JPH0195174A - Adhesive curable by microwave heating - Google Patents
Adhesive curable by microwave heatingInfo
- Publication number
- JPH0195174A JPH0195174A JP25074887A JP25074887A JPH0195174A JP H0195174 A JPH0195174 A JP H0195174A JP 25074887 A JP25074887 A JP 25074887A JP 25074887 A JP25074887 A JP 25074887A JP H0195174 A JPH0195174 A JP H0195174A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- microwave heating
- conductive particles
- particles
- acid salt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 26
- 239000000853 adhesive Substances 0.000 title claims abstract description 25
- 238000010438 heat treatment Methods 0.000 title claims abstract description 12
- 239000002245 particle Substances 0.000 claims abstract description 19
- 239000002253 acid Substances 0.000 claims abstract description 14
- 150000003839 salts Chemical class 0.000 claims abstract description 13
- 229920000642 polymer Polymers 0.000 claims abstract description 12
- 239000006249 magnetic particle Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 4
- 239000006229 carbon black Substances 0.000 claims abstract description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 3
- 239000010937 tungsten Substances 0.000 claims abstract description 3
- 238000001723 curing Methods 0.000 claims description 7
- 239000004838 Heat curing adhesive Substances 0.000 claims description 4
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 3
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims description 2
- 238000013007 heat curing Methods 0.000 claims description 2
- 150000007942 carboxylates Chemical group 0.000 abstract 1
- 238000010008 shearing Methods 0.000 abstract 1
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 125000000542 sulfonic acid group Chemical group 0.000 description 3
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 125000002843 carboxylic acid group Chemical group 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- -1 poly(ethylene sulfonic acid) Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- XHIOOWRNEXFQFM-UHFFFAOYSA-N ethyl prop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(=O)C=C XHIOOWRNEXFQFM-UHFFFAOYSA-N 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 1
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 1
- 239000005043 ethylene-methyl acrylate Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- MYSWGNHLJGOCPT-UHFFFAOYSA-N methyl prop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C=C MYSWGNHLJGOCPT-UHFFFAOYSA-N 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920006027 ternary co-polymer Polymers 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、マイクロ波加熱硬化用接着剤に関する。更に
詳しくは、接着部の引張せん断強度を向上せしめるマイ
クロ波加熱硬化用接着剤に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an adhesive for microwave heating curing. More specifically, the present invention relates to a microwave heat curing adhesive that improves the tensile shear strength of the bonded portion.
マイクロ波によって加熱硬化せしめる接着剤としては、
誘電損失の大きいことが必要である。即ち、マイクロ波
加熱の利点は、通常の加熱方法とは異なり、誘電損失の
大きいものだけを加熱することができ、従ってエネルギ
ー損失の少ないことにある。また、内部から発熱するた
め、熱勾配による硬化の不均一性ということもない。Adhesives that can be heated and cured using microwaves include:
It is necessary to have a large dielectric loss. That is, the advantage of microwave heating is that, unlike normal heating methods, it is possible to heat only those materials with large dielectric loss, and therefore there is little energy loss. Furthermore, since heat is generated from within, there is no possibility of non-uniform curing due to thermal gradients.
しかるに、通常用いられている加熱硬化型接着剤は、一
般に誘電率が低く、誘電損失も低いため、マイクロ波加
熱の場合には、エネルギー効率があまり上がっていない
という問題がある。However, commonly used thermosetting adhesives generally have a low dielectric constant and low dielectric loss, so there is a problem in that energy efficiency is not very high when using microwave heating.
そこで本発明者らは、接着剤本来の接着強度を低下させ
ない範囲内で、誘電損失を大きくする物質を添加するこ
とにより、従来の加熱硬化型接着剤をマイクロ波加熱硬
化用として改質することを図り、この問題を解決するこ
とに成功した。Therefore, the present inventors attempted to modify conventional heat-curing adhesives for microwave heat-curing by adding a substance that increases dielectric loss within a range that does not reduce the adhesive's original adhesive strength. We succeeded in solving this problem.
従って、本発明はマイクロ波加熱硬化用接着剤に係り、
この接着剤は、加熱硬化型接着剤に、高分子酸塩、導電
性粒子または磁性粒子を分散させてなる。Therefore, the present invention relates to an adhesive for microwave heating curing,
This adhesive is made by dispersing a polymeric acid salt, conductive particles, or magnetic particles in a thermosetting adhesive.
加熱硬化型接着剤としては、アミノ樹脂、フェノール樹
脂、キシレン樹脂、エポキシ樹脂、ポリイソシアネート
系樹脂、不飽和ポリエステル樹脂５アクリル樹脂など、
任意の熱硬化性樹脂が用いられる。Examples of heat-curable adhesives include amino resins, phenolic resins, xylene resins, epoxy resins, polyisocyanate resins, unsaturated polyester resins, acrylic resins, etc.
Any thermosetting resin can be used.
高分子酸塩としては、側鎖にカルボン酸金属塩基または
スルホン酸金属塩基を結合させている重合体が用いられ
る。As the polymeric acid salt, a polymer having a carboxylic acid metal base or a sulfonic acid metal base bonded to its side chain is used.
側鎖にカルボン酸基を有する重合体としては、例えばポ
リアクリル酸１、エチレン−アクリル酸共重合体、エチ
レン−メタクリル酸共重合体、アクリル酸メチル−アク
リル酸共重合体、エチレン−アクリル酸メチル−アクリ
ル酸３元共重合体、アクリル酸エチル−アクリル酸共重
合体などが挙げられ、カルボン酸基含有単量体は重合体
中１００〜３０モル対の割合で用いられる。Examples of polymers having carboxylic acid groups in side chains include polyacrylic acid 1, ethylene-acrylic acid copolymer, ethylene-methacrylic acid copolymer, methyl acrylate-acrylic acid copolymer, and ethylene-methyl acrylate. -acrylic acid ternary copolymer, ethyl acrylate-acrylic acid copolymer, etc., and the carboxylic acid group-containing monomer is used in a ratio of 100 to 30 mole pairs in the polymer.
また、スルホン酸基を有する重合体としては。Also, as a polymer having a sulfonic acid group.
例えばポリ（エチレンスルホン酸）、ポリ（ρ−スチレ
ンスルホン酸）、スチレン−ｐ−スチレンスルホン酸共
重合体、ポリ（プロピレンスルホン酸）、アクリル酸メ
チル−プロピレンスルホン酸共重合体などが挙げられ、
スルホン酸基含有単量体は重合体中１００〜３０モル％
の割合で用いられる。Examples include poly(ethylene sulfonic acid), poly(ρ-styrene sulfonic acid), styrene-p-styrene sulfonic acid copolymer, poly(propylene sulfonic acid), methyl acrylate-propylene sulfonic acid copolymer, etc.
The sulfonic acid group-containing monomer is 100 to 30 mol% in the polymer.
used at a rate of
これらの重合体の側鎖カルボン酸基またはスルホン酸基
は、リチウム、ナトリウム、カリウムなどのアルカリ金
属、カルシウム、マグネシウム、亜鉛などのアルカリ土
類金属、鉄、コバルト、銅、ニッケルなどの遷移金属な
どによって塩を形成せしめて用いられる。塩の形成は、
一般に高分子酸の約０．１〜２０％水溶液と酸に当量の
全屈水酸化物とを混合し、中和することにより行われる
。The side chain carboxylic acid or sulfonic acid groups of these polymers include alkali metals such as lithium, sodium, and potassium, alkaline earth metals such as calcium, magnesium, and zinc, and transition metals such as iron, cobalt, copper, and nickel. It is used by forming a salt. The formation of salt is
Generally, this is carried out by mixing an approximately 0.1 to 20% aqueous solution of a polymeric acid and an equivalent amount of total hydroxide to the acid and neutralizing the mixture.
導電性粒子としては、カーボンブラック、カーボン繊維
、金属粉末、金属フレーク、金属繊維などが用いられ、
また磁性粒子としてはフェライト、カルボニル鉄などが
用いられる。これらの粒子は、サブミクロンオーダーの
大きさであることが必要である。それは、接着層自体が
通常数〜数１０μｍ程度の厚みしか有しないため、ミク
ロンオーダーの粒子を用いると深刻な接着強度の低下を
もたらすからである。そのため、これらの粒子の粒径と
しては、約０．０１〜１．０μｍのものが好んで用いら
れる。As the conductive particles, carbon black, carbon fiber, metal powder, metal flake, metal fiber, etc. are used.
Further, as the magnetic particles, ferrite, carbonyl iron, etc. are used. These particles need to be on the order of submicrons. This is because the adhesive layer itself usually has a thickness of only a few to several tens of micrometers, so the use of micron-order particles would seriously reduce the adhesive strength. Therefore, the particle size of these particles is preferably about 0.01 to 1.0 μm.
高分子酸塩またはこれらの粒子は、約１〜５０体積％、
好ましくは約１０〜２０体積２となるような割合で用い
られる。これらの粒子を導電性付与や磁性付与のために
用いる場合には、樹脂に対して数１０〜数１００％混入
する必要があるが、加熱することを目的としている本発
明接着剤の場合には、このように多量に混入する必要は
なく、このような量で混入するとかえって接着性の低下
を招くようになる。これらのものの加熱硬化型接着剤へ
の分散は、一般に混練法によって行われるが、混線法が
適用できない場合には溶剤法なども用いられる。The polymeric acid salts or particles thereof are about 1 to 50% by volume,
It is preferably used in a proportion of about 10 to 20 volumes. When these particles are used to impart conductivity or magnetism, it is necessary to mix several tens to several hundred percent of the resin, but in the case of the adhesive of the present invention that is intended for heating, It is not necessary to mix in such a large amount; if it is mixed in in such a large amount, it will actually cause a decrease in adhesive properties. Dispersion of these materials into a heat-curing adhesive is generally carried out by a kneading method, but if the cross-wire method is not applicable, a solvent method may also be used.
〔作用〕および〔発明の効果〕
高分子酸塩は、酸と塩基とのイオン結合を含んでおり、
このイオン結合は共有結合と比べ非常に大きな双極子と
なっているため、高ｖｉ電率と高誘電損失とを有してい
る。[Action] and [Effect of the invention] The polymeric acid salt contains an ionic bond between an acid and a base,
Since this ionic bond has a much larger dipole than a covalent bond, it has a high vi electric constant and a high dielectric loss.
また、導電性粒子はマトリックス中に分散することで全
体の誘電率および誘電損失を高める効果がみられ、磁性
粒子は高い透磁率の損失を持つことで、マイクロ波を熱
に変換する作用を有してい ′る。In addition, conductive particles have the effect of increasing the overall permittivity and dielectric loss when dispersed in the matrix, and magnetic particles have the effect of converting microwaves into heat by having a high magnetic permeability loss. are doing.
このような作用により、加熱硬化型接着剤は全体的に誘
電損失が高められる結果、マイクロ波によって良好に加
熱され、接着強度も改善されるという効果を奏する。Due to this effect, the dielectric loss of the thermosetting adhesive is increased as a whole, so that it can be heated well by microwaves, and the adhesive strength is also improved.
次に、実施例について本発明を説明する。 Next, the present invention will be explained with reference to examples.
実施例
メラミン樹脂（大鹿振興製品大鹿レジン３１１）フェノ
ール樹脂（アイカニ業製品アイカボンド）エポキシ樹脂
（旭電化製品アデカレジンＥＤ−４０００）これらの樹
脂に、それぞれ５，２０または５０体積％のポリ（Ｐ−
スチレンスルホン酸ナトリウム）［重合度約４０００〜
６０００１、カーボン微粉末［平均粒径０．０２μｍｌ
、タングステン微粉末［粒径約０．４〜０．７μｍ］ま
たはフェライト微粉末［粒径０．５〜１．０μｍ］を添
加し、ロールにより混練、分散させた配合物を、２．４
５ＧＨｚ、４００Ｉ１１のマイクロ波を用いて６０秒間
加熱硬化させ、硬化物についてＪＩＳに−６８５０の引
張せん断接着強さを測定した。得られた結果は、次の表
に示される。Examples Melamine resin (Oshika Resin 311 manufactured by Oshika Shinko Co., Ltd.) Phenol resin (Aikabond manufactured by Aikani Industries) Epoxy resin (Adeka Resin ED-4000 manufactured by Asahi Denka Co., Ltd.) To these resins, 5, 20 or 50% by volume of poly(P-
sodium styrene sulfonate) [degree of polymerization approximately 4000~
60001, carbon fine powder [average particle size 0.02 μml
, tungsten fine powder [particle size approximately 0.4 to 0.7 μm] or ferrite fine powder [particle size 0.5 to 1.0 μm] was added, and the mixture was kneaded and dispersed with a roll.
It was heated and cured for 60 seconds using microwaves of 5 GHz and 400I11, and the tensile shear adhesive strength of -6850 according to JIS was measured for the cured product. The results obtained are shown in the following table.
（以下余白） 一コル七μｍ何匹偽ＷメＬ−(Margin below) One cor 7 μm how many fake W me L-
Claims (1)
は磁性粒子を分散させてなるマイクロ波加熱硬化用接着
剤。 ２、高分子酸塩が側鎖にカルボン酸金属塩基またはスル
ホン酸金属塩基を結合させている重合体である特許請求
の範囲第１項記載のマイクロ波加熱硬化用接着剤。 ３、導電性粒子がカーボンブラックまたはタングステン
である特許請求の範囲第１項記載のマイクロ波加熱硬化
用接着剤。 ４、磁性粒子がフェライトである特許請求の範囲第１項
記載のマイクロ波加熱硬化用接着剤。 ５、高分子酸塩、導電性粒子または磁性粒子を約１〜５
０体積％分散させた特許請求の範囲第１項記載のマイク
ロ波加熱硬化用接着剤。[Claims] 1. An adhesive for microwave heat curing, which is made by dispersing a polymeric acid salt, conductive particles, or magnetic particles in a heat curing adhesive. 2. The adhesive for microwave heating curing according to claim 1, wherein the polymeric acid salt is a polymer having a carboxylic acid metal base or a sulfonic acid metal base bonded to the side chain. 3. The adhesive for microwave heating curing according to claim 1, wherein the conductive particles are carbon black or tungsten. 4. The adhesive for microwave heating curing according to claim 1, wherein the magnetic particles are ferrite. 5. Approximately 1 to 5 polymeric acid salts, conductive particles or magnetic particles
The adhesive for microwave heating curing according to claim 1, wherein the adhesive is dispersed at 0% by volume.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25074887A JPH0195174A (en) | 1987-10-06 | 1987-10-06 | Adhesive curable by microwave heating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25074887A JPH0195174A (en) | 1987-10-06 | 1987-10-06 | Adhesive curable by microwave heating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0195174A true JPH0195174A (en) | 1989-04-13 |
Family
ID=17212450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25074887A Pending JPH0195174A (en) | 1987-10-06 | 1987-10-06 | Adhesive curable by microwave heating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0195174A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998012040A1 (en) * | 1996-09-19 | 1998-03-26 | Mcdonnell Douglas Corporation | Magnetic particle integrated adhesive and method of repairing a composite material |
| WO1999024520A1 (en) * | 1997-11-06 | 1999-05-20 | Lambda Technologies, Inc. | Microwave curable adhesive |
| JP2009112824A (en) * | 2002-03-28 | 2009-05-28 | Boston Scientific Scimed Inc | Method of manufacturing a medical device using microwave energy |
| WO2014203983A1 (en) * | 2013-06-21 | 2014-12-24 | オリンパスメディカルシステムズ株式会社 | Endoscope imaging unit and endoscope device |
| JPWO2015133040A1 (en) * | 2014-03-07 | 2017-04-06 | リンテック株式会社 | Heat curable adhesive composition and heat curable adhesive sheet |
| JP2018141148A (en) * | 2017-02-28 | 2018-09-13 | 積水化成品工業株式会社 | Heat-generating polymer, heat-generating agent, and various methods using heat generation with heat-generating polymer |
-
1987
- 1987-10-06 JP JP25074887A patent/JPH0195174A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998012040A1 (en) * | 1996-09-19 | 1998-03-26 | Mcdonnell Douglas Corporation | Magnetic particle integrated adhesive and method of repairing a composite material |
| WO1999024520A1 (en) * | 1997-11-06 | 1999-05-20 | Lambda Technologies, Inc. | Microwave curable adhesive |
| JP2009112824A (en) * | 2002-03-28 | 2009-05-28 | Boston Scientific Scimed Inc | Method of manufacturing a medical device using microwave energy |
| WO2014203983A1 (en) * | 2013-06-21 | 2014-12-24 | オリンパスメディカルシステムズ株式会社 | Endoscope imaging unit and endoscope device |
| JP5711438B1 (en) * | 2013-06-21 | 2015-04-30 | オリンパスメディカルシステムズ株式会社 | Endoscopic imaging unit and endoscope apparatus |
| CN104822307A (en) * | 2013-06-21 | 2015-08-05 | 奥林巴斯株式会社 | Endoscope imaging unit and endoscope device |
| US9364137B2 (en) | 2013-06-21 | 2016-06-14 | Olympus Corporation | Endoscope image-acquisition unit and endoscope apparatus |
| JPWO2015133040A1 (en) * | 2014-03-07 | 2017-04-06 | リンテック株式会社 | Heat curable adhesive composition and heat curable adhesive sheet |
| JP2018141148A (en) * | 2017-02-28 | 2018-09-13 | 積水化成品工業株式会社 | Heat-generating polymer, heat-generating agent, and various methods using heat generation with heat-generating polymer |
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