JPH0325925B2 - - Google Patents
Info
- Publication number
- JPH0325925B2 JPH0325925B2 JP19020086A JP19020086A JPH0325925B2 JP H0325925 B2 JPH0325925 B2 JP H0325925B2 JP 19020086 A JP19020086 A JP 19020086A JP 19020086 A JP19020086 A JP 19020086A JP H0325925 B2 JPH0325925 B2 JP H0325925B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- copper
- coating layer
- layer
- plating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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- Details Of Resistors (AREA)
Description
【発明の詳細な説明】
技術分野
本発明は、接続端子を有するたとえばコンデン
サなどの電子部品に関する。TECHNICAL FIELD The present invention relates to electronic components, such as capacitors, having connection terminals.
従来技術
典型的な従来技術の電子部品の端子構造は、第
３図に示される。電子部品等に接続された端子１
は、銅系材料から成る基材２上に、第１の被覆層
であるニツケルめつき層３と、第２の被覆層であ
る錫または半田めつき層４とで構成される。Prior Art A typical prior art electronic component terminal structure is shown in FIG. Terminal 1 connected to electronic components, etc.
consists of a nickel plating layer 3, which is a first covering layer, and a tin or solder plating layer 4, which is a second covering layer, on a base material 2 made of a copper-based material.
発明が解決すべき問題点
上述のような従来技術では、端子１の曲げ加工
を行つた場合、ニツケルめつき層３は、基材２お
よび錫または半田めつき層４に比べて展延性に乏
しいため、曲折部分５のニツケルめつき層３でク
ラツク６が発生し、このクラツク６は、めつき層
３，４部分だけでなく基材２にまで及び、端子の
折損を招いていた。Problems to be Solved by the Invention In the prior art as described above, when the terminal 1 is bent, the nickel plating layer 3 has poor malleability compared to the base material 2 and the tin or solder plating layer 4. As a result, cracks 6 occur in the nickel plating layer 3 at the bent portion 5, and the cracks 6 extend not only to the plating layers 3 and 4 but also to the base material 2, causing breakage of the terminal.
本発明の目的は、曲げ加工に強い端子構造を有
する電子部品を提供することである。 An object of the present invention is to provide an electronic component having a terminal structure that is resistant to bending.
問題点を解決するための手段
本発明は、電子部品本体に取付けられる端子の
少なくとも屈曲部分は、銅系材料から成る基材の
外周面に、
銅系材料から成る第１の被覆層と、
ニツケルから成る第２の被覆層と、
銅系材料から成る第３の被覆層と、
錫または半田から成る第４の被覆層とが形成さ
れて成ることを特徴とする電子部品である。Means for Solving the Problems According to the present invention, at least the bent portion of a terminal attached to an electronic component main body includes a first coating layer made of a copper-based material on the outer peripheral surface of a base material made of a copper-based material, and a nickel-based material. An electronic component characterized by comprising: a second coating layer made of a copper-based material; and a fourth coating layer made of tin or solder.
作 用
本発明に従えば、基材を覆うニツケルから成る
第２の被覆層の前後を、銅系材料から成る第１お
よび第３被覆層で挟込んで端子を形成する。Function According to the present invention, a terminal is formed by sandwiching the front and back of the second covering layer made of nickel that covers the base material between the first and third covering layers made of a copper-based material.
実施例
第２図は、本発明の一実施例の電解コンデンサ
２０を、配線基板２７に取付けたときの断面図で
ある。電解コンデンサ２０の陽極端子１０は、コ
ンデンサ素子２２内の陽極体から引出され、タン
タルなどの材料より成るリード線２３に接続され
る。陰極端子１１は、コンデンサ素子２２の陰極
である外周面と半田または導電性接着剤２５によ
つて接続される。コンデンサ素子２２の周囲は、
外被材である樹脂層２６で覆われ、その両端から
は、端子１０，１１がそれぞれ突出される。端子
１０，１１は帯状に形成され、基板２７上に形成
された導体２９と、半田３０によつて固定され、
かつ電気的に接続される。Embodiment FIG. 2 is a cross-sectional view of an electrolytic capacitor 20 according to an embodiment of the present invention attached to a wiring board 27. The anode terminal 10 of the electrolytic capacitor 20 is drawn out from the anode body within the capacitor element 22 and connected to a lead wire 23 made of a material such as tantalum. The cathode terminal 11 is connected to the outer peripheral surface of the capacitor element 22, which is a cathode, by solder or conductive adhesive 25. The area around the capacitor element 22 is
It is covered with a resin layer 26 which is an outer cover material, and terminals 10 and 11 are respectively protruded from both ends thereof. The terminals 10 and 11 are formed in a band shape and are fixed to a conductor 29 formed on a substrate 27 with solder 30.
and electrically connected.
コンデンサ素子２２は、タンクル粉末を加圧・
成型後、焼結して多孔質体に形成された陽極体の
表面に、誘電体の酸化皮膜を形成し、さらに二酸
化マンガン等の半導体層、カーボン層、陰極層の
順に積層して構成される。 The capacitor element 22 pressurizes and
After molding, a dielectric oxide film is formed on the surface of the anode body, which is sintered to form a porous body, and then a semiconductor layer such as manganese dioxide, a carbon layer, and a cathode layer are laminated in this order. .
第１図は、端子１１の屈曲部分３２付近の断面
図である。端子１０，１１は、銅系材料から成る
基材１２上に、第１の被覆層である銅ストライク
めつき層１３と、第２の被覆層であるニツケルめ
つき層１４と、第３の被覆層である銅ストライク
めつき層１５と、第４の被覆層である錫または半
田めつき層１６とが、前記順序で積層されて構成
される。ニツケルめつき層１４は、タンタルなど
の材料より成るリード線２３との溶接を安定させ
るために施される。錫または半田めつき層１６
は、配線基板２７上での半田３０との接合性を改
善する。 FIG. 1 is a sectional view of the vicinity of the bent portion 32 of the terminal 11. Terminals 10 and 11 have a copper strike plating layer 13 as a first coating layer, a nickel plating layer 14 as a second coating layer, and a third coating layer on a base material 12 made of a copper-based material. The copper strike plating layer 15, which is a layer, and the tin or solder plating layer 16, which is a fourth covering layer, are laminated in the above order. The nickel plating layer 14 is applied to stabilize welding with the lead wire 23 made of a material such as tantalum. Tin or solder plating layer 16
improves the bondability with the solder 30 on the wiring board 27.
上述のように構成された電解コンデンサ２０を
電子機器等の配線基板２７に取付けるにあたつ
て、参照符３１，３２，３３，３４で示される部
分には、曲げ加工が施される。このとき屈曲部分
３２の断面は第１図に示されるように、ニツケル
めつき層１４には、クラツク３５が発生する場合
がある。このような場合でも、ニツケルよりも展
延性に富む銅ストライクめつき層１３，１５に
は、クラツク３５に起因したクラツクは発生しな
い。 When attaching the electrolytic capacitor 20 configured as described above to a wiring board 27 of an electronic device or the like, portions indicated by reference numerals 31, 32, 33, and 34 are bent. At this time, the cross section of the bent portion 32 is shown in FIG. 1, and cracks 35 may occur in the nickel plating layer 14. Even in such a case, cracks caused by the cracks 35 do not occur in the copper strike plating layers 13 and 15, which have better malleability than nickel.
したがつて前述の従来技術で示されたように、
基材１２および錫または半田めつき層１６にまで
は、クラツクが及ぶことがなく、これによつて端
子１１の折損は抑止されている。 Therefore, as shown in the prior art described above,
The crack does not extend to the base material 12 and the tin or solder plating layer 16, thereby preventing the terminal 11 from breaking.
銅ストライクめつき層１３，１５は、曲げ加工
が施される部分についてのみ実施されてもよい。 The copper strike plating layers 13, 15 may be applied only to the portions to be bent.
本件発明者の実験によれば、従来技術の構造を
有する端子と、本発明に従つた構造を有する端子
とに、くり返し折り曲げ試験を行なつた結果、従
来技術の構造を有する端子に比して本発明に従つ
た構造を有する端子では３倍から５倍以上にくり
返し折り曲げ強度が改善された。 According to experiments conducted by the inventor of the present invention, repeated bending tests were conducted on terminals having the structure of the prior art and terminals having the structure according to the present invention. In the terminals having the structure according to the present invention, the repeated bending strength was improved by 3 to 5 times or more.
効 果
以上のように本発明によれば、基材を覆うニツ
ケルから成る第２の被覆層の前後を、格段に展延
性を有する銅系材料から成る第１および第３被覆
層で挟込んで端子を構成したため、曲げ加工に対
する電子部品の端子の強度が飛躍的に向上され
る。Effects As described above, according to the present invention, the second coating layer made of nickel that covers the base material is sandwiched between the first and third coating layers made of a copper-based material having extremely ductility. Due to the structure of the terminal, the strength of the terminal of the electronic component against bending is dramatically improved.
第１図は端子１１の屈曲部分３２付近の断面
図、第２図は本発明の一実施例の電解コンデンサ
２０を配線基板２７に取付けたときの断面図、第
３図は従来技術の電子部品の端子構造を示す断面
図である。
１０，１１……端子、１２……基材、１３，１
５……銅ストライクめつき層、１４……ニツケル
めつき層、１６……錫または半田めつき層、２０
……電解コンデンサ、２２……コンデンサ素子、
３１，３２，３３，３４……屈曲部分、３５……
クラツク。
FIG. 1 is a cross-sectional view of the vicinity of the bent portion 32 of the terminal 11, FIG. 2 is a cross-sectional view of an electrolytic capacitor 20 according to an embodiment of the present invention attached to a wiring board 27, and FIG. 3 is a conventional electronic component. FIG. 3 is a sectional view showing the terminal structure of FIG. 10, 11... terminal, 12... base material, 13, 1
5... Copper strike plating layer, 14... Nickel plating layer, 16... Tin or solder plating layer, 20
... Electrolytic capacitor, 22 ... Capacitor element,
31, 32, 33, 34...Bending portion, 35...
Kratsk.
Claims (1)
も屈曲部分は、銅系材料から成る基材の外周面
に、 銅系材料から成る第１の被覆層と、 ニツケルから成る第２の被覆層と、 銅系材料から成る第３の被覆層と、 錫または半田から成る第４の被覆層とが形成さ
れて成ることを特徴とする電子部品。[Claims] 1. At least the bent portion of the terminal to be attached to the electronic component main body includes, on the outer peripheral surface of a base material made of a copper-based material, a first coating layer made of a copper-based material, and a second coating layer made of nickel. An electronic component comprising: a coating layer; a third coating layer made of a copper-based material; and a fourth coating layer made of tin or solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19020086A JPS6345812A (en) | 1986-08-13 | 1986-08-13 | electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19020086A JPS6345812A (en) | 1986-08-13 | 1986-08-13 | electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6345812A JPS6345812A (en) | 1988-02-26 |
| JPH0325925B2 true JPH0325925B2 (en) | 1991-04-09 |
Family
ID=16254118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19020086A Granted JPS6345812A (en) | 1986-08-13 | 1986-08-13 | electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6345812A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11135226A (en) * | 1997-10-27 | 1999-05-21 | Harness Syst Tech Res Ltd | Manufacturing method of mating connection terminals |
| JP3562719B2 (en) * | 2001-11-13 | 2004-09-08 | 矢崎総業株式会社 | Terminal |
| JP4814552B2 (en) * | 2005-06-13 | 2011-11-16 | Ｄｏｗａメタルテック株式会社 | Surface treatment method |
| JP4767066B2 (en) * | 2006-03-31 | 2011-09-07 | 中国電力株式会社 | Buried object marking device |
| JP4880431B2 (en) * | 2006-11-27 | 2012-02-22 | ニチコン株式会社 | Chip-shaped solid electrolytic capacitor |
-
1986
- 1986-08-13 JP JP19020086A patent/JPS6345812A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6345812A (en) | 1988-02-26 |
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