JPH02108485A - laser processing equipment - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention [Industrial Application Field] The present invention relates to a laser processing device used for processing a workpiece with a laser beam, and in particular, the present invention relates to a laser processing device used for processing a workpiece with a laser beam, and in particular, The present invention relates to a laser processing device that detects a positional shift in a laser beam.

[Prior Art] FIG. 2 is a schematic configuration diagram showing a processing head of a conventional three-dimensional laser processing device. In the figure, a laser beam 2 oscillated from a laser beam oscillator 1 is reflected by a bend mirror 3 and is incident on a processing head 4 . Inside the processing head 4, two bend mirrors 5, 5 are arranged so that their parallelism and mounting angle can be freely adjusted, and a nozzle 6 is provided.
A condenser lens 7 is installed above the laser beam 2 to converge the laser beam 2 reflected by the two bend mirrors 5, 5. 8.9 is the center line of the horizontal rotation axis and the center line of the vertical rotation axis for irradiating the focused laser beam 2 onto the workpiece (not shown) to be cut at an arbitrary angle.

Since the processing head 1 of the conventional three-dimensional laser processing device is configured as described above, the laser beam 2 is reflected and transmitted in the right angle direction by the bend mirrors 3 and 5, respectively, and is reflected by the condenser lens 7. The beam is further focused into a minute beam and irradiated from the nozzle 6 onto the workpiece. The processing head 4 is rotated around the centers 8 and 9 of the horizontal rotation axis and the vertical rotation axis by starting a drive motor (not shown) in response to a command from an NC device (not shown), so that the laser beam 2 The workpiece is processed three-dimensionally by emitting it to an arbitrary position in three-dimensional space.

[Problems to be Solved by the Invention] In the conventional three-dimensional laser processing apparatus configured as described above, when attaching the two bend mirrors 5.5 that are arranged opposite to each other in the processing head 4, Mirror 5.
5. The parallelism and installation angle of the comrades may be incorrect,
Alternatively, when the laser beam 2 itself enters the processing head 1, the angle of the optical axis of the laser beam 2 may be changed and the laser beam 2 may enter the bend mirror 5 at an inaccurate angle.

Therefore, in the case of such inaccurate laser beam incidence, the laser beam 2 whose optical axis passes through the central axis of the processing head
There has been a problem in that the beam spot is misaligned with respect to the focal position, which has a great negative effect on the processing accuracy of the workpiece.

This invention was made to solve the above problems, and it detects the positional deviation of the beam spot with respect to the focal position of the laser beam whose optical axis passes through the central axis of the processing head, and also detects the positional deviation of the beam spot. It is an object of the present invention to provide a laser processing device that allows the cause of deviation to be clearly determined.

[Means for Solving the Problems] A laser processing apparatus according to the present invention includes a semiconductor two-dimensional position detection element, etc. in the transmission optical path of a laser beam that is oscillated from a laser beam oscillator and reaches a workpiece via a processing head. The optical axis position detecting means is provided with a display section that displays the optical axis position based on the detection information detected by the position detecting means.

[Function] In the present invention, the laser processing device is activated and the optical axis position of the laser beam is detected in real time by a position detection element provided in the transmission optical path of the laser beam. Then, the locus of the optical axis position of the laser beam is automatically displayed on the display section. As a result, by comparing the locus patterns representing the focal position of the laser beam whose optical axis passes through the central axis of the processing head, it is possible to determine the positional deviation of the optical axis position of the laser beam whose position has been detected, and also to detect the position of the optical axis of the laser beam. It is possible to visually determine the state of the mirror, and it serves as an indicator for adjusting the bend mirror, etc.

[Example] An embodiment of the present invention will be described below with reference to FIG.

FIG. 1 is an overall schematic diagram showing an embodiment in which the laser processing apparatus according to the present invention is a three-dimensional laser processing apparatus.

In the figure, the same parts as in FIG. 2 of the conventional example are given the same reference numerals, and the explanation thereof will be omitted, and the explanation will focus on the different parts.

Reference numeral 10 denotes a semiconductor two-dimensional position detecting element which is attached to the tip of the nozzle 6 of the processing head 1 and is arranged so that the laser beam focal point coincides with the light receiving surface of the laser beam. .

This semiconductor two-dimensional position detection element 10 is, for example, an X
, Y. Among the types classified according to the arrangement of each pair of signal extraction electrodes, surface-split type or double-side split type elements are used.

11 is a processing circuit that converts the information signal from the position detection element 10 into a signal corresponding to a two-dimensional position, and by taking in start and end signals of the three-dimensional processing head 1 from an NC device (not shown), The two-dimensional position of the laser beam spot is detected. Reference numeral 12 denotes a display section that displays the laser beam spot position based on the laser beam spot position information signal from the processing circuit 11. The display section 12 includes, for example, a personal computer 13 and a display 14.

According to the three-dimensional laser processing apparatus configured as described above, the movement of the optical axis position of the laser beam 2 at the time of startup of the laser processing apparatus is detected in real time by the semiconductor two-dimensional position detection element 10, and the laser beam is automatically The locus of the optical axis position of the beam is displayed on the display 14 of the display unit 12. Then, by comparing the trajectory pattern representing the focal position of the laser beam whose optical axis passes through the center axis of the processing head, the position of the optical axis position of the detected laser beam is visually detected, and the bending of the laser processing equipment is detected. It is possible to determine what state the mirror is in. Therefore,
Based on this information, the alignment method can finally be determined.

In the above embodiment, the optical axis position of the laser beam is detected by the optical axis position detecting means provided at the focal position of the laser beam passing through the central axis of the processing head, and the position shift is detected. However, the optical axis position of the laser beam may be detected by using this front axis position detection means in the transmission optical path of the laser beam from the laser beam oscillator to the processing head, and the same effect as in the above embodiment can be obtained. It is something to play.

[Effects of the Invention] As described above, according to the present invention, a means for detecting the optical axis position of the laser beam is provided in the transmission optical path of the laser beam that is oscillated from the laser beam oscillator and reaches the workpiece via the processing head. Since the configuration includes a display unit that displays the optical axis position based on the detection information detected by the optical axis position detection means, it is possible to visually detect the positional deviation of the optical axis position of the laser beam with respect to the central axis of the processing head. This has the advantage that it is possible to determine the correct way to adjust the bend mirror, etc. disposed in the transmission optical path.

[Brief explanation of drawings]

FIG. 1 shows an embodiment of a laser processing device according to the present invention, and FIG. 2 is a schematic configuration diagram showing a processing head of a three-dimensional laser processing device, and FIG. 2 is a schematic diagram showing a processing head of a conventional three-dimensional laser processing device. FIG. 1... Laser beam oscillator, 2... Laser beam,
3...Bend mirror, 4...Processing head, 5,5.
...Bend mirror, 6... Nozzle, 7... Condensing lens, 10... Optical axis position detection means, 11... Processing circuit, 12... Display section, 13... Personal computer, 14...Display. In addition, in the figures, the same reference numerals indicate the same or corresponding parts. Figure 1

Claims (1)

[Claims] A bend mirror that reflects the laser beam emitted from the laser beam oscillator, a condensing lens that converges the laser beam reflected by the bend mirror, and a convergent lens that focuses the converged laser beam on the workpiece to be cut. In a laser processing apparatus having a processing head having a vertical rotation axis and a horizontal rotation axis for irradiating at an angle, in the transmission optical path of a laser beam emitted from the laser beam oscillator and reaching the workpiece via the processing head. 1. A laser processing apparatus, comprising: a display section which is provided with a laser beam optical axis position detecting means, and displays the optical axis position based on detection information detected by the position detecting means.