JPH09321203A - Resin-sealed semiconductor device, semiconductor device manufactured using this method, and lead frame - Google Patents

Abstract

(57) [Abstract] [Problem] Package "chip" or "crack" caused by the connection between the package and the lead frame frame rail.
Provided are a method for manufacturing a resin-encapsulated semiconductor device that prevents the occurrence of the above, a semiconductor device manufactured using this method, and a lead frame. First, at the stage of forming a lead frame, a space is formed between a package area and a rail of a lead frame frame portion corresponding to the package area. The rail is connected to the package by the resin connection part, then the other end of the outer lead is separated from the lead frame frame part, and the rails of the lead frame frame part are separated from each other corresponding to other packages, and finally. , The rail is separated from the package at the resin connecting portion.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package in which one end of a lead formed on a lead frame and a semiconductor pellet are integrally sealed with resin to form a package, and the other end of the lead led out from the package. The present invention relates to a method of manufacturing a resin-encapsulated semiconductor device obtained by separating a semiconductor device from a lead frame frame portion, a semiconductor device manufactured using this method, and a lead frame for forming this semiconductor device.

[0002]

2. Description of the Related Art FIG. 3 is a process chart for explaining a conventional method of manufacturing a resin-sealed semiconductor device of this type. Here, as shown in FIG. 1A, a die pad 2 on which a wafer (not shown) is mounted is connected to a lead frame 1 by a die pad support 3, which is generally called a hanging pin, on the lead frame 1. Formed in the state. Of the lead frame frame portion, the portion located above the drawing is called the top rail 1a, and the portion located below the drawing is called the bottom rail. The portion related to the bottom rail is symmetrical to the portion related to the top rail 1a. Therefore, only the peripheral portion of the top rail 1a is shown here.

Further, the lead frame frame portion is integrally formed with a large number of leads each having an end near the die pad 2 and serving as the outer lead 4 and the inner lead 5. Then, as is well known, after undergoing the steps of die bonding for adhering and fixing the semiconductor pellet on the die pad 2 and wire bonding for electrically connecting the connection electrode on the semiconductor pellet and the inner lead 5, the semiconductor pellet is removed. The mounted die pad 2 and inner lead 5 are integrally sealed with resin to form a package 6.

Then, by cutting at the positions indicated by alternate long and short dash lines A and B, the outer leads 4 are led out from the package 6 and the top rail 1a, as shown in FIG.
A package having a shape in which the package 6 and the package 6 are connected by the die pad support 3 is obtained. Subsequently, in a state where the package 6 and the top rail 1a are connected, after assembly work including bending of the outer leads 4 is completed, the die pad support 3 is cut at the position of the alternate long and short dash line C, and the same figure ( c)
Obtain the product shown in.

[0005]

In the conventional method of manufacturing the resin-sealed semiconductor device described above, the die pad support 3 for connecting the package 6 and the top rail 1a is used.
However, since the material of the lead frame 1 is the same metal, and the strength of the package 6 is weaker than that of the die pad support 3, when cutting along the chain line C to separate the top rail 1a from the package 6. In some cases, "chips" and "cracks" were generated in the package 6.

As a recent market trend, the resin thickness of the package 6 of the resin-encapsulated semiconductor device tends to be thin, and it is added to the die pad support 3 even in an assembly process other than cutting the die pad support 3. The force acts on the package 6, and the chip 6 or the crack is likely to occur on the package 6.

The present invention has been made to solve the above-mentioned problems, and is resin-sealed to prevent the occurrence of "chip" or "crack" of the package due to the connection between the package and the rail of the lead frame frame. An object of the present invention is to provide a method for manufacturing a semiconductor device, a semiconductor device manufactured by using the method, and a lead frame for forming the semiconductor device.

[0008]

When the ends of the leads led out from the package, that is, the outer leads are separated from the lead frame frame, the separation position is relatively far from the package and Since the lead is pressed at a near portion and is cut off at the outside of the lead, "chip" or "crack" is unlikely to occur in the package in this process. However, since the package and the rails of the lead frame frame are close to each other, when disconnecting the connection between them, or because the connection exerts an unnecessary force on the package during the assembly process, there is a risk of "breakage" on the package. And "cracks" occur. In order to reduce the influence of the force exerted by the connecting portion on the package, the present invention first forms a gap between the package area and the corresponding rail of the lead frame frame at the step of forming the lead frame, and then, At the time of packaging, the rail of the lead frame frame is connected to the package by the resin connection part, then,
Separate the other end of the outer lead from the lead frame frame, separate the rails of the lead frame frame from those corresponding to other packages, and finally separate the rail from the package at the resin connection part. With this, useless force does not act on the package, and it is possible to prevent the occurrence of "chip" or "crack" of the package.

In this case, the rail of the lead frame frame is formed with a drop-prevention hole penetrating in the front-back direction, and the resin connection portion is connected to the rail in a chain shape through the drop-prevention hole, whereby the rail is attached to the package. It is possible to perform a reliable assembly work in the connected state.

The die pad on which the semiconductor pellets are mounted may not necessarily be formed integrally with the lead frame frame portion by using the hanging pins, and the above method can be applied to this structure as well.

Further, by making at least a part of the resin connection portion thinner than the package body portion and thinner than the chain-like joint portion with the rail,
Separation is facilitated.

Further, the resin-encapsulated semiconductor device produced by this method has no deterioration in characteristics due to "chip" or "crack" of the package, and the reliability can be improved accordingly.

By the way, in a manufacturing process of a resin-sealed semiconductor device, a package and a rail of a lead frame frame portion corresponding to the package are assembled as a pair. Another invention of the present application uses a lead frame having a gap between a package area and a rail of a lead frame frame portion corresponding to the package area as a lead frame in the assembly process, and further, the package and the lead frame frame portion. Since the rail and the rail are connected using the resin that constitutes the package and are separated by the end of the assembly work, the occurrence of "chip" or "crack" of the package can be suppressed.

Also in this case, the resin connecting portion is connected to the rail in a chain shape through the fall-preventing hole formed in the rail of the lead frame frame, so that the assembly work can be reliably performed with the rail connected to the package. Done and also
By thinning at least a part of the resin connection,
Separation is facilitated.

Further, another invention of the present application is a lead frame in which a gap is provided between the package area and a rail of a frame portion corresponding to the package area without providing a hanging pin. It is possible to prevent the occurrence of "chip" or "crack" in the package.

Even in such a lead frame, as described above, a drop-preventing hole may be provided, or the die pad may be formed separately from the lead frame frame portion.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on preferred embodiments shown in the drawings. FIG. 1 is a process diagram showing a first embodiment of the present invention. In the figure, the same elements as those of FIG. 3 showing the conventional manufacturing method are designated by the same reference numerals, and the description thereof will be omitted. Here, first, as shown in (a), a gap 11 is provided between the package forming area 6c indicated by a broken line and the top rail 1a, and the die pad 2 which has been connected to the rail is connected by the connection bar 7. Lead frame 1 configured to be connected to the inner lead 5
To form The lead frame 1 further includes a top rail 1a within the area of the package forming area 6c.
Individual connection resin drop-out preventing holes 8 are formed, and notches 9 are formed at the edges near the package forming area 6c. In this state, the semiconductor pellets are mounted on the die pad 2 and die bonding and wire bonding operations are performed.

Next, as shown in (b), the sealing resin is poured into the package forming area 6c to form the package 6. At this time, the resin connecting portion 6a is simultaneously formed. The resin connection portions 6a are formed at the positions where the connection resin drop-out preventing holes 8 are respectively provided when viewed in the longitudinal direction of the lead frame 1, and the cross section taken along the line XX of FIG. As shown in the section (f) of the same figure, it is connected to the connection resin drop-out preventing hole 8 in a chain shape, and is thinner than the main body of the package 6, and more than the chain-shaped connecting section. It also has a thinned cutting portion 6b. The notch 9 described above is formed in order to improve the flow of the resin into the connection resin drop-out preventing hole 8.

Next, as shown in (c), the top rails 1a of the lead frame frame are separated from those corresponding to the other packages 6 and, at the same time, the outer leads 4 are separated from the lead frame frame. In this state, the package 6 is connected to the top rail 1a by the two resin connecting portions 6a.
Further, since the resin connecting portion 6a is connected to the connecting resin drop-out preventing hole 8 in a chain shape, the package 6 is prevented from falling off the top rail 1a. After the assembly process is completed in this state, the lead frame 1 is separated from the package 6 at the cutting portion 6b as shown in (d).

At this time, even if the cutting portion 6b is cut, an unreasonable force does not act on the package 6. Therefore, the "chip" of the package caused by the connection between the package and the rail of the lead frame frame portion It is possible to prevent the occurrence of "cracks". In addition, a highly reliable resin-sealed semiconductor device can be obtained without deterioration of characteristics due to "break" or "crack" of the package.

FIG. 2 shows the connection between the lead frame 1 and the die pad 2 according to the second embodiment of the present invention.
The same elements as those in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted. In the first embodiment shown in FIG. 1, since the die pad 2 is connected to the inner lead 5 by the connection bar 7, its positioning is not necessary. FIG. 2 shows an example in which the die pad 2 is separated from the lead frame 1 from the beginning. In this case, in order to fix the die pad 2 to the inner lead 5 at an appropriate position, the die pad support 2a and the both sides thereof are positioned. Inner lead 5
And are fixed by the fixing insulating tape 10. Even with such a configuration, one in which two connection resin drop-out preventing holes 8 are formed in the top rail 1a of the lead frame frame and a notch 9 is formed in the edge near the package forming area 6c are used. . Hereinafter, in the same steps as shown in FIGS. 1B to 1D, as in the first embodiment, the occurrence of “chip” or “crack” in the package is prevented, and due to this, It is possible to obtain a highly reliable resin-encapsulated semiconductor device without deterioration of characteristics.

In each of the first and second embodiments, the semiconductor device which requires the die pad 2 has been described. For example, without using the die pad 2, the semiconductor pellet is fixed at a predetermined position by an insulating tape. 1B to 1D, even if it is manufactured by the same process, the generation of "chip" or "crack" of the package is prevented by the same steps as those shown in FIG. It is possible to prevent deterioration.

[0023]

As is apparent from the above description, according to the present invention, a gap is formed between the package area and the corresponding rail of the lead frame frame at the step of forming the lead frame, Upon packaging,
The rail of the lead frame frame part is connected to the package by the resin connecting part, the other end of the outer lead is separated from the lead frame frame part, and the rail of the lead frame frame part is separated from those corresponding to other packages,
Finally, since the rail is separated from the package at the resin connection part, unnecessary force does not act on the package from the connection part, and it is possible to prevent "chips" and "cracks" from occurring in the package. Can be prevented.

Further, by forming a drop-out preventing hole penetrating in the front and back direction of the rail and connecting the resin connecting portion in a chain through the drop-out preventing hole, a reliable assembling work can be performed.
Here, the productivity is improved by forming the die pad separately from the lead frame frame portion and positioning the die pad with respect to the leads using an insulating tape.
Further, the thickness of at least a part of the connecting portion is made thinner than the other, so that the separation can be facilitated. Furthermore, the resin-encapsulated semiconductor device produced by this method has no deterioration in characteristics due to "break" or "crack" of the package, and the reliability can be improved accordingly.

On the other hand, as the lead frame in the assembly process, one having a space between the package area and the rail of the lead frame frame portion corresponding to this package area is used, and the package and the rail of the lead frame frame portion are packaged. By providing a resin connecting portion that is connected by using the resin that constitutes the package and is cut off at the end of the assembly work, it is possible to suppress the occurrence of "chip" or "crack" of the package.

Also in this case, the resin connecting portion is connected to the rail in a chain shape through the fall-prevention hole formed in the rail of the lead frame frame, so that the assembly work can be reliably performed with the rail connected to the package. Further, the separation is facilitated by thinning at least a part of the resin connecting portion.

According to the lead frame according to another invention of the present application, a lead frame having a gap is provided between the package area and the rail of the frame portion corresponding to the package area without providing a hanging pin. , Package's "chip"
It is possible to prevent the occurrence of “crack”.

Further, a drop-prevention hole is provided, or
By adopting a die pad formed separately from the lead frame frame portion, not only the occurrence of "break" and "crack" of the package can be prevented, but also the productivity can be improved.

[Brief description of drawings]

FIG. 1 is a process drawing showing a first embodiment of the present invention.

FIG. 2 is a diagram showing a connection state of a lead frame and a die pad according to a second embodiment of the present invention.

FIG. 3 is a process drawing for explaining a conventional method for manufacturing a resin-sealed semiconductor device.

[Explanation of symbols]

 1 Lead Frame 1a Top Rail 2 Die Pads 2a, 3 Die Pad Support 4 Outer Leads 5 Inner Leads 6 Package 6a Resin Connection Part 6b Cutting Part 7 Connection Bar 8 Connection Resin Fall Prevention Hole 9 Notch 10 Fixing Insulation Tape 11 Void

Claims (12)

[Claims] 1. A package in which one end of a lead formed on a lead frame and a semiconductor pellet are integrally sealed with a resin to form a package, and the other end of the lead derived from the package is separated from the lead frame frame portion. In a method for manufacturing a resin-sealed semiconductor device separated from each other, a lead frame having a space is formed between a package area and a rail of the lead frame frame portion corresponding to the package area, and packaging is performed with resin. At this time, a package having a resin connecting portion for connecting the package and the rail of the lead frame frame portion is formed, and the other end portion of the lead drawn out from the package is separated from the lead frame frame portion, and the lead frame is formed. Separate the frame rails from each other corresponding to other packages, A method of manufacturing a resin-encapsulated semiconductor device, characterized in that the rail of the lead frame frame portion connected to the package is separated at the resin connection portion. 2. The rail of the lead frame frame is formed with a drop-prevention hole penetrating in the front-back direction, and the resin connecting portion is connected to the rail in a chain shape through the drop-prevention hole. 1. The method for manufacturing a resin-encapsulated semiconductor device according to 1. 3. A die pad for mounting a semiconductor pellet is formed separately from the lead frame frame portion, and the die pad is positioned and fixed to the lead with an insulating tape for packaging. The method for manufacturing a resin-encapsulated semiconductor device according to claim 1 or 2. 4. At least a part of the resin connecting portion is thinner than a package body portion for sealing the semiconductor pellet and the die pad, and thinner than a chain connecting portion with the rail. The method for manufacturing a resin-encapsulated semiconductor device according to claim 1, wherein the resin-encapsulated semiconductor device is manufactured. 5. A package is formed by integrally sealing one end of a lead formed on a lead frame and a semiconductor pellet with a resin to form a package, and the other end of the lead led out from the package is a lead frame frame part. A resin-encapsulated semiconductor device separated from the above, which is manufactured by using the method according to any one of claims 1 to 4. 6. A package in which one end of a lead formed on a lead frame and a semiconductor pellet are integrally sealed with a resin to form a package, and the other end of the lead led out from the package is cut from the lead frame frame. At the same time as separating, the rails of the lead frame frame part are separated from those corresponding to other packages, and the package and the rails of the lead frame frame part corresponding to this package are assembled as a pair to form a resin-sealed semiconductor. In the device, the lead frame having a gap between the package area and the rail of the lead frame frame portion corresponding to the package area, the package, and the rail of the lead frame frame portion, the resin forming the package. Resin connection that is connected by using the When a resin-sealed semiconductor device characterized by comprising a. 7. The rail of the lead frame frame is formed with a drop-prevention hole penetrating in the front-back direction, and the resin connecting portion is connected to the rail in a chain shape through the drop-prevention hole. 7. The resin-encapsulated semiconductor device according to item 6. 8. A die pad, which is formed separately from the lead frame frame portion, and an insulating tape for positioning and fixing the die pad with respect to the leads. A semiconductor pellet is mounted on the die pad for packaging. The resin-sealed semiconductor device according to claim 6 or 7, wherein 9. The resin connecting portion is at least partially thinner than the semiconductor pellet and the package body portion, and thinner than a chain-like joint portion with the rail. The resin-encapsulated semiconductor device according to claim 6. 10. A lead frame for integrally sealing one end of a lead formed in a predetermined frame portion and a semiconductor pellet with a resin to form a package, and a package area and the package area corresponding to the package area. A lead frame, characterized in that a suspension pin is not provided between the rail of the frame part and a gap is provided. 11. The drop prevention hole penetrating in the front-back direction in the rail of the lead frame frame, and the drop prevention hole is used for connecting the package and the lead. Lead frame. 12. The lead frame according to claim 10, wherein the die pad for mounting the semiconductor pellet is formed separately from the lead frame frame portion.