a proportional relationship, and that it is possible to perform processing on the submicron order by one irradiation. For resin materials that could not be confirmed this time,
ArF excimer laser with wavelength 193 nm and wavelength 308
By using the XeCl excimer laser of nm, processing on the order of submicron is possible.
【００１９】[0019]
【発明の効果】以上の説明で明らかなように、本発明の
砥石の砥粒突き出し量調整方法においては、砥粒の突き
出し量をサブミクロンオーダーで調節することができ
る。これにより、研削するワークの加工面の状態を調節
することができる。また、光化学反応による加工のた
め、総型砥石のような凹凸のある形状でも、形状に沿っ
て同量の砥石の砥粒の突き出し量を得ることができる。As is apparent from the above description, in the method of adjusting the amount of protrusion of the abrasive grains of the grindstone of the present invention, the amount of protrusion of the abrasive grains can be adjusted in the submicron order. Thereby, the state of the processed surface of the workpiece to be ground can be adjusted. Further, because of the processing by the photochemical reaction, even in a shape having irregularities such as a full-scale grindstone, the same amount of protrusion of the abrasive grains of the grindstone can be obtained along the shape.
【図１】本発明の実施例における砥石の砥粒突き出し量
調整装置の構成を示した図である。FIG. 1 is a diagram showing a configuration of an abrasive grain protrusion amount adjusting device for a grindstone according to an embodiment of the present invention.
【図２】本発明の実施例における砥石の砥粒突き出し量
調整方法の説明図である。FIG. 2 is an explanatory diagram of a method for adjusting the amount of protrusion of abrasive grains of a grindstone according to an embodiment of the present invention.
【図３】本発明の実施例における砥石の砥粒突き出し量
調整方法のレンズにより照射エネルギーを上げた場合の
説明図である。FIG. 3 is an explanatory diagram when the irradiation energy is increased by the lens of the method for adjusting the amount of protrusion of abrasive grains of the grindstone in the example of the present invention.
【図４】本発明の実施例における砥石の砥粒突き出し量
調整方法での樹脂ボンド除去の際に起きる除去工程の説
明図である。FIG. 4 is an explanatory diagram of a removing step that occurs when removing a resin bond in the method of adjusting the amount of protrusion of abrasive grains of a grindstone in the example of the present invention.
【図５】本発明の実施例における凹凸形状の総型砥石の
一例を示した図である。FIG. 5 is a diagram showing an example of a concave-convex formed mold wheel according to an embodiment of the present invention.
【図６】本発明の実施例における砥石の砥粒突き出し量
調整方法でのレーザー光線の照射エネルギー０．５Ｊ／
ｃｍ2の時の照射数に対する樹脂材料の除去量のグラフ
である。FIG. 6 is a laser beam irradiation energy of 0.5 J / in the method of adjusting the amount of protrusion of abrasive grains of a grindstone in the example of the present invention.
It is a graph of the amount of removal of the resin material with respect to the number of irradiation when cm 2 .
【図７】本発明の実施例における砥石の砥粒突き出し量
調整方法でのレーザー光線の照射エネルギー１．０Ｊ／
ｃｍ2の時の照射数に対する樹脂材料の除去量のグラフ
である。FIG. 7: Laser beam irradiation energy of 1.0 J / in the method of adjusting the amount of protrusion of abrasive grains of a grindstone in the example of the present invention.
It is a graph of the amount of removal of the resin material with respect to the number of irradiation when cm 2 .
１ レーザー発振器 ２ レーザー光線 ３ ミラー ４ 砥石 ５ モータ ６ レーザー制御装置 ７ モータ制御装置 ８ 総合制御装置 ９ 樹脂ボンド １０ 砥粒 １１ 樹脂ボンド除去部分 １２ レンズ １３ 総型砥石 １４ 通常砥石 DESCRIPTION OF SYMBOLS 1 laser oscillator 2 laser beam 3 mirror 4 grindstone 5 motor 6 laser control device 7 motor control device 8 general control device 9 resin bond 10 abrasive grains 11 resin bond removal portion 12 lens 13 general-purpose grindstone 14 normal grindstone
Claims (4)
き出し量調整方法において、砥石を回転させながら紫外
線レーザーを砥石表面に照射することにより樹脂ボンド
のみを除去し、砥粒を突き出させる砥石の砥粒突き出し
量調整方法。1. A method of adjusting the amount of protrusion of abrasive grains of a grindstone using a resin bond, in which only the resin bond is removed by irradiating the surface of the grindstone with an ultraviolet laser while rotating the grindstone so that the grindstone is protruded. Method for adjusting the amount of protrusion of abrasive grains.
射時間を可変することにより、樹脂ボンドの除去量をサ
ブミクロンオーダーで調節すること、すなわち砥粒の突
き出し量をサブミクロンオーダーで調節することができ
る請求項１に記載の砥石の砥粒突き出し量調整方法。2. The amount of resin bond removed can be adjusted on the order of submicron, that is, the amount of protrusion of abrasive grains can be adjusted on the order of submicron, by changing the irradiation energy, the number of irradiation, and the irradiation time of the laser. The method of adjusting the amount of protrusion of abrasive grains of a grindstone according to claim 1, which is possible.
なっている砥石において、樹脂ボンドの除去量を一定に
することができる請求項１に記載の砥石の砥粒突き出し
量調整方法。3. The method for adjusting the amount of protrusion of abrasive grains of a grindstone according to claim 1, wherein in a grindstone such as a full-scale grindstone whose surface has an irregular shape, the removal amount of the resin bond can be made constant.
ーザーを照射するためのレーザー発振器、光学系、およ
びそれらを制御する制御装置から構成された砥石の砥粒
突き出し量調整装置。4. An abrasive grain projection amount adjusting device comprising a whetstone rotation driving device for rotating a whetstone, a laser oscillator for irradiating a laser, an optical system, and a control device for controlling them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10086696A JPH09285962A (en) | 1996-04-23 | 1996-04-23 | Method and device for adjusting abrasive grain ejecting amount of grinding wheel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10086696A JPH09285962A (en) | 1996-04-23 | 1996-04-23 | Method and device for adjusting abrasive grain ejecting amount of grinding wheel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09285962A true JPH09285962A (en) | 1997-11-04 |
Family
ID=14285243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10086696A Pending JPH09285962A (en) | 1996-04-23 | 1996-04-23 | Method and device for adjusting abrasive grain ejecting amount of grinding wheel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09285962A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999012705A1 (en) * | 1997-09-08 | 1999-03-18 | The Institute Of Physical And Chemical Research | Optical dressing method, machining device based on this method, grindstone and polishing cloth |
| WO2002066207A1 (en) * | 2001-02-20 | 2002-08-29 | Ebara Corporation | Polishing apparatus and dressing method |
| US6458704B2 (en) * | 1999-06-17 | 2002-10-01 | National Semiconductor Corporation | Light sensitive chemical-mechanical polishing method |
| US6793562B2 (en) | 2001-04-23 | 2004-09-21 | Mitsubishi Denki Kabushiki Kaisha | Grinder and method of and apparatus for non-contact conditioning of tool |
| KR100837616B1 (en) * | 2006-08-01 | 2008-06-13 | 주식회사 엘티에스 | Polishing pad processing equipment and processing method |
| CN103878704A (en) * | 2013-11-21 | 2014-06-25 | 湖南大学 | Fiber laser-assisted dressing equipment for dense bonded extra-hard grinding wheels |
| CN114952522A (en) * | 2022-06-24 | 2022-08-30 | 南京航空航天大学 | Laser system and apparatus and method for processing ceramic materials |
| JP7706056B1 (en) * | 2024-05-16 | 2025-07-11 | 株式会社日進製作所グループ | Dressing method, dressing device and grinding wheel |
-
1996
- 1996-04-23 JP JP10086696A patent/JPH09285962A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999012705A1 (en) * | 1997-09-08 | 1999-03-18 | The Institute Of Physical And Chemical Research | Optical dressing method, machining device based on this method, grindstone and polishing cloth |
| US6126523A (en) * | 1997-09-08 | 2000-10-03 | The Institute Of Physical And Chemical Research | Optical dressing method, machining device based on this method, grindstone and polishing cloth |
| US6458704B2 (en) * | 1999-06-17 | 2002-10-01 | National Semiconductor Corporation | Light sensitive chemical-mechanical polishing method |
| US6458291B2 (en) * | 1999-06-17 | 2002-10-01 | National Semiconductor Corporation | Light sensitive chemical-mechanical polishing aggregate |
| WO2002066207A1 (en) * | 2001-02-20 | 2002-08-29 | Ebara Corporation | Polishing apparatus and dressing method |
| US6793562B2 (en) | 2001-04-23 | 2004-09-21 | Mitsubishi Denki Kabushiki Kaisha | Grinder and method of and apparatus for non-contact conditioning of tool |
| US7175509B2 (en) | 2001-04-23 | 2007-02-13 | Itsubishi Denki Kabushiki Kaisha | Grinder and method of and apparatus for non-contact conditioning of tool |
| KR100837616B1 (en) * | 2006-08-01 | 2008-06-13 | 주식회사 엘티에스 | Polishing pad processing equipment and processing method |
| CN103878704A (en) * | 2013-11-21 | 2014-06-25 | 湖南大学 | Fiber laser-assisted dressing equipment for dense bonded extra-hard grinding wheels |
| CN114952522A (en) * | 2022-06-24 | 2022-08-30 | 南京航空航天大学 | Laser system and apparatus and method for processing ceramic materials |
| CN114952522B (en) * | 2022-06-24 | 2023-07-25 | 南京航空航天大学 | Laser system and apparatus and method for processing ceramic materials |
| JP7706056B1 (en) * | 2024-05-16 | 2025-07-11 | 株式会社日進製作所グループ | Dressing method, dressing device and grinding wheel |
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