JPH09308961A - Soldering method - Google Patents
Soldering methodInfo
- Publication number
- JPH09308961A JPH09308961A JP12478496A JP12478496A JPH09308961A JP H09308961 A JPH09308961 A JP H09308961A JP 12478496 A JP12478496 A JP 12478496A JP 12478496 A JP12478496 A JP 12478496A JP H09308961 A JPH09308961 A JP H09308961A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- soldering
- flux
- alloy
- soldering method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims description 17
- 229910000679 solder Inorganic materials 0.000 claims abstract description 59
- 230000004907 flux Effects 0.000 claims abstract description 15
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 9
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 9
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 8
- 239000000956 alloy Substances 0.000 claims abstract description 8
- 150000001875 compounds Chemical class 0.000 claims abstract description 7
- 229910052801 chlorine Inorganic materials 0.000 claims abstract description 6
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 6
- 238000002844 melting Methods 0.000 claims abstract description 4
- 230000008018 melting Effects 0.000 claims abstract description 4
- 229910007116 SnPb Inorganic materials 0.000 claims abstract description 3
- 239000000460 chlorine Substances 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 229910000978 Pb alloy Inorganic materials 0.000 claims description 5
- 235000008331 Pinus X rigitaeda Nutrition 0.000 claims description 3
- 235000011613 Pinus brutia Nutrition 0.000 claims description 3
- 241000018646 Pinus brutia Species 0.000 claims description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 abstract description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract 1
- 229910000765 intermetallic Inorganic materials 0.000 abstract 1
- 239000011342 resin composition Substances 0.000 abstract 1
- 239000002344 surface layer Substances 0.000 description 10
- 238000000921 elemental analysis Methods 0.000 description 7
- 229910052745 lead Inorganic materials 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000005496 eutectics Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000000682 scanning probe acoustic microscopy Methods 0.000 description 4
- 241000270666 Testudines Species 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002128 reflection high energy electron diffraction Methods 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000000864 Auger spectrum Methods 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 229910006913 SnSb Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は半田付け方法に関
し、特に半田表面に有害なＰｂ原子の無い被膜を形成す
る半田付け方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering method, and more particularly to a soldering method for forming a coating film without harmful Pb atoms on a solder surface.
【０００２】[0002]
【従来の技術及び発明が解決しようとする課題】半田付
け工程は、電子回路製造上欠かせぬ技術である。自動化
された半田付け作業では、液体状のフローハンダを電子
回路ボードにのせる。または、クリームハンダと呼ばれ
る半田微粒子とフラックスの混合物を使用する半田付け
工程も重要である。しかし、半田中のＰｂ原子、イオン
が水中に溶け出し易いために人体への影響、環境汚染か
ら、Ｐｂを使用しない新しい半田材の開発が行われてい
る。しかしながら、新材料開発は困難でアメリカでも共
晶半田使用禁止は先送りされている。2. Description of the Related Art The soldering process is an essential technique for manufacturing electronic circuits. In automated soldering operations, liquid flow solder is placed on an electronic circuit board. Alternatively, a soldering process using a mixture of solder fine particles and flux called cream solder is also important. However, since Pb atoms and ions in the solder are easily dissolved in water, the influence on the human body and environmental pollution have led to the development of new solder materials that do not use Pb. However, the development of new materials is difficult, and the ban on the use of eutectic solder has been postponed even in the United States.
【０００３】共晶半田は電子回路ボードの製造に広く使
用されているのみならず、ＩＣのリードピンの表面も半
田メッキされていて、今後とも半田の使用量は増加する
と考えられる。半田付けの接着強度は接着面にＣｕとＳ
ｎの合金が形成されることにより生じる。Ｐｂ原子の役
割は、Ｓｎ金属の強度を増加させること、Ｃｕ表面との
ぬれ性を向上させ半田付けを容易にすること、融点を降
下させること、及びＳｎ金属の低温での結晶変態を抑制
することである。Eutectic solder is not only widely used in the manufacture of electronic circuit boards, but the surface of the IC lead pins is also solder-plated, and it is considered that the amount of solder used will continue to increase. The adhesive strength of soldering is Cu and S on the adhesive surface.
It is caused by the formation of an alloy of n. The role of the Pb atom is to increase the strength of the Sn metal, improve the wettability with the Cu surface to facilitate soldering, lower the melting point, and suppress the crystal transformation of the Sn metal at low temperatures. That is.
【０００４】Ｐｂ金属の使用禁止の動きからアメリカＴ
Ｉ社は半田表面にパラジュウムをコートする方法を開発
し、一部実用化されている。日本では動きが遅いが、Ｐ
ｂ金属に代わりＳｎＳｂまたはＳｎＡｌ合金を使用する
研究が開始されているが、実用のめどがたっていない。
上記Ｐｂ原子の役割を別の金属原子により行うことは容
易でない。From the movement to prohibit the use of Pb metal
Company I has developed a method for coating the surface of the solder with palladium, which has been partially put into practical use. It moves slowly in Japan, but P
While b metals used instead SnSb or SnAl alloy study has been initiated, the prospect of practical use not stand.
It is not easy to play the role of the Pb atom by another metal atom.
【０００５】更に、半田付け作業にはフラックスの使用
は欠かせない。今日最も広く使用されているフラックス
はロジン（松やに成分）にＣｌ成分を加えた活性化ロジ
ンである。半田付け後には表面にフラックス成分が残
り、電子回路に影響を与える（劣化）ことがあり問題が
ある。この発明の目的は、半田表面に有害なＰｂ原子を
含まない安定な被膜を形成する新規な半田付け方法を提
供することにある。Further, the use of flux is essential for soldering work. The most widely used flux today is an activated rosin obtained by adding a Cl component to rosin (pine nut ingredient). After soldering, the flux component remains on the surface and may affect (deteriorate) the electronic circuit, which is a problem. An object of the present invention is to provide a novel soldering method for forming a stable coating film containing no harmful Pb atom on the solder surface.
【０００６】[0006]
（１）請求項１の半田付け方法は、鉛（Ｐｂ）合金半田
及びフラックスまたはフラックス入り鉛合金半田を使用
して空気中で半田付けした後、直ちにその半田の溶解温
度と室温との間の所定の温度に所定時間保持し、その後
室温で自然冷却させることにより、半田付け後の半田表
面に鉛を含まない被膜を形成するものである。(1) The soldering method according to claim 1 uses lead (Pb) alloy solder and flux or flux-containing lead alloy solder in the air, and immediately after that, the solder is melted between the melting temperature and room temperature. By holding at a predetermined temperature for a predetermined time and then naturally cooling at room temperature, a lead-free film is formed on the solder surface after soldering.
【０００７】（２）請求項２の発明では、前記（１）に
おいて、Ｐｂ合金半田としてＳｎＰｂ合金に数％のＡｇ
を付加した半田を用いる。 （３）請求項３の発明では、前記（１）において、フラ
ックスとしてロジン（松やに成分）に塩素（Ｃｌ）を加
えた活性化ロジンを用いる。 （４）請求項４の発明では、前記（１）〜（３）におい
て、被膜としてＳｎ，Ｏ，Ｃｌを主成分とする化合物を
形成する。(2) In the invention of claim 2, in the above (1), several percent of Ag is added to SnPb alloy as Pb alloy solder.
Solder with is added. (3) In the invention of claim 3, in the above-mentioned (1), an activated rosin obtained by adding chlorine (Cl) to rosin (a component of pine tree) is used as the flux. (4) In the invention of claim 4, in the above (1) to (3), a compound containing Sn, O, or Cl as a main component is formed as a film.
【０００８】（５）請求項５の発明では、前記（４）に
おいて、所定の温度として７５±１０℃が、前記所定時
間として数分間がそれぞれ設定されているものである。(5) In the invention of claim 5, in the above (4), the predetermined temperature is set to 75 ± 10 ° C. and the predetermined time is set to several minutes.
【０００９】[0009]
【発明の実施の形態】これまで使用されてきた共晶Ｓｎ
Ｐｂ合金半田を使用して、Ｐｂ汚染を減少、または無く
する方法の１つは、半田付け後の半田表面にＰｂ原子が
存在しない状態を作ることである。普通、半田はα相
（Ｐｂリッチ相）、β相（Ｓｎリッチ相）の混合状態
で、その表面はＳｎＯ2 ，ＰｂＯ2 により覆われてい
る。BEST MODE FOR CARRYING OUT THE INVENTION Eutectic Sn that has been used so far
One way to reduce or eliminate Pb contamination using Pb alloy solder is to create the absence of Pb atoms on the solder surface after soldering. Normally, the solder is in a mixed state of α phase (Pb rich phase) and β phase (Sn rich phase), and its surface is covered with SnO 2 and PbO 2 .
【００１０】本発明による方法は、半田及びフラックス
以外特別の材料を使用することなく、α相、β相以外の
化合物で半田表面を覆うことである。普通、半田付けに
は活性化ロジンを使用する。我々の研究結果では、半田
付け後の半田の冷却の際に、自然冷却をするのではな
く、冷却を遅らせて７５℃前後に数分間半田を空気中に
保持すると、ロジン中のＣｌと半田のＳｎ及び空気中の
酸素とが化合した特殊な表面層を形成することができ
る。この表面層は、光学顕微鏡で観察すると亀の甲状の
模様を形成するので容易に見分けられる。The method according to the present invention is to coat the solder surface with a compound other than α phase and β phase without using any special material other than solder and flux. Usually, activated rosin is used for soldering. According to our research results, when cooling the solder after soldering, rather than performing natural cooling, delaying the cooling and keeping the solder in the air at around 75 ° C. for several minutes causes A special surface layer formed by combining Sn and oxygen in the air can be formed. This surface layer forms a turtle's instep pattern when observed with an optical microscope, so that it can be easily identified.
【００１１】この表面層はＡｇ入り半田において形成さ
れるが、普通の半田では形成されない。しかしながら、
表面層の元素分析によれば、表面層にはＡｇ原子が検出
されず、Ｓｎ，Ｏ，Ｃｌが主成分である。従って、Ａｇ
原子はこの表面層の形成を促進する役割があると考えら
れる。この表面被膜の結晶構造はＲＨＥＥＤ（反射高速
電子線回折法）観測によれば回折パターンが現れず、非
晶質と考えられる。This surface layer is formed with Ag-containing solder, but is not formed with ordinary solder. However,
According to the elemental analysis of the surface layer, Ag atoms are not detected in the surface layer and Sn, O and Cl are the main components. Therefore, Ag
Atoms are thought to play a role in promoting the formation of this surface layer. According to RHEED (reflection high-energy electron diffraction method) observation, the crystal structure of this surface coating is considered to be amorphous because no diffraction pattern appears.
【００１２】実験では約１cm×１cmのＣｕ板を用意し、
アセトン洗浄を行い、ホットプレート上で、半田付け後
の冷却温度を種々変化させた。フラックス入り糸半田
（Ａｇ２ｗｔ％，直径0.８mm）を約３００℃の半田ゴテ
で溶解した後、設定温度に２分間保った後室温（約２０
℃）へ自然冷却させた。冷却後の半田表面を光学顕微鏡
観察及びオージェ電子分光元素分析により観察した。In the experiment, a Cu plate of about 1 cm × 1 cm was prepared,
Acetone cleaning was performed, and the cooling temperature after soldering was variously changed on the hot plate. Flux-cored wire solder (Ag 2 wt%, diameter 0.8 mm) is melted with a soldering iron at a temperature of about 300 ° C, and then kept at a set temperature for 2 minutes and then at room temperature (about 20
(° C) and allowed to cool. The solder surface after cooling was observed by optical microscope observation and Auger electron spectroscopy elemental analysis.
【００１３】Ａｇ入り半田の自然冷却、ホットプレート
８０℃（２分）冷却、ホットプレート１２０℃（２分）
冷却した試料の半田表面を観察した。図１Ａに示すよう
に８０℃冷却の半田表面は、亀の甲の模様になってい
て、特殊な表面であることが分かる。Ａｇなしの半田の
自然冷却した試料、ホットプレート８０℃（２分）冷却
した試料の半田表面を観察すると、普通に見られるα，
β相の混合状態を表している。Natural cooling of Ag-containing solder, hot plate 80 ° C. (2 minutes) cooling, hot plate 120 ° C. (2 minutes)
The solder surface of the cooled sample was observed. As shown in FIG. 1A, it can be seen that the solder surface cooled at 80 ° C. has a turtle shell pattern and is a special surface. Observing the solder surface of the naturally cooled sample of Ag-free solder and the sample cooled by hot plate 80 ° C (2 minutes), α
The mixed state of the β phase is shown.
【００１４】次に、オージェ電子分光元素分析及びＳＥ
Ｍ（走査電子顕微鏡）観察を行った結果、自然冷却と、
１２０℃冷却した試料の表面は、ＳＥＭ画像では輝度の
違う２種類の混合になっている。輝度の違いは、オージ
ェ分析の元素分析データに現れる。データ例として、１
２０℃冷却のものを図２に示す。Ｐｂ，Ｓｎに着目する
と、図２Ａは、白い部分のデータで、Ｐｂ，Ｓｎの両方
が検出された。図２Ｂは黒い部分のデータで、Ｓｎのみ
でＰｂは検出されなかった。このことにより、図２Ａの
データはα相で、図２Ｂのデータはβ相であると考えら
れる。Next, Auger electron spectroscopy elemental analysis and SE
As a result of M (scanning electron microscope) observation, natural cooling,
The surface of the sample cooled at 120 ° C. is a mixture of two kinds having different brightness in the SEM image. The difference in brightness appears in the elemental analysis data of Auger analysis. As an example of data, 1
The thing cooled at 20 degreeC is shown in FIG. Focusing on Pb and Sn, in FIG. 2A, both Pb and Sn are detected in the white portion of the data. FIG. 2B shows the data of the black portion, Sn was not detected and Pb was not detected. From this, it is considered that the data in FIG. 2A is in the α phase and the data in FIG. 2B is in the β phase.
【００１５】８０℃冷却の亀の甲模様の半田表面はαま
たはβ相とは異なり、Ｓｎ：Ｏ：Ｃｌ＝１：0.１１：0.
３５（Ｓｎ3 ＯＣｌ1/3 ）の特殊な化合物表面であるこ
とがオージェスペクトルより解析された。この化合物
は、空気との接触がないと形成されない。実際上、半田
溶解時にフラックス液体が半田表面を覆っていると、こ
の表面層が形成されないことが観測されている。その他
の原子として、Ｃｌ，Ｏ，Ｃが検出されているが、これ
は、どの半田表面にも含まれている。図１Ｂは、オージ
ェ電子分光元素分析より解析した表面組成比を示したも
のである。これよりＡｇ入り半田の７５〜８０℃冷却試
料の表面には、Ｐｂが無いこと、またＣｌ／Ｓｎ比が広
がっていることが分かる。これはＳｎ3 ＯＣｌ1/3 の被
膜の形成後、過剰のＣｌが表面に付着していると解釈さ
れる。Unlike the α or β phase, the turtle shell pattern solder surface cooled at 80 ° C. was Sn: O: Cl = 1: 0.11: 0.
It was analyzed by Auger spectrum that it was a special compound surface of 35 (Sn 3 OCl 1/3 ). This compound does not form without contact with air. In fact, it has been observed that if the flux liquid covers the surface of the solder when the solder is melted, this surface layer is not formed. Cl, O, and C are detected as other atoms, which are contained in any solder surface. FIG. 1B shows the surface composition ratio analyzed by Auger electron spectroscopy elemental analysis. From this, it can be seen that there is no Pb and the Cl / Sn ratio is wide on the surface of the solder sample containing Ag and cooled at 75 to 80 ° C. This is interpreted as the excess Cl adhering to the surface after the formation of the Sn 3 OCl 1/3 film.
【００１６】以上の光学顕微鏡による表面画像とオージ
ェ電子分光元素分析の結果から、７５〜８０℃冷却の半
田表面にはフラックス成分と半田成分とが反応した化合
物が形成され、Ｐｂ原子の無い表面層の被膜を形成でる
ことが分かった。この被膜は安定で、１００℃で１日間
放置しても破れることはない。また、実験によって最適
の表面層形成温度は、７５±１０℃であることが分かっ
た。Ａｇが入っていない共晶半田では、この表面層の形
成が観測されなかった。From the above-mentioned surface image by the optical microscope and the result of Auger electron spectroscopic elemental analysis, a compound in which the flux component and the solder component react with each other is formed on the solder surface cooled at 75 to 80 ° C., and the surface layer having no Pb atom is formed. It was found that the above film could be formed. This coating is stable and will not break even if left at 100 ° C. for 1 day. In addition, it was found from an experiment that the optimum surface layer formation temperature is 75 ± 10 ° C. The formation of this surface layer was not observed in the eutectic solder containing no Ag.
【００１７】[0017]
【発明の効果】この発明によれば、半田付けした半田表
面にＰｂ原子の無い表面被膜を形成することができる。
これにより回路基板の製造工程中または廃棄後における
Ｐｂの水中への溶解及び接触による人体へのＰｂイオン
の転移を防止することが可能となり、従来からの半田材
の使用を継続することができる。According to the present invention, it is possible to form a Pb atom-free surface coating on the soldered solder surface.
This makes it possible to prevent the transfer of Pb ions to the human body due to the dissolution and contact of Pb in water during the manufacturing process of the circuit board or after disposal, and the conventional use of the solder material can be continued.
【図１】Ａはこの発明の半田付け方法において、銀入り
半田を用いて半田付け後８０℃で２分間冷却した後、自
然冷却した場合の半田表面の光学顕微鏡で見た画像、Ｂ
は半田の種類及び半田付け後の冷却条件を変えた場合の
半田表面の元素の組成比を示す図。FIG. 1A is an image of an image of a solder surface observed by an optical microscope when the silver-containing solder is used for soldering and then cooled at 80 ° C. for 2 minutes and then naturally cooled in the soldering method of the present invention.
FIG. 4 is a diagram showing the composition ratio of elements on the solder surface when the type of solder and the cooling conditions after soldering are changed.
【図２】銀入り半田を用いて半田付け後１２０℃で２分
間冷却した後、自然冷却した場合の半田表面のα相とβ
相のオージェ電子分光元素分析の結果を示す図。[Fig. 2] α phase and β of the solder surface when the solder containing silver is used for soldering and then cooled at 120 ° C for 2 minutes and then naturally cooled
The figure which shows the result of the Auger electron spectroscopy elemental analysis of a phase.
Claims (5)
はフラックス入り鉛合金半田を使用して空気中で半田付
けした後、直ちにその半田の溶解温度と室温との間の所
定の温度に所定時間保持し、その後室温で自然冷却させ
ることにより、半田付け後の半田表面に鉛を含まない被
膜を形成することを特徴とする半田付け方法。1. A lead (Pb) alloy solder and flux or a flux-containing lead alloy solder is used for soldering in air, and then immediately held at a predetermined temperature between the melting temperature of the solder and room temperature for a predetermined time. The soldering method is characterized in that a lead-free coating is formed on the solder surface after soldering by natural cooling at room temperature.
ＳｎＰｂ合金に数％のＡｇを付加した半田であることを
特徴とする半田付け方法。2. The soldering method according to claim 1, wherein the Pb alloy solder is a SnPb alloy to which several% of Ag is added.
ジン（松やに成分）に塩素（Ｃｌ）を加えた活性化ロジ
ンであることを特徴とする半田付け方法。3. The soldering method according to claim 1, wherein the flux is an activated rosin obtained by adding chlorine (Cl) to rosin (a pine tree component).
ｎ，Ｏ，Ｃｌを主成分とする化合物であることを特徴と
する半田付け方法。4. The coating according to claim 1, wherein the coating is S
A soldering method, which is a compound containing n, O, and Cl as main components.
て７５±１０℃が、前記所定時間として数分間がそれぞ
れ設定されていることを特徴とする半田付け方法。5. The soldering method according to claim 4, wherein the predetermined temperature is set to 75 ± 10 ° C. and the predetermined time is set to several minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12478496A JPH09308961A (en) | 1996-05-20 | 1996-05-20 | Soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12478496A JPH09308961A (en) | 1996-05-20 | 1996-05-20 | Soldering method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09308961A true JPH09308961A (en) | 1997-12-02 |
Family
ID=14894046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12478496A Withdrawn JPH09308961A (en) | 1996-05-20 | 1996-05-20 | Soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09308961A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005071750A3 (en) * | 2004-01-13 | 2006-01-12 | Halliburton Energy Serv Inc | Conductive material compositions, apparatus, systems, and methods |
| JP2015232179A (en) * | 2015-07-09 | 2015-12-24 | 日立金属株式会社 | Copper base material |
-
1996
- 1996-05-20 JP JP12478496A patent/JPH09308961A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005071750A3 (en) * | 2004-01-13 | 2006-01-12 | Halliburton Energy Serv Inc | Conductive material compositions, apparatus, systems, and methods |
| US7696611B2 (en) | 2004-01-13 | 2010-04-13 | Halliburton Energy Services, Inc. | Conductive material compositions, apparatus, systems, and methods |
| JP2015232179A (en) * | 2015-07-09 | 2015-12-24 | 日立金属株式会社 | Copper base material |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20030805 |