JPH0945442A - IC socket and semiconductor device handling method using the same - Google Patents

Abstract

(57) [Summary] [Object] To provide an IC socket in which a lead and a contact pin of a semiconductor device can be contacted immediately after being transported. A socket main body 1 having a device mounting portion 1a for holding a semiconductor device 2 at a predetermined position, and a contact pin 4 attached to the socket main body 1 for electrically connecting the semiconductor device 2 to a predetermined test circuit 3 are provided. Is provided on the bottom surface 1b of the socket body 1 by opening to the device mounting portion 1a, one side of the semiconductor device 2 of the device mounting portion 1a is negatively suctioned, and the lead 2a provided thereon is pressed against the contact pin 4. It is an IC socket S having a suction pad 6 for The suction pad 6 projects from the bottom surface portion 1b by a length such that the lead 2a is in an optimum contact state with the contact pin 4 when the semiconductor device 2 is suctioned.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for an IC socket for electrically connecting a semiconductor device that has undergone an assembly process and a test circuit for testing the semiconductor device.

[0002]

2. Description of the Related Art In manufacturing a semiconductor device, an electrical characteristic test and a reliability evaluation test are performed on a semiconductor device that has been assembled, and only semiconductor devices that pass these tests are shipped as finished products. . In such a test, an IC socket is used to electrically connect the semiconductor device and the test circuit. As an example that describes the test evaluation technology for semiconductor devices in detail, for example, "'
94 Latest semiconductor process technology "P373 ~ P381, P394 ~ P413.

The semiconductor device is picked up from the tray by the transfer arm and held in the device mounting portion of the IC socket, and all the leads of the semiconductor device are I.
In order to make sure contact with each contact pin of the C socket, it is necessary to press the semiconductor device against the IC socket with the pressure arm.

[0004]

However, according to the above-mentioned technique, the pressure is applied from the time when the carrier arm mounts the semiconductor device in the IC socket to the time when the carrier arm is separated, that is, while the carrier arm is on the IC socket. It is not possible to shift to the pressure operation by the arm. The shorter the test time is, for example, 10 seconds per piece, the greater the temporal ratio of such pressure arm movement inhibiting factors becomes, and as a result, the test efficiency is significantly impaired. become.

Therefore, an object of the present invention is to provide an IC socket in which the leads and contact pins of a semiconductor device can be contacted immediately after being transported.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0007]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, the IC socket according to the present invention is
A socket body formed with a device mounting portion for holding the semiconductor device in a predetermined position, and attached to the socket body,
A contact pin that electrically connects the semiconductor device to a predetermined test circuit, and an opening in the device mounting portion, which is provided on the bottom surface of the socket body. It has a suction means for pressing the lead against the contact pin.

In such an IC socket, it is desirable that the suction means protrude from the bottom surface by a length such that the leads are in an optimum contact state with the contact pin when the suction means sucks the semiconductor device. Further, a surface-mounted semiconductor device can be applied to the semiconductor device.

Further, in the semiconductor device handling method according to the present invention, the first step of transporting the semiconductor device on the tray to the IC socket by the transport arm and the suction of the semiconductor device by the suction means to press the lead against the contact pin. And a second step of performing a test.

[0011]

According to the above-mentioned means, since the semiconductor device mounted on the device is sucked by the suction means under negative pressure,
The leads of the semiconductor device and the contact pins can be contacted immediately after the conveyance.

As a result, the time required for retracting the transfer arm from the semiconductor device, which is required when the semiconductor device is pressed by the pressing arm, is no longer required, and the handling time is shortened and the test efficiency is improved. You can

[0013]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a perspective view showing an IC socket which is an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line II--II in FIG.
3A and 3B are explanatory views successively showing a semiconductor device handling method using the IC socket of FIG.

As shown in FIGS. 1 and 2, the IC socket S of this embodiment has a surface mount type QFJ (Quad Flat J-) in the central portion of the socket body 1 integrally molded of plastic resin, for example. A device mounting portion 1a is formed in a concave shape to hold the leaded package type semiconductor device 2 at a predetermined position. The device mounting portion 1a is formed in a shape into which the semiconductor device 2 to be inspected can fit. Therefore, the semiconductor device 2 has the device mounting portion 1a.
Is held in place so that it does not move.

A plurality of contact pins 4 for establishing electrical continuity between the semiconductor device 2 and the test circuit 3 are provided on the bottom surface 1b of the socket body 1 with leads 2a provided on the semiconductor device 2.
It is attached so as to form a quadrangle.

As shown in FIG. 2, this contact pin 4
Is a plurality of mounting holes 5 formed in the bottom surface portion 1b so that the bent contact portion 4a faces the device mounting portion 1a.
, One side of which extends vertically from the back surface of the socket body 1 to fit into the connection terminals of the test circuit 3. In this embodiment, since the leads 2a of the semiconductor device 2 to be inspected are provided in four directions, the contact pins 4 are arranged so as to form a quadrangle, but in the case of two directions, for example. Are arranged so as to form two straight lines parallel to each other.

A suction pad (suction means) 6 made of, for example, hard rubber is provided on the bottom surface 1b of the socket body 1 so as to be surrounded by the contact pins 4 having such an arrangement. The suction pad 6 opened and attached to the device mounting portion 1a is connected to a vacuum pump 8 via a pipe 7, and one surface of the semiconductor device 2 in the device mounting portion 1a is attached to the suction pad 6 by the vacuum pump 8. Negative pressure is sucked into. As shown in FIG. 2, this suction pad 6
Is the length for which all the leads 2a are pressed without deforming when the semiconductor device 2 is sucked, that is, the leads 2a and the contact pins 4 are in the optimum contact state. It is provided so as to project from the bottom surface portion 1b by the length. Note that, in FIG. 2, above the semiconductor device 2, a suction portion of the transfer arm 10 for transferring the semiconductor device 2 from the tray 9 (FIG. 3) to the IC socket S is shown.

Here, the transfer arm 10 is not limited to such a suction type, but various other types such as a grip type can be adopted. Further, the suction pad 6 may be made of metal instead of rubber.

A method of handling the semiconductor devices 2 and 12 by the IC socket S having such a configuration will be described with reference to FIG.

First, as shown in FIG. 3A, the tray 9
The semiconductor device 2 to be transported is adsorbed from above and transported to the IC socket S.

Then, when the carrier arm 10 is lowered when it reaches above the device mounting portion 1a, as shown in FIG. 3B, the semiconductor device 2 is mounted on the device mounting portion 1a and at the same time, the semiconductor device 2 is attached to the suction pad. Suction negative pressure at 6. This allows
The lead 2a of the semiconductor device 2 is pressed against and comes into contact with the contact pin 4, and a test such as a functional test is performed in this state.

While the semiconductor device 2 is adsorbed and held in the IC socket S and the test is performed, the carrier arm 10 is returned to the tray 9 (FIG. 3C), and the next semiconductor device 12 is transferred to the IC.
It is transported to the socket S and kept in standby (Fig. 3
(D)). Then, as shown in FIG. 3E, when the test of the semiconductor device 2 is completed, the semiconductor device 12 is mounted and the suction pad 6 sucks a negative pressure. After that, the operation returns to the operation shown in FIG. 3C, and the operations shown in FIGS. 3D and 3E are repeated.

As described above, according to the IC socket S of this embodiment, the semiconductor device 2 of the device mounting portion 1a is attached to the suction pad 6a.
By adopting the configuration in which the negative pressure is sucked in, it is possible to make contact between the lead 2a of the semiconductor device 2 and the contact pin 4 immediately after the conveyance. As a result, as in the case of pressing the semiconductor device 2 with the pressing arm, the transfer arm 10
However, the time required to evacuate the semiconductor device 2 from the semiconductor device 2 is not required, and the handling time is shortened, and the test efficiency can be improved.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, in this embodiment, the QFJ type semiconductor device 2 is targeted for transportation and inspection.
The present invention is not limited to the surface mounting type including this,
An insertion type semiconductor device can also be adopted.

[0027]

The effects obtained by typical ones of the inventions disclosed in the present application will be briefly described as follows.

(1) That is, according to the IC socket of the present invention, since the semiconductor device in the device mounting portion is sucked by the negative pressure by the suction means, the lead and the contact pin of the semiconductor device are immediately connected after being transported. It is possible to make contact with each other.

(2) As a result, the time required for retracting the transfer arm from the semiconductor device, which is required when the semiconductor device is pressed by the pressing arm, is no longer necessary, and the handling time is shortened and the test efficiency is improved. It is possible to improve.

[Brief description of drawings]

FIG. 1 is a perspective view showing an IC socket according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II in FIG.

3A to 3E are explanatory views successively showing a method of handling a semiconductor device by the IC socket of FIG.

[Explanation of symbols]

 1 Socket Main Body 1a Device Mounting Part 1b Bottom Part 2 Semiconductor Device 2a Lead 3 Test Circuit 4 Contact Pin 4a Contact Part 5 Mounting Hole 6 Suction Pad (Suctioning Device) 7 Piping 8 Vacuum Pump 9 Tray 10 Transfer Arm 12 Semiconductor Device S IC Socket

Claims (4)

[Claims] 1. A socket body having a device mounting portion for holding a semiconductor device in a predetermined position, a contact pin attached to the socket body for electrically connecting the semiconductor device to a predetermined test circuit, and the device mounting portion. And a suction means which is provided in the bottom surface of the socket body and is suctioned to one side of the semiconductor device of the device mounting portion under negative pressure to press the lead provided therein against the contact pin. I characterized by
C socket. 2. The IC socket according to claim 1, wherein
An IC socket, wherein the suction means is protruded from the bottom surface by a length such that the lead is in an optimum contact state with the contact pin when the suction means sucks the semiconductor device. 3. The IC socket according to claim 1, wherein
An IC socket, wherein the semiconductor device is a surface-mounted semiconductor device. 4. A semiconductor device handling method using the IC socket according to claim 1, 2, or 3, wherein the semiconductor device on the tray is transferred to the IC by a transfer arm.
Handling a semiconductor device, comprising: a first step of carrying the semiconductor device to a socket; and a second step of sucking the semiconductor device by the suction means to press the lead against the contact pin to perform a test. Method.