JPH01115129A - Manufacture of optical element - Google Patents
Manufacture of optical elementInfo
- Publication number
- JPH01115129A JPH01115129A JP62272835A JP27283587A JPH01115129A JP H01115129 A JPH01115129 A JP H01115129A JP 62272835 A JP62272835 A JP 62272835A JP 27283587 A JP27283587 A JP 27283587A JP H01115129 A JPH01115129 A JP H01115129A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- mixed liquid
- optical element
- chip
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000003822 epoxy resin Substances 0.000 claims abstract description 31
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 31
- 239000007788 liquid Substances 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000003960 organic solvent Substances 0.000 claims abstract description 3
- 239000011521 glass Substances 0.000 abstract description 20
- 238000005266 casting Methods 0.000 abstract description 9
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 5
- 238000009833 condensation Methods 0.000 abstract description 3
- 230000005494 condensation Effects 0.000 abstract description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract 2
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 238000013005 condensation curing Methods 0.000 abstract 1
- 238000002845 discoloration Methods 0.000 abstract 1
- 150000002148 esters Chemical class 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 6
- 239000011368 organic material Substances 0.000 description 5
- 239000003566 sealing material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920001002 functional polymer Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（ａ）産業上の利用分野
この発明はＬＥＤ等の光学素子の製造方法に関し、特に
チップの対土方法の改良に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application This invention relates to a method for manufacturing optical elements such as LEDs, and particularly to an improvement in the method for attaching chips to soil.
（ｂｌ従来の技術
ＬＥＤなどの光学素子においては、チップ表面を覆う封
止材として従来はもっばら透光性樹脂（クリアエポキシ
樹脂等）が使用されていた。製法はたとえば砲弾型のキ
ャスティングケースにクリアエポキシ樹脂を流し込んで
おき、この中にＬＥＤチップがダイポンディングされ更
に金線がワイヤボンディングされたリードフレームを挿
入し、熱硬化さセた後キャスティングケースより引っ張
りだすことによりチップ周囲をエポキシ樹脂で封止した
り、またはＴｏ−１８型ステム電極にＬＥＤチップをグ
イポンディングし、さらにワイヤボンディング処理した
後クリアエポキシ樹脂をステム電極上にポンティングし
て熱硬化することによってチップ周囲を封止するように
していた。(bl Conventional Technology) In optical elements such as LEDs, translucent resins (clear epoxy resin, etc.) have traditionally been used as the sealing material to cover the chip surface. Pour clear epoxy resin, insert the lead frame into which the LED chip is die-bonded and the gold wire wire-bonded, and after thermosetting, pull it out of the casting case to surround the chip with epoxy resin. After sealing or bonding the LED chip to the To-18 type stem electrode and further wire bonding, clear epoxy resin is poured onto the stem electrode and cured by heat to seal the area around the chip. That's what I was doing.
（Ｃ１発明が解決しようとする問題点 しかしながら一般に樹脂材は耐候性の点で問題がある。(Problems that the C1 invention attempts to solve However, resin materials generally have problems in terms of weather resistance.
特にエポキシ樹脂は紫外線に弱（透明であるものが変色
したり、クラックが発生したり、また長時間の使用中に
水分を吸収しチップ自身に悪影響を及ぼしたり、更にチ
ップの熱膨張係数が樹脂の熱膨張係数と大きく異なって
いるために、加熱処理して樹脂を硬化させるときにチッ
プに過・大な応力が加わりチップの劣化やワイヤの断線
などを引き起こす問題があった。In particular, epoxy resins are sensitive to ultraviolet light (transparent ones may discolor, cracks may occur, they may absorb moisture during long-term use and adversely affect the chips themselves, and the coefficient of thermal expansion of the chips may be lower than that of the resin). Because the coefficient of thermal expansion is significantly different from the coefficient of thermal expansion of the resin, excessive stress is applied to the chip when the resin is cured by heat treatment, causing problems such as chip deterioration and wire breakage.
この発明の目的は、上記の問題を一掃するためにゾルガ
ラスを加えて耐候性などの機能をアップさせたエポキシ
樹脂を用いて光学素子を製造する方法を提供することに
ある。An object of the present invention is to provide a method for manufacturing an optical element using an epoxy resin to which sol glass is added to improve functions such as weather resistance, in order to eliminate the above-mentioned problems.
（ｄ）問題点を解決するための手段
この発明は、エチルシリケートを主成分としてこれに有
機溶媒を加えたゾル溶液をエポキシ樹脂に加え、この混
合液体で光学素子のチップ周囲を被い、ついで加熱処理
を行って縮合硬化させることを特徴とする。(d) Means for Solving Problems This invention involves adding a sol solution containing ethyl silicate as a main component and adding an organic solvent to the epoxy resin, covering the periphery of the optical element chip with this mixed liquid, and then It is characterized by condensation hardening by heat treatment.
ＣＧ１作用
この発明においては、たとえば上述のキャスティングケ
ースを使用する場合、エチルシリケートを主成分とした
′ｆ機高分子のゾル溶液（以下ゾルガラスという）をエ
ポキシ樹脂に加え混合液体として、これをキャスティン
グケース内に入れてから光学素子をその混合液体内に入
れる。次に加熱処理を行って混合液体を熱硬化する。こ
の場合は、エポキシ樹脂の活性基である一ＣＯＯＨ基と
ゾルガラスの反応基である一０Ｈｉが熱硬化の縮合の過
程でエステル結合を引き起こし活性基が安定結合するこ
とにより耐水性、耐熱性などのいわゆる耐候性か著しく
向上する要因を作る。CG1 Effect In this invention, for example, when using the above-mentioned casting case, a sol solution of a functional polymer mainly composed of ethyl silicate (hereinafter referred to as sol glass) is added to the epoxy resin to form a mixed liquid, and this is added to the casting case. and then place the optical element into the mixed liquid. Next, heat treatment is performed to thermally harden the mixed liquid. In this case, the -COOH group, which is the active group of the epoxy resin, and the -0Hi, which is the reactive group of the sol glass, form an ester bond during the condensation process during thermosetting, and the active groups form a stable bond, resulting in improved water resistance, heat resistance, etc. Create factors that significantly improve so-called weather resistance.
なお、ゾルガラスとエポキシ樹脂の混合割合はエポキシ
樹脂の種類により最適条件を選択するが、ゾルガラス：
エポキシ樹脂−１００以内：１００（重量比）の範囲内
で決められる。このゾルガラスとエポキシ樹脂の混合液
体は粘度が４００〜５００ｃｐｓ程度の粘性液体である
ため従来のエポキシ樹脂などと同様に扱うことが出来る
。そして加熱処理を行った後においては縮合硬化するた
めに、樹脂を使う上において問題となった耐候性が著し
く改善される。Ｔｏ−１８タイプのＬＥＤを製造する場
合も従来の樹脂を扱う場合と同じような作業となる。す
なわちゾルガラスを加えたエポキシ樹脂の混合液体をＴ
ｏ−１８ヘツダ上にボッティングし、次いで加熱処理を
行って硬化させる。The optimum mixing ratio of sol glass and epoxy resin is selected depending on the type of epoxy resin, but sol glass:
Epoxy resin - within 100: determined within the range of 100 (weight ratio). This liquid mixture of sol glass and epoxy resin is a viscous liquid with a viscosity of about 400 to 500 cps, so it can be handled in the same way as conventional epoxy resins. Since the resin is condensed and cured after heat treatment, the weather resistance, which has been a problem when using resins, is significantly improved. When manufacturing To-18 type LEDs, the work is similar to that when handling conventional resins. In other words, the mixed liquid of epoxy resin with sol glass added is T.
Botted onto an O-18 header and then heat treated to harden.
（ｆ）実施例
実施例として、砲弾型のＬＥＤ素子の製造方法について
説明する。(f) Example As an example, a method for manufacturing a bullet-shaped LED element will be described.
ゾル化したエチルシリケートとしては、アルカリを全く
含まないケイ成上ツマ−を使用し、を機高分子からなる
溶媒を加える。溶媒としてはたとえばエタノールやイソ
プロピルアルコールなどの混合物が使用される。このゾ
ルガラスは１００’Ｃ〜２００°Ｃ程度の極めて低い温
度で縮合硬化してガラス化（ゲル化）する。あらかじめ
ゾルガラスとしてこのようにして低温度で硬化するよう
にエチルシリケートを調整すると、エポキシ樹脂との混
合液体において加熱処理時にチップに悪影習を及ぼすこ
とがない。As the solized ethyl silicate, a silicone resin containing no alkali is used, and a solvent consisting of a polymer is added thereto. For example, a mixture of ethanol, isopropyl alcohol, etc. is used as the solvent. This sol glass is condensed and hardened at extremely low temperatures of about 100'C to 200C to vitrify (gel). If ethyl silicate is prepared in advance as a sol glass so that it cures at a low temperature, it will not have any adverse effects on the chip during heat treatment in a mixed liquid with an epoxy resin.
第１図は上記のゾルガラスをエポキシ樹脂に加え混合液
体として、これを使用して砲弾型のＬＥＤ素子を製造す
る方法を説明するための図である。１は有機材料からな
るキャスティングケースであり、この中にゾル化した上
記混合液体２を注入する。一方フープ状に成形したリー
ドフレーム３にチップ４をグイボンディングし、更にワ
イヤ５をボンディングしたチップ部を別に形成してお（
ゆそしてこのチップ部を上記溶液２内に挿入しく第１図
に示す状態）、この状態で１００６Ｃ〜２００°Ｃ程度
で数時間加熱する。すると混合液体が熱硬化して完全に
固化する。なお封止材にゾルガラスを加えないエポキシ
樹脂のみを使用する場合には、有機物のキャスティング
ケースとエポキシ樹脂の濡れ性が良いためにキャスティ
ングケース１の内側に予め離形剤を塗布し、さらに相当
大きな引抜きの力で引っ張る必要があったが、ゾルガラ
スは有機材料との濡れ性がよくないためゾルガラスとエ
ポキシ樹脂との混合液体どした場合はエポキシ樹脂のみ
の場合に比し加熱処理後キャステインク防−ス１から比
較的容易に引き出すことができる。FIG. 1 is a diagram for explaining a method of manufacturing a bullet-shaped LED element by adding the above-mentioned sol glass to an epoxy resin to form a mixed liquid. Reference numeral 1 denotes a casting case made of an organic material, into which the sol-formed mixed liquid 2 is poured. On the other hand, a chip 4 is bonded to a hoop-shaped lead frame 3, and a chip part to which a wire 5 is bonded is formed separately (
Then, insert the tip into the solution 2 (in the state shown in FIG. 1) and heat it at about 1006C to 200C for several hours in this state. The mixed liquid is then thermally cured and completely solidified. In addition, when using only epoxy resin without adding sol glass as a sealing material, since the organic material has good wettability between the casting case and the epoxy resin, apply a mold release agent to the inside of the casting case 1 in advance, and use a considerably large mold. It was necessary to pull it out with a pulling force, but since sol glass does not have good wettability with organic materials, when a mixed liquid of sol glass and epoxy resin is used, the cast ink resistance after heat treatment is lower than when using only epoxy resin. It can be pulled out from the base 1 relatively easily.
本実施例で機能アップ材として使用するゾルガラスを熱
硬化させて得たゲルガラスは、熱膨張係数が５Ｘ１０−
’ （１／’Ｃ）と、ＬＥＤチップ素材であるＧ、Ａ、
の熱膨張ケース（６，８×１Ｏ−６（１１０Ｃ）に近い
ため、エポキシ樹脂との混合液体とすることにより熱硬
化時の膨張係数の差によるＬＥＤチップに与える応力歪
みの影響が工ボキシ樹脂のみを使用する場合に比べ小さ
く、チップに及ぼすストレスを緩和することができる。The gel glass obtained by thermosetting the sol glass used as the function-enhancing material in this example has a coefficient of thermal expansion of 5X10-
'(1/'C), G, A, which is the LED chip material,
Since the thermal expansion case (6,8 x 1O-6 (110C) is close to that of It is smaller than when using only the chip, and the stress on the chip can be alleviated.
第２図はＴｏ−１８型のＬＥＤ素子を示している。この
ＬＥＤ素子の製造も、エポキシ樹脂を使用する場合と同
様に、図外のデイスペンサに上記ゾルガラスとエポキシ
樹脂との混合液体を用意し、ＬＥＤチップとワイヤのボ
ンディングされたヘッダ６の上に上記デイスペンサによ
って適当量をボッティングする。そして１００〜２００
’Ｃ程度で数時間はど加熱して硬化する。FIG. 2 shows a To-18 type LED element. Similarly to the case of using epoxy resin, this LED element is manufactured by preparing a mixed liquid of the sol glass and epoxy resin in a dispenser (not shown), and placing the dispenser on the header 6 where the LED chip and wire are bonded. Bot the appropriate amount. and 100-200
It is cured by heating for several hours at around 'C.
上記のようにＭ単な工程によってＬＥＤチップの封止を
行うことができ、しかも封止剤としては耐候性に非常に
優れた、ゾルガラスとエポキシ樹脂の混合液体を使用す
るために直射日光のもとでも長期間の使用が可能になる
。As mentioned above, LED chips can be sealed in a simple process, and since the sealant is a mixed liquid of sol glass and epoxy resin, which has excellent weather resistance, it can be exposed to direct sunlight. However, it can be used for a long time.
なお本発明はＬＥＤ素子の他ホトダイオードなどの受光
素子にも勿論適用することができる。Note that the present invention can of course be applied to light receiving elements such as photodiodes in addition to LED elements.
（ｇ１発明の効果
以上のようにこの発明によれば、常温でエチルシリケー
トを主成分としたゾルガラスとエポキシ樹脂の混合粘性
液体を使用するために作業性が非常に良い。また、この
混合液体は１００°Ｃ〜２ｏｏ’ｃ程度の熱処理で硬化
させることができる。このように比較的低温で硬化でき
るのでチップへの悪影響を防ぐことができ、品質を悪化
させない。また、ゾルガラスはもともと有機材料との漏
れ性がよくないために、本発明のようにエポキシ樹脂と
の混合液体を有機材料からなるキャスティングケースに
入れて封止材の成形を行う場合には、エポキシ樹脂のみ
を使用する場合に比べて成形部をキャスティングケース
から容易に引き出すことができる。加熱処理後−旦固化
すれば、封止材料が機能アンプするために従来のような
樹脂で生じた耐候性が悪いといった問題を大きく改善で
きる。すなわち長期の使用中に、特に高温で且つ太陽直
射光のもとて長期間使用しても封止材の変色やクランク
発生を生じることがなく、また水分を吸収してチップ劣
化を引き起こすこともない。すなわち耐候性に優れたも
のとなる。このため太陽直射光のもとで直接使用するこ
とができ封止材を樹脂で形成した光学素子を室外使用す
る場合に必要であったカーボネート板などを設ける必要
がな（なるなど、発行装置全体を低コストで簡単な構成
にすることができる。(g1 Effects of the Invention As described above, according to the present invention, workability is very good because a mixed viscous liquid of sol glass and epoxy resin mainly composed of ethyl silicate is used at room temperature. It can be cured by heat treatment at about 100°C to 200°C. In this way, it can be cured at a relatively low temperature, so it can prevent adverse effects on the chip and do not deteriorate its quality. In addition, sol glass is originally an organic material. Due to poor leakage properties, when molding a sealant by placing a mixed liquid with epoxy resin in a casting case made of organic material as in the present invention, it is difficult to mold the sealing material compared to when using only epoxy resin. The molded part can be easily pulled out from the casting case.Once solidified after heat treatment, the sealing material increases its functionality, which greatly improves the problem of poor weather resistance caused by conventional resins. In other words, during long-term use, especially at high temperatures and under direct sunlight, the encapsulant will not discolor or crack, and will not absorb moisture and cause chip deterioration. In other words, it has excellent weather resistance.For this reason, it can be used directly under direct sunlight, and a carbonate plate, which was necessary when using an optical element whose sealing material is made of resin, is used outdoors. Since there is no need to provide the above, the entire issuing device can be constructed at a low cost and with a simple structure.
第１図、第２図は本発明によってＬＥＤ素子を製造する
方法について説明するための図である。FIGS. 1 and 2 are diagrams for explaining a method of manufacturing an LED element according to the present invention.
Claims (1)
媒を加えたゾル溶液をエポキシ樹脂に加え、この混合液
体で光学素子のチップ周囲を被い、ついで加熱処理を行
って縮合硬化させることを特徴とする光学素子の製造方
法。(1) A sol solution containing ethyl silicate as the main component and an organic solvent added thereto is added to the epoxy resin, the mixed liquid is coated around the chip of the optical element, and then heat treatment is performed to condensate and harden it. A method for manufacturing an optical element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62272835A JPH01115129A (en) | 1987-10-28 | 1987-10-28 | Manufacture of optical element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62272835A JPH01115129A (en) | 1987-10-28 | 1987-10-28 | Manufacture of optical element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01115129A true JPH01115129A (en) | 1989-05-08 |
| JPH0524675B2 JPH0524675B2 (en) | 1993-04-08 |
Family
ID=17519437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62272835A Granted JPH01115129A (en) | 1987-10-28 | 1987-10-28 | Manufacture of optical element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01115129A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008208380A (en) * | 2008-05-26 | 2008-09-11 | Nippon Electric Glass Co Ltd | Luminescent color-converting member |
| JP2008255362A (en) * | 2008-05-26 | 2008-10-23 | Nippon Electric Glass Co Ltd | Emitting color conversion member |
| DE102008005936A1 (en) * | 2008-01-24 | 2009-07-30 | Osram Opto Semiconductors Gmbh | Optoelectronic arrangement |
| JP2015087218A (en) * | 2013-10-30 | 2015-05-07 | 愛三工業株式会社 | Liquid quantity detector |
-
1987
- 1987-10-28 JP JP62272835A patent/JPH01115129A/en active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008005936A1 (en) * | 2008-01-24 | 2009-07-30 | Osram Opto Semiconductors Gmbh | Optoelectronic arrangement |
| JP2008208380A (en) * | 2008-05-26 | 2008-09-11 | Nippon Electric Glass Co Ltd | Luminescent color-converting member |
| JP2008255362A (en) * | 2008-05-26 | 2008-10-23 | Nippon Electric Glass Co Ltd | Emitting color conversion member |
| JP2015087218A (en) * | 2013-10-30 | 2015-05-07 | 愛三工業株式会社 | Liquid quantity detector |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0524675B2 (en) | 1993-04-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8247263B2 (en) | Method for producing an optical, radiation-emitting component and optical, radiation-emitting component | |
| CN108133670A (en) | Integration packaging LED display module packaging method and LED display module | |
| JP2656336B2 (en) | Optical semiconductor device and epoxy resin composition for encapsulating optical semiconductor used therein | |
| CN103190205A (en) | Method for coating an optoelectronic chip-on-board module and optoelectronic chip-on-board-module | |
| GB2280062B (en) | Method of packaging a power semiconductor device and package produced by the method | |
| US4230754A (en) | Bonding electronic component to molded package | |
| CN109777039B (en) | Epoxy resin composition rubber cake for chip LED packaging and preparation method and packaging process thereof | |
| CN110429170A (en) | It is a kind of to use the cured chip device packaging technology of ultraviolet light | |
| JPH01115129A (en) | Manufacture of optical element | |
| KR102125023B1 (en) | Epoxy resin composition for photosemiconductor element molding and method for preparation of the same | |
| CN111849366A (en) | How to use LED molding packaging film | |
| JP2834841B2 (en) | High heat resistant resin encapsulated semiconductor device | |
| CN116741913A (en) | Deep ultraviolet LED packaging structure based on side filling and preparation method | |
| CN105368004B (en) | A kind of high-performance liquid embedding composition and application | |
| JPH0311757A (en) | Semiconductor device and manufacture thereof | |
| CN209344122U (en) | A kind of quantum dot LED packaging | |
| JP3266680B2 (en) | Light emitting diode manufacturing method | |
| CN112420892B (en) | A kind of ultraviolet LED lamp bead bonded with silazane and preparation method thereof | |
| JPS63347A (en) | Epoxy resin composition for use in sealing semiconductor | |
| CN108681001A (en) | A kind of coaxial laser and coaxial laser system | |
| CN105968360B (en) | A kind of organosilicon ternary encapsulating material and preparation method thereof | |
| JPH0462188B2 (en) | ||
| TWI883430B (en) | Method for manufacturing an image sensor module | |
| JPH03201470A (en) | Optical semiconductor device | |
| JPS60103650A (en) | Light emitting diode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 8 Free format text: PAYMENT UNTIL: 20081013 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091013 Year of fee payment: 9 |
|
| LAPS | Cancellation because of no payment of annual fees |