JPH01312432A - Temperature measuring probe and manufacture thereof - Google Patents
Temperature measuring probe and manufacture thereofInfo
- Publication number
- JPH01312432A JPH01312432A JP63141834A JP14183488A JPH01312432A JP H01312432 A JPH01312432 A JP H01312432A JP 63141834 A JP63141834 A JP 63141834A JP 14183488 A JP14183488 A JP 14183488A JP H01312432 A JPH01312432 A JP H01312432A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cap
- metal cap
- temperature
- measuring probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、例えば熱伝導特性を改良した測温用プローブ
及びその製法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to, for example, a temperature measuring probe with improved heat conduction characteristics and a method for manufacturing the same.
[従来の技術]
従来、この種のプローブを用いた人体温測定用の電子゛
体温計においては、感温素子となるサーミスタ素子(以
下、「サーミスタ」という)を先端部位に実装した平面
プリント基板をケース中央部に装着し、熱伝導性ボッテ
ィング材を充填した金属キャップを被冠させたり或はガ
ラス若しくは樹脂で被覆したサーミスタを同様に熱伝導
性ボッティング材で充填した金属キャップをさせること
により体温測定を行っていた。[Prior art] Conventionally, electronic thermometers for measuring human body temperature using this type of probe have a flat printed circuit board with a thermistor element (hereinafter referred to as a "thermistor") as a temperature sensing element mounted on the tip. By attaching it to the center of the case and covering it with a metal cap filled with a thermally conductive botting material, or by covering a thermistor covered with glass or resin with a metal cap filled with a thermally conductive botting material as well. Body temperature was being measured.
[発明が解決しようとする課題]
そこで、従来による測温用プローブの一例を第9図を用
いて説明する。[Problems to be Solved by the Invention] An example of a conventional temperature measuring probe will be described with reference to FIG. 9.
第9図は従来による測温用プローブの構成を示す一部断
面側面図である。第9図において、円筒状に成型された
測温用プローブ100の本体101は先端部に円筒状の
金属キャップ102が被覆されている。金属キャップ1
02により形成される空間部103には本体101のほ
ぼ中心を通るように取り付けられた基板104が延び、
その基板104の先端にサーミスタ105が実装され、
熱伝導性を有したボッティング材106でサーミスタ1
05の位置を固定している。FIG. 9 is a partially sectional side view showing the configuration of a conventional temperature measuring probe. In FIG. 9, a cylindrical body 101 of a temperature measuring probe 100 has a tip covered with a cylindrical metal cap 102. metal cap 1
A substrate 104 attached to the main body 101 extends through the space 103 formed by the main body 101, and
A thermistor 105 is mounted on the tip of the substrate 104,
Thermistor 1 is made of thermally conductive botting material 106.
The position of 05 is fixed.
しかしながら、上述した従来の測温用プローブによれば
、基板に実装されているサーミスタの装着方法では金属
キャップの内壁とサーミスタまでのスペースは熱伝導性
ボッティング材により充填されるため、サーミスタと金
属キャップの内壁までの距離或はボッティング剤の充填
量のばらつき、さらには熱容量が大きくなってしまい結
果的に体温計の熱応答特性が一定にならないという欠点
がある。However, according to the above-mentioned conventional temperature measurement probe, the space between the inner wall of the metal cap and the thermistor is filled with thermally conductive potting material, so the thermistor and the metal There are drawbacks such as variations in the distance to the inner wall of the cap or the amount of botting agent filled, and furthermore, the heat capacity increases, resulting in inconsistent thermal response characteristics of the thermometer.
また、測温用プローブの製造が困難になると、サーミス
タをうまく集熱部分に設置するのが極めて難しいものと
なる。Moreover, if it becomes difficult to manufacture a temperature measuring probe, it becomes extremely difficult to properly install a thermistor in a heat collecting part.
そこで、本発明は上述した従来例の欠点に鑑みてなされ
たものであり、その目的とするところは、例えば電子体
温計として或は電子体温計に用いたときの熱応答特性の
格差或は遅れのない測温用プローブを提供する点にある
。また製造が容易になる測温用プローブの製法を提供す
る点にもある。Therefore, the present invention has been made in view of the above-mentioned drawbacks of the conventional examples, and its purpose is to eliminate disparity or delay in thermal response characteristics when used as, for example, an electronic thermometer or an electronic thermometer. The purpose of the present invention is to provide a temperature measuring probe. Another point is to provide a method for manufacturing a temperature measuring probe that is easy to manufacture.
[課題を解決するための手段]
上述した問題点を解決し、目的を達成するため、本発明
に係わる測温用プローブは、少なくとも先端部位に感温
素子を実装した基板と、前記基板の先端部位を収納する
キャップとを有し、前記キャップを介して熱を前記感温
素子に伝導するように前記先端部位を固定して感温部を
形成した測温用プローブにおいて、前記基板は先端部位
上の感温素子を前記キャップの内側面に押し当てた状態
に付勢していることを特徴とする。[Means for Solving the Problems] In order to solve the above-mentioned problems and achieve the purpose, a temperature measuring probe according to the present invention includes a substrate on which a temperature sensing element is mounted at least at the tip portion, and a tip portion of the substrate. In the temperature measuring probe, the temperature sensing probe has a cap for accommodating the tip portion, and the temperature sensing portion is formed by fixing the tip portion so as to conduct heat to the temperature sensing element through the cap. It is characterized in that the upper temperature sensing element is biased against the inner surface of the cap.
また、好ましくは、前記基板の先端部位を前記キャップ
の内側面に押し当てる方向に向ける案内部材をプローブ
本体内部に有することを特徴とする。Preferably, the probe body is characterized by including a guide member inside the probe body that directs the tip end portion of the substrate in a direction to press it against the inner surface of the cap.
また、好ましくは、基板は、先端部位が予め湾曲された
ものであることを特徴とする。Preferably, the substrate is characterized in that the tip portion is curved in advance.
また、好ましくは、中空状に設けたプローブ本体の後方
から基板を挿入する工程と、前記基板の先端部位上の感
温素子をキャップの内側面に内接可能な位置まで移動さ
せ、所定位置に基板を位置決めする工程と、前記キャッ
プの内側面に前記感温素子を押し当てるように該キャッ
プを取り付ける工程とを含む製法を特徴とする。Preferably, the step of inserting the substrate from the rear of the hollow probe body, moving the temperature sensing element on the tip of the substrate to a position where it can be inscribed on the inner surface of the cap, and fixing it in a predetermined position. The method is characterized by a manufacturing method including a step of positioning a substrate, and a step of attaching the cap so as to press the temperature sensing element against the inner surface of the cap.
[作用]
以上の構成によれば、基板に実装した感温素子をキャッ
プの内側面に押し当てるので感温素子に伝わる熱の伝導
を速め、良好な熱伝導特性を得ることができる。また製
造時においては、キャップの内側面に感温素子を容易に
押し当てることができる。[Function] According to the above configuration, since the temperature sensing element mounted on the substrate is pressed against the inner surface of the cap, the conduction of heat to the temperature sensing element is accelerated, and good heat conduction characteristics can be obtained. Further, during manufacturing, the temperature sensing element can be easily pressed against the inner surface of the cap.
[実施例]
以下添付図面を参照して、本発明に係る好適な実施例を
詳細に説明する。[Embodiments] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
第1図は本実施例による測温用プローブの構成を示す一
部断面側面図、第2図は第1図による測温用プローブの
A−A線断面図である。第1図、第2図において、円筒
状の測温用プローブ1の本体2の先端部2aには先細で
且つ伝導率の高いステンレス製の金属キャップ3が被冠
され、本体2内部を密閉している。この測温用プローブ
1は電子体温計本体(図示せず)に脱着自在とする。FIG. 1 is a partially sectional side view showing the structure of the temperature measuring probe according to this embodiment, and FIG. 2 is a sectional view taken along line A--A of the temperature measuring probe according to FIG. 1 and 2, the tip 2a of the main body 2 of the cylindrical temperature measuring probe 1 is covered with a tapered metal cap 3 made of stainless steel with high conductivity to seal the inside of the main body 2. ing. The temperature measuring probe 1 is detachably attached to an electronic thermometer main body (not shown).
本体2に設けた空間部4において、はぼ中心を通るよう
に可撓性を有する基板5を本体2の後方2bより挿入し
て取り付けている。基板5の先端部位5aには感温部材
となるサーミスタ6を実装している。この基板5はポリ
イミドフィルムで作成されている0本体2の空間部4に
おいては基板5を第1図の矢印S方向に案内する突条の
案内リブ7.8を突出させて設けている。この案内リブ
7.8は第2図の如く、上部に2つ、下部に3つ有して
いる。金属キャップ3を先端部2aに被冠させるときに
は、まず基板2の先端部位2aを本体2後方より挿入し
、挿入が進むと同時に案内リブ7.8に案内され、丁度
、案内リブ7.8に挟まれる空間部4の位置4aで屈曲
する。このようにして本体2より外方に露出した矢印S
方向に延びる基板5の先端部位5aには、更に熱伝導性
を有したアルミフィラー入りのボッティング材9を塗布
し、この塗布状態で本体2の先端部2aに金属キャップ
3を被せていくのである。ここで、サーミスタ6には周
囲にのみボッティング材9を塗布する。In a space 4 provided in the main body 2, a flexible substrate 5 is inserted and attached from the rear 2b of the main body 2 so as to pass through the center of the dowel. A thermistor 6 serving as a temperature-sensitive member is mounted on the tip end portion 5a of the substrate 5. This substrate 5 is provided with protruding guide ribs 7.8 for guiding the substrate 5 in the direction of arrow S in FIG. 1 in the space 4 of the main body 2 made of polyimide film. As shown in FIG. 2, there are two guide ribs 7.8 at the top and three at the bottom. When the metal cap 3 is placed on the distal end portion 2a, the distal end portion 2a of the substrate 2 is first inserted from the rear of the main body 2, and as the insertion progresses, it is guided by the guide ribs 7.8, and the metal cap 3 is guided by the guide ribs 7.8. It is bent at the position 4a of the sandwiched space 4. The arrow S exposed outward from the main body 2 in this way
A botting material 9 containing thermally conductive aluminum filler is further applied to the tip portion 5a of the substrate 5 extending in the direction, and the metal cap 3 is placed over the tip portion 2a of the main body 2 in this coated state. be. Here, the botting material 9 is applied only to the periphery of the thermistor 6.
そして、上述した被冠工程では、金属キャップ3の形状
が先細であるため、矢印S方向延びる基板5の先端部位
5aはサーミスタ6を金属キャップ3の内側面に内接さ
せ、摺動させて被せていくことになり、可撓性及び柔軟
性を有する基板5は本体2の空間部2aで屈曲したとき
の曲がる向きとは逆の向きに曲がる。ここで、基板5の
先端部位5aは金属キャップ3を第1図の矢印Tの示す
方向に被冠させていくに従って、矢印Uの示す方向に付
勢を増加し、これにより被冠完了時にはサーミスタ6が
金属キャップ3に当接した状態に達する。In the above-mentioned capping step, since the shape of the metal cap 3 is tapered, the thermistor 6 is inscribed in the inner surface of the metal cap 3 at the tip end portion 5a of the substrate 5 extending in the direction of the arrow S, and the thermistor 6 is slid and covered. As a result, the flexible and pliable substrate 5 bends in the opposite direction to the bending direction when bent in the space 2a of the main body 2. Here, as the tip portion 5a of the substrate 5 is capped with the metal cap 3 in the direction shown by the arrow T in FIG. 6 reaches the state where it is in contact with the metal cap 3.
このようにして、本体2に金属キャップ3を被冠させ、
基板5の外部への露出方向を変化させることで、基板5
に実装したサーミスタ6は金属キャップ3との間に何も
介することなく、直接に内接する。In this way, the main body 2 is covered with the metal cap 3,
By changing the direction in which the substrate 5 is exposed to the outside, the substrate 5 can be
The thermistor 6 mounted on the metal cap 3 is directly inscribed with the metal cap 3 without any interposition.
上述の説明において、基板5を本体2に挿入するときの
方法については省略したが、これは、例えば不図示の本
体2の後部に穴を設け、この穴より基板5を挿入すれば
良い、また基板5を本体2に固定する方法においては公
知技術を用いることにする。In the above explanation, the method for inserting the board 5 into the main body 2 has been omitted, but this can be done, for example, by providing a hole at the rear of the main body 2 (not shown) and inserting the board 5 through this hole. A known technique will be used to fix the substrate 5 to the main body 2.
更に、基板5の先端部位5aにボッティング材9を塗布
するが、金属キャップ3の内面に内接するサーミスタ6
の内接面に若干のボッティング材9が塗布されても、極
微少量なため、ここでは電子体温計の出力する体温の値
には影響がほとんどでないものとする。Further, a botting material 9 is applied to the tip end portion 5a of the substrate 5, and the thermistor 6 inscribed in the inner surface of the metal cap 3
Even if a small amount of the botting material 9 is applied to the inscribed surface of the electronic thermometer, it is assumed here that it has little effect on the body temperature value output by the electronic thermometer because it is a very small amount.
また、空間部4において、案内リブ7.8の形成する案
内路1oに基板2の先端部位2aを挿入するときに、基
板5をスムーズに案内するため、案内リブ7においては
、案内路10の入口側に、第1図の如く、傾斜面7aを
設ければ良い。In addition, in order to smoothly guide the substrate 5 when inserting the tip end portion 2a of the substrate 2 into the guide path 1o formed by the guide ribs 7.8 in the space 4, the guide ribs 7 are provided with a guide path 10. As shown in FIG. 1, an inclined surface 7a may be provided on the entrance side.
以上の説明により本実施例によれば、プローブによる熱
応答特性の格差を減少し、体温測定時の体温を迅速に出
力できるように機能する測温用プローブを提供してくれ
る。また製造工程では容易にサーミスタを集熱体となる
キャップの内側面に押し当てて内接させることができる
ので製造が容易であると共に、量産に適する。As described above, the present embodiment provides a temperature measuring probe that functions to reduce differences in thermal response characteristics between probes and quickly output body temperature when measuring body temperature. Further, in the manufacturing process, the thermistor can be easily pressed against the inner surface of the cap, which serves as a heat collector, so that it is inscribed therein, so that manufacturing is easy and it is suitable for mass production.
さて、第2図に示した案内リブ7.8の数は本発明の主
旨を逸脱しない範囲であれば、これに限定されるもので
はなく、またリブの形状も上部下部共に一つだけ配設し
ても良い。Now, the number of guide ribs 7 and 8 shown in FIG. You may do so.
次に、上述した実施例の測温用プローブ本体及び案内リ
ブを変形した第1.第2の変形例を第3図、第4図を用
いて説明する。Next, a first example in which the temperature measurement probe body and guide rib of the above-mentioned example were modified. A second modification will be explained using FIGS. 3 and 4.
第3図は第1の変形例を示す一部断面側面図である。第
1の変形例では案内リブを本体とは別部材から構成し、
第3図の如く、本体20の先端部分20aに金属キャッ
プ(図示せず)を被冠させるフランジ部21を設け、こ
のフランジ部21の内面21aに前述の実施例で述べた
案内リブと同形状、同数の別部材から成る案内リブ22
,23を取り付け、基板(図示せず)をまず本体2oの
後方より挿入し、空間部24を通して、図中の矢印■の
示す方向に案内する。ここでも、金属キャップの内側面
に対して基板の付勢でサーミスタを押し当てることがで
きる。FIG. 3 is a partially sectional side view showing the first modification. In the first modification, the guide rib is constructed from a separate member from the main body,
As shown in FIG. 3, a flange portion 21 is provided on the tip portion 20a of the main body 20 to be covered with a metal cap (not shown), and the inner surface 21a of this flange portion 21 has the same shape as the guide rib described in the previous embodiment. , guide ribs 22 made of the same number of separate members.
, 23 are attached, and a board (not shown) is first inserted from the rear of the main body 2o and guided through the space 24 in the direction indicated by the arrow ■ in the figure. Here, too, the thermistor can be pressed against the inner surface of the metal cap by the bias of the substrate.
このように、第1の変形例でも前述の実施例と同様の作
用・効果を得ることができる。In this way, the first modified example can also provide the same functions and effects as those of the above-mentioned embodiment.
また、第4図は第2の変形例を示す一部断面側面図であ
る。第2の変形例では第4図の如く、本体30の先端部
分30aにおいて、前述の案内リブのように緩やかな傾
斜面に替えて、第4図の如く、突起状の案内リブ32を
設け、この案内リブ32に基板(図示せず)を案内させ
てもよい。この場合には、図中の矢印Wの示す方向に不
図示の基板を案内して露出させることができる。Moreover, FIG. 4 is a partially sectional side view showing a second modification. In a second modification, a protruding guide rib 32 is provided at the tip portion 30a of the main body 30, as shown in FIG. 4, instead of a gentle slope like the guide rib described above. A substrate (not shown) may be guided by the guide ribs 32. In this case, the substrate (not shown) can be exposed by guiding it in the direction indicated by the arrow W in the figure.
このように、第2の変形例でも前述の実施例と同様の作
用・効果を得ることができる。In this way, the second modified example can also provide the same functions and effects as those of the above-described embodiment.
次に、上述した実施例の基板を変形した第3の変形例を
第5図を用いて説明する。Next, a third modification of the substrate of the above-described embodiment will be described with reference to FIG. 5.
第5図は第3の変形例による基板の構成を示す概略側面
図、第6図は第3の変形例を示す一部断面側面図である
。第5図において、可撓性を有すと共に、ポリイミドフ
ィルムで作成されている基板40は先端部位40aの位
置に前述したサーミスタ6を実装し、更に前述の基板5
が金属キャップ3を被冠させたときに屈曲した位置に該
当する部分を屈曲させて屈曲部41.42を予め設けて
いる。FIG. 5 is a schematic side view showing the configuration of a substrate according to a third modification, and FIG. 6 is a partially sectional side view showing the third modification. In FIG. 5, a flexible substrate 40 made of polyimide film has the thermistor 6 described above mounted at the tip portion 40a, and the substrate 5
Bent portions 41 and 42 are provided in advance by bending portions corresponding to the bent positions when the metal cap 3 is placed on the metal cap 3.
そこで、基板40を第1図に示す測温用プローブ1と基
板のみを入れ替えた状態の構成を説明する。Therefore, a configuration in which only the substrate 40 is replaced with the temperature measuring probe 1 shown in FIG. 1 will be described.
第6図によれば、第1図で説明したときの基板5の屈曲
した部分に屈曲部41.42が丁度、位置する。According to FIG. 6, the bent portions 41 and 42 are located exactly at the bent portions of the substrate 5 as described in FIG.
このように、第3の変形例を用いても多少、基板40の
先端部位40aによる金属キャップ3の内面への付勢が
減少するが、測温用プローブの組み立てが容易になり、
前述の実施例と同様の作用・効果を得ることができる。In this way, even if the third modification is used, the force applied to the inner surface of the metal cap 3 by the tip portion 40a of the substrate 40 is reduced to some extent, but the assembly of the temperature measuring probe becomes easier.
It is possible to obtain the same functions and effects as those of the above-mentioned embodiments.
さて、上述した実施例及び第1〜第3の実施例では案内
リブを本体に設けていたが、本発明はこれに限定される
ことはなく、本発明の主旨を逸脱しない範囲であれば、
金属キャップに案内リブを設けても良い。Now, in the above-mentioned embodiments and the first to third embodiments, guide ribs were provided on the main body, but the present invention is not limited to this, and as long as it does not depart from the gist of the present invention,
A guide rib may be provided on the metal cap.
そこで、第4の変形例を第7図、第8図を用いて説明す
る。Therefore, a fourth modification will be explained using FIGS. 7 and 8.
第7図は第4の変形例を示す一部断面側面図、第8図は
第4の変形例による案内リブ部材の構成を示す外観斜視
図である。FIG. 7 is a partially sectional side view showing a fourth modification, and FIG. 8 is an external perspective view showing the configuration of a guide rib member according to the fourth modification.
第7図において、第1図に示す測温用プローブ1と同様
に円筒状に設けられた測温用プローブ50は、案内リブ
を有していない本体51に基板5と同様の構成から成り
且つサーミスタ6と同様の感温機能を有するサーミスタ
52を先端部位に実装した基板53を内設し、基板53
の外部に露出する先端部位53aは本体51の中心線に
沿って延びる。金属キャップ54は金属キャップ3と同
様の構成から成り、第8図の如く、別部材から成る環状
の案内リブ部材55を内部に取り付けている。この案内
リブ部材55は第8図中の矢印Xの示す方向に末広がり
であると共にそれぞれの端部55a、55bを矢印X方
向に突出するように湾曲させて基板53の案内面56を
形成している。In FIG. 7, a temperature measuring probe 50, which is provided in a cylindrical shape similar to the temperature measuring probe 1 shown in FIG. A board 53 having a thermistor 52 having a temperature sensing function similar to the thermistor 6 mounted on the tip part is installed inside the board 53.
The distal end portion 53a exposed to the outside extends along the center line of the main body 51. The metal cap 54 has the same structure as the metal cap 3, and as shown in FIG. 8, an annular guide rib member 55 made of a separate member is attached inside. The guide rib member 55 widens toward the end in the direction indicated by the arrow X in FIG. There is.
そこで、金属キャップ54を本体51の先端部に被冠さ
せるまえに、前述の実施例と同様に基板53の先端部位
53aにボッティング材9と同様の材質から成るボッテ
ィング材57を塗布してから被冠する。この場合、案内
リブ部材55の案内面56が金属キャップ54内に挿入
される先端部位53aの方向を本体51の中心線より第
7図の如く、上方に傾斜させ、更に被冠量を増加させる
とサーミスタ52は金属キャップ54の内面に内接する
。このようにして完全に金属キャップ54を被冠させる
と前述の実施例と同様に基板53に2箇所の屈曲部58
.59が形成され、基板53の付勢により確実にサーミ
スタ52を金属キャップ54の内面に当接させることが
できる。Therefore, before the metal cap 54 is placed on the tip of the main body 51, a botting material 57 made of the same material as the botting material 9 is applied to the tip portion 53a of the substrate 53 as in the previous embodiment. crowned from In this case, the guide surface 56 of the guide rib member 55 tilts the direction of the distal end portion 53a inserted into the metal cap 54 upward from the center line of the main body 51 as shown in FIG. 7, thereby further increasing the amount of crown coverage. The thermistor 52 is inscribed in the inner surface of the metal cap 54. When the metal cap 54 is completely covered in this manner, two bent portions 58 are formed on the substrate 53 as in the previous embodiment.
.. 59 is formed, and the thermistor 52 can be reliably brought into contact with the inner surface of the metal cap 54 by the biasing of the substrate 53.
以上の説明により第4の変形例でも前述の実施例と同様
の作用・効果を得ることができる。According to the above explanation, the same operations and effects as those of the above-mentioned embodiment can be obtained in the fourth modification.
[発明の効果]
以上の説明により本発明によれば、プローブによる熱応
答特性の格差を減少し、体温測定時の体温を迅速に出力
できるように機能し、また製造時には容易に感温部を集
熱体となるキャップの内側面に押し当てて内接させるこ
とができるので、製造が容易になる。[Effects of the Invention] As described above, according to the present invention, the disparity in thermal response characteristics between probes is reduced, the body temperature can be quickly output when measuring body temperature, and the temperature sensing part can be easily removed during manufacturing. Since it can be pressed against and inscribed on the inner surface of the cap that serves as a heat collector, manufacturing is facilitated.
例えば、プローブ本体内部に設けた案内部材がキャップ
の内側面への方向ずけを容易に行ってくれる。或は予め
先端部位を湾曲しである基板を用いれば、簡単な構成に
より、容易にキャップの内側面に感温素子を押し当てる
ことができる。For example, a guide member provided within the probe body facilitates orientation of the cap toward the inner surface. Alternatively, by using a substrate whose tip portion is curved in advance, the temperature sensing element can be easily pressed against the inner surface of the cap with a simple configuration.
第1図は本実施例による測温用プローブの構成を示す一
部断面側面図、
第2図は第1図による測温用プローブのA−A線断面図
、
第3図は第1の変形例を示す一部断面側面図、第4図は
第2の変形例を示す一部断面側面図、第5図は第3の変
形例による基板の構成を示す概略側面図、
第6図は第3の変形例を示す一部断面側面図、第7図は
第4の変形例を示す一部断面側面図、第8図は第4の変
形例による案内リブ部材の構成を示す外観斜視図、
第9図は従来による測温用プローブの構成を示す一部断
面側面図である。
図中、1.1’ 、50,100−・・測温用フローブ
、2,20,51,101・・・本体、2a。
20 a−先端部、2 b ・・・後部、3,54゜1
02・・・金属製キャップ、4,24,31,103・
・・空間部、5,40,53,104・・・基板、5a
、40a、53a・・・先端部位、6..52゜105
・・・サーミスタ、7,8,22.23゜32・・・案
内リブ、7a・・・傾斜面、9,57゜106・・・ボ
ッティング材、21・・・フランジ部、22・・・内面
、30a・・・先端部分、41,42゜58.59・・
・屈曲部、55・・・案内リブ部材、55a、55b・
・・先端、56・・・案内面である。
第3図Fig. 1 is a partially sectional side view showing the configuration of the temperature measuring probe according to this embodiment, Fig. 2 is a sectional view taken along line A-A of the temperature measuring probe according to Fig. 1, and Fig. 3 is the first modification. FIG. 4 is a partial cross-sectional side view showing an example; FIG. 4 is a partial cross-sectional side view showing a second modification; FIG. 5 is a schematic side view showing the configuration of a substrate according to a third modification; FIG. 7 is a partial cross-sectional side view showing a fourth modification; FIG. 8 is an external perspective view showing the configuration of a guide rib member according to the fourth modification. FIG. 9 is a partially sectional side view showing the configuration of a conventional temperature measuring probe. In the figure, 1.1', 50, 100-- Temperature measurement flow probe, 2, 20, 51, 101-- Main body, 2a. 20 a-tip, 2 b...rear, 3,54°1
02...Metal cap, 4, 24, 31, 103.
...Space part, 5, 40, 53, 104...Substrate, 5a
, 40a, 53a... tip portion, 6. .. 52°105
...Thermistor, 7,8,22.23°32...Guide rib, 7a...Slope, 9,57°106...Botting material, 21...Flange part, 22... Inner surface, 30a... Tip part, 41, 42° 58.59...
・Bending portion, 55...Guiding rib member, 55a, 55b・
... Tip, 56 ... Guide surface. Figure 3
Claims (4)
、前記基板の先端部位を収納するキャップとを有し、前
記キャップを介して熱を前記感温素子に伝導するように
前記先端部位を固定して感温部を形成した測温用プロー
ブにおいて、 前記基板は先端部位上の感温素子を前記キャップの内側
面に押し当てた状態に付勢していることを特徴とする測
温用プローブ。(1) It has a substrate on which a temperature sensing element is mounted at least at the tip portion, and a cap that houses the tip portion of the substrate, and the tip portion is configured to conduct heat to the temperature sensing element through the cap. A temperature measuring probe having a fixed temperature sensing portion, wherein the substrate biases the temperature sensing element on the tip portion against the inner surface of the cap. probe.
し当てる方向に向ける案内部材をプローブ本体内部に有
することを特徴とする請求項1記載の測温用プローブ。(2) The temperature measuring probe according to claim 1, further comprising a guide member inside the probe body that directs the tip portion of the substrate in a direction to press it against the inner surface of the cap.
とを特徴とする請求項1記載の測温用プローブ。(3) The temperature measuring probe according to claim 1, wherein the substrate has a tip portion curved in advance.
入する工程と、前記基板の先端部位上の感温素子をキャ
ップの内側面に内接可能な位置まで移動させ、所定位置
に基板を位置決めする工程と、前記キャップの内側面に
前記感温素子を押し当てるように該キャップを取り付け
る工程とを含むことを特徴とする測温用プローブの製法
。(4) Inserting the substrate from the rear of the hollow probe body, moving the temperature sensing element on the tip of the substrate to a position where it can be inscribed on the inner surface of the cap, and inserting the substrate into the predetermined position. A method for manufacturing a temperature measuring probe, comprising the steps of: positioning; and attaching the cap so as to press the temperature sensing element against the inner surface of the cap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63141834A JPH01312432A (en) | 1988-06-10 | 1988-06-10 | Temperature measuring probe and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63141834A JPH01312432A (en) | 1988-06-10 | 1988-06-10 | Temperature measuring probe and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01312432A true JPH01312432A (en) | 1989-12-18 |
Family
ID=15301223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63141834A Pending JPH01312432A (en) | 1988-06-10 | 1988-06-10 | Temperature measuring probe and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01312432A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6419388B2 (en) | 1998-10-09 | 2002-07-16 | Microlife Intellectual Property Gmbh | Medical thermometer |
| WO2006035585A1 (en) * | 2004-09-29 | 2006-04-06 | Citizen Watch Co., Ltd. | Electronic clinical thermometer and method of producing the same |
| JP2006098180A (en) * | 2004-09-29 | 2006-04-13 | Citizen Watch Co Ltd | Manufacturing method for electronic clinical thermometer |
| JP2006098179A (en) * | 2004-09-29 | 2006-04-13 | Citizen Watch Co Ltd | Electronic clinical thermometer |
| JP2007120963A (en) * | 2005-10-25 | 2007-05-17 | Omron Healthcare Co Ltd | Electronic clinical thermometer |
| US20100091817A1 (en) * | 2007-03-01 | 2010-04-15 | Heraeus Sensor Technology Gmbh | Turbocharger Protection Device |
| US7806587B2 (en) | 2004-09-29 | 2010-10-05 | Citizen Holdings Co., Ltd. | Electronic clinical thermometer and method of producing the same |
| US7988355B2 (en) * | 2005-11-03 | 2011-08-02 | Tyco Healthcare Group Lp | Electronic thermometer with flex circuit location |
| US9313910B2 (en) | 2007-05-22 | 2016-04-12 | Covidien Lp | Multiple configuration electronic thermometer |
| US9453768B2 (en) | 2007-12-31 | 2016-09-27 | Covidien Ag | Method of making a molded thermometer probe component |
| US10309839B2 (en) | 2014-07-17 | 2019-06-04 | Denso Corporation | Temperature sensor |
-
1988
- 1988-06-10 JP JP63141834A patent/JPH01312432A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6419388B2 (en) | 1998-10-09 | 2002-07-16 | Microlife Intellectual Property Gmbh | Medical thermometer |
| US7806587B2 (en) | 2004-09-29 | 2010-10-05 | Citizen Holdings Co., Ltd. | Electronic clinical thermometer and method of producing the same |
| JP2006098180A (en) * | 2004-09-29 | 2006-04-13 | Citizen Watch Co Ltd | Manufacturing method for electronic clinical thermometer |
| JP2006098179A (en) * | 2004-09-29 | 2006-04-13 | Citizen Watch Co Ltd | Electronic clinical thermometer |
| WO2006035585A1 (en) * | 2004-09-29 | 2006-04-06 | Citizen Watch Co., Ltd. | Electronic clinical thermometer and method of producing the same |
| JP2007120963A (en) * | 2005-10-25 | 2007-05-17 | Omron Healthcare Co Ltd | Electronic clinical thermometer |
| EP1950543A4 (en) * | 2005-10-25 | 2013-12-18 | Omron Healthcare Co Ltd | Electronic thermometer |
| US7988355B2 (en) * | 2005-11-03 | 2011-08-02 | Tyco Healthcare Group Lp | Electronic thermometer with flex circuit location |
| US20100091817A1 (en) * | 2007-03-01 | 2010-04-15 | Heraeus Sensor Technology Gmbh | Turbocharger Protection Device |
| US8328419B2 (en) * | 2007-03-01 | 2012-12-11 | Heraeus Sensor Technology Gmbh | Turbocharger protection device |
| US9313910B2 (en) | 2007-05-22 | 2016-04-12 | Covidien Lp | Multiple configuration electronic thermometer |
| US9453768B2 (en) | 2007-12-31 | 2016-09-27 | Covidien Ag | Method of making a molded thermometer probe component |
| US10309839B2 (en) | 2014-07-17 | 2019-06-04 | Denso Corporation | Temperature sensor |
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