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JPH01186591A - Electroluminescence element - Google Patents

Electroluminescence element

Info

Publication number
JPH01186591A
JPH01186591A JP63005800A JP580088A JPH01186591A JP H01186591 A JPH01186591 A JP H01186591A JP 63005800 A JP63005800 A JP 63005800A JP 580088 A JP580088 A JP 580088A JP H01186591 A JPH01186591 A JP H01186591A
Authority
JP
Japan
Prior art keywords
layer
hygroscopic
fine powder
powder
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63005800A
Other languages
Japanese (ja)
Inventor
Etsuo Ogino
悦男 荻野
Shiro Kobayashi
史朗 小林
Koji Nakanishi
功次 中西
Toshitaka Shigeoka
重岡 利孝
Katsuhisa Enjoji
勝久 円城寺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Sheet Glass Co Ltd
Original Assignee
Nippon Sheet Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Sheet Glass Co Ltd filed Critical Nippon Sheet Glass Co Ltd
Priority to JP63005800A priority Critical patent/JPH01186591A/en
Publication of JPH01186591A publication Critical patent/JPH01186591A/en
Pending legal-status Critical Current

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  • Electroluminescent Light Sources (AREA)

Abstract

PURPOSE:To make brightness deterioration and film peeling etc., difficult to arise and improve the reliability of an EL element by making a hygroscopic powder to be included in a resistant body layer. CONSTITUTION:A transference electrode 2 having a thickness of approximately 400nm is formed on a glass substrate 1 by a sputtering method. Next a luminous layer 3 of approximately 1mum thickness is formed on the electrode 2 by vacuum evaporation with the substrate 1 heated to about 250 deg.C. And MnO2 as A conductive material is ground in which its particle diameter becomes as small as about 1mum. Then a fine powder having a particle diameter of approximately 0.8mum is made with at least one kind of a hygroscopic material; which is selected from groups composed of silicagel, activated alumina sulfuric anhydride sodium, magnesium perchlorate, barium oxide, and active carbon; ground. A resistance layer 4 of the sickness of about 20mum is formed with a conductive fine powder and a hygroscopic fine powder mixed together with a binder material, applied on the layer 3, and then dried. Then Al having the thickness of about 200mum is formed on the layer 4 by a vacuum evaporation method as an upper electrode. Finally a glass cap 6 is adhered with a seal material.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、電界印加により発光するエレクトロルミネッ
センス素子に関し、特に発光層の湿気による劣化を防止
するために抵抗月に吸湿効果を備えたエレクトロルミネ
ッセンス素子に関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an electroluminescent device that emits light by applying an electric field, and particularly relates to an electroluminescent device that has a moisture absorbing effect on a resistor to prevent deterioration of the light emitting layer due to moisture. It is related to the element.

[従来の技術] 従来発光層母体として、■族硫化物(例えば、ZnSな
ど)を用いたエレクトロルミネ、・センス素子(以後E
L素子と略称する)が知られている。
[Prior art] Conventionally, electroluminescence/sense elements (hereinafter referred to as E
(abbreviated as L element) is known.

これら■族硫化物は、湿気に非常に弱く駆動時の輝度劣
化あるいは膜はがれ等の一因となっている。
These Group 1 sulfides are extremely sensitive to moisture and are a cause of brightness deterioration or film peeling during driving.

従来において、導電性微粉末をバインダーで固めた抵抗
体層を含むEL素子の防湿対策としては、ガラスキャッ
プなどの外囲器を設は前記ガラスキャップ中を脱ガス真
空化するか、あるいは乾燥ガス置換するという手法が用
いられていた。
Conventionally, as a moisture-proofing measure for an EL element containing a resistor layer made of conductive fine powder hardened with a binder, an envelope such as a glass cap is provided, and the inside of the glass cap is degassed and evacuated, or a dry gas A method of substitution was used.

[発明が解決しようとする課題] しかしながら上記従来の防湿対策においては、前記ガラ
スキイツブ中を完全に無湿状態に出来なかったり、EL
基板ガラスと外囲器のシール部から外囲器中へ、水分が
侵入したりあるいは、抵抗体層からの水分の放出等によ
り、十分な防湿効果が得られないため、輝度劣化等のE
LXe子寿命に大きな問題があった。
[Problems to be Solved by the Invention] However, in the above-mentioned conventional moisture-proofing measures, it is not possible to make the inside of the glass cabinet completely moisture-free, and the EL
Moisture may enter the envelope from the seal between the substrate glass and the envelope, or moisture may be released from the resistor layer, making it impossible to obtain a sufficient moisture-proofing effect.
There was a big problem with the lifespan of LXe.

[課題を解決するための手段] 本発明は前記問題点を解決するためになされたものであ
って、透明絶縁基板上に、透明電極、発光層、抵抗体層
、および背面電極を順次積層してなるエレクトロルミネ
ッセンス素子において、該抵抗体層に吸湿性粉末を含ま
せている。□該吸湿性粉末としては、吸湿性を有する物
質であれば任意の物が使用できるが、内でも/す力ゲル
、無水硫酸カルシウム、過塩素酸マグネシウム、酸化バ
リウム、酸化カルシウム、活性炭よりなる群より選ばれ
た少なくとも1種の粉末又は混合粉末を用いることが、
吸湿後の材質がEL素fに対して悪影響を与えにくいの
で好ましい。
[Means for Solving the Problems] The present invention has been made to solve the above problems, and includes a transparent electrode, a light-emitting layer, a resistor layer, and a back electrode that are sequentially laminated on a transparent insulating substrate. In the electroluminescent device, the resistor layer contains a hygroscopic powder. □As the hygroscopic powder, any material can be used as long as it has hygroscopic properties, but among them, the group consisting of hygroscopic gel, anhydrous calcium sulfate, magnesium perchlorate, barium oxide, calcium oxide, and activated carbon can be used. Using at least one powder or mixed powder selected from
This is preferable because the material after absorbing moisture is unlikely to have an adverse effect on the EL element f.

該抵抗体層中に含ませる吸湿性粉末は、少ないと本発明
の効果が表われに(<、又多すぎると電気的性質を阻害
することになるので、抵抗体層に対して2〜10vo1
%の範囲で加えられることが好ましい。
If the amount of hygroscopic powder contained in the resistor layer is small, the effect of the present invention will not be apparent (and if it is too large, the electrical properties will be impaired, so the amount of hygroscopic powder contained in the resistor layer is 2 to 10 vol
It is preferable that it is added in a range of %.

又該吸湿性粉末の大きさは、導性又は半導体性の特性を
作り出す抵抗体層の主要粉末(通常直径1〜数μm)に
対して大きすぎると電気的特性に影響しやすくなり、又
小さすぎると取り扱いが繁雑になりやすいので直径0.
5〜1.0μ腸の大きさとすることが好ましい。
In addition, if the size of the hygroscopic powder is too large compared to the main powder (usually 1 to several μm in diameter) of the resistor layer that produces conductive or semiconducting characteristics, it will easily affect the electrical characteristics; If it is too large, it will be difficult to handle, so use a diameter of 0.
The size of the intestine is preferably 5 to 1.0 microns.

該吸湿性粉末は、抵抗体層に対して均一に混合されても
良いし、発光層からはなれた位置において最大な濃度を
示す様に混合されても良い。
The hygroscopic powder may be mixed uniformly into the resistor layer, or may be mixed so as to exhibit a maximum concentration at a position away from the light emitting layer.

[作用コ 本発明によれば、EL素子内部に吸湿機構を設えている
ため、例えばガラスキャンプ等の外囲器のモレによって
侵入したり、内部より発生した水分を発光層に取り込ま
れる前に吸収し、発光効率の低下を防止することができ
る。
[Function] According to the present invention, a moisture absorbing mechanism is provided inside the EL element, so moisture that enters due to leakage in the envelope of the glass camp or the like or that is generated from the inside is absorbed before it is taken into the light emitting layer. However, a decrease in luminous efficiency can be prevented.

[実 施 例コ 以下、本発明の実施例について図面を参照しながら説明
する。第1図は本発明に係るEL素子の一実施例である
。透明なガラス基板(1)上に、透明電極(2)を、ス
パッタリング法により、約400nmの厚さに形成する
。次にガラス基板を約250°Cに加熱し、発光層(3
)を、約1μIの厚さに透明電極(2)上に真空蒸着に
より形成する。この後ガラス基板(1)を、真空装置よ
り取り出し抵抗層(4)を形成せしめる。抵抗層(4)
の形成方法の一例としては、以下の通りである。 まず
、導電性物質としてN M n O2を粉砕装置により
、粒径が約1μmになるまで粉砕し、導電性微粉末を作
製する。次にこれと同じ方法で吸湿材を粉砕し粒径が約
0.8μmの吸湿性微粉末を作製する。(吸湿性微粉末
の粒径としては、上記導電性微粉末よりも、小さい方が
望ましい。
[Embodiments] Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows an embodiment of an EL element according to the present invention. A transparent electrode (2) with a thickness of about 400 nm is formed on a transparent glass substrate (1) by sputtering. Next, the glass substrate is heated to about 250°C, and the light emitting layer (3
) is formed to a thickness of about 1 μI on the transparent electrode (2) by vacuum evaporation. Thereafter, the glass substrate (1) is taken out from a vacuum apparatus and a resistance layer (4) is formed thereon. Resistance layer (4)
An example of a method for forming is as follows. First, N M n O 2 as a conductive substance is pulverized by a pulverizer to a particle size of about 1 μm to produce a conductive fine powder. Next, the hygroscopic material is pulverized in the same manner as above to produce a hygroscopic fine powder having a particle size of about 0.8 μm. (The particle size of the hygroscopic fine powder is preferably smaller than that of the conductive fine powder.

この理由は吸湿性微粉末の粒径が、導電性微粉末のそれ
よりも大きくなると導電性微粉末同士の接触面積が小さ
くなり抵抗層の抵抗が増大し、発光効率が減少するため
と、発光エリア内の非発光部分が増加するためである。
The reason for this is that when the particle size of the hygroscopic fine powder becomes larger than that of the conductive fine powder, the contact area between the conductive fine powders becomes smaller, the resistance of the resistive layer increases, and the luminous efficiency decreases. This is because the non-light-emitting portion within the area increases.

) このような、導電性微粉末と吸湿性微粉末を、バインダ
ー材料といっしょに混合する。吸湿性微粉末の量として
は、導電性微粉末に対して5%とした。(この割合が大
きくなりすぎると発光効率の減少及び非発光部分の増加
の原因となってしまう。)混合された導電性a粉末、吸
湿性微粉末、バインダーは、スプレー装置等により発光
層(3)、[−に、塗布し、その後乾燥することにより
厚さ約20μ踵の抵抗体層(4)を、形成した。次に、
低抗体層(4)上に上部電極として、AIを真空蒸着法
により約200nmの厚みに形成する。最後にガラスキ
ャンプ(6)を、シール材により接着する。
) Such conductive fine powder and hygroscopic fine powder are mixed together with a binder material. The amount of hygroscopic fine powder was 5% based on the conductive fine powder. (If this ratio becomes too large, it will cause a decrease in luminous efficiency and an increase in non-luminous areas.) The mixed conductive a powder, hygroscopic fine powder, and binder are sprayed onto the luminescent layer (3 ), [-, and then dried to form a resistor layer (4) with a thickness of about 20 μm. next,
AI is formed as an upper electrode on the low antibody layer (4) to a thickness of about 200 nm by vacuum evaporation. Finally, the glass camp (6) is adhered with a sealant.

本実施例におけるEL素子は、従来のEL素子が約30
00時間で性能劣化するものが約50%あったのに対し
、約10000時間で性能劣化したものが約50%とな
った。
The EL element in this example has about 30
Approximately 50% of the samples showed performance degradation after 00 hours, while about 50% of samples showed performance degradation after about 10,000 hours.

父上記実施例においては、IEL素子に対して外遮断、
外傷保護等の目的で外囲器を設けた物であるが、前記目
的が達成されるのであれば、複数のEL素子に対して1
外囲器を設けたり、上記形状の外囲器を設けなくてもか
まわない。
In the above embodiment, external shielding is applied to the IEL element,
This device is equipped with an envelope for the purpose of protecting against external injuries, etc., but if the above purpose is achieved, one envelope is provided for multiple EL elements.
There is no need to provide an envelope or an envelope having the above shape.

[発明の効果] 本発明によれば、EL素子の内の発光に対して影響を与
えない部分に吸湿機能があるため、例えば外囲器からの
モレや内部から発成する水分の悪影響を防止することが
できる。又水分による発光層の劣化が起こらないため、
輝度劣化、膜ハガレ等が生じにくく、EL素子の信頼性
を向上することができる。
[Effects of the Invention] According to the present invention, a portion of the EL element that does not affect light emission has a moisture absorbing function, so that, for example, leakage from the envelope and the adverse effects of moisture generated from the inside can be prevented. can do. Also, since the luminescent layer does not deteriorate due to moisture,
Brightness deterioration, film peeling, etc. are less likely to occur, and the reliability of the EL element can be improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は実施例で作成したエレクトロルミネッセンス素
子の概略を示す断面図である。 (1)ガラス基板 (4)吸湿性粉末を含む抵抗体層(
2)透明電導膜 (5)Az電極 (3)発光層   (6)パックキャップ第1図
FIG. 1 is a cross-sectional view schematically showing an electroluminescent device produced in an example. (1) Glass substrate (4) Resistor layer containing hygroscopic powder (
2) Transparent conductive film (5) Az electrode (3) Light emitting layer (6) Pack cap Figure 1

Claims (2)

【特許請求の範囲】[Claims] (1) 透明絶縁基板上に、透明電極、発光層、抵抗体
層、および背面電極を順次積層してなるエレクトロルミ
ネッセンス素子において、該抵抗体層に吸湿性粉末を含
ませておくことを特徴とするエレクトロルミネッセンス
素子。
(1) An electroluminescent device in which a transparent electrode, a light emitting layer, a resistor layer, and a back electrode are sequentially laminated on a transparent insulating substrate, characterized in that the resistor layer contains a hygroscopic powder. electroluminescent element.
(2) 該吸湿性粉末がシリカゲル、活性アルミナ、無
水硫酸ナトリウム、過塩素酸マグネシウム、酸化バリウ
ム、活性炭よりなる群より選ばれた少なくとも1種の粉
末又は混合粉末である特許請求の範囲第1項記載のエレ
クトロルミネッセンス素子。
(2) Claim 1, wherein the hygroscopic powder is at least one powder or mixed powder selected from the group consisting of silica gel, activated alumina, anhydrous sodium sulfate, magnesium perchlorate, barium oxide, and activated carbon. The electroluminescent device described.
JP63005800A 1988-01-14 1988-01-14 Electroluminescence element Pending JPH01186591A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63005800A JPH01186591A (en) 1988-01-14 1988-01-14 Electroluminescence element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63005800A JPH01186591A (en) 1988-01-14 1988-01-14 Electroluminescence element

Publications (1)

Publication Number Publication Date
JPH01186591A true JPH01186591A (en) 1989-07-26

Family

ID=11621156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63005800A Pending JPH01186591A (en) 1988-01-14 1988-01-14 Electroluminescence element

Country Status (1)

Country Link
JP (1) JPH01186591A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0374498U (en) * 1989-11-21 1991-07-26
US6520821B1 (en) 1998-05-18 2003-02-18 Nec Corporation Device package and device encapsulation method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0374498U (en) * 1989-11-21 1991-07-26
US6520821B1 (en) 1998-05-18 2003-02-18 Nec Corporation Device package and device encapsulation method

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