JPH01304800A - housing - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a housing used for various audio devices having an operation display or a design panel, such as an in-vehicle audio device or a home audio device. It is related to.

[Conventional technology]

FIGS. 6 and 7 are diagrams showing conventional casings of this type.
In the figure, 1 is an audio circuit board, 2 is a power amplification element with large power consumption attached to the board 1, 3 is a radiator to which the element 2 is attached and is used to dissipate heat from the element 2 to the atmosphere, and 4 is a heat sink. a back structure plate to which the heat sink 3 is screwed;
5 is a front structural plate to which the mounting surface 31 of the radiator 3 is attached with screws 6, 7 is a design panel that is attached to the front structural board 5, and 8 is a separate plate that is housed in the design panel 7 by an appropriate method (not shown). This is a circuit board.

Here, upper and lower lids (not shown) are usually attached to the upper and lower openings to form a box-shaped housing, and the upper and lower lids are generally designed to be removed during assembly and maintenance and inspection.

In this conventional device, the element 2 that amplifies the power of a small signal generates heat, but it is attached to a radiator 3 to prevent the temperature from reaching the element's thermal breakdown temperature, and radiates the heat to the atmosphere. Structural plate 4.5 for internal heat transfer and attached to this
reach. Since the thermal resistance due to direct thermal conduction between metals is smaller than the thermal resistance of the atmosphere, the structural plate 5 is heated to a high temperature close to that of the radiator 3. The substrate 8 housed between the structural board 5 and the design panel 7 receives heat from the structural board 5, but is thermally insulated from the outside air by the design panel 7.
Is the circuit component itself generated? Since the substrate 8 is easily exposed to high temperatures, circuit elements that are sensitive to high temperatures cannot be accommodated in this substrate 8. In addition, the design panel 7 is often touched by human fingers due to its nature as a front panel, but in such cases there are inconveniences such as the design panel 7 feeling hot.

[Problem to be solved by the invention]

Since the conventional casing is constructed as described above, the temperature of the radiator cannot be raised too high, and the temperature of the design panel must be kept low enough so that it does not feel strange to the touch. In addition, it is necessary to increase the size of the heat sink and suppress power consumption to a low level, making it impossible to obtain sufficient audio output and resulting in a large external size. Furthermore, there were other problems such as the design panel feeling warm.

This invention was made in order to solve these problems, and provides a housing for audio equipment, etc., which can keep the design panel at a low temperature and can operate high-power, high-output audio elements to the maximum with a small heatsink. The purpose is to obtain a small body at low cost.

[Means to solve the problem]

The casing according to the present invention includes a heat radiator to which a heating element is attached, and a structural plate attached to the heat radiator via a heat insulating part.

[Effect]

Since the structure in the invention of B is attached to the radiator through the heat insulating part, the heat conduction resistance is large, the structural plate is not heated, and therefore heat is transferred from the structural plate to the outside. Things will disappear.

〔Example〕

An embodiment of the present invention will be described below based on FIGS. 1 to 3.
This is explained below. That is, in FIGS. 1 to 3, 51
32 □ is a mounting part having a mounting screw hole 511 and a protrusion 512 formed by punching out a height A in a part of the structural plate 5; This is a mounting surface having a pair of protrusions 322 having a height B lower than the height A of the mounting portion 51 so as not to contact the structural plate 5 for thermal insulation.

Note that the other configurations are the same as those of the conventional device shown in FIGS. 6 and 7, so the explanation will be omitted.

The heat generated by the element 2 is conducted to the radiator 3 which is screwed in place, and the heat is radiated to the outside air from the surface expanded by the fins of the radiator 3. However, in order to make the audio device compact and have high output, the amount of heat conducted is determined by the temperature. Since it is proportional to the difference, the higher the temperature, the greater the temperature difference with the outside air until the element is not damaged by heat, which lowers the thermal resistance and improves the transmission efficiency. In this case, the heat tries to be transferred to the structural plate 5 which is fixed to the spring, but since the mounting part 51 is formed in a protruding shape to reduce the heat transfer area, it is different from the conventional one in which the entire surface is in contact. Thermal resistance is higher and heat transfer is difficult.

Furthermore, the structural board 5 is a partition plate so as to shade the design panel 7 and the board 8 against heat radiation from mounted components such as the elements 2 on the board 1. , so transmission is prevented.

Therefore, it is possible to set the heat radiator 3, the substrate 1, and the element 2 to arbitrary conditions with good thermal efficiency without affecting the design panel 7 and the substrate 8.

In this embodiment, a part of the structural plate 5 is punched out into a protruding shape as the mounting part 51, but as shown in FIG. By providing this, the heat transfer cross section may be reduced and the mounting shape may be stably maintained.

As shown in FIG. 5, a cylindrical spacer 9 may be inserted separately, or a spacer of an arbitrary shape made of a heat insulating material may be inserted. Further, although a pair of rib-like protrusions 312 are provided on the mounting surface 3 to prevent rotation when screwing, a recessed portion into which the mounting portion 51 fits may be formed on the mounting surface 31. Other fitting methods may also be used. Also, if a jig is used to assist assembly, there is no need for a rotation stopper.

Furthermore, it is better to use a material with a low heat transfer coefficient for the mounting screws instead of metal. Furthermore, although a case with a partition plate and a board is shown, in the case of a case without an operation display section, only the board or both may be insulated and a design panel and a heat sink may be attached.

[Effect of investigation]

As described above, in the case according to the present invention, since the structural plate is attached to the heat radiator through the heat insulating part, the structural plate is not heated and no heat is transmitted from the structural plate to the outside.

[Brief explanation of the drawing]

1 to 3 are views showing one embodiment of the present invention, in which FIG. 1 is a plan view, FIG. 2 is an exploded perspective view of essential parts, FIG. 3 is an exploded side view of essential parts, and FIG. 5 and 5 are views showing other embodiments of the present invention, in which FIG. 4 is an exploded perspective view of essential parts, FIG. 5 is an exploded side view of essential parts, and FIGS. FIG. 6 is a plan view, and FIG. 7 is a fragmented perspective view of the main parts. In the figure, 1.8 is a substrate, 2 is an element, 3 is a heat sink, 4.5 is a structural plate, and 7 is a design panel. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] A housing composed of a heat radiator to which a heating element is attached, and a structural plate attached to the heat radiator via a heat insulating part.