JPH03152967A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To enable a large number of electrical connections between a wiring board and IC chips to be collectively executed so as to improve an integrated circuit device in density by a method wherein a wiring plate which covers the IC chips and a part of the wiring board together is provided, and the joining of parts is carried out through conductor bumps. CONSTITUTION:A recess is provided to a wiring board 2 so as to make the upside of the recess level with the upside of an IC chip 1 mounted in the recess. A wiring plate 3 on which a circuit has been formed is made to overlap the upside of the wiring board 2 mounted with the IC chip 1 making wirings 4 or electrode pads 5 face each other respectively and to enable the wirings 4 and the electrode pads 5 to be connected together through the intermediary of conductor bumps 6 such as solder bumps or the like formed on the upside or the underside of the joints concerned covering the chip 1 and the board 2 together. By this setup, a large number of electrical connections can be collectively carried out throughout IC chips, so that an integrated circuit can be improved in density.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hybrid integrated circuit device, and particularly to a hybrid integrated circuit device having a high-density mounting structure of IC chips.

[Conventional technology]

FIG. 4 is a longitudinal sectional view of an example of a conventional hybrid integrated circuit device.

A conventional hybrid integrated circuit device, as shown in FIG.
Chip 1 is die-bonded to wiring board 2, and the IC
Electrode pads 5 formed on chip 1 and wiring 4 of wiring board 2 were electrically connected by bonding wires 8.

[Problem to be solved by the invention]

In the above-mentioned conventional hybrid integrated circuit device, the number of connections is small because the connection between the electrode pad on the IC chip and the bonding pad on the wiring board is performed in one wire bonding process separately from other pairs. wire bonding must be performed, and the time required for wire bonding increases in proportion to the number of connections. For this reason, there is a drawback that it takes a lot of time when manufacturing an IC chip with a large number of connections or a hybrid integrated circuit device using a large number of IC chips.

Furthermore, since wire bonding is used, it is difficult to create a three-dimensional mounting structure, and even if a hybrid integrated circuit device is made with a three-dimensional mounting structure, it will be thick.

An object of the present invention is to provide a hybrid integrated circuit device that can realize a thin three-dimensional mounting structure in a short time.

[Means to solve the problem]

In the hybrid integrated circuit device of the present invention, a wiring board that simultaneously covers at least a part of a wiring board and an IC chip mounted on the wiring board is electrically connected to the wiring board and the IC chip via conductor bumps. [Embodiments] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a longitudinal sectional view of a first embodiment of the invention.

In the first embodiment, as shown in FIG. 1, a recess is provided in the wiring board 2, and the wiring board 2 is placed so that the top surface of the IC chip 1 and the top surface of the recess of the wiring board 2 are at the same height. The IC chip 1 is mounted in the recess.

From the top surface of the wiring board 2 on which this IC chip 1 is mounted, the wiring board 3, which has a circuit formed on a flat board, is aligned so that the wiring 4 or electrode pad 5 faces each other, and the top surface of each joint is Alternatively, one or more IC chips 1 and the wiring board 2 are connected so as to be covered at the same time via the conductor bumps 6 formed on the lower surface.

These connections can be made all at once by using, for example, solder bumps as the conductor bumps 6 and heating and melting them.

FIG. 2 is a longitudinal sectional view of a second embodiment of the invention.

In the second embodiment, as shown in FIG.
The wiring board 12 is die-bonded onto the wiring board 12 and covered with a case-shaped wiring board 13 having four parts with wiring 4 formed therein, and the wiring board 13 and the IC chips 1. It is electrically connected to the wiring board 12 via conductor bumps 6.

A sealing resin 7 is poured between the wiring board 12 and the outer periphery of the case-like wiring board 13 to seal the inside.

Therefore, in this embodiment, the ordinary flat wiring board 12
It has the advantage that it can be used for electrical connection and sealing.

FIG. 3 is a longitudinal sectional view of a third embodiment of the invention.

As shown in FIG. 3, the third embodiment has the same partial structure as the first embodiment, but wiring is provided on both sides of the wiring board 2, and this wiring board 2 is similar to the first embodiment. It can also serve as the wiring board 3 in the example, and is bonded to another wiring board 22 using the same connection method as in the first example to form a multilayer structure.

Therefore, in this embodiment, a hybrid integrated circuit in which the IC chips 1 are arranged three-dimensionally can be formed easily and thinly.

In other words, in connection using bonding wire, the loop height of the bonding wire and an extra height to prevent the bonding wire from touching other parts are required, and the total of these is 0.5 mm or more. , if the structure of this embodiment is adopted, the height is 0.1. mm or less, the thickness can be made thinner by 0.4 mm or more per layer, and the structure can be constructed without defects caused by the bonding wires such as electrical short circuits due to the falling of the bonding wires.

〔Effect of the invention〕

As explained above, the present invention uses a wiring board that covers at least part of an IC chip and a wiring board at the same time, and connects each part with conductor bumps, thereby making a large number of electrical connections across multiple IC chips. There is an effect that can be done all at once.

In addition, by stacking this structure, it is possible to easily realize a three-dimensional mounting structure for thin and thin IC chips, and as a result, the wiring board becomes multilayered, which further increases the density. This has the effect of making a hybrid integrated circuit device.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view of a first embodiment of the present invention, FIG. 2 is a longitudinal sectional view of a second embodiment of the invention, and FIG. 3 is a longitudinal sectional view of a third embodiment of the invention.
FIG. 4 is a vertical cross-sectional view of an embodiment of the conventional hybrid integrated circuit.
FIG. 3 is a longitudinal cross-sectional view of an example of a C chip mounting section. 1...IC chip, 2,12.22...wiring board, 3
,] 3... Wiring board, 4... Wiring, 5... Electrode pad, 6... Conductor hump, 7... Sealing resin, 8... Bonding wire.

Claims (1)

[Claims] At least a part of the wiring board and an I mounted on the wiring board
A hybrid integrated circuit device characterized in that a wiring board that simultaneously covers a C chip is electrically connected to the wiring board and the IC chip via conductor bumps.