JPH0353858U - - Google Patents
Info
- Publication number
- JPH0353858U JPH0353858U JP1989114666U JP11466689U JPH0353858U JP H0353858 U JPH0353858 U JP H0353858U JP 1989114666 U JP1989114666 U JP 1989114666U JP 11466689 U JP11466689 U JP 11466689U JP H0353858 U JPH0353858 U JP H0353858U
- Authority
- JP
- Japan
- Prior art keywords
- base material
- semiconductor base
- light emitting
- insulating substrate
- conductor pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Description
第１図は本考案に係るＬＥＤアレイプリントヘ
ツドの断面図、第２図ａ，ｂは従来のＬＥＤチツ
プの一部を示す平面図と断面図、第３図は従来の
ＬＥＤアレイプリントヘツドの断面図、第４図は
本考案の他の実施例を示す断面図、第５図は本考
案のさらに他の実施例を示す断面図である。
１……電極、２……半導体母材、３……発光部
、５……絶縁膜、６……発光部電極、８……絶縁
基板、９，１０，１６，１８……導体パターン、
１１……ＬＥＤチツプ、１２，１７……ボンデイ
ングワイヤ、１４……樹脂被膜、１５……ＩＣド
ライバ。
Fig. 1 is a cross-sectional view of an LED array print head according to the present invention, Fig. 2 a and b are a plan view and a cross-sectional view showing a part of a conventional LED chip, and Fig. 3 is a cross-section of a conventional LED array print head. FIG. 4 is a cross-sectional view showing another embodiment of the present invention, and FIG. 5 is a cross-sectional view showing still another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Electrode, 2... Semiconductor base material, 3... Light emitting part, 5... Insulating film, 6... Light emitting part electrode, 8... Insulating substrate, 9, 10, 16, 18... Conductor pattern,
11...LED chip, 12, 17...bonding wire, 14...resin coating, 15...IC driver.
Claims (1)
部と、 上記半導体母材上に形成された発光部電極と、 上記発光部電極又は上記導体パターンに接続さ
れるワイヤとを有するＬＥＤアレイプリントヘツ
ドにおいて、 上記導体パターン表面、上記ワイヤ表面及び上
記発光部を除く半導体母材表面を覆う樹脂被膜を
設けたことを特徴とするＬＥＤアレイプリントヘ
ツド。[Claims for Utility Model Registration] An insulating substrate, a conductor pattern provided on the insulating substrate, a semiconductor base material provided on the insulating substrate, and a light emitting material formed at a predetermined position on the semiconductor base material. a light emitting part electrode formed on the semiconductor base material; and a wire connected to the light emitting part electrode or the conductor pattern, the surface of the conductor pattern, the surface of the wire, and the light emitting part electrode formed on the semiconductor base material; An LED array print head characterized in that a resin coating is provided to cover the surface of a semiconductor base material except for the parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989114666U JPH0353858U (en) | 1989-09-29 | 1989-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989114666U JPH0353858U (en) | 1989-09-29 | 1989-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0353858U true JPH0353858U (en) | 1991-05-24 |
Family
ID=31663022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989114666U Pending JPH0353858U (en) | 1989-09-29 | 1989-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353858U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001024231A (en) * | 1999-07-12 | 2001-01-26 | Nippon Sheet Glass Co Ltd | Light emitting element array device |
| JP2009055006A (en) * | 2007-07-27 | 2009-03-12 | Nichia Corp | Light emitting device and manufacturing method thereof |
| JP2011146480A (en) * | 2010-01-13 | 2011-07-28 | Nichia Corp | Light-emitting device and manufacturing method of light-emitting device |
| WO2014080583A1 (en) * | 2012-11-21 | 2014-05-30 | 信越半導体株式会社 | Light-emitting apparatus and method for manufacturing same |
| JP2015062261A (en) * | 2010-08-25 | 2015-04-02 | 日亜化学工業株式会社 | Light emitting device |
| US9306127B2 (en) | 2010-08-25 | 2016-04-05 | Nichia Corporation | Light emitting device that includes protective film having uniform thickness |
| JP2019009171A (en) * | 2017-06-21 | 2019-01-17 | スタンレー電気株式会社 | Semiconductor device |
-
1989
- 1989-09-29 JP JP1989114666U patent/JPH0353858U/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001024231A (en) * | 1999-07-12 | 2001-01-26 | Nippon Sheet Glass Co Ltd | Light emitting element array device |
| JP2009055006A (en) * | 2007-07-27 | 2009-03-12 | Nichia Corp | Light emitting device and manufacturing method thereof |
| JP2011146480A (en) * | 2010-01-13 | 2011-07-28 | Nichia Corp | Light-emitting device and manufacturing method of light-emitting device |
| JP2015062261A (en) * | 2010-08-25 | 2015-04-02 | 日亜化学工業株式会社 | Light emitting device |
| US9306127B2 (en) | 2010-08-25 | 2016-04-05 | Nichia Corporation | Light emitting device that includes protective film having uniform thickness |
| WO2014080583A1 (en) * | 2012-11-21 | 2014-05-30 | 信越半導体株式会社 | Light-emitting apparatus and method for manufacturing same |
| JP2019009171A (en) * | 2017-06-21 | 2019-01-17 | スタンレー電気株式会社 | Semiconductor device |