JPH0287485A - Terminal board for electronic components - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Summary] The present invention relates to a terminal structure of a terminal board for electronic components mounted with a semiconductor chip, etc., which uses cylindrical terminals to completely separate multiple terminals and achieve high terminal density. The purpose of the present invention is to provide a terminal board for electronic components in which a semiconductor chip, etc. is mounted and terminals for wiring are arranged in a grid pattern, in which each of the terminals is centered around a terminal pin. The structure consists of a pair of terminals surrounded by a cylindrical terminal and filled with a low-visibility, high-insulating material between them.

[Industrial application field]

The present invention relates to a terminal structure of a terminal board for electronic components on which a semiconductor chip or the like is mounted.

[Conventional technology]

As semiconductor devices have become faster and more highly integrated in recent years, requirements have become more stringent for chip carriers and wiring boards on which these devices are mounted. Higher speeds require lower dielectric constants and characteristic impedance matching on circuits containing elements, and higher integration requires smaller wiring and pitches between terminals.

In conventional terminal boards for electronic components, the terminals are arranged in a grid to increase the degree of integration, and the pitch between the terminals is reduced to increase the number of terminals per area. FIG. 3 is an explanatory diagram of this type of conventional example. As shown in the external perspective view of FIG. Since this cannot be covered by terminals arranged only in two or four directions, a terminal board 10 with terminals arranged in a grid pattern is provided as shown in the figure, and a large number of terminal pins 11 are arranged in the same figure (b). The IC chip 13 is mounted on the top surface of the IC chip 13 and its lead wires are connected to the respective terminal pins 11. The lattice-shaped terminal pins 11 are inserted into corresponding connection holes 12 (through holes or connectors) at predetermined installation positions 12 of the printed circuit board 14 and joined or pressed together.

In this case, the number of terminals was increased as the density of IC chips increased, and the terminal pitch was made as small as possible. Therefore, in order to accommodate the required number of terminals in the groove, the outer shape of the terminal array may have to be enlarged.

[Problem to be solved by the invention]

In the above-mentioned lattice-shaped terminal board, it is not easy to further increase the density of the IC chips mounted thereon.

In the present invention, the signals at the terminals of each element of an IC chip include dynamic signals such as input/output, and static signals such as power and ground, and the dynamic signals are based on the related static potential. Taking advantage of the stabilizing effect of blocking with a conductor, the terminal pitch can be reduced by filling a high insulating material with a low dielectric constant between the terminal pin and the cylindrical terminal surrounding it. The use of this cylindrical terminal was considered because it is possible to make the number of terminals almost the same and to impose equal constraints on the number of terminals.

An object of the present invention is to provide a terminal board for electronic components in which the terminals are completely separated and the terminal density is increased by using cylindrical terminals.

[Means to solve the problem]

In order to achieve the above object, the present invention provides a terminal board for electronic components in which a semiconductor chip or the like is mounted and terminals of wiring are arranged in a lattice pattern, as shown in FIGS. As shown in the configuration, each terminal has a cylindrical terminal 21! centered around a terminal pin 211. It has a structure consisting of a pair of terminals surrounded by and filled with a low dielectric constant, high insulating material 213 between them.

[For production]

The configuration of the pair of terminals mentioned above reduces the dielectric constant to ensure high-speed signal transmission, and allocates dynamic signals to the terminal pins and static signals to the cylindrical terminals to protect them from external noise. to stabilize the signal. Furthermore, since the pitch of the pair of terminals can be set to be approximately the same as the conventional terminal pitch, a terminal density approximately twice as high can be obtained.

〔Example〕

FIGS. 2(8) to 2(6) are explanatory diagrams of the configuration of an embodiment of the present invention. The difference between FIG. 3(α) and FIG. 3(α) is the shape of the grid-like paired terminals 21 of the terminal board 10 and the terminal pads 22 in the corresponding installation portion 20 of the printed board 14.

That is, the lattice-shaped pair terminals 21 are arranged as shown in FIG. 1 (α), (
As shown in b), each terminal pin 211 is surrounded by a cylindrical terminal 212, and a low dielectric constant, high insulating material such as Teflon is filled between them. and,
Depending on the type of bonding to the printed board 14, its edges are textured. In the same figure (α), the terminal pad 22 provided on the surface wiring of the printed circuit board 14 has a shape corresponding to the terminal end surface of the notch, as shown in the enlarged view of the circle. A solder portion 25 is formed thereon and soldered to the cylindrical terminal 222, as shown in FIG.

In FIG. 1(6), the tip of the terminal pin 211 in the notch is bent I4 in a direction from the cylindrical terminal 212 to prevent a short circuit during soldering. In the same figure (C), the terminal pin 211 is inserted into the through hole of the printed board 14, and is connected to the wiring inside or on the back surface, and the cylindrical terminal is connected to the surface wiring. Note that the joining method is not limited to solder joining.

〔Effect of the invention〕

As explained above, the paired terminals of the present invention are formed into lattice-shaped terminals with the same pitch as conventional terminal pins, and each is used as two terminals, so it is possible to double the number of terminals. be equivalent. The terminal pin is used for dynamic signals such as input/output, and the cylindrical terminal is used for static signals such as power supply and ground. By filling the gap with a material having a low dielectric constant and high insulating properties, signal delay at high frequencies is reduced and the shielding effect against external noise is sufficient.

Another advantage is the improvement in mechanical strength due to the use of paired terminals.

In this way, the terminal board using the paired terminals of the present invention not only doubles the density of the grid terminals, but also improves the electrical characteristics and mechanical strength. .

[Brief explanation of the drawing]

FIGS. 1(a) to (6) are detailed explanatory diagrams of the present invention, FIGS. 2(a) and (6) are configuration explanatory diagrams of embodiments of the present invention, and FIGS. 3(α) and (6). is an explanatory diagram of a conventional example l), in the figure, 10 is a terminal board, 13 is an IC chip, 14 is a printed board, 21 is a pair terminal, 211 is a terminal pin, 211 is a cylindrical terminal, and 213 is a low dielectric constant high Insulating material, 22 is a terminal pad, 2
6 indicates solder. (bl Main parts of the present invention 1st part vv1st part Figure 1 (b) Solder joint diagram Configuration explanatory diagram of an embodiment of the present invention Figure 2

Claims (1)

[Scope of Claims] A terminal board for electronic components on which a semiconductor chip or the like is mounted and wiring terminals arranged in a grid pattern, each terminal having a terminal pin surrounded by a cylindrical terminal, and a low dielectric A terminal board for electronic components comprising a pair of separated terminals filled with a highly insulating material.