JPH01155694A - How to install electronic components - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component mounting method for an electronic component mounting machine.

Prior Art As a conventional method, the mounting head 1o3 moves up and down at a predetermined position Z position, and the printed circuit board 101 is fixed on an XY table 102 that can move in the XY force direction.
Some devices can be attached to any position on the printed circuit board 101 by moving 02.

Problems to be Solved by the Invention However, in the conventional example, the xY table must move at least four times as far as the printed circuit board in order to mount an electronic component at an arbitrary position on the board. Therefore, interference occurs between the XY table and the electronic component supply device, etc., and there is a problem in that the size of the printed circuit board that can be mounted is limited. On the other hand, as shown in Figure 4,
In some cases, such interference can be prevented by inserting the Y table 102 into the lower part of the electronic component supply device 104, but the taping component 105 of the electronic component supply device
In order to avoid interference with the XY table 102, it is necessary to bend the taping parts, which results in restrictions on the taping parts.

In view of the above-mentioned problems, the present invention provides an electronic component mounting method that does not slow down the mounting tact (by reducing the amount of movement of the This is what we provide.

Means for Solving the Problems In order to solve the above-mentioned problems, the electronic component mounting method of the present invention divides the mounting range on the board on which the electronic components are mounted in advance, and divides the mounting range into a plurality of divided mounting tubes. This device includes a second step of moving the table portion to move from the first mounting range to the next mounting range.

Effects of the present invention When a plurality of pre-divided mounting ranges are divided into halves by the above-described process, the center of the substrate and the center of the rotary table are aligned with the substrate in the direction perpendicular to the flow direction of substrate transport. Since it is coaxial with the center of the movable space and rotates 1000 times on the horizontal plane, it is possible to turn the board of maximum diagonal length in half with respect to the board movable space, so it is possible to reduce the size of the printed circuit board that can be mounted. Restrictions can be significantly relaxed. In addition, when the rotary table is installed on the underside of the XY table, there is no need to install the rotary table drive device, its wiring, board regulating part, board support part, etc. on the rotary table, so the wiring may be damaged due to the movement of the XY table. It is possible to reduce electrolytic corrosion on the XY table without the fear of it becoming twisted or tangled. In addition, by mounting from the center to the outer periphery or from the outer periphery to the middle of the divided mounting range, the center of the board and the center of the rotary table can be aligned with the center of the movable space in the direction perpendicular to the flow direction of the board transport. It is possible to minimize the time required for coaxial alignment with the XY table and the amount of movement of the XY table, allowing high-speed installation. Furthermore, by gradually increasing and decreasing the rotational speed of the rotary table, the rotation is completed without applying any impact to the substrate, allowing highly accurate mounting.

EXAMPLE Hereinafter, an electronic component mounting method according to a first example of the present invention will be described with reference to the drawings.

FIG. 1 shows an overall view of the electronic component mounting method according to the first embodiment of the present invention. In the electronic component mounting machine shown in FIG. 1, a plurality of nozzles 2 for sucking components arranged circumferentially on a rotary head 1 sucks a component 4 from an electronic component supply device 3 at a point B, and at a point A. , half-turning table 7
The configuration is such that it is mounted on a print substrate 6 on an xY table 6. In this case, as shown in FIG. 1, the movable space of the XY table in the Y direction is D. As shown in FIG. The wearing range is divided into wearing range A and wearing range B, and wearing starts in this order. Figure 2 a, b
As shown in FIG. Finally, attach it to the attachment point closest to the center of attachment range A. If the mounting is performed in this order, the center of rotation α and the center β of the substrate will be closest to each other, and the center α can be moved coaxially with the center β in the shortest amount of time.

After moving the center α to be coaxial with the rotation center β, the board 6 is rotated 1800 degrees on a horizontal plane, and mounting in the mounting range B is started. In this case, if it is necessary to rotate the board 1000 times and return it to its original state after mounting B, it should be mounted from the outer periphery of the mounting range toward the center, as in the case of mounting range A. If there is no need to rotate the board by 18° again to return it to its original state, there is no need to mount the mounting range B from the outer periphery toward the center. Also, when rotating the table,
Since the rotation speed is gradually increased to start, the rotation speed is gradually lowered to stop, and the rotation is finished, the parts on the board do not become misaligned and the stopping accuracy is high.

As described above, according to this embodiment, the base center to be attached,
The table is rotated 1000 times on a horizontal plane with the center of the table's movable space, that is, the center of rotation, on the same axis. Therefore, the time required to move the center of the substrate coaxially with the center of rotation is minimized. Furthermore, since the rotation speed is gradually increased and then gradually lowered before the end of rotation, there is no misalignment of the mounted components on the board. After rotation, the remaining half of the mounting range is mounted, thereby completing the mounting of the entire mounting range on the board.

In this way, since the movable space is much smaller than that of a normal XY table, even larger substrates can be mounted. Furthermore, by inserting the XY table and rotary table under the electronic component supply device and rotating the table 1800 times on a horizontal plane, it is possible to mount even larger boards.

Next, a description of the second embodiment will be given. FIG. 5 shows an overall view of the second embodiment. The substrate 1o sent from the loader 9 is smoothly transferred to the substrate regulating section 11, the substrate 10 is appropriately regulated by the regulating stopper 12, and the substrate support section 13 is raised to appropriately support the lower surface of the substrate.

Thereafter, as described in the first embodiment, mounting is performed on the mounting ranges A and H, which have been divided in half in advance, and the board regulating section 11 and the board support 13 are
The table is rotated 1800 times on a horizontal surface, and the mounting is performed on the mounting range B. In some cases, the flow continues to the unloader 14 until that point, and in some cases, after 1800 revolutions on the horizontal surface again, the unloader 14 flowing into In this example, it is only necessary to rotate the substrate regulating section 1o and the support section 2 on the horizontal plane, so it is possible to make the substrate regulating section smaller than the XY child table and the regulating section. Regulations section 10. By making the substrate support portion 12 and the like from lightweight titanium alloy or resin, it is possible to reduce the size of the rotational drive device. In addition, by rotating the regulating part 1o itself 1800 times on a horizontal plane, the substrate movement stroke in the direction perpendicular to the substrate flow direction is maximized, and as in the first embodiment, large substrates can be moved at high speed.

High precision mounting can be performed.

Effects of the Invention As described above, the present invention divides the mounting range on a board on which electronic components are mounted in half in advance, and mounts the electronic components from the outer periphery of the mounting range toward the center of the first mounting range. in,
The center of the board and the table that fixes the board are on a horizontal plane.
Minimize the time required to make the center coaxial with the center of 800 rotations. Next, the center of the board is coaxial with the center of rotation of the table fixing the board 1000 times on a horizontal plane,
Since the second mounting range is mounted by rotating 1800 degrees on a horizontal plane, the space for moving the table is smaller than that of a normal XY child table, so even larger substrates can be mounted. When rotating, the rotation speed is gradually increased and rotation is started, and the rotation speed is gradually lowered and rotation is stopped, so as not to damage the board, parts on the board may become misaligned. Nor. In this way, it is possible to mount large substrates at high speed and with high precision.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIGS. 4 is a schematic front view of another conventional device, and FIG. 5 is a perspective view of a second embodiment of the present invention. 1...Rotary head, 2...Nozzle, 3...Electronic component supply device, 4...
Electronic components, 5...XY child table 6...
・Substrate, completed...Rotary table, 8°°゛°゛°
Installed “RAD 0” Name of agent: Patent attorney Toshi Nakao and 1 other person J
---X y table figure 3 section

Claims (9)

[Claims] (1) A first step in which the mounting range on the board on which electronic components are mounted is divided in advance, and the mounting order is determined for the plurality of divided mounting ranges, and then the first mounting range is mounted. An electronic component mounting method characterized in that the second step of moving a table portion that supports a board and then moving to the first mounting range and then moving to the next mounting range is repeated in a predetermined order. (2) Rotate the table part that supports the substrate, and
2. The electronic component mounting method according to claim 1, wherein the electronic component mounting method is configured to move to the next mounting range following the mounting range. (3) The electronic component mounting method according to claim 1, wherein the center of the board and the rotation center of the table portion are arranged at substantially the same position. (4) The electronic component mounting method according to claim 1, wherein the mounting range on the board on which the electronic components are mounted is divided in half in advance. (5) A rotary table for rotating the board 180° on a horizontal plane is provided on the top or bottom surface of the XY table for the first and second mounting ranges of electronic components, which are divided into halves of the board. After mounting the range, the center of the board or the vicinity thereof, and the rotation center of the rotary table or the vicinity thereof,
A patent for mounting a second mounting range by rotating the substrate and the rotary table 180 degrees on a horizontal plane on the center of a space where the substrate can be placed, which is coaxial and perpendicular to the flow direction of substrate transport. An electronic component mounting method according to claim 4. (6) In order to mount electronic components on a board, a rotary table is equipped with a regulating part that regulates the board, a board support that prevents the board from deflecting due to impact from nozzles, etc. during mounting.
After mounting the first mounting range, rotate the electronic component by 180° on a horizontal plane to attach the electronic component to the first and second mounting ranges, which are provided on the XY table and divided in advance on the board. 5. The electronic component mounting method according to claim 4, wherein the electronic component mounting method comprises: mounting. (7) The electronic component mounting method according to claim 4, wherein the regulating portion, the substrate support portion, and the rotary table including them are made of titanium or the like, a lightweight alloy, or resin. (8) When attaching electronic components to a pre-divided attachment range, the order of attachment is from the outer periphery of the attachment area to the center, or conversely from the center to the outer periphery of the attachment area. By doing so, the time required to make the center of the substrate and the center of the rotary table coaxial with the center of the substrate movement space in the direction perpendicular to the flow direction of substrate transport is minimized. The electronic component mounting method described in Section 4. (9) After mounting a certain mounting range of the plurality of mounting ranges of electronic components divided in advance on the board, the center of the board and the center of the rotary table are aligned in the board movement space in the direction perpendicular to the flow direction of board transport. When the board is rotated 180 degrees on a horizontal plane with the board coaxial with the center, the rotation speed is gradually increased to start a half rotation, the rotation speed is gradually lowered and stopped, and the rotation is finished. 5. The electronic component mounting method according to claim 4, which enables accurate mounting.