JPH02155296A - High heat radiating structure for heat generator - Google Patents

Abstract

PURPOSE:To improve heat radiating efficiency and to further enhance its cooling effect by providing a heat radiating wall outside a shelf, and thermally coupling the heat radiating wall with a heat generation circuit unit by the use of a heat pipe. CONSTITUTION:Heat radiating walls 1e each having a heat radiating fin 13-1 are disposed on the back of a backboard 1a-4 and at both sides of a shelf 1a, a bracket 1f is clamped with screws at inside having no heat radiating fin 1e-1, and the heat radiating end 1c-2 of a heat pipe 1c is inserted fixedly to the insertion hole 1f-1 of a bracket 1f. A power source board 1b is inserted and guided by the guide rails 1a-5 of the shelf 1a, its plug connector 1b-2 is electrically connected to the socket connector 1a-6 of the backboard 1a-4, and the heat absorption end 1c-1 of the heat pipe 1 is engaged with and inserted into the insertion hole 1d-3 of a heat coupling 1d. In the heat sink, heat generated at the power source board 1b-1 is absorbed by the heat absorption end 1c-1 of the heat pipe 1c through the heat coupling 1d, thermally conducted from the heat sink end 1c-2 directly to the heat radiating wall 1e to radiate the heat from the heat radiating fin.

Description

[Detailed Description of the Invention] (Summary) Regarding the high heat dissipation structure of heat generating devices such as power supplies, the purpose of this invention is to improve the heat dissipation efficiency and further enhance the cooling effect. A heat generating device in which a heat generating circuit unit is connected to a connector and housed therein includes a heat dissipating wall having heat dissipating fins arranged on the outside of the heat generating device, one heat dissipating end being fixed to the heat dissipating wall surface, and the other heat absorbing end being fixed to the heat dissipating wall surface. The heat pipe is arranged to be connected to and removed from the thermal coupling attached to the heat generating circuit unit by insertion and removal associated with the connector connection.

[Industrial application field]

The present invention relates to a high heat dissipation structure for a heat generating device such as a power supply device.

A power supply device that supplies power to electronic circuits in communication equipment, etc.
It consists of a box-shaped shelf with a power supply board mounted on it, connected to the backboard at the rear with a connector, and housed in parallel.
The power supply device is mounted within the communication equipment housing together with a shelf that houses other electronic circuit boards. Since the power supply panel houses power components such as power transformers, power transistors, and resistors, it generates a large amount of heat compared to other electronic circuit boards, so a heat sink with heat dissipation fins is attached to the surface of the power supply panel. It has good heat dissipation. However, since the power efficiency of power supply components has not been improved, there is a thermal limit to miniaturizing the power supply device by implementing higher density packaging.

Therefore, it is desired to further enhance the cooling effect by improving the heat dissipation efficiency.

[Conventional technology]

A conventional heat generating device 11, for example, the power supply device described above, has an open front and upper and lower frames 11, as shown in a perspective view of the main parts in FIG.
A box-shaped shelf 11a having ventilation holes 11a-3 on a-1 and 11a-2 and a backboard 11a-4 on the back side
The power supply boards 11b are housed in parallel.

The power supply board 11b screws a box-shaped power supply board 1tb-t containing a built-in power supply circuit (path shown), and a heat sink 11 having a radiation fin 11c-1 is mounted on the side of the power supply board 11b-1.
c, and a bank board 1 is attached to the tip of the power supply board 11b.
A plug connector 1lb-2 is provided to connect with the socket connector 11-6 of 1a-4.

The power supply board 11b is the upper and lower frame 11a-1 of the shelf l1a.
It is inserted and guided by a guide rail 11a-5 attached to the inner surface of the backboard 11a-2 and connected to the backboard 11a-4 by a connector.

Heat radiation is performed by natural convection or forced air cooling using a cooling fan (not shown).

[Problem to be solved by the invention]

However, with this heat dissipation structure, there is a problem that the temperature inside the power supply panel increases due to high-density mounting of power supply circuits, and even with forced air cooling using a cooling fan, the temperature may still exceed the allowable temperature. Ta.

In view of the above problems, an object of the present invention is to provide a high heat dissipation structure for a heat generating device that improves heat dissipation efficiency and further enhances its cooling effect.

[Means to solve the problem]

In order to achieve the above object, the high heat dissipation structure of the heat generating device of the present invention includes a heat dissipation wall having heat dissipation fins arranged on the outside of the heat dissipation device, one heat dissipation end fixed to the heat dissipation wall surface, and the other heat dissipation end fixed to the heat dissipation wall surface. The heat absorbing end of the heat pipe is connected to a thermal coupling attached to a heat generating circuit unit of a heat generating device so as to be inserted into and removed from the heat pipe when the connector is connected.

[Effect]

A thermal coupling is attached to the heat generating circuit unit connected and housed in the shelf of the heat generating device, one heat absorbing end of the heat pipe is inserted into this thermal coupling, and the other heat dissipating end is placed outside the heat generating device. By fixing it to the installed heat dissipation wall, the heat generation circuit unit and the heat dissipation wall are thermally coupled with the heat pipe, and the heat of the heat generation circuit unit absorbed at the heat absorption end is conducted from inside the shelf to the outside, and the heat dissipation end is fixed. Heat can be radiated from the radiating fins on the radiating wall. Since this heat dissipation wall is disposed outside the heat generating device, the heat dissipation area can be greatly expanded. Further, when the heat generating circuit unit is inserted or removed, electrical connection can be performed at the same time as this thermal coupling.

〔Example〕

The gist of the present invention will be explained in detail below based on embodiments shown in the drawings.

As shown in the main part perspective view of FIG. 1, the power supply device 1 (heat generating device) is constructed by housing power supply boards 1b (heat generating circuit units) in parallel in a box-shaped shelf 1a.

The shelf 1a has an open front and upper and lower frames 1a-1, 1a.
-2 has ventilation holes 1a-3, and backboard 1a on the back
A guide rail 1a-5 for inserting and guiding the power supply base 11b is provided on the inner surface of each of the upper and lower frames 1a-1 and 1a-2.

The backboard 1a-4 includes a socket connector 1a-6 to which the plug connector 1b-2 of the power supply board 1b is connected.

The power supply board 1b screws together a box-shaped power supply board 1b-1 containing a built-in power supply circuit (path shown in the diagram), and a 1 cm heat-absorbing end of a heat pipe 1c is fitted and inserted into the top surface of the power supply board 1b-1. A thermal coupling 1d is closely attached to the power supply board 1b, and a socket connector 1a- of the backboard 1a-4 is attached to the tip of the power supply board 1b.
6 is provided.

The heat absorption end 1cm1 of the heat pipe 1c is the backboard 1a.
-4 through the through hole 1a-4a from the outside of the power supply board 1.
The heat pipe 1c is made to protrude in the insertion/extraction direction of the heat pipe 1b and is plugged into the thermal coupling 1d to be thermally coupled.

The heat dissipation end IC-2 is bent into an L shape along a heat dissipation wall 1e, which will be described later, at the point where it exits the through hole 1a-4a, and is formed into a heat dissipation end 1c.
It is molded so that m2 is fixed with bracket lf.

(This heat pipe is a metal tube with a capillary structure on the inner wall of the tube, which is evacuated and filled with a small amount of working fluid such as water or fluorocarbon.The heat absorbed at the endothermic end (high temperature part) causes the working fluid to be (This is a type of commercially available heat exchanger that evaporates and transfers the working liquid vapor to the heat radiation end (low temperature part) through a capillary tube to release the latent heat of vaporization.) The thermal coupling 1d has a pair of upper and lower plates 1d-1. , 1d~
2, and drill an insertion hole 1d-3 with an inner diameter in the center of the seam so that it will fit tightly when the heat pipe IC is inserted.
It sticks to the top surface of.

A heat dissipation wall 1e having heat dissipation fins 1e-1 is arranged behind the backboard 1a-4 and on both sides of the shelf 1a, and a bracket lf is screwed onto the inner surface side where there is no heat dissipation fin 1e-1. The heat dissipation end IC-2 of the heat pipe 1c is inserted and fixed into the insertion hole 1f-1. (Alternatively, the thermal coupling 1d may be used instead of this bracket 1f.) The power supply board 1b is connected to the guide rail 1a-5 of the shelf 1a.
The plug connector 1b-2 is electrically connected to the socket connector 1a-6 of the backboard 1a-4, and at the same time the heat absorption end IC1 of the heat pipe 1c is inserted and guided.
into the insertion hole 1d-3 of the thermal coupling 1d. The heat absorption end 1cm1 of the heat pipe 1c is inserted into the insertion hole 1d-
3, the thermal coupling 1d comes into elastic contact with the compression spring 1d-5 and can be thermally coupled with low thermal resistance.

Heat is dissipated from the heat absorption end IC-1 of the heat pipe IC to the power supply panel 1b.
The heat generated by I is absorbed through the thermal coupling 1d,
Heat is directly conducted from the heat radiation end 1 cm2 to the heat radiation wall 1e, and the heat is radiated from the radiation fins.

Note that a plurality of heat pipes 1c may be provided on the power supply board 1b depending on the amount of heat generated (in the embodiment, the heat radiation wall 1e is provided on three surfaces around the outside, but depending on the amount of heat generated, it may be provided on one or two surfaces). However, the area can be selected appropriately and with good thermal efficiency.

Furthermore, the side plate itself of the device housing (not shown) may be used as the heat radiation wall. Furthermore, in the above embodiment, a plurality of power supply boards (heat generating circuit units) are housed in parallel in a shelf, but it goes without saying that the present invention is not limited to being housed in a shelf and can be similarly applied to a single power supply board.

In this way, the power supply board (heat generating circuit unit) of the power supply device (heat generating device) is equipped with a connector and a thermal coupling, a heat radiation wall is provided on the outside of the shelf, and the heat generating circuit unit and the heat radiation wall are connected using a heat pipe. By thermally coupling, the electrical connection and thermal connection of the heat generating circuit unit can be made at the same time, and the heat absorbed at the heat absorption end of the heat pipe is conducted to the outside of the shelf by the heat pipe, and the heat dissipation of the heat pipe is performed. Heat can be effectively radiated from the radiating fins of the radiating wall whose ends are fixed. This heat dissipation wall can be installed on the outside of the shelf, or the side plate of the equipment case can be used as a heat dissipation wall, so the heat dissipation area can be greatly increased.Additionally, the heat dissipation area can be further expanded by adding heat dissipation fins. can be increased, and a large amount of heat from the plurality of heat generating circuit units can be efficiently radiated.

(Effects of the Invention) As described in detail above, according to the present invention, a heat dissipation wall is provided on the outside of the shelf, and the heat dissipation wall and the heat generating circuit unit are thermally coupled by a heat pipe, thereby transferring heat to the outside of the heat generating device. It can conduct heat at high speed and dissipate heat effectively, allowing thermal and electrical connections of the heat generating circuit unit to be made at the same time.In addition, heat is less likely to accumulate inside the heat generating device, allowing for higher density mounting. The design becomes easier.The heat sink with radiation fins that was conventionally attached is no longer necessary, and the heat generating circuit unit and the heat generating device can be miniaturized, which is extremely useful in industry.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a main part of an embodiment according to the present invention, and FIG. 2 is a perspective view of a main part according to the prior art. In the figure, 1 is a power supply device (heat generating device), 1a is a shelf, 1a-4 is a backboard, 1b is a power supply board (heat generating circuit unit), 1c is a heat pipe, 1cm1 is a heat absorption end, 1cm2 is a heat radiation wall, 1d is a 1e is a heat radiation wall, 1e-1 is a heat radiation fin, and 1f is a bracket.

Claims (1)

[Scope of Claims] A heat generating device (1) in which a heat generating circuit unit (1b) is connected to a connector and housed in a box-shaped shelf (1a) having a backboard (1a-4) on the back side, comprising: 1) Heat dissipation fins (1e-
1), one heat dissipating end (1c-2) is fixed to the surface of the heat dissipating wall (1e), and the other heat absorbing end (1c-1) is connected to the heat generating circuit unit (1b). A high heat dissipation structure for a heat generating device, characterized in that the heat pipe (1c) is arranged so as to be connected to and connected to a thermal coupling (1d) attached to the heat pipe (1c) by insertion and removal associated with the connector connection.