JPH01304717A - Conductive paint for multilayer capacitor internal electrodes - Google Patents
Conductive paint for multilayer capacitor internal electrodesInfo
- Publication number
- JPH01304717A JPH01304717A JP63134463A JP13446388A JPH01304717A JP H01304717 A JPH01304717 A JP H01304717A JP 63134463 A JP63134463 A JP 63134463A JP 13446388 A JP13446388 A JP 13446388A JP H01304717 A JPH01304717 A JP H01304717A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- coupling agent
- parts
- conductive paint
- multilayer capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003973 paint Substances 0.000 title claims description 32
- 239000003990 capacitor Substances 0.000 title claims description 29
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 28
- 239000007822 coupling agent Substances 0.000 claims description 26
- 239000000843 powder Substances 0.000 claims description 21
- 229910052788 barium Inorganic materials 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 12
- -1 barium organic acid salt Chemical class 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 230000032798 delamination Effects 0.000 description 23
- 150000002902 organometallic compounds Chemical class 0.000 description 12
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 9
- 238000010304 firing Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000003350 kerosene Substances 0.000 description 5
- 239000007772 electrode material Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- IEKHISJGRIEHRE-UHFFFAOYSA-N 16-methylheptadecanoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O IEKHISJGRIEHRE-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- HIQAWCBKWSQMRQ-UHFFFAOYSA-N 16-methylheptadecanoic acid;2-methylprop-2-enoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(=C)C(O)=O.CC(=C)C(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O HIQAWCBKWSQMRQ-UHFFFAOYSA-N 0.000 description 1
- 101100309447 Caenorhabditis elegans sad-1 gene Proteins 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229940075386 barium oxalosuccinate Drugs 0.000 description 1
- CIVPYUFTSJMQBK-UHFFFAOYSA-L barium(2+);2-oxalobutanedioate Chemical compound [Ba+2].OC(=O)C(=O)C(C([O-])=O)CC([O-])=O CIVPYUFTSJMQBK-UHFFFAOYSA-L 0.000 description 1
- AGXUVMPSUKZYDT-UHFFFAOYSA-L barium(2+);octadecanoate Chemical compound [Ba+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O AGXUVMPSUKZYDT-UHFFFAOYSA-L 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229940125904 compound 1 Drugs 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Conductive Materials (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
悲1ユ!ソリ111
本発明は、セラミック積層コンデンサの内部電極を形成
するための導電性塗料に関する。[Detailed description of the invention] Sad 1 Yu! Warp 111 The present invention relates to a conductive paint for forming internal electrodes of a ceramic multilayer capacitor.
良未立弦韮
一般に積層コンデンサは、未焼成のセラミック誘電体層
と内部電極層とを交互に数層〜数十層積層し、高温で焼
結させ、これに外部端子を設けて製造される。誘電体に
はチタン酸バリウム、酸化チタン、鉛を含む複合へロブ
スカイト等のセラミック粉末を有機バインダーと混合し
てスラリー化し、ドクターブレード法などの方法でシー
ト状に成形したものを用いる。内部電極材料には、白金
、パラジウム、金、銀、ニッケル、銅及びこれらの混合
物、合金などの導電性粉末に、必要に応じて無機酸化物
添加剤等を配合し、有機ビヒクルに分散させて塗料化し
た組成物が使用される。通常この導電性塗料を前記未焼
成誘i体シートにスクリーン印刷して内部電極層を形成
し、これを複数枚重ねて加熱加圧成形し、チップ片に切
断した後、所定のプロファイルで焼成して一体化された
構造のコンデンザ素体とする。In general, multilayer capacitors are manufactured by alternately stacking several to dozens of unfired ceramic dielectric layers and internal electrode layers, sintering them at high temperatures, and providing external terminals. . The dielectric material used is a ceramic powder such as composite herovskite containing barium titanate, titanium oxide, and lead mixed with an organic binder to form a slurry and formed into a sheet by a method such as a doctor blade method. The internal electrode material is made by blending conductive powders such as platinum, palladium, gold, silver, nickel, copper, and mixtures and alloys thereof with inorganic oxide additives as necessary, and dispersing them in an organic vehicle. A composition made into a paint is used. Usually, this conductive paint is screen printed on the unfired dielectric sheet to form an internal electrode layer, which is stacked and molded under heat and pressure, cut into chips, and then fired to a predetermined profile. The capacitor body has an integrated structure.
ところが積層コンデンサの焼成時において、しばしば内
部電極と誘′@体セラミック層との間にデラミネーショ
ンc層間剥M)が発生し、容量の低下や半田付は時の熱
変化によるサーマルクラックの発生を招くため、大きな
問題となっている。デラミネーションの発生原因につい
ては未だ充分なる解明がなされていないが、デラミネー
ションの発生率は材料系即ち内部′!4極材料及び誘電
体材料、コンデンサの積層数やサイズ、積層条件、焼成
条件等の製造条件によって異なり、最も発生率の高いチ
タン酸バリウム系の高積層品では、製造条件を非常に厳
しく管理しても発生率を0にすることは難しく、生産性
、品質の向上のためデラミネーション対策が重要な課題
である。デラミネーションの防止のために種々の手段が
とられているが、薊えば特開昭60−136212号公
報では、内部電極材料の有機バインダとして誘′@体材
料の有機バインダと同一のものを使用することによって
デラミネーションをある程度抑制しているが、焼成条件
によってはなおかつデラミネーションが発生し、その効
果は充分とはいえない、又特開昭61−248412号
公報には、内部’!44[1中に誘電体セラミックス粉
末を添加することによりデラミネーションを抑制するこ
とが記載されているが、この方法は内部電極層の連続性
を劣化させ、近年の内部電極の薄層化の要求の点からも
望ましくない。However, during the firing of multilayer capacitors, delamination (c) often occurs between the internal electrodes and the dielectric ceramic layer, resulting in a decrease in capacitance and the occurrence of thermal cracks due to thermal changes during soldering. This has become a big problem. Although the cause of delamination has not yet been fully elucidated, the occurrence rate of delamination is due to the material system, that is, internal '! It varies depending on manufacturing conditions such as the 4-electrode material and dielectric material, the number of laminated layers and size of the capacitor, lamination conditions, firing conditions, etc., and the manufacturing conditions must be extremely strictly controlled for barium titanate-based high laminated products, which have the highest occurrence rate. However, it is difficult to reduce the incidence to zero, and countermeasures against delamination are an important issue in order to improve productivity and quality. Various measures have been taken to prevent delamination, and in Japanese Patent Application Laid-Open No. 136212/1983, the same organic binder as that of the dielectric material is used as the organic binder of the internal electrode material. Although this suppresses delamination to some extent, delamination still occurs depending on the firing conditions, and the effect cannot be said to be sufficient. It has been described that delamination can be suppressed by adding dielectric ceramic powder to 44 [1], but this method deteriorates the continuity of the internal electrode layer and meets the recent demand for thinner internal electrode layers. It is also undesirable from this point of view.
口が ゛しよ゛と る
本発明の目的は、特定の組成の内部電極材料により、積
層コンデンサの焼成時のデラミネーションの発生を有効
に防止することにある。An objective of the present invention is to effectively prevent the occurrence of delamination during firing of a multilayer capacitor by using an internal electrode material having a specific composition.
−t・めの
本発明は、
rt (a)導電性粉末100重社部と (b)金
属換算で0.02〜0.8重量部のチタネート系カップ
リング剤とを、 (c)有機ビヒクルに分散させてなる
積層コンデンサ内部t[l用導電性塗料。In the present invention, (a) 100 parts of conductive powder, (b) 0.02 to 0.8 parts by weight of a titanate coupling agent in terms of metal, and (c) an organic vehicle. A conductive paint for the inside of a multilayer capacitor made by dispersing the inside of a multilayer capacitor.
2 チタネート系カップリング剤が導電性粉末表面に被
覆されている、請求項1記載の積層コンデンサ内部電極
用導電性塗料。2. The conductive paint for internal electrodes of a multilayer capacitor according to claim 1, wherein the surface of the conductive powder is coated with a titanate coupling agent.
3(a)導電性粉末100重量部と (b)金属換算で
0.02〜0.8重量部のチタネート系カップリング剤
とバリウム有機酸塩との混合物とを、(c)有機ビヒク
ルに分散させてなる積層コンデンサ内部電極用導電性塗
料。3 (a) 100 parts by weight of conductive powder and (b) a mixture of 0.02 to 0.8 parts by weight of a titanate coupling agent and barium organic acid salt in terms of metal are dispersed in (c) an organic vehicle. Conductive paint for internal electrodes of multilayer capacitors.
4 チタネート系カップリング剤とバリウム有機酸塩の
どちらか一方が導電性粉末表面に被覆されており他方は
有機ビヒクルに分散している、請求項3記載の積層コン
デンサ内部電極用導電性塗料。4. The conductive paint for internal electrodes of a multilayer capacitor according to claim 3, wherein either the titanate coupling agent or the barium organic acid salt is coated on the surface of the conductive powder, and the other is dispersed in an organic vehicle.
5 チタネート系カップリング剤とバリウム有機酸塩と
の混合物が導電性粉末表面に被覆されている、請求項3
記載の積層コンデンサ内部″@極用導電性塗料」である
。5. Claim 3, wherein the surface of the conductive powder is coated with a mixture of a titanate coupling agent and a barium organic acid salt.
This is the "conductive paint for electrodes" inside the multilayer capacitor as described.
チタネート系カップリング剤としては、例えばイソプロ
ピルトリイソステアロイルチタネート、イソプロピルト
リ(N−アミノエチル−アミノエチル)チタネート、イ
ソプロピルトリオクタノイルチタネート、イソプロピル
ジメタクリルイソステアロイルチタネート、イソプロピ
ルイソステアロイルジアクリルチタネート、イソプロピ
ルトリクミルフェニルチタネートなどが使用される。Examples of titanate coupling agents include isopropyltriisostearoyltitanate, isopropyltri(N-aminoethyl-aminoethyl)titanate, isopropyltrioctanoyltitanate, isopropyldimethacrylisostearoyltitanate, isopropylisostearoyldiacryltitanate, and isopropyltrictitanate. Milphenyl titanate and the like are used.
バリウム有機酸塩としては、ナフテン酸バリウム、オク
チル酸バリウム、ステアリン酸バリウム、オキサロサク
シン酸バリウム等があげられる。Examples of barium organic acid salts include barium naphthenate, barium octylate, barium stearate, barium oxalosuccinate, and the like.
これらの金属有機化合物は、単に塗料中に添加混合する
だけでもよいが、予め導電性粉末表面に被覆処理して用
いることもできる。These metal organic compounds may be simply added and mixed into the paint, but they may also be used by coating the surface of the conductive powder in advance.
■
本発明の塗料においては、チタネート系カップリング剤
、又はチタネート系カップリング剤とバリウム有機酸塩
との混合物(以下「金属有機化合物1という)を導電性
粉末と併せて用いることにより、いかなる条件下におい
ても効果的にデラミネーションを防止できた。即ち従来
の内部電極塗料の場合、焼成条件等を非常に厳しく制御
してもデラミネーションが発生するが、金属有機化合物
を添加することにより容易に防止され、発生率を0にす
ることができる。金属有機化合物の配合量は、導電性粉
末に対して金属換算で0.02〜0゜8重量部程度が望
ましい、0.021!量部より少ないとその効果が充分
でなく、又0.8重量部より多いと焼成りラックが問題
となる。特に0.05〜0.5f!量部の範囲が望まし
い。■ In the paint of the present invention, by using a titanate coupling agent or a mixture of a titanate coupling agent and a barium organic acid salt (hereinafter referred to as "metal organic compound 1") together with a conductive powder, it is possible to In other words, in the case of conventional internal electrode paints, delamination occurs even if the firing conditions are controlled very strictly, but by adding a metal-organic compound, delamination can be easily prevented. It is possible to reduce the incidence to 0.The amount of the metal organic compound blended is preferably about 0.02 to 0.8 parts by weight based on the conductive powder in terms of metal, and from 0.021! parts by weight. If it is less than 0.8 parts by weight, the effect will not be sufficient, and if it is more than 0.8 parts by weight, problems will occur with the baking rack.A range of 0.05 to 0.5 parts by weight is particularly desirable.
金属有機化合物がデラミネーションの発生の抑制に効果
があるのは、金属有機化合物が積層体を焼成する際に内
部電極と誘電体層の間で接着剤的な役割を果たし、両者
の剥離を防止するためと考えられる。又、金属有機化合
物は例えば、導電性粉末としてパラジウム粉末を使用し
た場合パラジウムの酸化膨部を抑制する優れた作用があ
り、この作用もデラミネーションの発生防止に優れた効
果を奏している。尚焼成後、金属有機化合物は最終的に
は金属酸化物の形でt極膜中に存在すると考えられる。The reason why metal-organic compounds are effective in suppressing the occurrence of delamination is that when the laminate is fired, the metal-organic compounds act like an adhesive between the internal electrodes and the dielectric layer, preventing them from peeling off. This is thought to be for the purpose of In addition, the metal organic compound has an excellent effect of suppressing the oxidation swelling of palladium when, for example, palladium powder is used as the conductive powder, and this effect also has an excellent effect of preventing the occurrence of delamination. It is considered that after firing, the metal organic compound ultimately exists in the form of metal oxide in the t-electrode film.
金属有機化合物は塗料にそのまま添加する以外に、予め
導電性粉末の表面に被覆処理して用いても同様の効果が
得られる。被覆処理はいかなる方法で行ってもよく、例
えば乾式法では、導電性粉末をミキサー中で予備混合し
た後、金属有機化合物を必要量滴下して混合することに
よって被覆することができる。又湿式法では導電性粉末
を水や有機溶媒等に分散させ、充分に撹拌しながら金属
有機化合物を必要量滴下し、その後r過、乾燥したり、
又は金属有機化合物の溶液に導電性粉末を混合、分散さ
せた後、−過、乾燥するなどの方法がある。In addition to adding the metal organic compound to the paint as it is, the same effect can be obtained by coating the surface of the conductive powder in advance. The coating treatment may be performed by any method. For example, in a dry method, the conductive powder is premixed in a mixer, and then the required amount of the metal organic compound is dropped and mixed. In the wet method, the conductive powder is dispersed in water or an organic solvent, and the required amount of the metal organic compound is added dropwise with sufficient stirring, followed by filtration, drying, etc.
Alternatively, there is a method in which a conductive powder is mixed and dispersed in a solution of a metal organic compound, and then filtered and dried.
本発明で使用する有機ビヒクルには特に制限はな(、通
常積層コンデンサ内部′rrh極塗料に用いられている
ものを使用することができる。There are no particular limitations on the organic vehicle used in the present invention (although it is possible to use those commonly used in the internal electrode coating of multilayer capacitors).
本発明の導電性塗料には、その他クラックの防止等の目
的で従来より普通に添加される金属酸化物や有機ベント
ナイトなどを配合してもよい。The conductive paint of the present invention may also contain metal oxides, organic bentonite, and the like, which are conventionally added for the purpose of preventing cracks and the like.
寒■ヨ
実施例1
パラジウム粉末 100重量部チタネー
ト系カップリング剤 1.0重量部(金属Ti換算で
0.05fi量部)
エチルセルロース 7重量部テルピネオ
ール 30 ノ!ケロシン
47 11*イソプロピルトリイソステア
ロイルチタネート、Ti含有率5%
上記の組成物を混練してペースト状の導電性塗料を製造
゛した。Cold ■ Yo Example 1 Palladium powder 100 parts by weight Titanate coupling agent 1.0 parts by weight (0.05 parts by weight in terms of metal Ti) Ethyl cellulose 7 parts by weight Terpineol 30 parts by weight! kerosene
47 11* Isopropyl triisostearoyl titanate, Ti content 5% The above composition was kneaded to produce a paste-like conductive paint.
この導電性塗料をBaTiOs系誘電体グリーンシート
上に所定のパターンでスクリーン印刷し、乾燥後、35
層積層、圧着し、所定の大きさに切断して未焼成の積層
コンデンサチップを作製した。This conductive paint was screen-printed in a predetermined pattern on a BaTiOs-based dielectric green sheet, and after drying,
The layers were laminated, pressure bonded, and cut into a predetermined size to produce an unfired multilayer capacitor chip.
このチップを昇温速度200℃/時で昇温し、最高温度
1350℃で2時間保持することにより焼成したものに
ついて、デラミネーションの発生率を調べたところ、0
であった。When this chip was heated at a heating rate of 200°C/hour and fired by holding it at a maximum temperature of 1350°C for 2 hours, the occurrence rate of delamination was investigated and found to be 0.
Met.
実施例2〜4
チタネート系カップリング剤とケロシンの量を表1の通
りとする以外は、実施IMIと同様にして導電性塗料を
得た。同様に積層コンデンサを製造し、デラミネーショ
ンの発生率を表1に併せて示した。Examples 2 to 4 Conductive paints were obtained in the same manner as in Example IMI, except that the amounts of the titanate coupling agent and kerosene were as shown in Table 1. Multilayer capacitors were manufactured in the same manner, and the incidence of delamination is also shown in Table 1.
実施例5
チタネート系カップリング剤0.8重量部及びナフテン
酸バリウム1.3重量部(Ba含有率9%)を配合し、
ケロシンの量を46重量部とする以外は実施例1と同様
にして導電性塗料を得た。同様に積層コンデンサを製造
し、デラミネーションの発生率を表1に示した。Example 5 0.8 parts by weight of a titanate coupling agent and 1.3 parts by weight of barium naphthenate (Ba content 9%) were blended,
A conductive paint was obtained in the same manner as in Example 1 except that the amount of kerosene was changed to 46 parts by weight. A multilayer capacitor was manufactured in the same manner, and the incidence of delamination is shown in Table 1.
実施例6.7
チタネート系カップリング剤としてT i含有率11.
5%のイソプロピルトリ(N−アミノエチル−アミノエ
チル)チタネートを用い、カップリング剤とケロシンの
址を表1の通りとする以外は、実施例1と同様にしてそ
れぞれ導電性塗料を得た。同様に積層コンデンサを製遺
し、デラミネーションの発生率を表1に併せて示した。Example 6.7 Ti content as titanate coupling agent 11.
Conductive paints were obtained in the same manner as in Example 1, except that 5% isopropyl tri(N-aminoethyl-aminoethyl) titanate was used and the amounts of the coupling agent and kerosene were as shown in Table 1. A laminated capacitor was manufactured in the same manner, and the occurrence rate of delamination is also shown in Table 1.
実施例8
実施例2の組成の導電性塗料について、チタネート系カ
ップリング剤をパラジウム粉末の表面に被覆処理する以
外は同様にして導電性塗料を得た。Example 8 A conductive paint having the composition of Example 2 was obtained in the same manner as in Example 2, except that the surface of the palladium powder was coated with a titanate coupling agent.
被覆処理は、チタネート系カップリング剤をメチルエチ
ルケトンに溶解させ、この溶液にパラジウム粉末を添加
して10分間超音波分散させた後、乾燥させることによ
り行った。The coating treatment was performed by dissolving a titanate coupling agent in methyl ethyl ketone, adding palladium powder to this solution, ultrasonically dispersing it for 10 minutes, and then drying.
この導電性塗料を用いて積層コンデンサを製造したとこ
ろ、デラミネーションの発生率は0であった。When a multilayer capacitor was manufactured using this conductive paint, the incidence of delamination was zero.
実施例9
実施例5と同一の組成で、実施例8と同様の方法でチタ
ネート系カップリング剤及びナフテン酸バリウムをパラ
ジウム粉末の表面に被覆処理し、導電性塗料を得た。こ
の導電性塗料を用いて積層コンデンサを製造したところ
、デラミネーションの発生率は0であった。Example 9 With the same composition as in Example 5, a titanate coupling agent and barium naphthenate were coated on the surface of palladium powder in the same manner as in Example 8 to obtain a conductive paint. When a multilayer capacitor was manufactured using this conductive paint, the incidence of delamination was zero.
比較例1
チタネート系カップリング剤を配合しない他は、実施例
1と同様にして導電性塗料を得た。同様に積層コンデン
サを製造したところ、75%のチップでデラミネーショ
ンの発生が見られた。Comparative Example 1 A conductive paint was obtained in the same manner as in Example 1, except that the titanate coupling agent was not blended. When laminated capacitors were similarly manufactured, delamination occurred in 75% of the chips.
比較例2
チタネート系カップリング剤の量を0.2重量部(Ti
換算で0.01重量部)とする以外は、実施例1と同様
にして導電性塗料を得、同様に積層コンデンサを製造し
た。デラミネーションの発生率は30%であった。Comparative Example 2 The amount of titanate coupling agent was 0.2 parts by weight (Ti
A conductive paint was obtained in the same manner as in Example 1, except that the amount was 0.01 part by weight (calculated as 0.01 part by weight), and a multilayer capacitor was manufactured in the same manner. The incidence of delamination was 30%.
比較例3
チタネート系カップリング剤の址を20重量部(Ti換
算で1.01址部)、ケロシンの量を28@蓋部とする
以外は、実施例1と同様にして導電性塗料を得た。同様
に積層コンデンサを製造したところ、デラミネーション
は見られなかったが、焼成後クラックが多数発生し、実
用にならないものであった。Comparative Example 3 A conductive paint was obtained in the same manner as in Example 1, except that the amount of titanate coupling agent was 20 parts by weight (1.01 parts in terms of Ti) and the amount of kerosene was 28 parts by weight. Ta. When a multilayer capacitor was similarly manufactured, no delamination was observed, but many cracks occurred after firing, making it unusable.
i1ム荒1
本発明は、内部電極用導電性塗料チタネート系カップリ
ング剤、又はチタネート系カップリング剤とバリウム有
機酸塩との混合物を配合することにより、積層コンデン
サのデラミネーションを効果的に防止し得たものであり
、産業上極めて有用なものである。i1 Muara 1 The present invention effectively prevents delamination of multilayer capacitors by blending a titanate-based coupling agent or a mixture of a titanate-based coupling agent and a barium organic acid salt in a conductive paint for internal electrodes. This is extremely useful in industry.
Claims (1)
.02〜0.8重量部のチタネート系カップリング剤と
を、(c)有機ビヒクルに分散させてなる積層コンデン
サ内部電極用導電性塗料。 2 チタネート系カップリング剤が導電性粉末表面に被
覆されている、請求項1記載の積層コンデンサ内部電極
用導電性塗料, 3(a)導電性粉末100重量部と(b)金属換算で0
.02〜0.8重量部のチタネート系カップリング剤と
バリウム有機酸塩との混合物とを、(c)有機ビヒクル
に分散させてなる積層コンデンサ内部電極用導電性塗料
, 4 チタネート系カップリング剤とバリウム有機酸塩の
どちらか一方が導電性粉末表面に被覆されており他方は
有機ビヒクルに分散している、請求項3記載の積層コン
デンサ内部電極用導電性塗料。 5 チタネート系カップリング剤とバリウム有機酸塩と
の混合物が導電性粉末表面に被覆されている、請求項3
記載の積層コンデンサ内部電極用導電性塗料。[Claims] 1 (a) 100 parts by weight of conductive powder and (b) 0 in terms of metal
.. A conductive paint for internal electrodes of a multilayer capacitor, comprising: 02 to 0.8 parts by weight of a titanate coupling agent dispersed in (c) an organic vehicle. 2. The conductive paint for multilayer capacitor internal electrodes according to claim 1, wherein the titanate coupling agent is coated on the surface of the conductive powder, 3. (a) 100 parts by weight of the conductive powder and (b) 0 parts by weight in terms of metal.
.. 02 to 0.8 parts by weight of a mixture of a titanate coupling agent and a barium organic acid salt, dispersed in (c) an organic vehicle, a conductive paint for internal electrodes of a multilayer capacitor; 4. a titanate coupling agent; 4. The conductive paint for multilayer capacitor internal electrodes according to claim 3, wherein one of the barium organic acid salts is coated on the surface of the conductive powder and the other is dispersed in an organic vehicle. 5. Claim 3, wherein the surface of the conductive powder is coated with a mixture of a titanate coupling agent and a barium organic acid salt.
Conductive paint for internal electrodes of multilayer capacitors as described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63134463A JPH07118429B2 (en) | 1988-06-02 | 1988-06-02 | Conductive paint for internal electrodes of multilayer capacitors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63134463A JPH07118429B2 (en) | 1988-06-02 | 1988-06-02 | Conductive paint for internal electrodes of multilayer capacitors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01304717A true JPH01304717A (en) | 1989-12-08 |
| JPH07118429B2 JPH07118429B2 (en) | 1995-12-18 |
Family
ID=15128917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63134463A Expired - Lifetime JPH07118429B2 (en) | 1988-06-02 | 1988-06-02 | Conductive paint for internal electrodes of multilayer capacitors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07118429B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5372749A (en) * | 1992-02-19 | 1994-12-13 | Beijing Technology Of Printing Research Institute Chinese | Method for surface treating conductive copper powder with a treating agent and coupler |
| US6627120B2 (en) | 2002-02-27 | 2003-09-30 | Murata Manufacturing Co. Ltd. | Conductive paste and laminated ceramic electronic component |
| KR100859058B1 (en) * | 2006-03-31 | 2008-09-17 | 티디케이가부시기가이샤 | Laminated electronic component and method for manufacturing the same |
| WO2013125659A1 (en) * | 2012-02-21 | 2013-08-29 | Jx日鉱日石金属株式会社 | Metal powder paste and method for producing same |
| JP2020111681A (en) * | 2019-01-11 | 2020-07-27 | Jx金属株式会社 | Conductive composition |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58195A (en) * | 1982-05-27 | 1983-01-05 | 太陽誘電株式会社 | Conductive paste for forming conductive layer by baking on porcelain |
| JPS59155989A (en) * | 1983-02-25 | 1984-09-05 | 住友金属鉱山株式会社 | Composition for forming conductive film |
| JPS59155988A (en) * | 1983-02-25 | 1984-09-05 | 住友金属鉱山株式会社 | Method of producing thick film conductive paste |
| JPS62225573A (en) * | 1986-03-28 | 1987-10-03 | Fukuda Metal Foil & Powder Co Ltd | Copper powder for electrically conductive paste |
-
1988
- 1988-06-02 JP JP63134463A patent/JPH07118429B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58195A (en) * | 1982-05-27 | 1983-01-05 | 太陽誘電株式会社 | Conductive paste for forming conductive layer by baking on porcelain |
| JPS59155989A (en) * | 1983-02-25 | 1984-09-05 | 住友金属鉱山株式会社 | Composition for forming conductive film |
| JPS59155988A (en) * | 1983-02-25 | 1984-09-05 | 住友金属鉱山株式会社 | Method of producing thick film conductive paste |
| JPS62225573A (en) * | 1986-03-28 | 1987-10-03 | Fukuda Metal Foil & Powder Co Ltd | Copper powder for electrically conductive paste |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5372749A (en) * | 1992-02-19 | 1994-12-13 | Beijing Technology Of Printing Research Institute Chinese | Method for surface treating conductive copper powder with a treating agent and coupler |
| US6627120B2 (en) | 2002-02-27 | 2003-09-30 | Murata Manufacturing Co. Ltd. | Conductive paste and laminated ceramic electronic component |
| KR100859058B1 (en) * | 2006-03-31 | 2008-09-17 | 티디케이가부시기가이샤 | Laminated electronic component and method for manufacturing the same |
| WO2013125659A1 (en) * | 2012-02-21 | 2013-08-29 | Jx日鉱日石金属株式会社 | Metal powder paste and method for producing same |
| JPWO2013125659A1 (en) * | 2012-02-21 | 2015-07-30 | Jx日鉱日石金属株式会社 | Metal powder paste and method for producing the same |
| JP2020111681A (en) * | 2019-01-11 | 2020-07-27 | Jx金属株式会社 | Conductive composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07118429B2 (en) | 1995-12-18 |
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