JPH01206643A - Substrate attracting structure - Google Patents

Abstract

PURPOSE:To obtain a substrate attracting structure capable of corresponding to a plurality of pieces of substrates different in size by one piece of a substrate holding plate by a method wherein a plurality of attracting parts fitted to a plurality of sizes are formed on one piece of the substrate holding plate. CONSTITUTION:Annular attracting grooves 3A-3C fitted to substrates 1A-1C are formed on the upper surface of a substrate holding plate 2. Suction parts 4A-4C are connected to a vacuum pump 8 through a connecting pipe 7 by connecting pipes 6A-6C. Moreover, the pipes 6A-6C are respectively provided with ON-OFF valves 9A-9C, which can be opened and shut. Thereby, a plurality of the substrates 1A-1C different in size can be attracted by one piece of the plate 2 and as the valves 9A-9C simply have only to be opened and shut, a cost reduction in a device and a time reduction in a change-over work are contrived.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a substrate suction structure for suctioning and holding a substrate.

[Prior art] For example, as a tape bonder used in the manufacture of semiconductors, Japanese Patent Publication No. 57-53974 and Japanese Patent Publication No. 62-27735 are known.
As shown in Japanese Patent Publication No. 62-55298, etc., bumps of pellets are bonded to the leads of carrier tape, and Japanese Patent Publication No. 62-31819,
As shown in Japanese Patent Publication No. 62-34142, etc., it is known that a single bump is bonded to the lead of a carrier tape.

The substrate suction structure in this device is in the xY (horizontal) direction,
A substrate holding plate (vacuum chuck) is provided on a pound stage that is driven in the Z (vertical) direction and the θ (rotational) direction, and the pellets or bumps are collected by suction parts such as suction grooves or suction holes provided on this substrate holding plate. It holds a board provided with.

Incidentally, it is better to hold the substrate by suction at a portion as close to the outer periphery as possible to prevent warping of the substrate and improve holding stability. Therefore, conventionally, several types of board holding plates were prepared.
They are replaced and used depending on the board.

[Problems to be Solved by the Invention] The above-mentioned conventional technology has the problem that a plurality of substrate holding plates must be prepared, and replacement work is required each time the size of the substrate differs.

An object of the present invention is to provide a substrate suction structure that can accommodate a plurality of substrates of different sizes with one substrate holding plate.

[Means for Solving the Problems] The above object is to provide a suction unit that can accommodate multiple substrates of different sizes, and multiple suction units that can accommodate multiple substrates that communicate with the suction unit and are connected to external vacuum pumps. The problem is solved by providing a structure including a substrate holding plate having a section formed therein, and a plurality of opening/closing means for opening and closing the plurality of suction sections, respectively, at a connection section connecting the plurality of suction sections and the vacuum pump. Ru.

[Function] A plurality of suction parts corresponding to a plurality of sizes are formed on one substrate holding plate, and each of the suction parts can be opened and closed by an opening/closing means, so that suction can be performed according to the substrate. It is used in a vacuum suction state by opening only the part.

[Example] An example of the present invention will be described below with reference to FIGS. 1 to 3. In this embodiment, three types of substrates IA of different sizes,
A substrate adsorption structure configured to be applicable to IB and IC is shown. On the upper surface of the substrate holding plate 2, the substrates IA, IB, 4c
Annular suction grooves 3A, 3B, and 3C are formed in accordance with the above. Further, the side surface of the substrate holding plate 2 is provided with the suction grooves 3A, 3.
Horizontal suction parts 4A, 4B, 4C extending below B and 3C
These suction parts 4A, 4B, 4C and the suction grooves 3A, 3B, 3C are communicated with each other by vertical suction parts 5A, 5B, 5C.

The suction parts 4A, 4B, 4C are connected to vibros A, 6B,
6C is connected to a vacuum pump 8 via a connecting pipe 7. Further, the connecting vibros A, 6B, and 6C are provided with on-off valves 9A, 9B, and 9C that can be opened and closed, respectively.

Next, the effect will be explained. Now, when holding the substrate IA by suction, only the on-off valve 9A is opened and the on-off valves 9B and 9C are closed.

As a result, the suction groove 3A becomes the suction state, and the suction groove 3B
, 3C are in a non-suction state, and the suction groove 3A holds the substrate I.
A can be retained by adsorption. In the case of this board IA, not only the on-off valve 9A is open, but the on-off valves 9B,
9C may also be opened and used.

When holding the substrate IB by suction, the on-off valve 9A must be closed, and only the on-off valve 9B or the on-off valve 9B,
Use with 9C open. Also, when holding the board IC by suction, be sure to close the on-off valves 9A and 9B in the same way.
It is used by opening only the on-off valve 9C.

In this way, a plurality of substrates IA, IB, and IC of different sizes can be attracted to one substrate holding plate 2, and since it is only necessary to open and close the on-off valves 9A, 9B, and 9C, the device Cost reduction and switching work time can be significantly shortened.

In addition, in the above embodiment, the parts that attract the substrates IA, IB, and IC are the suction grooves 3A, 3B, and 3C, but the fourth
As shown in the figure and FIG. 5, the suction groove 3A shown in FIG.
Suction holes 10A on multiple sides corresponding to 3B and 3C, respectively,
A second substrate holding plate 11 having IOB, 10C may be manufactured and used by closely fixing this substrate holding plate 11 onto the substrate holding plate 2. In addition, in this embodiment, three types of substrates IA
, IB, and IC have been described, it goes without saying that the present invention can be configured to be applied to two or four or more types of substrates.

[Effects of the Invention] As is clear from the above description, according to the present invention, a plurality of substrates of different sizes can be attracted to one substrate holding plate, and it is possible to adsorb a plurality of substrates of different sizes by simply opening and closing the opening/closing valve. Therefore, it is possible to reduce the cost of the device and significantly shorten the time required for switching operations.

BRIEF DESCRIPTION OF THE DRAWINGS The plan view shown in FIG. 5 is a sectional view taken along the line CC in FIG. 4. IA, IB, IC: Board, 2: Board holding plate, 3A
, 3B, 3C: Suction groove, 4A, 4B, 4C15A, 5B, 5c: Suction part, 6A,
6B, 6C17: Connection pipe, 8: Vacuum pump, 9A, 9B, 9c: Open/close valve,
IOA, IOB, 1oc: suction hole, 11: substrate holding plate. Agent Patent attorney 1) Yoshinori Bebe 1A~IC: To basic sales 10A 10C: 0 station, Wakiri (11: Kubuki staff bamboo forest

Claims (1)

[Claims] (1) A substrate holding plate formed with suction parts corresponding to a plurality of substrates of different sizes and a plurality of suction parts corresponding to each substrate, which are connected to the suction parts and connected to an external vacuum pump, respectively; A substrate suction structure comprising: a connection part connecting the plurality of suction parts and the vacuum pump; and a plurality of opening/closing means for respectively opening and closing the plurality of suction parts.