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JPH03126289A - Card edge connector of printed wiring board and manufacture thereof - Google Patents

Card edge connector of printed wiring board and manufacture thereof

Info

Publication number
JPH03126289A
JPH03126289A JP1266005A JP26600589A JPH03126289A JP H03126289 A JPH03126289 A JP H03126289A JP 1266005 A JP1266005 A JP 1266005A JP 26600589 A JP26600589 A JP 26600589A JP H03126289 A JPH03126289 A JP H03126289A
Authority
JP
Japan
Prior art keywords
copper
connector
card edge
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1266005A
Other languages
Japanese (ja)
Inventor
Akio Takahashi
高橋 明夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP1266005A priority Critical patent/JPH03126289A/en
Publication of JPH03126289A publication Critical patent/JPH03126289A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • H05K3/062Etching masks consisting of metals or alloys or metallic inorganic compounds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Manufacturing Of Printed Circuit Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To eliminate damage when inserting and extracting a connector part and improved life by performing print-wiring of an electrode terminal continuously from the wiring surface of a printed-wiring board to the tip surface of an insertion side onto the cut slant surface of a card edge connector. CONSTITUTION:A gradient surface 5a which is gradient toward the inner side as it advances toward an end face 5b is formed in wedge shape by performing cutting-machining of the edge part of a copper-clad laminated plate 4. Covering is made with a copper layer 11 by plating, a plating resist 12 is applied to a part which is level with a wiring surface 2a, a seal 13 for resist is applied only to the gradient surface 5a which does not abut on a connector contact, and other parts are covered with a copper layer 14 by plating. A pattern consisting of the part of an electrode terminal 6 and the wiring on a solder layer 15 are solder-plated, the area on the copper layer 14 is covered with a solder layer 15, and the plating resist 12 and the seal 13 are eliminated. Copper layers 11 and 14 excluding the solder-plated part are corroded by etching an insulating substance 4a is exposed for the gradient surface 5a at a part which does not abut on the connector contact. Then, the solder surface 15 is released and nickel and gold layers 16 are plated onto the copper layer 14. The tip is cut and the area between the upper and lower surfaces is separated, and solder resist printing is performed for completion.

Description

【発明の詳細な説明】 〈産業上の利用分野ン 本発明は、電子機器などで使用されるプリント配線板の
一端部に一体形成されて外部回路側のコネクタ接点間に
挿入嵌合されるカードエツジコネクタとその製造方法に
関する。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Fields> The present invention relates to a card that is integrally formed at one end of a printed wiring board used in electronic equipment, etc., and is inserted and fitted between connector contacts on an external circuit side. This article relates to an edge connector and its manufacturing method.

〈従来の技術〉 第8図は、従来の電気接続構造の一例を示したものであ
る。
<Prior Art> FIG. 8 shows an example of a conventional electrical connection structure.

この接続構造では、電子機器本体50側に設けられてい
るソケット部分としてのコネクタ51に、プリント配線
板52の一端部(エツジ部)に一体形成されたカードエ
ツジコネクタ53をプラグ部分として直接挿入嵌合させ
る構造になっている。そのコネクタ51内には、カード
エツジコネクタ53が挿入される通路を挟んで複数のコ
ネクタ接点54が配線されており、これに対してカード
エツジコネクタ53側には、コネクタ接点54に対応し
て電極端子55がプリント配線されている。そして、カ
ードエツジコネクタ53がコネクタ51内に挿入される
と、コネクタ接点54が電極端子55に圧接され電気接
続が図れるようになっている。
In this connection structure, a card edge connector 53 integrally formed at one end (edge part) of a printed wiring board 52 is directly inserted and fitted as a plug part into a connector 51 as a socket part provided on the electronic device main body 50 side. It is structured to match. Inside the connector 51, a plurality of connector contacts 54 are wired across a passage into which the CardEdge connector 53 is inserted.On the other hand, on the CardEdge connector 53 side, there are electrodes corresponding to the connector contacts 54. Terminals 55 are printed and wired. When the card edge connector 53 is inserted into the connector 51, the connector contacts 54 are pressed against the electrode terminals 55 to establish an electrical connection.

また、このカードエツジコネクタ53は、第9図および
第10図に示すように、コネクタ接点54との間に挿入
をし易くするため、そのエツジをくさび状に切削し、先
端へ向かうに従って内側へ傾斜する傾斜面を挿入側先端
に設けている。なお、このプリント配線板52は、絶縁
物152の上下面に銅箔252を積層してなる銅張積層
板で形成されている。
In addition, as shown in FIGS. 9 and 10, the edge of the card edge connector 53 is cut into a wedge shape so that it can be easily inserted between the connector contacts 54, and the edge is cut inward toward the tip. An inclined surface is provided at the insertion side tip. Note that this printed wiring board 52 is formed of a copper-clad laminate in which copper foil 252 is laminated on the upper and lower surfaces of an insulator 152.

そして、この銅張積層板からカードエツジコネクタ53
を有したプリント配線板52を作る場合は、銅張積層板
における絶縁物152上の銅箔252をエツチング処理
して電極端子55と共に配線図形を形成し、その後から
エツジを切削して傾斜面56を設けるようにしている。
Then, the card edge connector 53 is made from this copper clad laminate.
In order to make a printed wiring board 52 having a copper clad laminate, the copper foil 252 on the insulator 152 in the copper clad laminate is etched to form a wiring pattern together with the electrode terminal 55, and then the edges are cut to form the inclined surface 56. I am trying to set it up.

したがって、このカードエツジコネクタ53の傾斜面5
6には、電極端子55は形成されず、絶縁物152が露
出された状態になっている。
Therefore, the inclined surface 5 of this card edge connector 53
6, the electrode terminal 55 is not formed and the insulator 152 is exposed.

〈発明が解決しようとする課題〉 このため、カードエツジコネクタ53がコネクタ51に
脱着による抜き差しが繰り返し行われると、切削されて
表面が荒くなっている傾斜面56と、電極端子55の角
部57とで、コネクタ接点54の接触面が損傷し易く、
寿命を短くしている問題点があった。
<Problem to be Solved by the Invention> For this reason, when the card edge connector 53 is repeatedly inserted and removed from the connector 51, the inclined surface 56, which has been cut and has a rough surface, and the corner portion 57 of the electrode terminal 55 are removed. Therefore, the contact surface of the connector contact 54 is easily damaged.
There was a problem that shortened the lifespan.

本発明は上記問題点に鑑みてなされたものであり、その
目的はコネクタ部分の脱着時における損傷を少なくして
寿命を向上させることのできるカードエツジコネクタお
よびその製造方法を提供することにある。
The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a card edge connector and a method for manufacturing the same, which can reduce damage during attachment and detachment of the connector portion and improve the life of the connector.

〈課題を解決するための手段〉 上記目的を達成するため、本発明に係るカードエツジコ
ネクタは、プリント配線されるt8i端子を、コネクタ
の間に挿入されて行く方向へ進むに従って内側へ連続し
て傾斜するように切削してなる傾斜面に沿わせて、プリ
ント配線板の配線面からほぼ挿入側端面まで連続して設
けたものである。
<Means for Solving the Problems> In order to achieve the above object, the card edge connector according to the present invention continuously connects the printed wiring T8i terminals inward as they proceed in the direction in which they are inserted between the connectors. It is provided continuously from the wiring surface of the printed wiring board to almost the insertion side end surface along the sloped surface formed by cutting the wiring board so as to be inclined.

〈作用〉 この構成によれば、切削された傾斜面には、プリント配
線板の配線面から挿入側先端面まで連続して電極端子が
プリント配線される。したがって、相手側のコネクタ接
点との間に差し込まれるとき当接するカードエツジコネ
クタの部分全体が電極端子で覆われた状態になっている
ので、切削されている傾斜面上の当接部分が電極端子に
よって滑らかに形成されてコネクタ接点との摺動摩擦力
を少なくすることができる。
<Operation> According to this configuration, electrode terminals are printed and wired continuously on the cut inclined surface from the wiring surface of the printed wiring board to the insertion side tip surface. Therefore, the entire part of the card edge connector that comes into contact when it is inserted between the mating connector contacts is covered with the electrode terminal, so the contact part on the cut slope is the electrode terminal. It is formed smoothly and the sliding friction force with the connector contact can be reduced.

〈実施例〉 以下、本発明の実施例について図面を用いて詳細に説明
する。
<Example> Hereinafter, an example of the present invention will be described in detail using the drawings.

第1図は本発明に係るカードエツジコネクタを有したプ
リント配線板の概略斜視図で、第2図は第1図の■−■
線に相当する部分における拡大断面図、第3図は第1図
の■−■線に相当する部分における拡大断面図である。
Fig. 1 is a schematic perspective view of a printed wiring board having a card edge connector according to the present invention, and Fig. 2 is a schematic perspective view of the printed wiring board shown in Fig. 1.
FIG. 3 is an enlarged sectional view of a portion corresponding to the line ``---'' in FIG. 1.

そして、このカードエツジコネクタ1は、プリント配線
板2の一端部に一体に形成され、第8図乃至第10図に
示したカードエツジコネクタ53と同様に、不図示の装
置本体または接続ケーブルのコネクタなど、相手側の弾
性を有したコネクタ接点3く第2図参照)との間に抜き
差し可能に挿入嵌合させて取り付けできるようになって
いる。
The card edge connector 1 is integrally formed at one end of the printed wiring board 2, and is a connector for the device main body or connection cable (not shown), similar to the card edge connector 53 shown in FIGS. 8 to 10. It is designed to be able to be removably inserted into and attached to a mating elastic connector contact 3 (see FIG. 2).

また、カードエツジコネクタ1は、その先端部分がくさ
び状に切削形成されて、挿入される側のエツジ部5の上
下面に先端に向かうに従って内側へ傾斜する傾斜面5a
が設けられている。そして、脱着による抜き差しで相手
側のコネクタ接点3と当接する傾斜面5aの部分(以下
、「端子部」と言う)には、電極端子6がそれぞれ設け
られている。この電極端子6は、各種電子部品などが実
装されるプリント配線板2の配線面2aに形成されてい
る配線パターン(不図示)から傾斜面5aに沿って挿入
側端面5bと隣接する位置に至るまで連続した状態で緩
やかにプリント配線されてコーティングされた状態で設
けられ、コネクタ接点3との間における摺動摩擦が少な
くなるようにして形成されている(第2図参照)、これ
に対して、相手側のコネクタ接点3と当接せずに抜き差
しされる傾斜面5aの部分には、第3図に示すように電
極端子6が設けられず、単に絶縁物4だけでくさび状に
形成された状態にされる。
Further, the card edge connector 1 has a wedge-shaped distal end portion cut and formed, and an inclined surface 5a that slopes inward toward the distal end on the upper and lower surfaces of the edge portion 5 on the insertion side.
is provided. Electrode terminals 6 are provided on the portions of the inclined surface 5a (hereinafter referred to as "terminal portions") that come into contact with the mating connector contacts 3 when the connectors are inserted and removed. The electrode terminal 6 extends from a wiring pattern (not shown) formed on the wiring surface 2a of the printed wiring board 2 on which various electronic components are mounted, along the inclined surface 5a to a position adjacent to the insertion side end surface 5b. It is provided in a state where the printed wiring is loosely continuous and coated, and is formed in such a way that the sliding friction between it and the connector contact 3 is reduced (see Fig. 2). As shown in FIG. 3, the part of the inclined surface 5a that is inserted and removed without coming into contact with the mating connector contact 3 is not provided with an electrode terminal 6, but is simply formed into a wedge shape with an insulator 4. be put into a state.

したがって、このように形成されたカードエツジコネク
タ1では、相手側のコネクタ接点3と当接される部分に
対応している電極端子6がコーティングされた状態で、
プリント配線板2の配線面2aから挿入側端面5bと隣
接する位置に至るまで連続して傾斜面5aに沿ってプリ
ント配線されているので、この電極端子6によって摩擦
力を減らすことができ、脱着による抜き差し時にコネク
タ接点3との間に生ずる摺動摩擦力を少なくすることが
できる。これにより、カードエツジコネクタ1とコネク
タ接点3との間における損傷が減るとともに串耗が少な
くなり、寿命を向上させることができる。
Therefore, in the card edge connector 1 formed in this way, the electrode terminals 6 corresponding to the portions that come into contact with the mating connector contacts 3 are coated.
Since the printed wiring is continuous along the inclined surface 5a from the wiring surface 2a of the printed wiring board 2 to the position adjacent to the insertion side end surface 5b, the frictional force can be reduced by the electrode terminals 6, making it easy to attach and detach. It is possible to reduce the sliding friction force generated between the connector contact 3 and the connector contact 3 when the connector is inserted or removed. This reduces damage between the card edge connector 1 and the connector contacts 3, reduces skewer wear, and improves service life.

なお、本発明のカードエツジコネクタ1に形成する電極
端子6は、プリント配線板2の配線面2aから挿入時に
コネクタ接点3と当接しない部分となる挿入側端面5b
と隣接する位置に至るまで連続して傾斜面5bに沿って
形成したものであれば、塗布で形成しても、エツチング
またはその他の方法で形成しても良いものである。また
、その後から電極端子6に銅メッキまたは金メッキなど
をしても良いものである。
Note that the electrode terminals 6 formed in the card edge connector 1 of the present invention are inserted from the wiring surface 2a of the printed wiring board 2 to the insertion side end surface 5b, which is a portion that does not come into contact with the connector contacts 3 when inserted.
It may be formed by coating, etching, or other methods as long as it is formed continuously along the inclined surface 5b up to a position adjacent to . Further, the electrode terminals 6 may be plated with copper or gold thereafter.

次に、第4図7第5A図、第5B図は、プリント配線板
2の配線面2aから挿入側端面5bと隣接する位置に至
るまで傾斜面5aに沿って電極端子6を連続して形成し
たカートエツジコネクタを製造する方法の一実施例を示
したものである。そして、第4図はその製造工程を示し
、第5A図は相手側のコネクタ接点と当接される部分、
すなわち第1図中の■−■線に相当する端子部を第4図
の製造工程に対応させて時系列的に示したもので、第5
B図は相手側のコネクタ接点と当接しない部分すなわち
第1図中の■−■線に相当する部分における構造状態を
第4図の製造工程に対応させて時系列的に示したもので
ある。そして、第4図、第5A図、第5B図において第
1図乃至第3図と同一符号を付したものは第1図乃至第
3図と同一のものを示している。
Next, in FIG. 4, FIG. 7, FIG. 5A, and FIG. 5B, electrode terminals 6 are continuously formed along the inclined surface 5a from the wiring surface 2a of the printed wiring board 2 to a position adjacent to the insertion side end surface 5b. This figure shows an example of a method for manufacturing a cart edge connector. FIG. 4 shows the manufacturing process, and FIG. 5A shows the part that comes into contact with the mating connector contact,
In other words, the terminal portion corresponding to the line ■-■ in FIG. 1 is shown in chronological order in correspondence with the manufacturing process in FIG.
Figure B shows the structural state of the part that does not come into contact with the mating connector contact, that is, the part corresponding to the ■-■ line in Figure 1, in chronological order, corresponding to the manufacturing process in Figure 4. . In FIGS. 4, 5A, and 5B, the same reference numerals as in FIGS. 1 to 3 indicate the same parts as in FIGS. 1 to 3.

また、この製造方法は、プリント配線板を形成するとき
に良く使用されている「サブトラクティブ法」を用いる
もので、この製造工程を次に説明する。
Further, this manufacturing method uses the "subtractive method" which is often used when forming printed wiring boards, and this manufacturing process will be explained next.

まず、カードエツジコネクタ1を設けたプリント配線板
2を形成するための素材、すなわち絶縁物4aの上下面
に銅箔4bを張設してなる銅張積層板4が用意される。
First, a material for forming the printed wiring board 2 provided with the card edge connector 1 is prepared, that is, a copper-clad laminate 4 made of an insulator 4a and copper foil 4b stretched on the upper and lower surfaces thereof.

この銅張積層板4は、第5A図A1および第58図81
でそれぞれ示すように、挿入先端側に未だ傾斜面が設け
られていない状態になっている。
This copper-clad laminate 4 is shown in Fig. 5A A1 and Fig. 58 81.
As shown in the figures, the insertion tip side is not yet provided with an inclined surface.

そして、第1工程では、カードエツジコネクタ1のエツ
ジ部となる部分に切削加工を行い、この部分を挿入側端
面5bへ進に従って内側へ連続して徐々に傾斜するよう
にした傾斜面5aを上下に設けてくさび状に形成する(
同図A2.同図B2参照)。
In the first step, cutting is performed on the edge part of the card edge connector 1, and this part is cut upward and downward on the sloped surface 5a that gradually slopes inward as it advances toward the insertion side end surface 5b. to form a wedge shape (
Same figure A2. (See B2 in the same figure).

次に、第2工程では、銅張積層板4に活性化処理を施す
(同図A3.同図83参照)。
Next, in the second step, the copper-clad laminate 4 is subjected to activation treatment (see A3 in the same figure and 83 in the same figure).

第3工程では、この上がら無電解銅メッキを施し、銅張
積層板4の全体を銅層11で覆った状態にする(同図A
4.同図84参照)。
In the third step, electroless copper plating is applied to this top layer, so that the entire copper-clad laminate 4 is covered with the copper layer 11 (A in the same figure).
4. (See Figure 84).

第4工程では、配線面2aと面一な部分にメッキレジス
ト12を塗布する(同図A5.同図B5参照)。
In the fourth step, a plating resist 12 is applied to a portion flush with the wiring surface 2a (see A5 in the same figure and B5 in the same figure).

第5工程では、相手側のコネクタ接点と当接されない部
分側の傾斜面5aにだけレジスト用のシール13を貼り
付ける(同図A6.同図86参照)。
In the fifth step, the resist seal 13 is pasted only on the inclined surface 5a of the portion that does not come into contact with the mating connector contact (see A6 in the same figure and 86 in the same figure).

第6エ程では、電解銅メッキが施され、シール13が貼
り付けられた部分を除く他の部分が銅層14で覆われる
(同図A7.同図B7参照)。
In the sixth step, electrolytic copper plating is applied, and the parts other than the part to which the seal 13 is attached are covered with the copper layer 14 (see A7 in the same figure and B7 in the same figure).

第7エ程では、電極端子6となる部分と配線面2a上に
形成される配線とを一緒にしたパターンでハンダメッキ
され、f171114上がさらにハンダ層15で覆われ
る(同図A8.同図88参照〉。
In the seventh step, the portion that will become the electrode terminal 6 and the wiring formed on the wiring surface 2a are solder plated in a pattern that combines them, and the top of f171114 is further covered with a solder layer 15 (A8 in the same figure. See 88>.

第8工程では、第4工程及び第5工程でそれぞれ施され
たメッキレジスト12とシール13の除去を行う(同図
A9参照)。
In the eighth step, the plating resist 12 and seal 13 applied in the fourth and fifth steps are removed (see A9 in the same figure).

第9工程では、エツチング処理を行う、すると、ハンダ
メッキされた部分を除く他の銅層11.14が腐食され
、相手側のコネクタ接点と当接されない部分における傾
斜面5aは絶縁物4aが露出した状態になる(同図AI
O参照)。
In the ninth step, an etching process is performed, and the other copper layers 11 and 14 except the solder-plated part are corroded, and the insulator 4a is exposed on the sloped surface 5a in the part not in contact with the mating connector contact. (AI in the same figure)
(see O).

次いで、第10工程ではフュージング、第11工程では
端子部テーピングをそれぞれ経て第12工程へ進み、こ
の第12工程でハンダ層15を剥離する(同図A11.
同図B9参照)。
Next, the process proceeds to the 12th process through fusing in the 10th process and terminal taping in the 11th process, in which the solder layer 15 is peeled off (A11 in the same figure).
(See B9 in the same figure).

次に、第13工程では、ハンダ層15を剥離した端子部
の銅層14上にニッケルおよび金をメッキし、ニッケル
および金の層16を形成する(同図A12.同図BIO
参照)。
Next, in the thirteenth step, nickel and gold are plated on the copper layer 14 of the terminal part from which the solder layer 15 has been peeled off, to form a nickel and gold layer 16 (A12 in the same figure, BIO in the same figure).
reference).

第14工程では、カードエツジコネクタ1の先端を切削
し、端子部の上下面間の電気接続を切り離す(同図A1
3.同図Bll参照)。
In the 14th step, the tip of the card edge connector 1 is cut to separate the electrical connection between the upper and lower surfaces of the terminal part (A1 in the same figure).
3. (See Bll in the same figure).

最後の第15工程では、ソルダレジスト印刷がなされて
製品として完成する。
In the final 15th step, solder resist printing is performed to complete the product.

そして、このようにして形成されたカードエツジコネク
タ1では、エツジ部5を形成した後から電極端子6とな
る銅/[11,14または金の層16をメッキして形成
するようにしているので、配線面2a上の配線パターン
とつながっている電極端子6でカードエツジコネクタ1
の端子部全体が連続して覆われた状態になる。これによ
り、相手側のコネクタ接点3との接触面が滑らかになり
、摺動摩擦力を少なくすることができる。
In the card edge connector 1 thus formed, the copper/[11, 14 or gold layer 16, which will become the electrode terminal 6, is plated after the edge portion 5 is formed. , the card edge connector 1 is connected to the electrode terminal 6 connected to the wiring pattern on the wiring surface 2a.
The entire terminal section of the terminal is continuously covered. Thereby, the contact surface with the mating connector contact 3 becomes smooth, and sliding frictional force can be reduced.

次に、第6図乃至第7図B図は、カードエツジコネクタ
を製造する方法の他の実施例を示すものである。そして
、第6図はその製造工程を示し、第7A図は相手側のコ
ネクタ接点と当接される部分、すなわち第1図中の■−
■線に相当する端子部を第6図の製造工程に対応させて
示したもので、第7B図は相手側のコネクタ接点と当接
しない部分、すなわち第1図の■−■線に相当する部分
を第6図の製造工程に対応させて示したものである。ま
た、第6図、第7A図、第7B図において、第1図乃至
第3図と同一符号を付したものは第1図乃至第3図と同
一のものを示している。
Next, FIGS. 6 to 7B show another embodiment of the method for manufacturing a card edge connector. FIG. 6 shows the manufacturing process, and FIG. 7A shows the part that comes into contact with the mating connector contact, that is, the part shown in FIG.
The terminal part corresponding to the ■ line is shown in correspondence with the manufacturing process in Figure 6, and Figure 7B shows the part that does not come into contact with the mating connector contact, that is, the part corresponding to the ■ - ■ line in Figure 1. The parts are shown in correspondence with the manufacturing process shown in FIG. Further, in FIGS. 6, 7A, and 7B, the same reference numerals as in FIGS. 1 to 3 indicate the same parts as in FIGS. 1 to 3.

また、この製造方法は、プリント配線板を形成するとき
に良く使用されている「アディティブ法」を用いるもの
で、この製造工程を次に説明する。
Further, this manufacturing method uses the "additive method" which is often used when forming printed wiring boards, and this manufacturing process will be explained next.

まず、第4図、第5A図、第5B図に示した実施例と同
様に、カードエツジコネクタ1を設けた配線板2を形成
するための素材、すなわち絶縁物4aの上下面に銅箔4
bを張設してなる銅張積層板4が用意される(第7A図
C1,第78図D1参照)。
First, similarly to the embodiment shown in FIGS. 4, 5A, and 5B, copper foil 4 is placed on the upper and lower surfaces of the material for forming the wiring board 2 on which the card edge connector 1 is provided, that is, the insulator 4a.
A copper-clad laminate 4 is prepared by stretching the copper clad laminate 4 (see FIG. 7A, C1, and FIG. 78, D1).

そして、第1工程では、カードエツジコネクタ1のエツ
ジ部となる部分に切削加工を行い、この部分を挿入側端
面5b側へ進に従って内側へ連続して傾斜するようにし
た傾斜面5aを上下に設けてくさび状に形成する(同図
C2,同図D2参照)。
In the first step, cutting is performed on the edge part of the card edge connector 1, and the inclined surface 5a, which is continuously inclined inward as it advances toward the insertion side end surface 5b side, is cut vertically. It is formed into a wedge shape (see C2 and D2 in the same figure).

次に、第2工程では、銅張積層板4の上から無電解メッ
キを施し、この銅張積層板4の全体を銅層25で覆う(
同図C3,同図D3参照)。
Next, in the second step, electroless plating is applied from above the copper-clad laminate 4, and the entire copper-clad laminate 4 is covered with a copper layer 25 (
(See C3 and D3 in the same figure).

第3工程では、電解銅メッキを行って銅層25の上を銅
層26でさらに覆う(同図C4,同図D4)。
In the third step, electrolytic copper plating is performed to further cover the copper layer 25 with a copper layer 26 (C4 in the same figure, D4 in the same figure).

第4工程では、銅層25の上から電極端子6となる部分
と配線面2a上に形成される配線とを一緒にしたパター
ンでレジストを塗布する。
In the fourth step, a resist is applied from above the copper layer 25 in a pattern that includes the portion that will become the electrode terminal 6 and the wiring formed on the wiring surface 2a.

第5工程では、相手側のコネクタ接点と当接されない部
分側の挿入側端面5bと相手側のコネクタ接点と当接さ
れる端子部分とにレジスト用のシール27が貼り付けら
れる(同図C5,同図D5参照)。
In the fifth step, a resist sticker 27 is pasted on the insertion side end surface 5b of the part that does not come into contact with the mating connector contact and the terminal part that comes into contact with the mating connector contact (see C5 in the same figure). (See D5 in the same figure).

次いで、第6エ程ではエツチング処理され、レジストお
よびシール27が施されていない部分における銅層25
,26を腐食させて絶縁物4aを露出した状態にする(
同図06参照)。
Next, in the sixth step, the copper layer 25 is etched in the areas where the resist and seal 27 are not applied.
, 26 to expose the insulator 4a (
(See Figure 06).

第7エ程ではレジストおよびシール27を除去しく同図
D6参照)、第8工程では端子部にテーピングを行う。
In the seventh step, the resist and seal 27 are removed (see D6 in the same figure), and in the eighth step, the terminal portions are taped.

第9工程では、銅層26上にニッケルおよび金をメッキ
し、ニッケルおよび金の層28を形成する(同図C7,
同図D7参照)。
In the ninth step, nickel and gold are plated on the copper layer 26 to form a nickel and gold layer 28 (see C7 in the same figure).
(See D7 in the same figure).

第10工程では、カードエツジコネクタ1の先端を切断
し、端子部の上下面間の電気接続を切り離す(同図C8
,同図D8参照)。
In the 10th step, the tip of the card edge connector 1 is cut off, and the electrical connection between the upper and lower surfaces of the terminal section is separated (C8 in the same figure).
, see D8 in the same figure).

第11工程でソルダレジスト印刷を行い、最後に第12
工程でフラックスコートを行うと製品として完成する。
Solder resist printing is performed in the 11th step, and finally the 12th step
The product is completed by flux coating during the process.

したがって、この製造方法においても、エツジ部5を形
成した後からti端子6となる銅層2526または金の
層28をメッキして形成しているようにしているので、
配線面2a上の配線パターンとつながる電極端子6でカ
ードエツジコネクタ1の端子部全体が連続して覆われた
状態になる。これにより、相手側のコネクタ接点3との
接触面が滑らかになり、摺動摩擦力を少なくすることが
できる。
Therefore, in this manufacturing method as well, the copper layer 2526 or the gold layer 28 which will become the TI terminal 6 is plated and formed after the edge portion 5 is formed.
The entire terminal portion of the card edge connector 1 is continuously covered with the electrode terminals 6 connected to the wiring pattern on the wiring surface 2a. Thereby, the contact surface with the mating connector contact 3 becomes smooth, and sliding frictional force can be reduced.

なお、上記各実施例における製造方法では、電極端子6
となる部分にニッケルおよび金メッキした層16.28
を設ける場合について説明したが、電極端子6を銅層(
11,14,25,26)だけで形成しても良いもので
ある。
In addition, in the manufacturing method in each of the above embodiments, the electrode terminal 6
Nickel and gold plated layer 16.28
Although we have explained the case where the electrode terminal 6 is provided with a copper layer (
11, 14, 25, 26) may be formed alone.

〈発明の効果〉 以上説明したとおり、本発明によれば切削された傾斜面
には電極端子が、プリント配線板の配線面から挿入側端
面までプリント配線されるので、相手側のコネクタ接点
との間に差し込まれるときに当接されるカードエツジコ
ネクタの部分全体が電極端子で覆われた状態になる。こ
れにより、切削されている傾斜面上の当接部分が電極端
子によって滑らかにされてコネクタ接点との摺動摩擦力
を少なくすることができる。この結果、コネクタ部分の
脱着に伴う抜き差しによる損傷が減り、寿命を向上させ
ることができる。
<Effects of the Invention> As explained above, according to the present invention, the electrode terminals are printed on the cut inclined surface from the wiring surface of the printed wiring board to the insertion side end surface, so that there is no connection with the mating connector contacts. The entire portion of the card edge connector that comes into contact with the card edge connector when inserted between the connectors is covered with electrode terminals. Thereby, the contact portion on the cut inclined surface is smoothed by the electrode terminal, and the sliding frictional force with the connector contact can be reduced. As a result, damage caused by insertion and removal associated with the connection and removal of the connector portion is reduced, and the service life can be improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例に係るカードエツジコネクタ
を有したプリント配線板の概略外観斜視図、 第2図は第1図の■−■線に沿う拡大断面図、第3図は
第1図の■−■線に沿う拡大断面図、第4図は同上コネ
クタの製造方法に係る一実施例と示した製造工程図、 第5A図は第1図中のll−Tl線に相当する端子部を
第4図の製造工程に対応させて時系列的に示した状態図
、 第5B図は第1図中のIII−III線に相当する部分
を第4図の製造工程に対応させて時系列的に示した状態
図、 第6図は同上コネクタの製造方法に係る他の実施例を示
した製造工程図、 第7A図は第1図中の■−■線に相当する端子部を第6
図の製造工程に対応させて時系列的に示した状態図、 第7B図は第1図中の■−■線に相当する端子部を第6
図の製造工程に対応させて時系列的に示した状態図、 第8因は従来の電気接続構造の一例を示した概略構成図
、 第9図は従来のカードエツジコネクタの概略斜視図、 第10図は第9図のx−X線に沿う拡大断面図である。 1・・・カードエツジコネクタ。 2・・・プリント配線板、2a・・・配線面。 3・・・コネクタ接点、4・・・銅張積層板。 5・・・エツジ部、5a・・・傾斜面。 5b・・・挿入側端面、6・・・電極端子。 特許…願人
FIG. 1 is a schematic external perspective view of a printed wiring board having a card edge connector according to an embodiment of the present invention, FIG. 2 is an enlarged sectional view taken along the line ■-■ in FIG. 1, and FIG. 1 is an enlarged cross-sectional view taken along the line ■-■ in FIG. 1, FIG. 4 is a manufacturing process diagram showing an example of the method for manufacturing the above connector, and FIG. 5A corresponds to the ll-Tl line in FIG. 1. Figure 5B is a state diagram chronologically showing the terminal part corresponding to the manufacturing process shown in Figure 4. Fig. 6 is a manufacturing process diagram showing another embodiment of the method for manufacturing the same connector as above; Fig. 7A shows the terminal portion corresponding to the line ■-■ in Fig. 1; 6th
Figure 7B is a state diagram shown in chronological order corresponding to the manufacturing process in Figure 1.
Figure 8 is a schematic configuration diagram showing an example of a conventional electrical connection structure; Figure 9 is a schematic perspective view of a conventional card edge connector; FIG. 10 is an enlarged sectional view taken along the line xx in FIG. 9. 1...Card edge connector. 2...Printed wiring board, 2a...Wiring surface. 3... Connector contact, 4... Copper clad laminate. 5... Edge portion, 5a... Inclined surface. 5b... Insertion side end surface, 6... Electrode terminal. Patent...Applicant

Claims (2)

【特許請求の範囲】[Claims] (1)相手側のコネクタ接点に対応してプリント配線さ
れた電極端子を有するプリント配線板の一端部に一体形
成されているとともに、挿入側先端が切削されてくさび
状に形成され、相手側のコネクタ接点間に挿入嵌合され
るカードエッジコネクタにおいて、 前記切削された挿入側先端の傾斜面に沿わせて前記電極
端子を前記プリント配線板の配線面からほぼ挿入側端面
まで連続して設けたことを特徴とするプリント配線板の
カードエッジコネクタ。
(1) It is integrally formed at one end of a printed wiring board that has electrode terminals printed and wired corresponding to the connector contacts on the mating side, and the tip on the insertion side is cut to form a wedge shape. In a card edge connector that is inserted and fitted between connector contacts, the electrode terminal is provided continuously from the wiring surface of the printed wiring board to almost the insertion side end surface along the sloped surface of the cut insertion side tip. A card edge connector for a printed wiring board, which is characterized by:
(2)銅張積層板で形成されるプリント配線板の一端部
に一体に設けられて相手側のコネクタ接点間に挿入嵌合
されるカードエッジコネクタの製造方法であって、 前記コネクタ接点間に挿入嵌合される方向へ進むに従っ
て内側へ傾斜する傾斜面を有したくさび状に前記銅張積
層板のエッジを切削する工程と、前記銅張積層板全体を
銅メッキする工程と、前記銅メッキされた前記銅張積層
板の配線面から前記傾斜面を通ってほぼ挿入側端面まで
の間にわたって連続してレジスト材を設ける工程と、前
記レジスト材が設けられた前記銅張積層板をエッチング
し前記レジスト材で描かれた電極パターンを形成する工
程とを備えたことを特徴とするプリント配線板のカード
エッジコネクタの製造方法。
(2) A method for manufacturing a card edge connector that is integrally provided at one end of a printed wiring board formed of a copper-clad laminate and inserted and fitted between the connector contacts of the mating side, the method comprising: a step of cutting the edge of the copper-clad laminate into a wedge shape having an inclined surface that slopes inward in the direction of insertion and fitting; a step of plating the entire copper-clad laminate with copper; and a step of plating the copper-clad laminate with copper. a step of continuously providing a resist material from the wiring surface of the copper-clad laminate through the inclined surface to approximately the insertion side end surface; and etching the copper-clad laminate provided with the resist material. A method for manufacturing a card edge connector for a printed wiring board, comprising the step of forming an electrode pattern drawn with the resist material.
JP1266005A 1989-10-12 1989-10-12 Card edge connector of printed wiring board and manufacture thereof Pending JPH03126289A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1266005A JPH03126289A (en) 1989-10-12 1989-10-12 Card edge connector of printed wiring board and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1266005A JPH03126289A (en) 1989-10-12 1989-10-12 Card edge connector of printed wiring board and manufacture thereof

Publications (1)

Publication Number Publication Date
JPH03126289A true JPH03126289A (en) 1991-05-29

Family

ID=17425047

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1266005A Pending JPH03126289A (en) 1989-10-12 1989-10-12 Card edge connector of printed wiring board and manufacture thereof

Country Status (1)

Country Link
JP (1) JPH03126289A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0557785U (en) * 1992-01-13 1993-07-30 日本エー・エム・ピー株式会社 Low insertion force type connector
US6855891B2 (en) 2001-10-31 2005-02-15 Fujitsu Limited Card edge connector, method of manufacturing same, electronic card and electronic equipment
WO2007039039A1 (en) * 2005-09-19 2007-04-12 Tyco Electronics Nederland B.V. Electrical connector
WO2009025059A1 (en) * 2007-08-23 2009-02-26 Fujitsu Limited Printed board and method for producing the same
WO2011134701A1 (en) * 2010-04-28 2011-11-03 International Business Machines Corporation Printed circuit board edge connector
CN110875534A (en) * 2018-09-03 2020-03-10 住友电装株式会社 Terminal, connector for substrate, substrate with connector, and method for manufacturing terminal

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0557785U (en) * 1992-01-13 1993-07-30 日本エー・エム・ピー株式会社 Low insertion force type connector
US6855891B2 (en) 2001-10-31 2005-02-15 Fujitsu Limited Card edge connector, method of manufacturing same, electronic card and electronic equipment
WO2007039039A1 (en) * 2005-09-19 2007-04-12 Tyco Electronics Nederland B.V. Electrical connector
WO2009025059A1 (en) * 2007-08-23 2009-02-26 Fujitsu Limited Printed board and method for producing the same
WO2011134701A1 (en) * 2010-04-28 2011-11-03 International Business Machines Corporation Printed circuit board edge connector
GB2492490A (en) * 2010-04-28 2013-01-02 Ibm Printed circuit board edge connector
GB2492490B (en) * 2010-04-28 2014-03-12 Ibm Printed circuit board edge connector
US8677617B2 (en) 2010-04-28 2014-03-25 International Business Machines Corporation Printed circuit board edge connector
US9549469B2 (en) 2010-04-28 2017-01-17 International Business Machines Corporation Printed circuit board edge connector
US9693457B2 (en) 2010-04-28 2017-06-27 International Business Machines Corporation Printed circuit board edge connector
US9814140B2 (en) 2010-04-28 2017-11-07 International Business Machines Corporation Printed circuit board edge connector
CN110875534A (en) * 2018-09-03 2020-03-10 住友电装株式会社 Terminal, connector for substrate, substrate with connector, and method for manufacturing terminal

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