JPH09298356A - Bump forming method and apparatus and electronic component formed - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the reliability and production ability by placing solder balls facing attraction jigs at indexed positions of the jigs and performing the attraction of the solder balls, flux coating and package mounting at the same time, and executing inspections at every step. SOLUTION: An attraction jig 50 attracts and arranges solder balls 61, the arrangement quality thereof is examined and flux 70a is fed to the balls 61 with checking if the balls 61 drop from the jig 50. A cleaned board is fed to a solder ball mounting apparatus which positions bump-forming pads of the board at the balls 61 and verifies if the balls 61 are mounted correctly on a package 75. The package is set in a high temp. atmosphere to melt and bond the balls 61 to the structure pads 307. After cooling them, solder bumps are formed on the pads 307 of the package 75.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, a BGA (Ball Grid) among semiconductor package forms.
Array package, CSP (Chip Size)
Package or Chip Scale Pa
formation of bumps for forming bumps by mounting a conductive ball typified by a solder ball or a gold ball on a package (hereinafter simply referred to as a package) that uses a solder ball as a connecting material with a mounting substrate, such as a package The present invention relates to a method, an apparatus therefor, and an electronic component formed.

[0002]

2. Description of the Related Art As shown in FIG. 65, a package such as BGA has an LSI chip 2005 on one surface of a substrate 2001.
Is mounted, the LSI chip 2005 terminal and the terminal of the substrate 2001 are connected by a lead wire 2006 such as gold or gold-plated aluminum, and the LSI is sealed by a sealing resin 2002.
After encapsulating the chip 2005 in the substrate 2001, the substrate 20
01 is formed on the other surface of the resist film 2004, and the solder bump 2000 is formed on the pad 2003 exposed from between the resist films 2004.

As a method of forming the solder bump 2000, there is a method disclosed in USP 5,284,287. In this U.S. Patent, flux is supplied to a solder ball by immersing the solder ball sucked in vacuum by a suction jig in a flux liquid tank, and the solder ball is placed on a pad (connection terminal) formed on an electronic circuit board. , And by heating (reflowing) the electronic circuit board that holds the solder balls by the adhesive force of the flux,
Techniques for forming solder bumps are disclosed.

A method of forming solder bumps is also disclosed in USP 5,279,045. This U.S. patent discloses a technique in which a solder ball is supplied to a suction jig by a gas flow, the bump is formed by mounting the solder ball on a semiconductor element and then heating it.

66 to 68 show an example of a conventional solder ball mounting device. In FIG. 66, 1 is a base. A block 2 is fixed in parallel on the base 1. Reference numeral 3 is a linear guide device, which is fixed on the block 2 in parallel. A beam 4 is movably supported by the linear guide device 3. A feed screw 5 is rotatably supported on the block 2 and is screwed into a nut (not shown) fixed to the beam 4. A motor 6 is supported by the base 1 and is connected to the feed screw 5. Therefore, when the motor 6 operates, the beam 4 moves in the Y direction (vertical direction in FIG. 66).

A linear guide unit 7 is fixed in parallel with the beam 4. A slider 8 is movably supported by the linear guide device 7. A feed screw 9 is rotatably supported by the beam 4 and is screwed into a nut (not shown) fixed to the slider 8. A motor 10 is supported by the beam 4 and is connected to the feed screw 9. Therefore,
When the motor 10 operates, the slider 8 moves in the X direction (see FIG. 66).
Then move left and right).

Reference numeral 11 denotes a linear guide device, which is fixed in parallel to the slider 8. A saddle 12 is a linear guide device 11
It is movably supported. A feed screw 13 is rotatably supported by the slider 8 and is screwed into a nut (not shown) fixed to the saddle 12. 14 is a motor,
It is fixed to the slider 8 and is connected to the feed screw 13. Therefore, when the motor 14 operates, the saddle 12
Moves in the X direction (vertical direction in FIG. 67).

A suction jig 15 is fixed to the saddle 12. The suction jig 15 is formed in a box shape and is shown in FIG.
As shown in FIG. 5, a plurality of holes 17 for attracting and holding the solder balls 16 are formed on the lower surface in the same arrangement as the arrangement of the solder balls mounted on the package.

Reference numeral 19 is a solder ball supply device, which is a base 1
It is fixed on the top and houses the solder balls 16. The solder ball supply device 19 is formed in a box shape having an open upper surface, and a plurality of holes smaller than the diameter of the solder ball 16 are formed on the bottom surface.

Reference numeral 20 denotes a flux supply device, which is fixed on the base 1 and has solder balls 16 in the flux pool.
Is immersed to a predetermined depth to apply the flux 21.

A conveyor belt 22 is supported by the base 1. A stopper 23 is fixed to the base 1. Reference numeral 24 denotes a package on which the solder balls 16 are mounted, which is conveyed by the belt 22 and abuts on the stopper 23 to be positioned.

With such a configuration, the motor 6 and the motor 10
Is operated to attach the suction jig 15 to the solder ball supply device 19
Position above. Then, the motor 14 is operated to move the suction jig 15 to a position where the lower end of the suction jig 15 covers the opening of the solder ball supply device 19. Then, compressed air is ejected from the bottom surface of the solder ball supply device 19,
The solder balls 16 are floated between the suction jig 15 and the bottom surface of the solder ball supply device 19. At the same time, suction jig 1
A vacuum pressure is supplied to 5 and the solder balls 16 are sucked into the holes 17 of the suction jig 15 by sucking through the holes 17.

When a preset time elapses, the compressed air jetted from the bottom surface of the solder ball supply device 19 is shut off, the motor 14 is operated, and the suction jig 15 which has sucked the solder ball 16 is raised. .

Then, the motors 6 and 10 are operated to move the suction jig 15 which has sucked the solder balls 16 to above the flux supply device 20. Then, the motor 14 is operated, and the suction jig 15 is attached to the lower end of the solder ball 16 sucked on the lower surface (1/4 of the diameter of the solder ball).
(About 1/3) is lowered to a position where it is immersed in the flux, and the flux 21 is supplied to the solder balls 16. When the flux 21 is supplied to the solder balls 16, the motor 14 operates to raise the suction jig 15.

The motors 6 and 10 are operated to move the suction jig 15 which has sucked the solder balls 16 whose flux is supplied to the lower end, to a position above the mounting position on the package 24. At this time, the package 24, which is placed on the belt 22 in advance, is conveyed by the belt 22, and contacts the stopper 23 and is positioned, stands by. Then, when the suction jig 15 is positioned at a predetermined position above the package 24, the motor 14 operates to lower the suction jig 15 and bring the solder balls 16 close to the package 24.

At this time, compressed air is supplied to the suction jig 15 through the pipe 18. By ejecting the air from the holes 17, the solder balls 16 that have been adsorbed are released and mounted on the package 24. The solder balls 16 mounted on the package 24 are held in the package 24 by the viscosity of the flux supplied to the lower end thereof.
Then, the operation of the motor 14 causes the suction jig 15 to move upward to the next suction of the solder ball 16.

[0017]

However, the above conventional method has the following problems. In the solder ball mounting device as described above, since each operation is sequentially performed,
The time required for the cycle is long (about 15 seconds), and the production capacity of the solder ball mounting device is low.

Further, when the type of the package is changed, the suction jig must be replaced, so that the cost of preparing various kinds of expensive suction jigs and the labor of the replacement are problems. In addition, in each process, solder balls may be missing or the package and suction jig may not be properly aligned.
Defective products occur due to missing solder balls and misalignment with pads when mounted on a package.

When attracting a solder ball, if one of the numerous suction holes of the suction jig has a suction defect, the defective solder ball will be defective even if mounted on a package. It is indispensable to suck the solder balls without dropping out. Therefore, when there is a dropout, it is necessary to repeat the suction of the solder ball again to suck the solder ball in the suction hole that has been pulled out. For reliable solder ball adsorption that minimizes this repetition, it is necessary to uniformly supply the solder balls by blowing air into all the adsorption holes. On the other hand, there is a problem that it is difficult to realize this.

Further, as the area of the suction jig becomes larger, it becomes more difficult to blow up the solder balls evenly in the surface of the container and supply the solder balls to the vicinity of the suction holes of the suction jig. There is also a problem that omissions occur frequently.

Further, as shown in FIG. 69, the lower end portion of the solder ball 16 sucked by the suction jig 15 is connected to the flux 21.
When the flux 21 having a high wettability is used when the flux 21 is dipped in the substrate and the flux 21 is supplied, the flux 21 may get wet to cover the solder balls 16 and contaminate the adsorption jig 15. Once the flux 21 contaminates the suction jig 15, the adhesive force of the flux 21 makes the mounting of the solder balls 16 on the substrate from the suction jig 15 uncertain. The problem of being necessary occurs.

If the package is warped,
The part where the solder ball comes into contact with the pad can be reliably mounted, but the part that does not come into contact will drop onto the pad,
The mounting position may shift. Further, as shown in FIG. 70, when the solder balls 1302 are mounted on the board 1311, the pressing force 1314 acting on the solder balls 1302 acts as a board vertical component force 1313 and a board surface direction component force 1312. Of these, the substrate surface direction component force 1312 is a force that acts in a direction in which the solder ball 1302 is displaced from the pad 1309, and due to this force,
The solder balls 1302 may be displaced from the pads 1309. In this case as well, non-defective bumps are not formed.

Further, as shown in FIG. 71, the flux 1
When 319 adheres in a biased form, even the solder ball 1302 mounted at the solder ball mounting position shown by the broken line,
It may be observed that the flux 1319 is displaced to the position indicated by the solid line by the action of fluid force such as surface tension. In this state, the pads 1309 and the solder balls 1302 are not in contact with each other even if the solder balls are re-melted by reflow, so the solder balls 1302 easily move, coalesce with other solder balls, or flow away. To do. Therefore, a non-defective bump is not formed on the pad 1309, resulting in a defect.

Further, as shown in FIG. 72, during reflow, if a foreign substance 1316 is present at the place where the oxide film 1315 of the solder ball 1302 begins to break, the solder will be pad 1
309 Solder balls 1302
The oxide film 1315 of the solder ball 1 cannot be removed sufficiently and the solder ball 1
A defective solder bump in which the bonding between 302 and the pad 1309 is insufficient is formed.

An object of the present invention is to solve the above-mentioned conventional problems, and to provide a solder bump forming method and apparatus having high reliability and high production capacity, and an electronic component formed by this method and apparatus. Especially.

[0026]

To achieve the above object, a table that can be indexed and rotated at a predetermined interval and that can be moved up and down, and a plurality of suction holes are formed so that solder balls can be sucked in a required arrangement. The table is provided with suction jigs arranged at predetermined intervals in the rotation direction of the table so as to pass on the same circumference, and a plurality of small holes for blowing compressed air from the bottom surface. A solder ball supply device configured to float the solder balls supplied to the compressed air, a rotatable disc, and a squeegee arranged so as to face the surface of the disc at a predetermined interval, The solder ball supply device is provided with a flux supply device that forms the flux supplied on the disk in a film shape and a positioning device that positions a package on which a solder ball is mounted. A flux feeder and positioning device along a rotational direction of said table, and disposed so as to sequentially face each suction jig by indexing the position of the suction jig,
Adsorption of solder balls, application of flux and mounting on the package should be performed at three locations at the same time.

In addition to this, a plurality of CCD cameras,
An image information processing device for processing image information of a CCD camera is provided, and the CCD camera is arranged at an intermediate position between the respective devices so as to face the suction jig, and solder balls are sucked and flux is applied. After completion of each step of mounting on the package, the inspection for the presence of solder balls is performed at three locations at the same time.

Further, one CCD for detecting a reference mark such as a registration mark or a pad of the package.
A camera, a package position correction mechanism, and a control device are provided to align the suction jig and the package before mounting the solder balls, and to adjust the solder balls on the pads of the package after mounting the solder balls. I also tried to check the mounting status.

Further, a resistance plate for preventing wet-up which gives flow resistance to the flux is provided near the surface of the flux of the flux supply device, and the flux adheres to the adsorption jig when the solder balls are immersed in the flux. I tried to suppress.

For the warp of the board, the suction surface of the suction jig and the structure of the sword are made to follow the warp of the board, and a shield plate corresponding to the package is provided so as to facilitate the exchange of the type of the package. By doing so, I did not have to replace the mask and Kenzan.

Further, the pad surface of the package is cleaned in the mounting device immediately before mounting the solder ball to protect the pad from dirt on the package.

Further, in order to facilitate the alignment inspection of the solder balls, prevent the displacement after mounting, and prevent the occurrence of the solder wetting defect even if the pads are slightly contaminated, a part of the solder balls can be prevented. It was made flat.

Further, the amount of flux attached to each solder ball for the purpose of suppressing the variation in the amount of flux supplied to the solder ball is obtained by temporarily filling the flux in the recesses or through holes corresponding to the solder balls of the suction jig on a one-to-one basis. The solder balls were immersed in these recesses and through holes.

Further, in order to surely suck the solder balls onto the suction jig, the nozzle for stirring the solder balls is moved at a high speed.

Further, for one suction hole of the suction jig,
For the problem that multiple solder balls are adsorbed,
A mask plate was prepared to prevent a plurality of solder balls from adsorbing to each adsorption hole. Further, means for brushing off, means for scraping off by a rubber blade, and means for blowing off by a gas flow were provided.

[0036]

BEST MODE FOR CARRYING OUT THE INVENTION A first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a flowchart of a solder bump forming method of the present invention, and FIGS.
It is a process drawing corresponding to the flowchart of FIG.

In the present invention, as shown in FIG.
As shown in FIG. 5, the solder balls 61 are sucked by the suction jig 50 and aligned (step A-1). Next, the quality of the alignment is inspected (step A-2). Next, FIG.
Alternatively, as shown in (b), the flux 70a (or 70b) is supplied to the solder balls 61 (step A-
3). Next, it is inspected whether or not the solder balls 61 were separated from the suction jig 50 during the flux supply and no alignment defect was generated (step A-4). Up to this point, the aligned solder balls 61 supplied with the flux 70 (a or b) are prepared.

On the other hand, if necessary, the substrate on which the bump forming surface has been cleaned (step A-5) is supplied to the solder ball mounting apparatus, and then the bump forming position pad on the substrate is positioned at the solder ball mounting position. Yes (Step A-
6). Then, as shown in FIG. 4, the solder balls 61 are mounted on the positioned package 75 (step A-7). Next, it is inspected whether the solder balls 61 remain on the suction surface of the suction jig 50 used for aligning the solder balls 61 (step A-8), and the package 7
The inspection for checking the number of solder balls 61 on the pad 307 of No. 5 and the positional deviation is performed (step A-9) to confirm whether the solder balls 61 are correctly and accurately mounted.

In this way, as shown in FIG. 5, the package 75 on which the solder balls 61 are mounted is placed in a high temperature environment, whereby the solder balls are melted and bonded to the pads on the substrate, and then cooled. (Step A-1
0), as shown in FIG.
Solder bumps 311 are formed on 7.

Next, a second embodiment of the present invention will be described with reference to the drawings. 7 to 12 show a second embodiment of the present invention. FIG. 7 is a plan view of a solder ball mounting apparatus, FIG. 8 is a front sectional view of the solder ball mounting apparatus in FIG. 7, and FIG. 7 is a sectional view of the suction jig in FIG. 7, FIG. 10 is a front sectional view of the mounting portion in FIG. 7, FIG. 11 is a side sectional view of the mounting portion in FIG. 7, and FIG.
FIG. 8 is a plan view showing a stop position of the table when the solder balls in FIG.

In the figure, 1 is a base. Reference numeral 27 denotes a shaft, which is rotatably supported by a housing 25 attached to the base 1 via a bearing 26. 29
Is a servomotor and is supported by a plate 28 fixed to the lower end of the housing 25. The shaft 27 can be indexed and rotated at an arbitrary angle by the servo motor 29 via the timing pulleys 30 and 31, and the timing belt 32.

Reference numeral 33 denotes a supply / exhaust passage, which is formed on the shaft 27. A rotary joint 34 is fixed to the plate 28 via a bracket 35 and is rotatably fitted to the shaft 27 so as to face the openings of the supply / exhaust passages 33 formed on the outer peripheral surface of the shaft 27. There is. A slip ring 36 is fixed to the rotary joint 34 via a bracket 37 and faces the lower end of the shaft 27. Reference numeral 38 denotes a disc, which is formed integrally with the shaft 27.

An air cylinder 39 is fixed to the center of the disk 38. When the air cylinder 39 operates, the table 41 moves up and down.

Reference numeral 50 denotes a suction jig, which is arranged on the table 41 via the plate 51 at a predetermined interval (120 in this embodiment).
It is fixed at intervals. This suction jig 50 is shown in FIG.
It is configured as shown in FIG. The suction jig 50 is formed in a box shape, and holes 52 for sucking the solder balls 61 are formed in a lower surface of the suction jig 50 in accordance with a required arrangement pattern. Reference numeral 53 is a pipe that connects the supply / exhaust passage 33 formed on the shaft 27 and the suction jig 50 to each other.
Supply vacuum pressure to.

Sword mountain pins 57 are formed on the plate 56 so as to have a diameter smaller than that of the holes 52 formed on the lower surface of the suction jig 50, and are arranged on the plate 56 in the same arrangement as the holes 52 so that the holes 52 can be penetrated. Has been done. Reference numeral 58 denotes a pipe, which connects the supply / exhaust passage 33 formed on the shaft 27 and the cylinder 55.

Therefore, when sucking the solder balls 61, the cylinder 55 is operated to raise the plate 56 and move the blade pin 57 to above the hole 52. When mounting the sucked solder balls 61 on the package, the cylinder 55 is operated and the plate 56 is lowered to penetrate the holes 52 and press the solder balls 61 to the package side with the hook pin 57. , Solder balls 61 from the suction jig 50 to the package
Can be mounted more reliably.

In the solder ball supply device 200, the solder ball hopper 59 has an opening formed in the upper surface as shown in FIG. 8, a solder ball 61 is accommodated inside, and a plurality of solder balls having a smaller diameter than the solder ball 61 are formed on the bottom surface. A hole 54 is formed,
It is fixed on the base 1. By covering the upper opening with the suction jig 50 and supplying compressed air from the air pipe 60 through the hole 54 on the bottom surface, the solder balls 61 are floated between the suction jig 50 and the bottom surface. By sucking through the vacuum suction tube 53, the hole 52 of the suction jig 50
The solder ball 61 can be adsorbed on the.

The flux supply device 201 is constructed as shown in FIGS. 7 and 8. Reference numeral 62 denotes a housing, in which a screw 104 is formed on an outer peripheral surface of a lower portion, and a flange 102 formed on an upper end is movably fitted to a guide pin 101 fixed to the base 1 to move vertically to the base 1. Supported as possible. Reference numeral 63 denotes a shaft, which is rotatably supported by the housing 62 via a bearing 64.

Reference numeral 65 denotes a motor, which is supported by the housing 103 which is supported at the lower end of the housing 62, and the output shaft of which is coupled to the shaft 63 via a coupling 66.

Reference numeral 107 denotes a housing, which is a stud bolt 1
It is supported on the lower surface of the base 1 so as to be located concentrically with the housing 62 via 13. Reference numeral 105 denotes a nut, which is screwed into the screw 104 of the housing 62,
It is rotatably supported by the housing 107 via. Reference numeral 108 denotes a stepping motor, which is a housing 107.
Supported by. A timing pulley 109 is fixed to the rotation shaft of the stepping motor 108. 11
A timing pulley 1 is fixed to the nut 105. 110 is a timing belt, which is a timing pulley 1.
It is hung between 09 and 111.

Therefore, when the stepping motor 108 is operated, the nut 10 is passed through the timing pulley 109, the timing belt 110, and the timing pulley 111.
5 rotates. Then, the housing 62 and the shaft 63 supported by the housing 62 via the screws 104.
Moves in the axial direction. Further, when the motor 65 operates, the shaft 63 rotates.

A liquid tank 67 is fixed to the upper end of the shaft 63. A sheet formed of an elastic material such as rubber or elastic plastic is arranged on the bottom surface of the liquid tank 67. A stand 68 is fixed to the base 1. Reference numeral 69 denotes a squeegee, which faces a sheet arranged on the bottom surface of the liquid tank 67 at a required interval, and the position in the height direction of the stand 68 can be adjusted by a vertical driving means (not shown).

70 is a flux, which is supplied onto the sheet of the liquid tank 67. According to the size of the solder balls 61, the stepping motor 1 of the flux supply device 201
08 is operated, the shaft 63 is moved, and the liquid tank 67 is moved.
The height of the squeegee 69 is adjusted, the position of the squeegee 69 is adjusted, the stepping motor 65 is operated, and the liquid tank 67 is rotated.
Can be spread on the sheet, and the flux 70 can be formed into a liquid film having a required thickness (a thickness corresponding to the distance between the sheet arranged on the bottom surface of the liquid tank 67 and the squeegee 69). By controlling the thickness of this flux 70,
The amount of the flux 70 supplied to the solder balls 61 can be adjusted.

CCD cameras 80, 81 and 82 are provided between the solder ball supply device 200 and the flux supply device 201, and between the flux supply device and the positioning device 202.
In between, and between the positioning device 202 and the solder ball supply device 200, they are arranged at predetermined intervals so as to face the lower surface of the suction jig 50. 83 is a CCD camera,
It is arranged above the mounting position so as to face the package 75. An image processing device 84 is connected to each CCD camera 80, 81, 82, 83. A control device 85 is connected to the image processing device 84.

The positioning device 202 is constructed as shown in FIGS. 7, 10 and 11. A roller 71 is rotatably supported by the base 1. A motor 72 is supported by the base 1, and its output shaft is coupled to the roller 71. A belt 73 is stretched between the rollers 71. A carrier 74 has a through hole formed at the mounting position of the package 75 and is mounted on the belt 73.

Reference numeral 86 denotes a Y stage, which is supported by the base 1. 87 is an X stage, which is movably supported by a Y stage 86. A θ stage 88 is rotatably supported by the X stage 87. This θ stage 88
On top of the pipe 78 connected to a vacuum source via a cylinder 76
A lift nozzle 77 having is attached. These Y stage 86, X stage 87, and θ stage 8
Reference numeral 8 is connected to the control device 85 and is moved by a command from the control device 85.

Therefore, when the carrier 74 on which the package 75 is placed is placed on the belt 73, the motor 72
Operates to convey the carrier 74 to a predetermined position. Then, the carrier 74 is stopped at a predetermined position by a positioning means such as a stopper (not shown). Then, the cylinder 76 operates and the lift nozzle 77 rises, sucks the package 75 by the vacuum suction force, and moves the carrier 74 upward to the solder ball mounting position.

Then, the CCD camera 83 recognizes the position of the pad of the package 75 by the image processing device 84, and the Y stage 81, the X stage 82, and the θ stage 83 are driven through the control device 85 to drive the package 75. By aligning the pads and the solder balls sucked by the suction jig 50, the solder balls 61 can be mounted on the pads of the package 75 more accurately.

With the above structure, the solder balls 61 are mounted on the pads of the package 75 as described below.

First, the servo motor 29 is actuated to rotate the table 41 for indexing. When the suction jig 50 is positioned by this indexing rotation, the suction jig 50 positioned at the position A moves to the solder ball supply device 2
00, and a suction jig 50 positioned at the position B.
Faces the flux 70 formed in a liquid film in the liquid tank 67 of the flux supply device 201, and the suction jig 50 positioned at the position C faces the package 75 positioned by the positioning device 202. Next, the cylinder 39 operates to lower the table 41 and lower the suction jig 50 to a desired position.

The suction jig 50 at the position A covers the opening at the upper end of the solder ball hopper 59. Then, compressed air is supplied from the bottom surface of the solder ball hopper 59, and at the same time, vacuum pressure is supplied to the suction jig 50. The solder balls 61 blown up by the compressed air are sucked and held by the suction jig 50.

Further, the suction jig 50 at the position B is lowered until the solder balls 61 held by the suction jig 50 come into contact with the sheet of the liquid tank 67. Then, the lower end of the solder ball 61 is immersed in the flux 70 formed in a liquid film shape, and the flux 70 adheres to the solder ball 61 and is supplied.

Further, the suction jig 50 at the position C moves down the solder balls 61 sucked and held until they come into contact with the package 75. Then, the vacuum pressure supplied to the suction jig 50 is released to the atmospheric pressure, and the suction of the solder balls 61 is released. At the same time, the cylinder 55 operates to lower the plate 56, project the blade pin 57 from the hole 52 of the suction jig 50 toward the package 75, and forcibly mount the solder ball 61 from the suction jig 50 to the package 75. To do. Solder balls 61 mounted on package 75
Is adhered to and held in the package 75 by the viscosity of the flux 70 supplied to the lower end thereof.

As described above, at the indexing positions A, B and C of the suction jig 50, the solder balls 61 are sucked, the flux 70 is supplied to the solder balls 61, and the package 7 is provided.
The solder balls 61 are mounted on the substrate 5 at the same time. And
The cylinder 39 operates to raise the table 41, the servo motor 29 operates to index and rotate the table 41, and temporarily stops the table 41 at a position facing the CCD camera as shown in FIG. Solder ball 6
After the adsorption of No. 1 and the supply of the flux, the lower surfaces of the adsorption jig 50 after the solder balls 61 are mounted on the package 75 are imaged by the CCD cameras 80, 81 and 82, respectively.

The image pickup result is sent to the image processing device 84, and by processing the image pickup data, the solder ball 6
It is possible to detect suction leakage, dropout, mounting leakage, etc. After making the confirmation in this manner, the table 41 is again indexed and rotated, and the respective suction jigs 50 are moved to the indexing positions A, B and C as shown in FIG.

Further, by observing the arrangement of the solder balls 61 on the package 75 after mounting the solder balls 61, it is possible to check the displacement of the solder balls 61 during mounting and the mounting error.

Then, the positioning device 202 releases the vacuum pressure supplied to the lift nozzle 77 to the atmospheric pressure and operates the cylinder 76 to cause the lift nozzle 77 to operate.
And the package 75 having the solder balls 61 mounted thereon is placed on the carrier 74. Then, the carrier 74 is moved to position the next package 75 below the mounting position. The cylinder 76 is operated, the lift nozzle 77 to which the vacuum pressure is supplied is raised, and the lift nozzle 7
In step 7, the package 75 is sucked and held, and the package 75 is raised to a predetermined mounting position and stands by. Further, the flux supply device 201 operates the stepping motor 65, rotates the liquid tank 67 by a predetermined angle, moves the flux 70 formed in the liquid film shape to the position B, and stands by.

According to the above-described embodiment, the solder balls 61 can be attracted, the flux 70 can be supplied, and the flux 75 can be mounted on the package 75 at the same time. Therefore, the time required for one cycle can be shortened (about 6 seconds). Therefore, the solder ball mounting work can be speeded up, and by checking each process, defects can be detected and high reliability can be secured.

As shown in FIG. 7, the discard box 9
0 may be appropriately arranged, and when the solder balls 61 drop off during the flux supply or the like, the solder balls 61 adsorbed by the adsorption jig 50 may be discarded in the discard box 90 and the process may be performed again.

Further, in the case of applying to a small number of things such as sample production, only one suction jig 50 may be used. Alternatively, three types of suction jigs 50 may be mounted and only the suction jigs 50 selected as needed may be used.

Next, another embodiment of the suction jig 50 will be described with reference to FIGS. 13 to 28. FIG.
Sectional drawing which shows the 2nd Example regarding the suction jig 50, FIG.
4 to 19 are process diagrams when the suction jig shown in FIG. 13 is used.

The suction jig 50 has a suction portion 600 for sucking the solder balls and a sword portion 601 for pushing the solder balls.
Consists of

The suction part 600 includes a suction block 604 including a mask 602 made of an elastic material such as rubber for sucking solder balls, and a suction plate 603 for adhesively holding the mask 602.
It is fixed to. Kenzan part 601 is Kenyama pin 60
5, a pressure rubber 606 for holding them under pressure, a sword mountain plate 607 for retaining them, and a sword mountain block 60
8 and.

The suction portion 600 has a suction port 612 for vacuum suction, a guide hole 610 for guiding the vertical sliding of the blade portion 601 and an O-ring 611 for maintaining the degree of vacuum. Solder ball supply device 2 in FIG.
00, the suction holes 60 are suctioned by vacuum suction from the suction port 612.
The solder ball 61 is adsorbed on 9.

Next, as shown in FIG. 14, the solder balls are immersed in the flux 70 in the flux supply device 201, and the flux 70 is attached to the solder balls 61. Next, as shown in FIG.
The solder ball 61 is brought close to the pad 307 of FIG. At this time, if the package 75 is warped, the solder balls 61
Start to contact from the pad 307 on the convex portion of the package 75. Further, when the solder balls 61 are brought closer to the package 75, as shown in FIG. 16, the mask 602 is deformed, and the solder balls 61 are pressed according to the warpage of the package 75.

Then, the sword mountain portion 601 is lowered, and FIG.
As shown in, the solder ball 61 is pushed by the sword pin 605. At this time, the pressure rubber 606 is deformed by the reaction force from the solder ball 61. Then, as shown in FIG.
The suction part 600 is raised to separate the solder balls 61 from the mask 602. Finally, as shown in FIG. 19, the sword portion 601 is raised to attach the solder balls 61 to the package 75 by the adhesive force of the flux 70.

The package 7 which is warped by the above method
The solder balls 61 can be surely mounted on the pads 307 of No. 5 as well. Here, as shown in FIG.
Solder balls 61
When the sword mountain pin 605 is pressed to such an extent that the indentation remains, the contact portion between the solder ball 61 and the pad 307 is slightly crushed and the contact surface is widened.
Adhesion of 7 is improved, and deviation during transportation can be prevented. In addition, the wettability of the pad 307 during reflow is improved, and the reliability of bump formation is increased. In addition, even if the surface of the pad 307 is contaminated with stains, the large contact surface increases the chances of the molten solder coming into contact with the unpolluted portion of the pad 307, and ensures reliable metal bonding with the pad 307. To be done.

FIG. 20 is a sectional view showing a third embodiment of the suction jig 50. The suction jig 50 includes a suction portion 600 that sucks the solder balls and a plurality of blade portions 601 that push out the solder balls.

An example in which a plurality of sword portions 601 are built in the suction portion 600 and the solder balls 61 are mounted on the plurality of packages 75 simultaneously or sequentially is shown. In this example, two sword portions 601 are built in the suction portion 600, and the solder balls 61 can be mounted on the two packages 75 at the same time. Further, when the package 75 is large and has a large warp, a plurality of blade portions 601 can be arranged for one package 75 and mounted in groups.

FIG. 21 is a sectional view showing a fourth embodiment of the suction jig 50. In this example, the sword mountain pin 605 formed of an elastic body is embedded in the sword mountain block 608. When the sword mountain portion 601 is lowered and the solder ball 61 is pressed against the pad 307, the sword mountain pin 605 is deformed and the package 75 warps. Is trying to absorb.

FIG. 22 is a sectional view showing a fifth embodiment of the suction jig 50. In the figure, the suction jig 50
Is composed of a suction portion 600 that sucks the solder balls 61, and a mask 602 that is formed of an elastic body such as rubber and is fixed to the lower surface of the suction block 604.

Then, solder balls 61 are formed on the mask 602.
And the flux is supplied, the solder balls 61 are pressed against the pads 307 of the package 75. In this case, the mask 602 is elastically deformed and the package 75
The solder balls 61 on the
07.

At this time, the pad 3 in the recess of the package 75
Even if the solder ball 61 corresponding to No. 07 falls from the mask 602 in a state where it does not contact the pad 307, the distance between the lower surface of the solder ball 61 and the pad 307 is small, and the flux 70 on the lower surface of the solder ball 61 has the pad 3
Since it contacts 07, there is no large displacement.

Therefore, the pad 30 of the package 75 is
This is effective when the dimension of 7 is large and mounting accuracy does not matter so much.

FIG. 23 is a sectional view showing a sixth embodiment of the suction jig 50. In the figure, the suction jig 50
By attaching a suction block 604 of the suction portion 600 that sucks the solder balls 61 and a resin film 615 that is punched with high precision by laser processing, etc. The mask 602 is configured to be inexpensive, highly accurate, and highly solvent resistant.

FIG. 24 is a sectional view showing a seventh embodiment of the suction jig 50, and FIG. 25 is an operation explanatory view. In the figure, the adsorption part 600 is a sword portion 601 having a pipe-shaped pin 616, a mask 602 having a hole slightly larger than the outer diameter of the pin 616 and the outer diameter of the solder ball 61,
It consists of a suction block 604. The sword mountain portion 601 sandwiches a pin 616 having a collar with a rubber 617, and a plate 618 and a plate 619 provide rigidity to the sword mountain block 608.
It is fixed to. At this time, the tip of the pin 616 is recessed from the lower surface of the mask 602 by about half the diameter of the solder ball 61.

In this embodiment, the solder ball supply device 2
When the solder ball 61 is attracted with 00, the solder ball 6
Since 1 is attracted to the pin 616 retracted in the mask 602, the probability that a plurality of solder balls 61 are attracted to the opening of the mask 602 becomes low as shown in FIG.

Further, even if a plurality of solder balls 61 are adsorbed, the plurality of adsorbed solder balls 61 are removed by the collision of the solder balls 61 blown up subsequently, and one pin 616 is quickly removed. Each solder ball 61 is adsorbed. The solder balls 61 adsorbed in this way are used for the pads 3 of the warped package 75.
When it is mounted on 07, as shown in FIG. 25, the rubber 617 is deformed in response to the warp, and all the solder balls 61 adsorbed on the blade 616 can be pressed against the pad 613, so that reliable mounting can be performed.

FIG. 26 is a sectional view showing an eighth embodiment of the suction jig 50, and FIG. 27 is an operation explanatory view. In the figure, in the suction jig 50, through holes are formed in a required pattern between a suction plate 603 fixed to the lower surface of the suction block 604 and a mask 602 fixed to the lower surface of the suction plate 603. The shield plate 622 is detachably provided.

With such a structure, by inserting the shield plate 622 between the suction plate 603 and the mask 602, when the solder balls 61 are sucked, only the holes of the mask 602 communicated by the through holes of the shield plate 622. The solder balls 61 can be attracted to the.

Further, as shown in FIG. 27, when the solder ball 61 is mounted on the substrate 75, the part of the shield plate 622 without the hole 623, the sword pin 605 hits the shield plate 622 and does not come out to the mask 602 side. .

By using the shield plate 622 as described above, it is possible to deal with the packages 75 having various numbers of pads only by exchanging the shield plate 622 without exchanging the suction portion 600 and the blade portion 601.

As described above, the solder balls 61 can be reliably mounted on the warped package 75 by the suction jig 50, and the solder balls 61 can be firmly adhered to the pads 307, so that wetting defects during reflow can be reduced. Also, screen 6
20 using a plurality of solder balls 6 on the mask 602.
It also does not adsorb 1. Further, the shield plate 622
It becomes easy to deal with the packages 75 of different types by using.

FIG. 28 is a sectional view showing a second embodiment of the solder ball supply device 200. In the figure, the solder ball hopper 59 has a
A screen 620 having a required pattern and having a through hole larger than the diameter of the solder ball 61 and smaller than twice the diameter thereof is provided.

With such a structure, the solder balls 61 blown up by the air flow from the air pipe 621 enter the through holes of the screen 620 and are adsorbed to the mask 602. At this time, since the plurality of solder balls 61 do not enter the one through hole, the solder balls 61 can be reliably attracted. Further, since the solder ball 61 once adsorbed enters the through hole of the screen 620 with a radius or more, it does not fall off even if the solder ball 61 blown up later collides.

Even when two solder balls 61 are sucked through the through holes of the screen 620 at the same time, the suction force is small, so that the solder balls 61 blown up later collide with each other to easily release the suction state. be able to.

29 to 32 are explanatory views showing a method for aligning the solder balls sucked by the suction jig. In FIG. 29, 50 is a suction jig. 61 is a solder ball. Reference numeral 503 is a brush.

While the solder balls 61 are sucked by the suction jig 50, the brush 503 arranged at a predetermined distance from the lower surface of the suction jig 50 is moved. Then, when the two solder balls 61 are sucked into one suction hole, the amount of protrusion of these solder balls 61 from the lower surface of the suction jig 50 is larger than that of the other solder balls 61. The other solder ball 61, which is pushed by the tip of 503 and is sucked at the same time, is pushed away and is sucked by the suction hole of the suction jig 50. In this way, the solder balls 61 can be aligned with the suction jig 50.

In FIG. 30, 50 is a suction jig. 61 is a solder ball. 504 is a blade. Even with such a configuration, the suction jig 50 is similar to the case of FIG.
The solder balls 61 can be aligned with each other.

In FIG. 31, 50 is a suction jig. 61 is a solder ball. An air nozzle 505 is provided with an air outlet having a width substantially the same as that of the suction jig 50. With such a configuration, the solder balls 61 are attracted to the suction jig 50 by moving the air nozzles 505 while blowing air from the air nozzles 505 to the solder balls 61 with the solder balls 61 attracted to the suction jig 50. Can be aligned.

In FIG. 32, 50 is a suction jig. 61 is a solder ball. 501 is a solder ball container, and the bottom surface is formed by a net 502 having eyes smaller than the diameter of the solder ball 61. An air nozzle 505 is provided with an air outlet having a width substantially the same as that of the suction jig 50.

With such a structure, by moving the air nozzle 505 while blowing air from the blowing port, the solder balls 61 are blown up sequentially from the end to the solder ball suction holes of the suction jig 50. As compared with the case where the solder balls 61 are blown up, the blow-up adjustment is facilitated, and the solder balls 61 can be reliably supplied to the suction jig 50 and sucked.

Next, another embodiment of the flux supply device will be described with reference to FIGS. 33 to 42. FIG.
Is a perspective view showing a second embodiment of the flux supply device,
34 to 36 are process diagrams when the flux supply device shown in FIG. 33 is used.

In FIG. 33, 314 is a motor. 308
Is a disk and is supported by the rotating shaft of the motor 314. 6
8 is a stand. A bearing 331 is supported by the stand 68. A shaft 332 is movably supported by the bearing 331. A moving mechanism 312 is formed of, for example, a micrometer head, and is fixed to the stand 68. 333 is a bracket that connects the movable portion of the moving mechanism 312 and the shaft 332. 69 is a squeegee and has a shaft 332
It is fixed to. 70 is flux. A liquid film 305 is formed by spreading the flux.

With such a configuration, the gap between the disc 308 and the squeegee 69 is set to a predetermined value via the moving mechanism 312, and the flux 70 is supplied between the squeegee 69 and the disc 308. Then, the motor 314 is operated, and the disk 308
As shown in FIG. 34, when the flux 70 is rotated, the flux 70
Is spread on the disk 308, and the disk 3 is placed on the disk 308.
The liquid film 305 of the flux 70 having a thickness corresponding to the distance between the 08 and the squeegee 69 is formed. When the required liquid film 305 is formed, the disk 308 stops.

Then, as shown in FIG. 35, this liquid film 3
05 solder balls 61 (a
To f) are dipped to supply the flux 70 to the solder balls 61 (a to f). Then, unevenness is formed on the surface of the liquid film 305 from which the flux 70 has been taken out by adhering to the solder balls 61.

Therefore, as shown in FIG. 36, the disk 308 is rotated again to repair the irregularities on the surface of the liquid film 305.

According to the present embodiment, the disk 308, on which the flux 70 is spread, also serves as a resistance plate that gives flow resistance to the flux 70. As a result, the structure of the portion of the flux supply device where the flux 70 is accumulated becomes a plate-like structure, which simplifies the structure. Therefore, it becomes easy to exchange the flux and maintain the device.

FIG. 37 is a side view showing a third embodiment of the flux supply apparatus, and FIGS. 38 to 39 are process drawings when the flux supply apparatus shown in FIG. 37 is used.

In the figure, 318 is a flux tank. 3
Reference numeral 16 is a recess, which is formed in the flux tank 318 at a predetermined interval. 70 is a flux and 69 is a squeegee.

With such a structure, as shown in FIG.
The flux 70 supplied onto the flux tank 318 is extended by a squeegee 69, and the recess 70 is filled with the flux 70.

Then, as shown in FIG. 38, the suction jig 5
The solder ball 61 adsorbed at 0 is immersed in the flux 70 filled in the recess 316 to a predetermined depth.

Further, as shown in FIG. 39, the solder ball 61 may be brought into contact with the bottom surface of the recess 316. At this time, if there is a concern that the solder ball may drop or be damaged due to contact, this can be prevented by forming the contact surface of the solder ball 61 with an elastic body such as silicon rubber.

With such a structure, the amount of the flux 70 supplied to the solder balls 61 can be made uniform. Note that, as shown in FIG. 40, a plurality of solder balls 61 may correspond to one recess 316. Further, as shown in FIG. 41, a plurality of recesses 316 may correspond to one solder ball 61. Thus, the solder balls 61 and the depressions 3 are not always
It is not necessary that 16 correspond one-to-one.

FIG. 42 is a side view showing the fourth embodiment of the flux supply apparatus. In the figure, reference numeral 335 denotes a plate having through holes 336 formed at predetermined intervals.
70 is a flux and 69 is a squeegee.

With such a structure, the squeegee 69 arranged so as to sandwich the plate 335 is moved to fill the flux 70 in the through hole 336, and the solder adsorbed by the suction jig 50 in the through hole 336. Ball 6
1 is immersed and the flux 70 is supplied to the solder balls 61.

FIG. 43 is a side view showing the fifth embodiment of the flux supply apparatus. In the figure, 70 is a flux, 318 is a flux liquid tank, 316 is a resistance plate for preventing wetting up, and 310 is an elastic body. Elastic body 310
When the solder ball 61 is dipped in the flux 70, the solder ball 61 may come into contact with the resistance plate 316, so that a load is applied to the solder ball 61 and the solder ball 61 is separated from the suction jig 50. It serves as a cushioning material for prevention.

With such a structure, the lower end of the solder ball 61 sucked by the suction jig 50 is dipped in the flux 70, so that the flux
Supply 0. At this time, the resistance plate 316 prevents the flux 70 from getting wet.

According to this embodiment, the resistance plate 316 for preventing wetting up is provided in the flux supply section, so that when the flux 70 is supplied to the solder balls 61, the flux 70 wets the adsorption jig 50. It is possible to limit the rise and to prevent the adsorption jig 50 from being contaminated even if the same flux as the conventional one is used. Therefore, the suction jig 50 is kept clean, and the solder bump forming apparatus can operate stably.

FIG. 44 shows the effect of preventing the resistance plate 316 from getting wet. The data is 0.7
A 6 mm eutectic solder ball was measured using Deltalux 527 (trade name) (viscosity: 8000 cP), which is a flux manufactured by Senju Metal Industry Co., Ltd. Further, the suction jig 50 is made of stainless steel, and the solder ball suction portion has a projection shape, and the resistance plate 316 is also made of stainless steel.

When the distance from the surface of the flux liquid to the upper surface of the resistance plate 316 is 6 mm, the flux 70 wets the adsorption jig 50 and the adsorption jig 50 is wet only by the solder balls 61 lightly touching the surface of the flux liquid. Pollutes.

However, the resistance plate 316 is changed from the flux surface.
When the distance at the upper surface of the flux is set to 0.4 mm, the wetting up of the flux 50 is limited to a range that does not reach the suction jig 50 slightly.

Further, from the flux liquid surface, the resistance plate 316 is
When the distance to the upper surface of the suction jig 50 is 0.2 mm, the wetting up of the flux 70 is further reduced, and the suction jig 50 stays in a safe range where there is no concern of contamination. And the suction jig 5
It is possible to eliminate various problems caused by the contamination due to the adhesion of the flux 70 to the zero.

Thus, when the resistance plate 316 is used,
By suppressing the distance from the flux liquid surface to the resistance plate to 50% or less of the diameter of the solder ball 61, the suction jig 50
It is possible to prevent the pollution of.

Further, the solder balls 61 are replaced with the flux 70.
In the state of being immersed in the
On the other hand, if the distance from the flux liquid surface to the resistance plate 316 is set so that the position of the upper end of the meniscus to be formed is suppressed to 50% or less of the diameter from the lower end of each solder ball 61,
It is a safer setting with no contamination of the suction jig 50.

FIG. 45 is a sectional view showing a sixth embodiment of the flux supply apparatus. In the figure, 318 is a flux liquid tank, 70 is a flux, 319 is a mesh-like resistance plate, 50 is a suction jig, 61 is a solder ball, and 310 is an elastic body.

Even with such a configuration, the flux 70
The same effect as above can be obtained by setting the distance from the liquid surface to the upper surface of the resistance plate 319 such that the position of the upper end of the meniscus is suppressed to 50% or less of the diameter from the lower end of each solder ball 61. You can

FIG. 46 is a side view showing the seventh embodiment of the flux supply apparatus. In the figure, 318 is a flux liquid tank, 70 is a flux, 316 is a resistance plate, 31
An elastic body 0 is fixed to the upper surface of the resistance plate 316.
Reference numeral 50 is a suction jig, and 61 is a solder ball.

With such a structure, the distance from the liquid surface of the flux 70 to the upper surface of the elastic body 310, the position of the upper end of the meniscus, and the diameter of the solder ball 61 from the lower end of the solder ball 61 are 50 mm in diameter.
By setting the content to be less than or equal to%, the same effect as described above can be obtained. Further, even if the solder ball 61 collides with the elastic body 319, it is possible to prevent the solder ball 61 from falling off the suction jig 50.

FIG. 47 is a side view showing the eighth embodiment of the flux supply apparatus. In the figure, 318 is a flux liquid tank, 70 is a flux, 320 is a resistance plate formed of a porous material, and a recess facing the solder balls is formed on the upper surface of the resistance plate, and from the liquid surface of the flux 70. It is installed so as to project. 50 is a suction jig, 61
Is a solder ball and 69 is a squeegee, which is movably arranged so as to contact the upper surface of the resistance plate 320.

With such a structure, the resistance plate 320 is formed of a sponge-like soft material, ceramics, or the like, so that the flux 70 seeps to the surface due to the osmotic pressure or the capillary phenomenon. Therefore, the flux 70 can be supplied to the solder balls 61 by contacting or pushing the solder balls 61 sucked by the suction jig 50 into the concave portions of the resistance plate 320.

Since the surface of the resistance plate 320 is exposed from the flux 70, when the characteristics of the flux 70 exuding on the surface of the resistance plate 320 deteriorate due to drying or oxidation, the squeegee 69 is moved to remove the resistance. The flux 70 on the surface of the plate 320 is scraped off, and the new flux 70
Ooze on the surface.

In each of the above-mentioned embodiments, the case where the solder balls are used has been described. However, when other conductive balls or conductive cylinders or the like are not required, for example, Even in the case of non-conductive balls such as glass spheres and plastic spheres used for setting the interval of liquid crystal glass, the same effect can be obtained regarding the supply of the adhesive.

In this embodiment, the flux is used as the adhesive liquid for attaching the solder balls to the substrate. However, as the adhesive liquid, a solder paste or an adhesive containing conductive particles is used. In this case, the same effect can be obtained.

FIG. 48 is a schematic view showing a solder ball alignment inspection method, FIG. 49 is an enlarged view of the vicinity of the solder balls in FIG. 48, and FIG. 50 is a bottom view of the solder balls in FIG.

In the figure, 50 is a suction jig, 61 is a solder ball, 1303 is a light source for illumination, 80 is an image pickup camera, 84 is an image processing device, 1306 is a solder ball 61.
Is a dark portion of the solder ball 61, and 1307 is a bright portion of the solder ball 61.

With such a configuration, the alignment inspection of the solder balls 61 aligned and adsorbed by the adsorption jig 50 is performed by the illumination light source 13.
Image processing device 84 performs image processing on the basis of the captured image captured by the image capturing camera 80 from below the solder ball 61 illuminated by the light beam from 03, and the bright portion 1307 of the solder ball 61 in the captured image is displayed. It is done by measuring the position and counting.

FIG. 51 is a side view showing a state in which the solder balls are mounted on the pads of the substrate.

In the figure, reference numeral 302 denotes a package substrate. Reference numeral 307 denotes a pad, which is formed on the substrate 302.
1310 is a resist film, which is the substrate 30 excluding the pad 307.
It is applied to the entire surface of 2. 50 is a suction jig. 57 is a Kenzan pin, which is movably arranged in the suction jig 50. 61 is a solder ball. 70 is a flux, which is supplied to the solder balls 61.

With such a structure, the suction jig 50 descends in a state where the solder balls 61 are vacuum-sucked, and finally the vacuum is released to the atmosphere.
By pushing 1 toward the pad 307, the solder ball 61 is mounted on the pad 307. Solder balls 61
Are fixed on the pad 307 by the adhesive force of the flux 70.

FIG. 52 is an enlarged view showing the wetting and spreading when the solder balls mounted on the pads of the substrate are reflowed.

In the figure, 61 is a solder ball and 13 is a solder ball.
Reference numeral 15 is an oxide film, 70 is a flux, and 307 is a pad.

Generally, the surface of the solder ball 61 is covered with an oxide film 1315. During reflow, the reducing action of the flux 70 breaks the oxide film 1315 covering the solder balls 61, and the melted solder spreads over the pads 307 by wetting. By this mechanism, solder bumps are formed.

FIG. 53 is an overall configuration diagram showing a third embodiment of a solder bump forming apparatus for realizing the bump forming method, and FIG. 54 is a flowchart of the bump forming method.

In the figure, the solder bump forming apparatus is
A solder ball accommodating portion 401 that accommodates several solder balls 61, and a suction jig 5 that is a jig for adsorbing and aligning the solder balls 61 in the solder ball accommodating portion 401.
0 and the solder balls 61 attracted to the suction jig 50
Flux supply device 402 for supplying the flux 70 to the
And three stations of the mounting portion 403 for mounting the solder balls 61 adsorbed by the adsorption jig 50 on the substrate,
Further, the suction jig 50 is composed of a transfer means (robot) 404 used for moving the suction jig 50 between the stations or moving the suction jig 50 in the vertical direction at each station, and a reflow furnace (not shown). Hereinafter, unless otherwise specified, the suction jig 50 is moved by the robot 404.

With the above-described structure, as shown in FIG. 54, the suction jig 50 is moved to the solder ball accommodating portion 401, and the solder balls 61 are vacuum-sucked in a state in which the solder balls 61 are aligned in the necessary number with the suction jig 50 ( Step B-1). Next, the suction jig 5
0 is moved to the flux supply unit 402, and the suction jig 5
0 is lowered, and the solder balls 61 are immersed in the flux 70 to supply the flux 70 to the solder balls 61 (step B-2). After the flux 70 is supplied to the solder balls 61, the suction jig 50 moves up.

Next, the suction jig 50 moves to the mounting portion 403 and is positioned above the board on which the solder balls 61 are mounted. Then, the suction jig 50 is lowered to mount the solder balls 61 on the pads of the substrate (step B-3).
The solder balls 61 are temporarily fixed on the pads by the adhesive force of the flux 70. Then solder balls 61
The substrate on which is mounted is transported into the reflow furnace by a conveyor or the like. The solder balls 61 are heated and melted in a reflow furnace, and then cooled to form solder bumps (step B-4).

The suction jig, the solder ball supply section, the flux supply section, the detection section, the mounting section, etc. in this embodiment can be constructed by appropriately combining the components shown in the above embodiments. Although illustration is omitted, a CCD camera is arranged between each unit. Even with such a configuration, it is possible to obtain the same effects as those of the above-described respective embodiments.

FIG. 55 is a flow chart showing a fourth embodiment of the solder bump forming method of the present invention.

As shown in the figure, the solder balls are attracted by a suction jig and aligned (step C-1). Next, the lower surface of the solder ball is flattened (step C-2).
Next, the quality of the alignment is inspected (step C-3).
Next, flux is supplied to the solder balls (step C-4). Next, it is inspected whether or not the solder balls were separated from the suction jig during the flux supply and no alignment defect was generated (step C-5). Up to this point, the aligned solder balls to which the flux has been supplied are prepared.

On the other hand, if necessary, the bump forming surface is cleaned by pulsed carbon dioxide laser irradiation (step C-
6) The prepared substrate is supplied to the solder ball mounting device, and then the pad, which is the bump forming position on the substrate, is positioned at the solder ball mounting position (step C-7). Then, the solder balls are mounted on the positioned substrate (step C-8).

Next, it is inspected whether or not the solder balls remain on the suction surface of the suction jig used for aligning the solder balls (step C-9), and the number and position shift of the solder balls on the board pads are checked. Perform an inspection (step C-
10) Check if solder balls are correctly and accurately mounted.

In this way, the substrate on which the solder balls are mounted is placed in a high temperature environment, whereby the solder balls are melted and bonded to the pads on the substrate, and then cooled (step C-11). Solder bumps are formed on the pads.

By flattening the solder balls as in this embodiment, it is possible to easily detect the solder balls. Further, when the solder balls are mounted on the substrate, the contact area between the solder balls and the pads on the substrate becomes large, so that the solder ball movement due to the surface force of the flux can be prevented and a more stable work can be performed. Further, even if the pad of the substrate is contaminated by the adhesion of the organic substance, it is possible to ensure the reliable bonding of the pad and the solder by the reflow.

FIG. 56 is a process drawing showing the first embodiment of the solder ball flattening process. In the figure, 50 is a suction jig, 61 is a solder ball, and 1308 is a rigid plate. The rigid plate 1308 is arranged, for example, between the solder ball supply device 200 and the CCD camera 80 shown in FIG.

With such a configuration, the solder balls 61 aligned and adsorbed by the adsorption jig 50 are pressed against the rigid plate 1308 and pressed to plastically deform the solder balls 61 and flatten the bottom surface.

57 and 58 are a side view and a bottom view showing a method for detecting a solder ball having a flat bottom surface.

As shown in the figure, in the case of the solder balls 61 which are aligned and sucked by the suction jig 50 and whose bottom surface is flattened, the surface 130 which reflects the illumination light from the light source in the camera direction.
6, the area of the surface 1307 that is specularly reflected is much larger than that shown in FIG. 49. In this way, since it is sufficient to recognize the large portion, the solder balls 61 can be easily recognized in the image processing during the alignment inspection. As a result, misrecognition at the time of alignment inspection can be reduced, and high-speed alignment inspection can be realized.

FIG. 59 is an enlarged view showing a state where the solder balls are mounted on the substrate.

As shown in the figure, by flattening the bottom surface of the solder ball 61, the pad 307 of the substrate 302 is formed.
Since the contact area between the solder ball 61 and the solder ball 61 becomes large, when the solder ball 61 is mounted on the pad 307 of the substrate 302, the stability of the solder ball 61 increases and the flux 70
It is possible to prevent the solder balls 61 from moving due to the surface force of.

FIG. 60 and FIG. 61 are an enlarged view showing a state during reflow of the solder ball and an enlarged view showing a state after reflow.

As shown in the figure, even if a foreign substance 1316 is present on the pad 307 of the substrate, there are a plurality of positions where the oxide film 1315 covering the solder ball 61 is broken by the reducing action of the flux 70 during reflow. As it is generated, the solder can wet and spread on the pad 307. Therefore, as shown in FIG. 61, properly connected solder bumps 1317 can be formed.

FIG. 62 is a process drawing showing a second mode of the flattening process of the bottom surface of the solder ball. In FIG.
Reference numeral 0 is an adsorption jig, 61 is a solder ball, 1308 is a rigid plate, 305 is a flux liquid film, and 70 is flux.

As described above, the resistance plate of the flux supply device is composed of the rigid plate 1308, and when the flux 70 is supplied to the solder balls 61, the solder balls 61 are connected to the rigid plate 1308.
It may be pressed against 308 to be flattened.

63 and 64 are process diagrams showing a third mode of the flattening process of the bottom surface of the solder ball. In the figure, 50 is a suction jig, 61 is a solder ball, 13
Reference numeral 08 is a rigid plate, 70 is a flux, and 1320 is an electronic component.

In this way, the electronic component 1320 is mounted on the rigid plate 1
The solder ball 61 is placed on the electronic component 132.
The solder ball 61 may be strongly pressed against the electronic component 1320 by the sword pin 57 to be flattened when mounted on the electronic component 1320.

[0167]

As described above, according to the present invention, it is possible to achieve a device structure in which the solder balls are sucked by the suction jig, the flux is supplied to the solder balls, and the solder balls are mounted on the package at the same time. Since this can be adopted, it is possible to provide a solder ball mounting device with a short cycle time and high operating efficiency.

By arranging a CCD camera and monitoring the lower surface of the suction jig, it is possible to check the occurrence of defects and prevent the production of defective products.

Further, one CC for detecting a reference such as a package alignment mark or a pad.
A D camera, a mechanism for correcting the position of the package, and a control device are provided to align the suction jig and the package before mounting the solder balls and to solder balls on the pads of the package after mounting the solder balls. I also tried to check the mounting state of.

With the above checking function, solder balls can be mounted with high reliability and defective products can be checked, so that productivity can be improved.

Further, a resistance plate that gives flow resistance to the flux is provided near the flux surface of the flux supply device to prevent the flux from adhering to the adsorption jig due to the wetting of the flux when the solder balls are immersed in the flux. Since it is prevented, it is possible to continuously supply the flux having good wettability to the solder balls with a simple mechanism, and it is possible to prevent an adsorption error and a mounting error due to the adhesion of the flux to the adsorption jig.

For the warp of the board, the suction surface of the suction jig and the swords are made to follow the warp of the board, and a screen for preventing the solder balls from being sucked is provided so that the solder balls can be sucked in a short time. In addition, a shield plate that can be easily attached and detached corresponding to the package is provided to facilitate the exchange of the package type. As a result, the solder balls can be reliably mounted even on a warped substrate, the time required for adsorption can be shortened, and the mask and sword mountain corresponding to the product type exchange can be omitted.

In addition, the pad surface of the package is cleaned in the mounting device immediately before mounting the solder ball to prevent the pad from being contaminated. As a result, defective solder wetting to the pad is eliminated, and highly reliable bump formation is possible.

Further, since the solder balls are partially flattened, the solder ball alignment inspection can be facilitated, the displacement after mounting can be prevented, and the solder wetting failure can be prevented even if the pad is slightly soiled. It is possible to prevent the occurrence.

Further, when the flux is supplied to the solder balls, the use of the flux supply plate in which the recesses are formed makes it possible to supply the highly accurate flux with less variation among the solder balls. Therefore, there is no excess or deficiency in the amount of flux supplied to each solder ball, and the occurrence of defects due to this is suppressed, so that bump formation can be stably and continuously performed.

Further, in addition to vacuum suction and air blowing, the air blowing nozzle was moved below the container containing the solder balls to supply the solder balls to the suction jig. This will not be a problem and it will be possible to supply solder balls with high reliability.

Further, even when a plurality of solder balls are sucked into one suction hole of the suction jig, a mask plate for preventing the plurality of solder balls from being sucked into each suction hole is used, or Excess solder balls can be removed by brushing off, scraping off with a blade, or blowing air.

As described above, bump formation with high reliability can be realized, and electronic parts having bumps can be supplied to the market at low cost.

[Brief description of drawings]

FIG. 1 is a flowchart showing a solder bump forming process in the present invention.

FIG. 2 is a process drawing showing the process in FIG.

FIG. 3 is a process drawing showing the process in FIG.

FIG. 4 is a process drawing showing the process in FIG.

FIG. 5 is a process drawing showing the process in FIG.

FIG. 6 is a process drawing showing the process in FIG.

FIG. 7 is a plan view of a solder ball mounting device according to the present invention.

8 is a front view of the solder ball mounting device of FIG. 7. FIG.

9 is a sectional view of the suction jig in FIG.

FIG. 10 is a side view of the mounting portion in FIG.

11 is a front cross-sectional view of the mounting portion in FIG.

FIG. 12 is a plan view showing a stop position of the table when the solder balls in FIG. 7 are detected.

FIG. 13 is a sectional view showing a second embodiment of a suction jig.

FIG. 14 is a process diagram showing a mounting process when the suction jig of FIG. 13 is used.

FIG. 15 is a process diagram showing a mounting process when the suction jig of FIG. 13 is used.

FIG. 16 is a process diagram showing a mounting process when the suction jig of FIG. 13 is used.

FIG. 17 is a process diagram showing a mounting process when the suction jig of FIG. 13 is used.

FIG. 18 is a process diagram showing a mounting process when the suction jig of FIG. 13 is used.

FIG. 19 is a process diagram showing a mounting process when the suction jig of FIG. 13 is used.

FIG. 20 is a cross-sectional view showing a third embodiment of a suction jig.

FIG. 21 is a sectional view showing a fourth embodiment of the suction jig.

FIG. 22 is a sectional view showing a fifth embodiment of the suction jig.

FIG. 23 is a sectional view showing a sixth embodiment of the suction jig.

FIG. 24 is a sectional view showing a seventh embodiment of the suction jig.

FIG. 25 is an operation explanatory view of the suction jig shown in FIG. 24.

FIG. 26 is a sectional view showing an eighth embodiment of the suction jig.

27 is an operation explanatory view of the suction jig shown in FIG. 26. FIG.

FIG. 28 is a sectional view showing a second embodiment of the solder ball supply device.

FIG. 29 is an explanatory diagram showing a method of aligning solder balls with respect to a suction jig.

FIG. 30 is an explanatory diagram showing a method of aligning solder balls with respect to a suction jig.

FIG. 31 is an explanatory diagram showing a method of aligning solder balls with respect to a suction jig.

FIG. 32 is an explanatory diagram showing a method of aligning solder balls with respect to a suction jig.

FIG. 33 is a perspective view showing a second embodiment of the flux supply device.

FIG. 34 is a process drawing when the flux supply device shown in FIG. 33 is used.

FIG. 35 is a process drawing when the flux supply device shown in FIG. 33 is used.

FIG. 36 is a process drawing when the flux supply device shown in FIG. 33 is used.

FIG. 37 is a sectional view showing a third embodiment of the flux supply apparatus.

FIG. 38 is a process drawing when the flux supply device shown in FIG. 37 is used.

FIG. 39 is a process drawing when the flux supply device shown in FIG. 37 is used.

FIG. 40 is a sectional view showing a modification of the third embodiment of the flux supply apparatus.

FIG. 41 is a sectional view showing a modification of the third embodiment of the flux supply apparatus.

FIG. 42 is a sectional view showing a fourth embodiment of the flux supply device.

FIG. 43 is a sectional view showing a fifth embodiment of the flux supply device.

FIG. 44 is a characteristic diagram showing the effect of preventing the flux of the resistance plate from getting wet.

FIG. 45 is a sectional view showing a sixth embodiment of the flux supply device.

FIG. 46 is a sectional view showing a seventh embodiment of the flux supply device.

FIG. 47 is a sectional view showing an eighth embodiment of the flux supply device.

FIG. 48 is a schematic view showing a solder ball alignment inspection method.

49 is an enlarged view of the vicinity of the solder ball in FIG. 48.

50 is a bottom view of the solder ball in FIG. 48. FIG.

FIG. 51 is a side view showing a state where solder balls are mounted on the pads of the substrate.

FIG. 52 is an enlarged view showing the wetting and spreading of solder.

FIG. 53 is an overall configuration diagram showing a third embodiment of a solder bump forming apparatus.

54 is a flowchart of the process in FIG. 53.

FIG. 55 is a flowchart showing a fourth embodiment of a solder bump forming method.

FIG. 56 is a process drawing showing the first mode of the solder ball flattening process.

FIG. 57 is a side view showing a method of detecting a solder ball having a flat bottom surface.

FIG. 58 is a bottom view showing a method for detecting a solder ball having a flat bottom surface.

FIG. 59 is an enlarged view showing a state in which flattened solder balls are mounted on a substrate.

FIG. 60 is an enlarged view showing a state during reflow of solder balls.

FIG. 61 is an enlarged view showing a state after the solder balls are reflowed.

FIG. 62 is a process drawing showing a second mode of the solder ball flattening process.

FIG. 63 is a process drawing showing a third mode of the solder ball flattening process.

64 is a sectional view of FIG. 63.

FIG. 65 shows an example of an electronic component to which the present invention is applied,
(A) is a perspective view, (b) is a sectional view.

FIG. 66 is a plan view of a conventional solder ball mounting device.

67 is a front view of FIG. 66.

68 is a cross-sectional view of the suction jig in FIG. 66.

FIG. 69 is an enlarged view showing a state in which the flux has wetted up onto the solder balls.

FIG. 70 is an enlarged view showing the displacement of solder balls that occurs when the substrate is tilted.

FIG. 71 is an enlarged view showing displacement of solder balls due to flux imbalance.

FIG. 72 is an enlarged view showing a state during reflow of solder balls.

[Explanation of symbols]

1 ... Base, 41 ... Table, 50 ... Suction jig, 55 ... Cylinder, 56 ... Plate, 59
… Solder ball hopper, 61… Solder ball, 69
... Squeegee, 70 ... Flux, 75 ... Package, 80, 81, 82, 83 ... CCD camera, 8
4 ... Image processing device, 85 ... Control device, 101 ...
Solder ball accommodating part, 102 ... Flux supplying part,
103 ... Transfer mounting part, 104 ... Conveying means (robot), 200 ... Solder ball supply device, 201 ...
Flux supply device, 202 ... Positioning device, 30
2 ... Substrate, 305 ... Liquid film, 307 ... Pad,
308 ... Disc, 310 ... Elastic body, 311 ... Solder bump, 312 ... Squeegee up / down mechanism, 314 ...
Motor, 316 ... Resistance plate, 317 ... Bottom portion of flux liquid tank, 318 ... Flux tank, 319 ... Resistance plate, 320 ... Porous material resistance plate, 321 ... Recess,
322 ... Through hole, 401 ... Solder ball accommodating portion,
402 ... Flux supply section, 403 ... Mounting section, 4
04 ... Robot, 501 ... Solder ball container, 50
2 ... Nozzle, 503 ... Brush, 504 ... Blade, 505 ... Slit air, 506 ... Suction hole, 60
0 ... Adsorption part, 601 ... Kenyama part, 602 ... Mask, 605 ... Kenyama pin, 606 ... Pressure rubber, 6
09 ... Suction hole, 612 ... Suction port, 614 ... Rubber, 615 ... Resin film, 616 ... Pipe Kenzan, 617 ... Rubber, 620 ... Screen, 62
2 ... Shielding plate, 623 ... Hole, 1303 ... Illumination light source, 1306 ... Dark part of solder ball, 13
07 ... bright part of solder ball, 1308 ... rigid plate,
1310 ... Resist film, 1312 ... Substituent component of pressing force in substrate surface direction, 1313 ... Substituent vertical component of pressing force, 1314 ... Pushing force, 1315 ... Oxide film, 1316 ... Foreign matter, 1320 ... Electronic component, 2
000 ... bump, 2001 ... substrate, 2002 ...
Sealing resin, 2003 ... Pad, 2004 ... Resist film, 2005 ... LSI chip, 2006 ... Gold wire,

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Reference number within the agency FI Technical indication location H01L 21/92 604Z (72) Inventor Hitoshi Odajima 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Stock company Hitachi, Ltd., Production Technology Laboratory (72) Inventor, Katsuhiro Iwashita, 292, Yoshida-cho, Totsuka-ku, Yokohama, Kanagawa Prefecture, Ltd.Hitachi, Ltd., Production Technology Laboratory, (72) Inventor, Tatsuya Yoneda 5-chome, Kamimizumoto-cho, Kodaira-shi, Tokyo No. 1 Incorporated company Hitachi, Ltd. Semiconductor Division (72) Inventor Michiharu Honda, 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Inside Production Engineering Research Laboratory Hitachi, Ltd. (72) Inventor Katsuhisa Tanaka Totsuka-ku, Yokohama-shi, Kanagawa 292 Yoshida-cho, Hitachi, Ltd., Production Engineering Laboratory (72) Inventor Go Yamaguchi, Ebina City, Kanagawa Prefecture Izumi 2100 In Hitachi Seiko Co., Ltd. (72) Inventor Tetsuo Murakami 2100 Kamiimazumi, Ebina City, Kanagawa Prefecture Hitachi Seiko Co., Ltd. (72) Inventor Tsuchiya Asahi 2100 Kamiimazumi, Ebina City, Kanagawa Hitachi Seiko Co., Ltd. (72) Inventor Yoshida Naito 2100 Kamiimazumi, Ebina City, Kanagawa Prefecture Hitachi Seiko Co., Ltd. (72) Inventor, Mitsuhiro Suzuki 2100, Kamiimazumi, Ebina City, Kanagawa Prefecture (72) Inventor, Hata Izumi 2100 Kamiimazumi, Ebina City, Kanagawa Prefecture Hitachi Seiko Co., Ltd. (72) Inventor Koji Shikiki 2100, Kamiimazumi, Ebina City, Kanagawa Prefecture Hitachi Seiko Co., Ltd.

Claims (38)

[Claims] 1. A step of adsorbing a conductive ball to an adsorption jig, a step of adhering a sticky liquid such as flux, solder paste or an adhesive containing conductive particles to the conductive ball, and the conductive ball. A step of aligning a pad of an electronic component, a step of pressing and mounting the conductive ball on the pad of the electronic component, and a step of applying a heat treatment to the electronic component on which the conductive ball is mounted. Bump forming method. 2. In the step of pressing and mounting a conductive ball on the pad of the electronic component according to claim 1, a suction jig is used to warp the pad surface corresponding to the warp of the surface of the electronic component on which the pad is formed. The bump forming method, characterized in that the conductive ball is pressed against the pad surface of the electronic component to be mounted thereon, following the above. 3. In the step of adhering a sticky liquid such as flux, solder paste or an adhesive containing conductive particles to the conductive ball according to claim 1, the conductive ball serves as a resistance plate for preventing the sticky liquid from getting wet. A bump forming method characterized in that an adhesive liquid is attached to the conductive balls by approaching or contacting them. 4. The bump forming method according to claim 1, wherein, after the step of adsorbing the conductive balls to the adsorption jig, and before the step of applying heat treatment to the electronic parts having the conductive balls mounted thereon, The method for forming bumps is characterized in that a step of flattening the surface of the conductive ball facing the pad is added or is performed in parallel with other steps. 5. In the step of adhering a sticky liquid such as a flux, a solder paste or an adhesive containing conductive particles to the conductive ball according to claim 3, a resistance plate that gives a flow resistance to the fixing liquid is provided on the surface of the sticky liquid. A method for forming bumps, characterized in that the adhesive liquid is attached to the conductive balls in the vicinity thereof. 6. In the step of adhering an adhesive liquid such as flux, solder paste or an adhesive containing conductive particles to the conductive balls according to claim 3, the bottom surface of the container containing the adhesive liquid also serves as a resistance plate. A bump forming method, wherein the adhesive liquid is attached to the conductive balls. 7. The step of adhering a sticky liquid such as a flux, a solder paste, or an adhesive containing conductive particles to the conductive ball according to claim 6, wherein the sticky liquid is immersed in a fixing liquid. The method for forming bumps is characterized in that the upper end of the meniscus formed on the conductive ball is set to 50% or less of the diameter of the conductive ball from the lower end of the conductive ball, and the adhesive liquid is attached to the conductive ball. 8. A resistance plate made of a porous material containing an adhesive liquid is provided in the step of adhering an adhesive liquid such as a flux, a solder paste or an adhesive containing conductive particles to the conductive ball according to claim 3. A bump forming method, characterized in that the adhesive liquid is adhered to the conductive balls by bringing the conductive balls into contact with the adhesive liquid that exudes from the porous material. 9. In the step of adhering an adhesive liquid such as a flux, a solder paste, or an adhesive containing conductive particles to the conductive ball according to claim 3, the resistance plate for preventing the adhesive liquid from getting wet is formed into a concave shape. A bump forming method, wherein the concave portion is filled with an adhesive liquid, the conductive ball is brought close to the concave portion, and the adhesive liquid is attached by contacting the filled adhesive liquid. 10. In the step of adhering an adhesive liquid such as a flux, a solder paste, or an adhesive containing conductive particles to the conductive ball according to claim 3, a resistance plate for preventing the adhesive liquid from getting wet is formed into a through hole shape. The bump forming method is characterized in that the through hole is filled with an adhesive liquid, the conductive ball is brought close to the through hole, and the adhesive liquid is attached by bringing the conductive ball into contact with the filled adhesive liquid. 11. In the step of adhering an adhesive liquid such as a flux, a solder paste or an adhesive containing conductive particles to the conductive ball according to claim 3, a resistance plate for preventing the adhesive liquid from getting wet is made of an elastic body. A bump forming method characterized by the above. 12. The bump forming method according to claim 1, wherein at least one of an adsorbing surface of an adsorbing jig for adsorbing and holding a conductive ball and a Kenzan pin for extruding the conductive ball is used to warp a pad forming surface of an electronic component. A bump forming method characterized in that the bumps are displaced by scanning and the conductive balls are pressed against the pad surface of the electronic component and mounted. 13. A bump forming method characterized in that, in the step of sucking the conductive balls according to claim 1, the relative positions of the ball blowing gas nozzle and the conductive ball suction holes are changed. 14. A bump forming method, wherein, in the step of adsorbing the conductive balls according to claim 13, the blow-off gas nozzle has a slit-shaped blow-out gas shape. 15. In the step of adsorbing the conductive balls according to claim 1, a suction jig is provided between a surface of the suction jig on the side where the conductive balls are sucked and a container containing the conductive balls. 100% of the diameter of the conductive balls in the same arrangement as the suction holes of
To less than 200% of the through-holes are arranged so as to substantially match the suction holes of the suction jig. 16. An electronic component, wherein bumps are formed by the bump forming method according to any one of claims 1 to 15. 17. A means for adsorbing a conductive ball to a suction jig, a means for adhering a sticky liquid such as a flux, a solder paste or an adhesive containing conductive particles to the conductive ball, and the conductive ball. A means for aligning a pad of an electronic component, a means for pressing and mounting the conductive ball on the pad of the electronic component, and a means for applying heat treatment to the electronic component on which the conductive ball is mounted. Characteristic bump forming device. 18. A means for mounting a conductive ball against a pad of an electronic component according to claim 17 by mounting a suction jig on the pad of the electronic component corresponding to the warp of the surface of the pad of the electronic component. A bump forming apparatus characterized in that a means for pressing the conductive ball against the pad surface of the electronic component is added in accordance with the above. 19. The resistance plate for preventing the adhesive liquid from getting wet as set forth in claim 17, wherein the means for adhering the adhesive liquid such as flux, solder paste or adhesive containing conductive particles to the conductive balls is provided with a resistance plate for preventing the adhesive liquid from getting wet. A bump forming apparatus. 20. The bump forming apparatus according to claim 17,
A bump forming apparatus comprising means for flattening a surface of the conductive ball facing a pad of an electronic component. 21. A resistance plate for preventing the wetting of the adhesive liquid in the means for adhering an adhesive liquid such as a flux, a solder paste or an adhesive containing conductive particles to the conductive ball of claim 19, and a porous material. A bump forming apparatus characterized by the above. 22. The resistance plate for preventing the adhesive liquid from getting wet in the means for adhering an adhesive liquid such as flux, solder paste or an adhesive containing conductive particles to the conductive ball of claim 19, A bump forming apparatus having a concave shape corresponding to the arrangement. 23. In the means for adsorbing conductive balls to a suction jig according to claim 17, a portion of the container containing the conductive balls facing the suction jig substantially coincides with a suction hole position of the suction jig. As described above, the bump forming apparatus is provided with a screen having through holes of 100% to less than 200% of the diameter and the same arrangement of the suction holes. 24. The bump forming apparatus according to claim 17, wherein a means for varying the number of suction holes is added to the suction jig. 25. The bump forming apparatus according to claim 17, wherein
Adhesive liquid such as flux, solder paste, or adhesive containing conductive particles is attached to the conductive balls, and a pad for electronic parts A bump forming apparatus having means for processing the steps of pressing and mounting the conductive balls in parallel with each other. 26. The bump forming apparatus according to claim 17,
A table that can be indexed and rotated and moved up and down at a predetermined interval, a suction jig that forms suction holes for the conductive balls and that is arranged at a predetermined interval in the rotation direction of the table, and a plurality of small diameter blown gas from the bottom surface. A conductive ball supply device that forms a hole and floats the conductive balls in a gas, a rotatable disk, and a squeegee arranged to face the surface of the disk at a predetermined interval, and on the disk. An adhesive liquid supply device that forms an adhesive liquid such as the supplied flux, solder paste, or adhesive containing conductive particles in the form of a liquid film,
A positioning device for positioning an electronic component on which conductive balls are mounted is provided, and the conductive ball supply device, the adhesive liquid supply device, and the positioning device are suctioned at the indexing position of the suction jig along the rotation direction of the table. A bump forming apparatus, which is arranged so as to face a jig in order. 27. The bump forming apparatus according to claim 25, wherein a plurality of image capturing devices and an image processing device for processing image information of the image capturing devices are provided, and the image capturing device is adhered to the conductive ball supply device. It is arranged at an intermediate position between the liquid supply device and the positioning device so as to face the suction jig, and has a function of inspecting the suction state of the conductive balls to the suction jig in each step. Bump forming device. 28. The bump forming apparatus according to claim 25, wherein one image capturing device is provided above the positioning device.
It is arranged so as to face the conductive ball mounting surface of the electronic component, the position of the pad of the electronic component is detected, the relative position with the suction jig is calculated, and the relative position error is corrected by the positioning device and necessary. The bump forming apparatus is characterized in that the number and positions of the conductive balls after mounting are inspected according to the above. 29. The bump forming apparatus according to claim 17, further comprising at least one of an adsorbing surface of the adsorbing head, which is displaced according to the warp of the sword mountain pin and the pad forming surface of the electronic component, and the sword mountain pin. Bump forming device. 30. The bump forming apparatus as claimed in claim 17, wherein the sword pin is made of a deformable elastic material. 31. The bump forming apparatus as claimed in claim 17, wherein the sword pin is formed of a pipe-shaped member. 32. The bump forming apparatus according to claim 17, wherein the suction surface is composed of an elastic body and a thin film. 33. The bump forming apparatus according to claim 17, wherein a plurality of blade mechanisms are built in one suction jig. 34. A resistance plate for preventing the adhesive liquid from getting wet, wherein concave portions are arranged in the means for adhering an adhesive liquid such as a flux, a solder paste or an adhesive containing conductive particles to the conductive ball according to claim 17. A bump forming apparatus comprising: 35. A resistance plate for preventing the adhesive liquid from getting up, wherein a through hole is provided in a means for attaching an adhesive liquid such as flux, solder paste or an adhesive containing conductive particles to the conductive ball according to claim 17. A bump forming apparatus comprising: 36. A bump forming apparatus, wherein the means for adsorbing the conductive balls according to claim 17 is provided with a gas blowing nozzle whose relative position to an adsorption hole of the adsorption jig is changed. . 37. The bump forming apparatus according to claim 36, wherein the shape of the gas outlet of the gas outlet nozzle is a slit shape. 38. An electronic component in which bumps are formed by using the bump forming apparatus according to any one of claims 17 to 37.