JPH02110992A - Pattern connection method - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a pattern connection method for repairing and connecting broken portions of fine conductive patterns formed on an insulating substrate.

2. Description of the Related Art A conventional method for repairing and connecting a disconnected portion of a conductive pattern in a conventional thermal head substrate that requires a fine conductive pattern on an insulating substrate will be described with reference to the drawings. In FIGS. 3 and 4, the insulating substrate 1 is several tens of μm thick.
An alumina substrate with a glass layer of m is used. and,
In forming the conductive pattern 2, first, a metal conductive film such as an Au film is formed on the entire surface of the glass layer.

This metal conductive film is formed by vapor deposition, sputtering, or printing and baking. In the printing and firing method, for example, after applying Au <metal organizuku> by ordinary screen printing, it is heated at 750°C to 90°C in an air or oxygen atmosphere.
By firing at 00℃, thickness 3000A~70
A metal conductive film of about 0.008 is formed.

Next, a metal conductive film is formed into a desired conductive pattern 2 by a normal photoetching method. However, in the thermal head substrate, when the density of heating element dots is 8 dots per 1 m1 (8 dots/round), the pitch is The width of the wiring 3 is usually about 50 μm, and in the smallest heating resistor portion 4, an Au pattern is formed with a width of about 25 μm.

Next, rutinium oxide (R20) is applied as a heating resistor by screen printing, and after firing at about 750° C. to 900° C., the resistance value is measured. Then, the disconnection is detected by measuring the resistance value. This disconnection is mainly due to pinholes generated during organic Au printing, missing Au due to photosensitive resin pinholes during photoetching, or damage. In order to repair and connect this disconnection, conventionally, while looking at the disconnection part with a microscope, using a very fine brush, organic Au paste 5 was applied to connect the missing part of the Au wiring 3 as shown in FIG. Partially apply A and bake at about 750℃ to 900℃ to add A to the broken wire.
It formed the wiring for u.

Problems to be Solved by the Invention However, according to the conventional method described above, the organic Au paste must be applied only to the desired area without contacting with other wiring, but this task requires considerable skill. However, there was a problem with poor productivity. Furthermore, since the organic Au is fired again after firing the heating resistor, there is a problem in that the temperature and atmosphere are restricted in order to prevent changes in the resistance value of the heating resistor during firing.

The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a pattern connection method that easily repairs a disconnection caused by a missing conductive film in a fine conductive pattern without requiring special skill.

Means for Solving the Problems In order to solve the above problems, the present invention applies a thick film paste on an insulating substrate formed with a conductive pattern, and reduces the thickness of a specific area corresponding to a disconnection part of the conductive pattern. The film paste is irradiated with a laser beam, and the laser beam selectively limits and fires the thick film paste in the specific area, and by firing the thick film paste, a conductor is formed only in the disconnected part of the conductive pattern. The structure is such that the wire is formed and the disconnected portion is connected.

Effect: With the above configuration, the energy locally applied by the laser beam burns only the thick film paste in a specific area corresponding to the disconnection, so there is no need to finely apply the thick film paste, and no skill is required. , the disconnection can be easily repaired.

Furthermore, since the heating is performed locally, there are no harmful effects caused by firing.

EXAMPLE Hereinafter, an example of the present invention will be described based on the drawings. 1 and 2, an Au conductive pattern 12 is formed on an insulating substrate 11 by photoetching, and a heating resistor is printed and fired. In addition, a disconnection portion 14 is generated in a part of the wiring a13 of the conductive pattern 12 due to lack of the Au conductive film. When repairing and connecting the broken wire 14, a thick-film paste 11 Au paste 15 is applied to an area on the insulating substrate 11 that includes at least the broken wire 14, as shown in FIG.

At this time, the organic A
U paste 15 may be applied, and the organic Au paste 15 may be applied over a wide area, for example, with a diameter of 1
A laser beam having an irradiation area of about 0 μm is applied to the disconnection part 1.
Specific V1.4 corresponding to V1.4. The organic Au paste 15 in the area is irradiated, and only the fi-Au paste 15 in a specific area is selectively limited and fired using the laser beam. and,
By this firing, the solvent of the organic Au paste 15 evaporates and thermally decomposes, and only the organic Au paste 15 corresponding to the disconnection part 14 locally becomes metallic Au, and a conductor is formed in the disconnection part 14. 14 repair connections are made.

Thereafter, the Au paste 15 applied to the areas not irradiated with the laser beam is removed using an organic solvent such as vinegar, Mn and glyph. Then, a protective glass layer is printed and fired on the insulating substrate 11 from which the paste 15 has been removed, and components such as a control IC are mounted to manufacture a thermal head.

Therefore, in the above configuration, the energy locally applied by the laser beam burns only the fi-Au paste in a specific area corresponding to the disconnection, so there is no need to apply the organic Au paste minutely and precisely. , disconnections can be easily repaired and connected without requiring any skill. In addition, since heating is performed locally, there are no adverse effects due to the configuration.Furthermore, in laser beam irradiation, a laser beam with a diameter of about 10 μm can be easily obtained with a YAG laser, etc., and the irradiation area can be controlled. Even in this case, industrial productivity can be improved because it can be done precisely and automatically using X-Y suji. Also,
In this example, organic Au is used as the thick film paste material.
Although the explanation was made using paste, the same effect can be obtained not only with ordinary glass frit type Au paste but also with metal paste such as Au eAg and Pt, and resistor paste such as RuO2. Needless to say, in addition to the alumina substrate, a ceramic substrate such as boron nitride, or a hollow substrate whose metal surface has been subjected to insulation treatment, for example, may be used.

Effects of the Invention As described above, according to the present invention, energy is applied locally to the thick film paste in a specific area corresponding to the disconnection part using a laser beam, and only the thick film paste in the specific area is fired. Therefore, there is no need to finely apply a thick film paste, and broken wires can be easily repaired and connected without requiring any skill. Further, since the heating is performed locally, there are no harmful effects caused by firing.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a disconnection state of a conductive pattern in an embodiment of the present invention, and FIG. 2 is a diagram showing a disconnection state of a conductive pattern in an embodiment of the present invention.
FIG. 3 is a diagram showing the state of application of the paste, FIG. 3 is a diagram showing a conductive pattern on an insulating substrate in the conventional method, and FIG. 4 is a diagram showing the state of application of the organic Au paste in the same method. 11... Insulating substrate, 12... Conductive pattern, 13
...Wiring, 14...Disconnection part, 15...With 11Au
paste. Agent Yoshihiro Morimoto Figure 1/2 Figure 3 Figure 4

Claims (1)

[Claims] 1. A thick film paste is applied onto an insulating substrate on which a conductive pattern is formed, and a laser beam is irradiated to the thick film paste in a specific area corresponding to the disconnection part of the conductive pattern. A pattern connection method in which a thick film paste is selectively limited and fired, and a conductor is formed only at a disconnection part of the conductive pattern by firing the thick film paste to connect the disconnection part.