JPH09316148A - Resin composition, its film and its cured product - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a resin composition which can give elaborate resistor, conductor, phosphor and diaphragm patterns for, e.g. a plasma display when they are developed and baked after exposure to ultraviolet rays by mixing a photopolymerizable resin with a metal powder, etc. SOLUTION: A photopolymerizable resin (A) is mixed with a non-reactive resin (A'), a diluent (B), a photopolymerization initiator (C), an ultraviolet absorber (D), a colorant (E), and a metal powder, a metal oxide or glass (F). Examples of component A include an aliphatic glycidyl ether (meth)acrylate described in Japanese Patent Laid-Open No.259528/1995 and a poly(meth)acrylate described in Japanese Patent Laid-open No.8-33099/1996. An example of component A' is polyethylene glycol polyester, and an example of component B is a reactive diluent or an organic solvent such as a half ester of a polycarboxylic acid anhydride. Examples of component F include Y2 O3 , Eu, YVO4 , Mn .Zn2 SiO4 , a copper powder, a silver powder and a glass powder having a particle diameter of 10μm or below. The obtained mixture is kneaded to obtain a resin composition for pattern formation, which is applied to various substrates to form patterns.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is preferably used in a manufacturing process of a resistor pattern, a conductor circuit pattern or a fluorescent substance pattern, a partition wall or the like used in a plasma display, a fluorescent display tube, an electronic component, etc. 400 to 1 after development with weak alkaline aqueous solution or water
A resin composition for forming a good resistor pattern, a circuit pattern having excellent conductivity, a fluorescent substance pattern, partition walls, or the like for stably flowing an electric current by firing at 000 ° C., a film thereof, and a cured product thereof. And a fired molded product.

[0002]

2. Description of the Related Art Conventionally, resistors, phosphors and barrier ribs for plasma displays, or circuit conductors have been used as resistor pastes (resist pastes), fluorescent pastes (fluorescent pastes). Pattern), partition paste (paste of partition material) and conductor paste (paste of conductive material such as copper powder, silver powder) by pattern printing by screen printing and then firing. It is known that a resistor pattern, a fluorescent substance pattern, a partition pattern, or a conductor circuit pattern is formed by the above method. However, these cannot cope with the recent high density, fine line pattern of the resistor pattern, the fluorescent pattern, the partition pattern, or the conductor circuit pattern.
On the other hand, a method of forming a pattern by using a photosensitive paste has been proposed, but when the filler content of the partition wall component or the phosphor in the resin composition is increased, the light scattering of the filler results in a precise pattern. It is difficult to obtain a pattern. Further, in the step of applying the paste to the substrate, it is difficult to apply a uniform film thickness when the size of the substrate is large, and thus the characteristics of the obtained resistor, phosphor, partition and conductor tend to vary.

[0003]

The resin composition of the present invention improves the above-mentioned drawbacks, enables fine pattern formation, and after curing with ultraviolet rays, a weak alkaline aqueous solution (for example, 1% sodium carbonate aqueous solution) or Provided are a resin composition which is developed with water to form a good resistor pattern, a fluorescent body pattern, a partition wall pattern or a conductor circuit pattern, and a cured product thereof. Further, instead of the conventional printing method, a uniform film thickness can be secured by forming a film of this composition and applying it to a substrate.

[0004]

The present invention provides [1] a photopolymerizable resin compound (A) and / or a non-reactive resin (A '), a diluent (B), a photopolymerization initiator (C). , A UV absorber (D) and / or a colorant (E) and one or more kinds (F) selected from metal powder, metal oxides and glass (F). , [2]
[3] The resin composition according to the above [1] for a resistor pattern, a conductor pattern, a phosphor pattern or a partition pattern.
A film comprising the composition according to the above [1] and [2],
[4] A cured product of the composition described in [1], [2] and [3], [5] a resistor, a conductor, a phosphor and a partition obtained by firing the cured product described in [4], Regarding

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below.
The resin (A) used in the present invention includes, for example, a compound having two or more epoxy groups in one molecule and an unsaturated 2 compound in one molecule.
A resin obtained by reacting a compound having one heavy bond and one compound having a carboxyl group and, if necessary, reacting the polybasic acid anhydride (c), and specific examples thereof include JP-A-7-25.
9528 (meth) acrylate of aliphatic glycidyl ether, unsaturated group-containing polycarboxylic acid resin described in JP-A-7-288194, JP-A-7-314890, JP-A-8-19283, JP-A-8-19284 and JP-A-8-19284.
The poly (meth) acrylate resin etc. of -33099 are mentioned.

The non-reactive resin (A ') used in the present invention is
For example, polyethylene glycol, polyester which is a reaction product of polyethylene glycol and polybasic acid or its anhydride, acrylic polymer, cellulose and the like are exemplified,
Preferably, a water-soluble polyether and / or polyester compound described in JP-A-7-259526,
Examples thereof include rosin and / or phenolic resin containing a carboxyl group described in 288193, a water-soluble polymer described in JP-A-7-314888, and partially saponified polyvinyl acetate described in JP-A-7-314889.

The diluent (B) is used in the present invention.
Specific examples of the component (B) include, for example, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 1,4-butanediol mono (meth) acrylate, carbitol (meth) acrylate, acryloyl Acid anhydride of morpholine, hydroxyl group-containing (meth) acrylate (for example, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 1,4-butanediol mono (meth) acrylate, etc.) and polycarboxylic acid compound (Eg, succinic anhydride, maleic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, etc.) half ester, polyethylene glycol di (meth) acrylate, tripropylene glycol di (meth) Acrylate, Methylolpropane tri (meth) acrylate, trimethylolpropane polyethoxytri (meth) acrylate, glycene polypropoxytri (meth) acrylate, di (meth) acrylate of ε-caprolactone adduct of neopyrene glycol hydroxybivalate (for example, KAY manufactured by Nippon Kayaku Co., Ltd.
ARAD HX-220, HX-620, etc.), pentaerythritol tetra (meth) acrylate, poly (meth) acrylate of a reaction product of dipentaerythritol and ε-caprolactone, dipentaerythritol poly (meth) acrylate, mono or polyglycidyl Compounds (for example, butyl glycidyl ether, phenyl glycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether,
Epoxy which is a reaction product of (meth) acrylic acid with hexahydrophthalic acid diglycidyl ester, glycerin polyglycidyl ether, glycerin polyethoxyglycidyl ether, trimethylolpropane polyglycidyl ether, trimethylolpropane polyethoxypolyglycidyl ether, etc. Reactive diluents (B-1) such as meth) acrylates, ethylene glycol monoalkyl ethers, ethylene glycol dialkyl ethers,
Diethylene glycol monoalkyl ether acetates, ethylene glycol monoaryl ethers, polyethylene glycol monoaryl ethers, ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, acetates, esters such as butyl acetate,
Toluene, xylene, aromatic hydrocarbons such as benzyl alcohol, propylene glycol monoalkyl ethers, dipropylene glycol dialkyl ethers, propylene glycol monoalkyl ether acetates, ethylene carbonate, propylene carbonate,
Organic solvents (B-2) such as γ-butyrolactone and solvent naphtha can be exemplified. The diluents may be used alone or as a mixture of two or more.

Specific examples of the photopolymerization initiator (C) include, for example, 2,4-diethylthioxanthone, 2-chlorocutixanthone, isopropylthioxanthone, 2-methyl-1- [4- (methylthio) phenyl]-. 2-morpholino-propane-1,2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -1-butanone, 4-benzoyl-4'-methyldiphenyl sulfide, 2,4,6-trimethylbenzoyl Examples thereof include diphenylphosphine oxide, Michler's ketone, benzyl dimethyl ketal and 2-ethyl anthraquinone. Further, a photopolymerization accelerator (for example, amines such as N, N-dimethylaminobenzoic acid ethyl ester, N, N-dimethylaminobenzoic acid isoamyl ester) as an accelerator of the photopolymerization initiator (B) is used in combination. You can also.

Examples of the ultraviolet absorber (D) include benzotriazole derivatives, benzophenone derivatives, salicylic acid derivatives and cyanoacrylate derivatives. As the benzotriazole derivative, 2- (2-hydroxy-5-methylphenyl) benzotriazole, 2- (2
-Hydroxy-5-tert-butylphenyl) benzotriazole, 2- (2-hydroxy-3,5-di-
tert-butylphenyl) benzotriazole, 2-
(2-hydroxy-3-tert-butyl-5-methyl) benzotriazole, 2- (2-hydroxy-3,
5-di-tert-butylphenyl) -5-chlorobenzotriazole, 2- (2-hydroxy-3,5-di-
tert-amylphenyl) benzotriazole, 2-
(2-hydroxy-4-octoxyphenyl) benzotriazole, 2- {2-hydroxy-3- (3,4,
5,6-tetrahydrophthalimidomethyl) -5-methylphenyl) benzotriazole, 2- (2-hydroxy-3,5-di-nonylphenyl) benzotriazole, 2- (2-hydroxy-5'-methacryloxyethylphenyl) ) As benzophenone derivatives such as -2H-benzotriazole and copolymers thereof, 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-octoxybenzophenone, 2-hydroxy-4- Dodecyloxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4,4 '
-Salicylic acid derivatives such as -dimethoxybenzophenone and 2-hydroxy-4-methoxy-5-sulfobenzone include phenyl salicylate, p-tert-butylphenyl salicylate, p-octylphenyl salicylate, and 2-ethylhexyl salicylate. And cyanoacrylate derivatives such as homomenthyl salicylate include 2
-Ethylhexyl-2-cyano-3,3-diphenyl acrylate, ethyl-2-cyano-3,3-diphenyl acrylate and the like.

Examples of the colorant (E) include dyes and pigments. Examples of the dye include natural dyes and synthetic dyes.Examples of natural dyes include animal dyes such as ancient purple and cochineal, plant dyes such as eye and madder, and mineral dyes such as mineral khaki.Synthetic dyes include nitroso dyes.
Nitro dye, azo dye, stilbene dye, pyrazolone dye, triphenylmethane dye, xanthene dye, acridine dye, quinoline dye, thiazole dye, quinone imine dye, azine dye, oxazine dye, thiazine dye,
Examples include triazine dyes, sulfur dyes, anthraquinone dyes, indigoid dyes, phthalocyanine dyes and oxidation dyes, and more specifically, Kayaset Flavin FN,
Kaya set Flavin FG, Kaya set yellow
SF-G, Kayaset Orange SF-R, Kayaset Red SF-4G, Kayaset Red SF-
B, Kaya Set Blue FR, Kaya Set Yellow 2G, Kaya Set Yellow GN, Kaya Set Orange G, Kaya Set Red G, Kaya Set Red 130, Kaya Set Red B, Kaya Set Blue N, Kaya Set Black G, Kaya Set Black B, Kaya Set Black AN, Kaya Set Green AB, Kayaset Blue A-
D, Kayaset Yellow AG, Kayaset Orange AN, Kayaset Red AG, Kayaset Red A-2G, Kayaset Red A-BR,
Kayaset Violet AR, Kayaset Blue A-2R, Kayaset Yellow EG, Kayaset Yellow E-AR, Kayaset Red EC
G, Kayaset Red E-BG, Kayaset Blue ARC, Kayalite B, Kayalite OS, and Kayalite OSN (all manufactured by Nippon Kayaku Co., Ltd.). As pigments, zinc white, lead white, basic lead sulfate, lead sulfate, lipotone, zinc sulfide, titanium oxide, antimony oxide, carbon black, acetylene black,
Lamp black, bone black, graphite, iron black, mineral black, aniline black, cyanine black, graphite, zinc yellow, barium chromate, cadmium yellow,
Yellow iron oxide, loess, titanium yellow, lead cyanamide, calcium lead acid, naphthol yellow S, Hansa yellow 10G,
Hansa Yellow 5G, Hansa Yellow 3G, Hansa Yellow G, Hansa Yellow GR, Hansa Yellow A, Hansa Yellow RN, Hansa Yellow R, Pigment Yellow L, Benzidine Yellow, Benzidine Yellow G, Benzidine Yellow G
R, Permanent Erone CG, Balken Fast Yellow 5G, Tartrazine Lake, Quinoline Yellow Lake,
Anslagen Yellow 6GL, Permanent Yellow FG
L, Permanent yellow H10G, Permanent yellow HR, Anthrapyridine yellow, Red lead graphite, Chrome vermillion, Sudan I, Permanent orange, Resole fast orange 3GL, Permanent orange GT
R, Hansa Yellow 3R, Vulcan Fast Orango G
G, Benzidine Orange G, Persian Orange, Indanthrene Brilliant Orange RK, Indanthrene Brilliant Orange GR, Iron Oxide, Amber, Permanent Brown FG, Para Brown, Bengala, Lead Tan,
Silver Vermilion, Cadmium Red, Cadmium Mercury Red, Antimony Vermilion, Permanent Red 4R, Para Red, Fire Red, Parachloroorthoaniline Red, Risole Fast Scarlet G, Brilliant Fast Scarlet, Yoseki, Brilliant Carmine B
S, Permanent Red F2R, Permanent Red F
4R, Permanent Red FRL, Permanent Red FRLL, Permanent Red F4RH, Vulcan Fast Rubin B, Vulcan Fast Pink G, Light Fast Red Toner R, Permanent Carmine FB, Pyrazolone Red, Risor Red, Lake Red C, Lake Red D, Ansosine B , Brilliant Scarlet G, Lisor Rubin GK, Permanent Red F5
R, Brilliant Toka 0 Min 6B, Pigment Scarlet 3B, Bordeaux 5B, Toluidine Maroon, Permanent Bordeaux F2R, Helio Bordeaux BL, Bordeaux 1
0B, Bon Maroon Light, Bon Maroon Media, Eosin Lake, Rhodamine Lake B, Rhodamine Lake Y, Alizarin Lake, Thioindigo Red B, Thio Indigo Maroon, Permanent Red FGR, PV Carmine HR, Monolight Fast Red YS, Permanent Red BL, cobalt purple, manganese purple, fast violet B, methyl violet lake, dioxazine violet, ultramarine, navy blue, cobalt blue, cerulean blue, gosu, alkali blue lake, peacock blue lake, Victoria blue lake, metal-free phthalocyanine blue, phthalocyanine Blue, Fast Sky Blue, Indanthrene Blue RS, Indanthrene Blue BC, Indigo, Chrome Green, Zinc Green, Chrome Oxide, Bi Zian, emerald green, cobalt green, pigment green B, naphthol green B, green gold, acid green lake, malachite green lake, phthalocyanine green, polybromide copper phthalocyanine, zinc sulfide, zinc silicate, zinc cadmium sulfide, calcium sulfide, strontium sulfide and Examples thereof include calcium tungstate.

Specific examples of the metal powder, metal oxide or glass (F) are, for example, ruthenium oxide, yttrium oxide, europium oxide, samarium oxide, cerium oxide, lanthanum oxide and oxide, which preferably have a particle size of 10 μm or less. Metal oxides or mixtures of praseodymium, neodymium oxide, gadolinium oxide, terbium oxide, dysprosium oxide, holmium oxide, erbium oxide, thulium oxide, Y ₂ O ₃ : Eu, YVO ₄ : Eu,
(Y, Gd) BO ₃ : Eu, BaAl ₁₂ O ₁₉ : Mn, Z
_{n 2 SiO 4: Mn, BaMgAl} 14 O 23: Eu, Ba
MgAl ₁₆ O ₂₇ : Eu, MgO, LaB ₆ , Al, La
_0.5 Sr _0.5 CoO ₃ , La _0.7 Sr _0.3 : MnO
₃ etc., copper powder, silver powder, palladium powder, mixed powder of silver and palladium, surface-treated gold powder, lanthanum, cerium, samarium, praseodymium, neodymium, promethium, europium, gadolinium, terbium, dysprosium, holmium, thulium, erbium, ruthenium,
Examples thereof include metal powder or a mixture of yttrium and scandium, glass powder, glass beads, and the like. Due to the characteristics possessed by them, they can be applied to a resistor composition, a conductor circuit composition, a phosphor composition, a partition composition, and the like.

The resin composition of the present invention comprises dissolving and mixing the components (A) and / or (A '), (B), (C), (D) and / or (E) and (F). It can be prepared by kneading. In the resin composition of the present invention, the use ratio of each component can be as follows (% is% by weight). The total amount of (A) + (B-1) + (C) used is preferably from 5 to 60%, particularly preferably from 10 to 50%, based on the composition. (F) The component is 40-
It is preferably 95%, particularly preferably 50 to 90%. The added amount of the component (D) or (E) is (A) + (B−
With respect to 1), 0.0001 to 20% is preferable, and 0.005 to 10% is particularly preferable. (A) + (B−
(1) The preferred amount of each component occupying in the total amount of (C) is as follows: (A) 30-90%, (B-
The amount of component 1) used is 5 to 65%, and the amount of component (C) used is 5 to 30%. The amount of the organic solvent (B-2) can be used in any ratio for the purpose of adjusting the viscosity and the like suitable for using the composition of the present invention.

In the resin composition of the present invention, a leveling agent, an antifoaming agent, a coupling agent, a polymerization inhibitor, waxes, etc. may be used within the range not impairing the performance.

As described above, the resin composition of the present invention comprises a resistor composition, a phosphor resin composition, a partition resin composition,
It can be used as a resin composition for a conductive circuit, and these are applied to the entire surface of various substrates (for example, glass, ceramic, metal, and the like) by a method such as screen printing, curtain flow coating, or spray coating. After application,
If necessary, pre-baking is carried out at about 50 to 250 ° C. with far infrared rays or warm air to remove the organic solvent, and then the film is exposed to ultraviolet rays using a negative mask that allows only the portions to be patterned to pass ultraviolet rays. UV exposure is 10
It is preferably from 1 to 10,000 mJ / cm ² . Liquid temperature 10-60
Development is carried out by a means such as spraying using a developing solution such as a dilute alkaline aqueous solution (eg, 1% sodium carbonate aqueous solution, 1% caustic soda aqueous solution) or water at 0 ° C., and then, for example, 1 to 24 at 400 to 1000 ° C. Bake for a time to form a pattern.

When used as a film, the resin composition of the present invention is applied to a release film or the like by using, for example, a wire bar system, a dipping system, a spin coating system, a gravure system, a doctor blade system or the like, If necessary, it is dried with far infrared rays or warm air at 50 to 250 ° C., and if necessary, a release film or the like is attached. When using, peel off the release film and transfer it to the substrate,
A pattern is formed by exposing, developing, and baking in the same manner as above.

[0016]

EXAMPLES The present invention will be described below with reference to Examples 1 to 5. In the examples, “parts” means “parts by weight”. According to the composition shown in Table 1, a partition and a resin composition for a phosphor were prepared. The obtained resin composition was applied on the entire surface of a glass substrate with a guide to a film thickness of 130 μm (dry film thickness) and prebaked at 80 ° C. for 30 minutes, and then a negative film (line / space =
(150 μm / 150 μm) was contacted and irradiated with 1500 mJ / cm ² by an ultrahigh pressure mercury lamp, and then the unexposed area was developed with a 1% sodium hydrogen carbonate aqueous solution or water (40 ° C.) at a spray pressure of 2 kg / cm ² for 2 minutes. After development, in air, 5
Firing was carried out at 00 ° C. for 1 hour to form partition walls and phosphor patterns. The residual resin content in the pattern, the developability, the state of the pattern after development, and the adhesion to the glass substrate after firing were evaluated.

(Synthesis Example of Reactant (A)) Synthesis Example In a round bottom flask equipped with a stirring device and a cooling tube, a copolymer type epoxy resin (manufactured by NOF CORPORATION, Bremmer CP) is used.
-50M, epoxy equivalent 310, average molecular weight 6000)
310 parts, 72 parts of acrylic acid, 1.8 parts of triphenylphosphine, 0.3 parts of methylhydroquinone and 450 parts of propylene glycol monomethyl ether acetate were charged, heated to 60 ° C and dissolved, and then reacted at 95 ° C for 32 hours. It was Then, 70 parts of succinic anhydride was charged, and 9 parts were added.
Reacted at 5 ℃ for 15 hours, solid content acid value 80mgKOH /
An unsaturated group-containing polycarboxylic acid resin having an average molecular weight of 9000 and a resin solid content of 50% was obtained.

[0018]

[Table 1] Table 1 Example 1 2 3 4 Polymer solution obtained in Synthesis Example 20.0 12.0 Paogen EP-15 * 1 10.0 6.0 Tetraethylene glycol diglycidyl 5.0 3.0 Diacrylate of ether KAYARAD THE-330 * 2 5.0 2.5 KAYARAD TPGDA * 3 3.0 2.0 KAYACURE DETX-S * 4 0.25 0.1 0.5 0.5 KAYACURE EPA * 5 0.25 0.1 0.5 0.5 Irg-651 * 6 0.1 Low melting point glass powder mixture 30 30 30 Y ₂ O ₃ : Eu 30 RUVA93 * 7 0.01 0.01 Carbon black * 8 0.01 0.01 Residual organic matter (wt%) 0.2 0.3 0.1 0.15 Developability (1% sodium carbonate solution) ○ ○ − − Developability (water) − − ○ ○ Pattern state after development ○ ○ ○ ○ Adhesion ○ ○ ○ ○

Note * 1 Paogen EP-15: Polyether polyester polymer (manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd.) * 2 KAYARAD THE-330: EO-modified trimethylolpropane triacrylate (Nippon Kayaku Co., Ltd.)
* 3 KAYARAD NPGDA: neopentyl glycol diacrylate (Nippon Kayaku Co., Ltd.) * 4 KAYACURE DETX-S: 2,4-diethylthioxanthone (Nippon Kayaku Co., Ltd.) * 5 KAYACURE EPA: Nippon Kayaku Manufactured by Yakuhin Co., Ltd.
p-Dimethylaminobenzoic acid ethyl ester * 6 Irg-651: manufactured by Ciba-Geigy Corporation, 2,
2-Dimethoxy-1,2-diphenylethan-1-one * 7 RUVA93: 2- (2-'hydroxy-5'-
Methacryloxyethylphenyl) -2H-benzothiazole (manufactured by Otsuka Chemical Co., Ltd.) * 8 Carbon black:

Example 5 The resin composition of Example 1 was applied to a release film so that the film thickness after drying was 130 μm, and dried at 80 ° C. for 30 minutes to obtain a film. Transfer this film to a glass substrate,
1500mJ by contacting a negative film with an ultra-high pressure mercury lamp
/ cm ² was irradiated and then developed for 2 minutes at a spray pressure 2 kg / cm ² using a 1% aqueous solution of sodium carbonate unexposed portions (40 ° C.). After the development, baking was performed at 500 ° C. for 1 hour in the air to form a partition wall pattern. The residual resin content in the pattern, the developability, the state of the pattern after development, and the adhesion to the glass substrate after firing were all ○.

(Residual organic content): The weight of the residual organic material after heating and baking at 450 or 600 ° C. for 30 minutes is measured. (Developability): 1% aqueous sodium hydrogen carbonate solution or water,
Development was performed at a liquid temperature of 40 ° C. and a spray pressure of 2 kg / cm ² for 2 minutes, and the evaluation was made as follows: ・ ・ ・ ・ Complete development was possible △ ・ ・ ・ ・ Slight residue was left × ・ ・ ・ ・ No development There is a portion (the state of the pattern after development): ○ ・ ・ ・ ・ The pattern is maintained accurately △ ・ ・ ・ ・ The width of the pattern is narrower × ・ ・ ・ ・ Part of the pattern portion or All are peeled off (adhesion): Cellotape peeling test was conducted ○ ・ ・ ・ ・ No peeling at all △ ・ ・ ・ ・ There is very little peeling × ・ ・ ・ ・ Many peeled portions

As is clear from the results of Examples 1 to 5,
The resin composition, film, and cured product thereof of the present invention have excellent developability, good pattern accuracy after development, little residual organic matter after firing, and excellent adhesion.

[0023]

The resin composition and film of the present invention are selectively exposed to ultraviolet light through a film on which a pattern is formed, and are developed by developing an unexposed portion to form a pattern of a resistor, a phosphor, a partition or a conductor circuit. In formation
Excellent developability, good pattern accuracy after development, little residual organic matter even when baked at low temperature, and excellent adhesion.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical indication H01J 11/02 H01J 11/02 B

Claims (5)

[Claims] 1. A photopolymerizable resin compound (A) and / or a non-reactive resin (A ′), a diluent (B), a photopolymerization initiator (C), an ultraviolet absorber (D) and / or a coloring. Selected from the agent (E) and metal powder, metal oxide or glass 1
Or a resin composition containing two or more kinds (F). 2. The resin composition according to claim 1, which is for a resistor pattern, a conductor pattern, a phosphor pattern or a partition pattern. 3. A film comprising the resin composition according to claim 1. 4. A cured product of the resin composition according to claim 1, 2 or 3. 5. A resistor, a conductor, a phosphor and a partition obtained by firing the cured product according to claim 4.