JPH02119073A - lead terminal - Google Patents
lead terminalInfo
- Publication number
- JPH02119073A JPH02119073A JP63272036A JP27203688A JPH02119073A JP H02119073 A JPH02119073 A JP H02119073A JP 63272036 A JP63272036 A JP 63272036A JP 27203688 A JP27203688 A JP 27203688A JP H02119073 A JPH02119073 A JP H02119073A
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- lead
- insulating substrate
- shape memory
- memory alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、混成集積回路基板に用いられるリド端子の改
良に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to improvements in lead terminals used in hybrid integrated circuit boards.
（従来の技術）
周知の如く、混成集積回路基板用の絶縁性基板の一側辺
には複数のバット部が設けられているが、印刷配線基板
との電気的導通をとるため例えば第４図に示すようなリ
ード端子が用いられている。(Prior Art) As is well known, a plurality of butt portions are provided on one side of an insulating substrate for a hybrid integrated circuit board. A lead terminal as shown in is used.
図中の１はリード端子である。このリード端子１は、リ
ード部２と、このリード部２と一体化されており前記絶
縁性基板のパッド部２を基板両面側から挟み込む挟持部
３とから構成されている。1 in the figure is a lead terminal. This lead terminal 1 is composed of a lead part 2 and a holding part 3 which is integrated with the lead part 2 and which holds the pad part 2 of the insulating substrate from both sides of the board.
こうしたリード端子１は、例えば鉄やリン青銅板からブ
レス打抜あるいはエツチング等によって製造される。こ
の際、リード端子１の取付はギャップしは絶縁性基板の
厚さよりも小さく形成し、リド端子の装着の際圧入して
いた。また、前記絶縁性基板へリード端子を装着すると
きは、例えば第５図に示す如く絶縁性基板４のパッド部
５に半田層６を介して固定することになる。Such a lead terminal 1 is manufactured, for example, from an iron or phosphor bronze plate by press punching or etching. At this time, when attaching the lead terminal 1, the gap was formed to be smaller than the thickness of the insulating substrate, and the gap was press-fitted when the lead terminal was attached. Further, when the lead terminal is attached to the insulating substrate, it is fixed to the pad portion 5 of the insulating substrate 4 via the solder layer 6, as shown in FIG. 5, for example.
ところで、混成集積回路基板の基材である絶縁性基板の
厚みは一種類ではなく、用途等に応じて例えば０．５ｍ
ｍ、０．６３５１１０．８ｍｍなどと使いわけられてい
る。しかしながら、従来のリード端子は同一の板厚の絶
縁性基板にしか用いることができず、板厚が変わる度１
、゛ギヤツブＬの異なるリード端子に変えなければなら
なかった。By the way, the thickness of the insulating substrate that is the base material of the hybrid integrated circuit board is not just one type, but varies depending on the application, for example, 0.5 m.
m, 0.635110.8mm, etc. However, conventional lead terminals can only be used on insulating boards of the same board thickness, and each time the board thickness changes,
, I had to change to a different lead terminal for gear L.
（発明が解決【７ようとする課題）
本発明は上記事情に鑑みでなされたもので、少なくとも
基板表面側又は裏面側の挟持部を形状記憶合金で形成す
ることにより、異なる板厚の絶縁性基板のパッド部を挟
持り、得るリード端子を提１扶す”ることを目１白とす
る。(Problems to be Solved by the Invention [7]) The present invention has been made in view of the above circumstances, and by forming at least the holding portion on the front side or the back side of the substrate with a shape memory alloy, insulation of different board thicknesses can be improved. The first thing to do is to hold the pad part of the board and provide the resulting lead terminal.
（課題を解決するだめの手段）
本発明は、混成集積回路基板用の絶縁性基板の一側辺に
沿って設けられたパッド部と電気的に接続するために用
いられるリー ド端子において、リー ド部と、このリ
ー ド部と一体をなしかつ前記絶縁性基板のパッド部を
該絶縁性基板の両面側から挾り込むコ字型状の挟持部と
からなり、少くとも前記基板表面側又は裏面側の前記挟
Ｐ９部が形状記憶合金からなることを特徴とするリード
端子である。(Means for Solving the Problems) The present invention provides a lead terminal used for electrically connecting a pad portion provided along one side of an insulating substrate for a hybrid integrated circuit board. and a U-shaped holding part which is integral with the lead part and which holds the pad part of the insulating substrate from both sides of the insulating substrate, and at least the front side of the board or the pad part of the insulating substrate. The lead terminal is characterized in that the pinched P9 portion on the back side is made of a shape memory alloy.
本発明において、形状記憶合金（形状を記憶させる合金
）は、リード端子全体、あるいは挟持部、あるいは挾持
部のうち絶縁性基板の表面側又は裏面側に位ｊ面する部
分のみに材料として用い”Ｃもよい。Ｊ：足形状記憶合
金としては、例えばＴＩ Ｎ１合金、Ｃｕ Ｚｎ ＡＪ
’！合金、あるいはこれに少量の第３元素を添加１．で
改良した合金等が挙げられろ。In the present invention, a shape memory alloy (an alloy that memorizes shape) is used as a material for the entire lead terminal, the clamping part, or only the part of the clamping part that faces the front or back side of the insulating substrate. C may also be used.J: Foot shape memory alloys include, for example, TI N1 alloy, Cu Zn AJ
'! Alloy or adding a small amount of third element to it 1. Can you name some alloys that have been improved?
本発明においては、リード端子の挟￥ｊｊ部のギャップ
は板厚が厚い絶縁性基板（前者）あるいは薄い絶縁性基
板（後者）のいずれに合せてしよいが、前者の場合形状
記憶合金にパッド部を挟み込む方向に形状が変化するよ
うに記憶させ、逆に後者の場合は形状記憶合金に外側に
広がる方向に形状が変化するように記憶させる。In the present invention, the gap between the sandwich parts of the lead terminal can be set to either a thick insulating substrate (the former) or a thin insulating substrate (the latter), but in the case of the former, the pad is formed on a shape memory alloy. In the latter case, the shape memory alloy is memorized so that its shape changes in the direction in which it spreads outward.
（作用）
本発明によれば、リード端子全体、あるいは挟持部、あ
るいは挟持部のうち絶縁性基板の表面側又は裏面側に位
置する部分のみに形状記憶合金を用いることにより、板
厚の異なる絶縁性基板を用いてもリード端子の挟持部の
ギャップが形状記憶合金の特性により狭くなったり（又
は広がり）、従来のようにリード端子を使い分ける必要
もなく、リード端子の管理を単純化できる。(Function) According to the present invention, by using a shape memory alloy for the entire lead terminal, the clamping part, or only the part of the clamping part located on the front side or the back side of the insulating substrate, insulation of different plate thicknesses is achieved. Even if a flexible substrate is used, the gap between the holding portions of the lead terminals becomes narrower (or wider) due to the characteristics of the shape memory alloy, and there is no need to use different lead terminals as in the past, and the management of the lead terminals can be simplified.
（実施例）
以下、本発明の一実施例を第１図〜第３図を参照（７て
説明する。ここで、第１図はリード端ｒの挟持部が変形
前の平面図、第２図は同挟持部の変形後の平面図、第３
図はリード端子の実際の使用状況の説明図である。(Embodiment) An embodiment of the present invention will be described below with reference to FIGS. 1 to 3 (7). Here, FIG. The figure is a plan view of the holding part after deformation,
The figure is an explanatory diagram of the actual usage situation of the lead terminal.
図中の１１は、リード端子である。このリード端子１１
は、リード部１２と、変形前のギャップＬ 、が例えば
０．８１１ｖの断面コ字型の挟持部１３とから構成され
ている。ここで、挟持部１３の一部例えば絶縁性基板１
４のパッド部１５と接触すべき部分（図中の点４部分）
は形状記憶合金から形成され、他の部分はリン青銅ある
いは鉄等から形成されている。11 in the figure is a lead terminal. This lead terminal 11
is composed of a lead portion 12 and a holding portion 13 having a U-shaped cross section with a gap L of, for example, 0.811v before deformation. Here, a part of the holding part 13, for example, the insulating substrate 1
The part that should come into contact with the pad part 15 of No. 4 (point 4 part in the figure)
is made of a shape memory alloy, and the other parts are made of phosphor bronze, iron, or the like.
ここで、この形状記憶合金からなる挟持部１３のギャッ
プは通常板厚の厚い絶縁性基板に対応して大きめに設定
されている（第１図図示）が、板厚の薄い絶縁性基板に
対して用いる場Δは形状記憶合金部分が絶縁性基板を挟
む方向に縮み、そのギャップＬ２は例えばＯ４５■とな
るように設定されている（第２図図示）。Here, the gap of the clamping part 13 made of this shape memory alloy is normally set to be large for a thick insulating substrate (as shown in Figure 1), but for a thin insulating substrate, In the field Δ used in this example, the shape memory alloy portion is contracted in the direction sandwiching the insulating substrate, and the gap L2 is set to be, for example, O45 (as shown in FIG. 2).
しかして、上記実施例に係るリード端子は、リド部１２
と断面コ字型の挟持部１３とから構成され、【７かも前
記挟持部１３の一部例えば絶縁性基板１４のパッド部１
５と接触すべき部分（図中の点々部分）が形状、記憶合
金から形成されているため、板厚の異なる絶縁性基板に
リード端子１１を接続させる際、従来のように種類の異
なるリード端子に変える必要がなく、同じ種類のリード
端子を用いてることができる。つまり、板厚が厚い基板
から板厚の薄い基板を挟持しようと１７た場合、挟持部
１３の一部が形状記憶心金から構成された前記挟持部１
３に予熱を行うことによりギャップを狭くする方向の力
が加わり、ギャップ■、１からギャップ１．２へと変化
し、リード端子１１の挟持部１３が適宜な力で絶縁性基
板の１４のパッド部を挟み込むことになる。Therefore, the lead terminal according to the above embodiment has the lead portion 12
and a holding part 13 having a U-shaped cross section.
Since the parts (dotted parts in the figure) that should be in contact with 5 are shaped and made of a memory alloy, when connecting the lead terminal 11 to insulating substrates with different thicknesses, different types of lead terminals can be used, unlike conventional methods. There is no need to change to the same type of lead terminal, and the same type of lead terminal can be used. In other words, when trying to clamp a thin board from a thick board, the clamping part 13 is partially composed of a shape memory mandrel.
By preheating 3, a force is applied in the direction of narrowing the gap, and the gap changes from 1 to 1.2, and the holding part 13 of the lead terminal 11 presses the pad 14 of the insulating substrate with an appropriate force. The part will be pinched.
なお、上記実施例では、リード端子の挟持部の一部のみ
が形状記憶合金から形成されている場合について述べた
が、これに限らず、挟持部全体あるいはリード端子全体
を形状記憶合金で形成してもよい。In the above embodiment, only a part of the clamping part of the lead terminal is made of a shape memory alloy. However, the present invention is not limited to this, and the entire clamping part or the entire lead terminal can be made of a shape memory alloy. It's okay.
［発明の効果］
以上詳述１．た如く本発明によれば、少なくとも基板表
面側又は裏面側の挟持部を形状記憶合金で形成すること
により、異なる板厚の絶縁性基板のパッド部を挟持し得
るリード端子を提供できる。[Effects of the invention] Detailed description above 1. According to the present invention, by forming at least the holding portion on the front side or the back side of the substrate from a shape memory alloy, it is possible to provide a lead terminal capable of holding pad portions of insulating substrates having different thicknesses.
第１図は本発明の一実施例に係るリード端子の挟持部が
変形前の平面図、第２図は同挟持部の変形後の１シ面図
、第３図はリード端子の実際の使用状況の説明図、第４
図は従来のリード端−ｒの平面図、第５図は同リード端
子の実際の使用状況の説明図である。
１１・・・リード端子、１２・・・リー ド部、１３・
・・挟持部、１４・・・絶縁性基板、１５・・・パッド
部、１６・・・半ＥＩＪ層。
出願人代理人 弁理士 鈴江武彦
第４
第５図Fig. 1 is a plan view of the clamping part of a lead terminal according to an embodiment of the present invention before deformation, Fig. 2 is a side view of the clamping part after deformation, and Fig. 3 is the actual use of the lead terminal. Explanatory diagram of the situation, 4th
The figure is a plan view of a conventional lead terminal -r, and FIG. 5 is an explanatory diagram of the actual usage situation of the lead terminal. 11...Lead terminal, 12...Lead part, 13...
... Sandwiching part, 14... Insulating substrate, 15... Pad part, 16... Half EIJ layer. Applicant's agent Patent attorney Takehiko Suzue No. 4 Figure 5
Claims (1)
られたパッド部と電気的に接続するために用いられるリ
ード端子において、リード部と、このリード部と一体を
なしかつ前記絶縁性基板のパッド部を該絶縁性基板の両
面側から挟み込むコ字型状の挟持部とからなり、少くと
も前記基板表面側又は裏面側の前記挟持部が形状記憶合
金からなることを特徴とするリード端子。In a lead terminal used for electrically connecting a pad portion provided along one side of an insulating substrate for a hybrid integrated circuit board, the lead portion is integral with the lead portion and has the insulating properties. A lead comprising a U-shaped holding part that holds a pad part of a substrate from both sides of the insulating substrate, and at least the holding part on the front side or the back side of the substrate is made of a shape memory alloy. terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63272036A JPH02119073A (en) | 1988-10-28 | 1988-10-28 | lead terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63272036A JPH02119073A (en) | 1988-10-28 | 1988-10-28 | lead terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02119073A true JPH02119073A (en) | 1990-05-07 |
Family
ID=17508231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63272036A Pending JPH02119073A (en) | 1988-10-28 | 1988-10-28 | lead terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02119073A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012100511A1 (en) | 2011-01-28 | 2012-08-02 | Yazaki Corp. | Contact and contact connection setup |
| DE102012100512A1 (en) | 2011-01-28 | 2012-08-02 | Yazaki Corp. | Contact fastening construction and electronic device |
-
1988
- 1988-10-28 JP JP63272036A patent/JPH02119073A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012100511A1 (en) | 2011-01-28 | 2012-08-02 | Yazaki Corp. | Contact and contact connection setup |
| DE102012100512A1 (en) | 2011-01-28 | 2012-08-02 | Yazaki Corp. | Contact fastening construction and electronic device |
| JP2012156081A (en) * | 2011-01-28 | 2012-08-16 | Yazaki Corp | Terminal and connection structure of the same |
| JP2012156080A (en) * | 2011-01-28 | 2012-08-16 | Yazaki Corp | Terminal attachment structure and electronic apparatus |
| US8714997B2 (en) | 2011-01-28 | 2014-05-06 | Yazaki Corporation | Terminal and terminal connecting construction |
| US8773863B2 (en) | 2011-01-28 | 2014-07-08 | Yazaki Corporation | Terminal mounting construction and electronic device |
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