JPH036053A - Trimmed resistor and adjustment of its resistance value - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a trimming resistor provided in a semiconductor integrated circuit and adjustment of its resistance value (hereinafter referred to as trimming).
Regarding the method.

<Prior art> When the circuit characteristics of a conventional semiconductor integrated circuit are determined by the resistance value in the circuit (for example, in the case of an analog-to-digital converter), a high-precision resistor is required, so trimming the resistance value is necessary. has been done.

In a conventional trimming resistor, a resistor section for trimming is constructed as shown in FIG.

In Fig. 5, 1 and 2.3 are resistance values RIR2 and R, respectively.
3 is the resistance layer, 4.5 is the connection point 6 on one side of the resistance layer 1, 2.3
, 7.8, and 9.10 are the resistance layers 1 and 2.
．． 14 is the pad of the first electrode 4 connected to the P+ type layer 16 of the Zener diode 15; 17 is the Zener diode 1;
5 N+ type layer 18 and Zener diode 19 P4
The pad of the second electrode 10 connected to the type layer 20, 21 the pad of the first electrode 5 connected to the N+ type layer 22 of the Zener diode 19, 23.24 the Zener diode 15.1
25.26 shows the connection point of the Zener diode +5.19 and the N+ type layer 1822.

When trimming, for example, ~resistance layer 1
．． If the value of the series resistor 2.3 is larger by R2 than the resistance value required from the circuit characteristics, an excessive current is passed through the pad 14.17, destroying the junction of the Zener diode 15 and shorting it, thereby reducing R2 to O. to obtain the desired resistance value.

<Problems to be Solved by the Invention> However, in the above-mentioned conventional technology, when the Zener diode junction breaks down, the junction breakdown does not occur completely, and the withstand voltage of the junction between the pad and the Zener diode recovers after trimming, or the Zener diode junction breaks down. Surge current when the junction with the diode breaks down may damage the semiconductor integrated circuit.

SUMMARY OF THE INVENTION In view of the above-mentioned problems, it is an object of the present invention to provide a trimming resistor and a method for trimming its resistance value, which can trim the resistance value of a semiconductor integrated circuit with high accuracy and reduce damage to the semiconductor integrated circuit.

A unique means for solving the problem > The means for solving the problem according to claim 1 of the present invention is shown in Fig. 2 (aXb
), one side connection point 33 of the low resistance layer 30, 31, 32,
a first electrode 36.37 for shorting connected to 34.35;
Resistance layer 30.31.32 other side connection point 38.39.40
The second short-circuiting electrodes 41 and 42 connected to the electrodes are placed close together to the extent that they can be electrically insulated, and the first electrode 36.37 and the second electrode 41.4-2 are connected by a conductor 47. This short-circuits the resistance layers 30, 31, and 32 to adjust the resistance value.

Further, the problem solving means according to claim 2 of the present invention is as follows.
．． 4 As shown in Figure 4, a resistive layer 30 provided within the semiconductor integrated circuit
．． 31.32 and electrodes 36, 37, 41.42, the resistor layer 30.31.32
A first short-circuiting electrode 36.37 connects the connection points 33, 34.35 on one side and a second electrode 41 for short-circuiting connects the connection points 38, 39, 4Q on the other side of the resistance layer 30.31.32. .4
2, the first electrode 36,37 and the second electrode 41
．． 42 are arranged close enough to each other to be electrically insulated.

<Function> In the above problem solving means, for example, the resistance layer 30, 31
．． When the value of the series resistance 32 is larger by the resistance value rise R2 required from the circuit characteristics, the conductor 47 is connected across both the first electrode 36 and the second electrode 42.

In this case, the resistance layer 31 is short-circuited, the resistance value R2 is reduced, and the trimming adjustment is completed.

Further, if the value of the series resistance of the resistance layers 30, 31, 32 is larger by the resistance value increase R2, R3 required from the circuit characteristics, in addition to the first electrode 36 and the second electrode 42, the first electrode 37 and the second electrode 42 also connects the conductor 47, the resistance layer 31
．． 32 is short-circuited, the resistance values R2 and R3 are reduced, and the trimming adjustment is completed.

In this way, by connecting the conductor 47 across both the first electrode 36, 37 and the second electrode 42 to short-circuit the resistance layer 31, 32 that requires trimming adjustment, it is possible to trim the resistance value in a conventional manner. It is no longer necessary to flow an excessive current through the semiconductor integrated circuit, and the semiconductor integrated circuit is not damaged.

Furthermore, since the resistance layers to be shorted can be completely shorted, the resistance value can be trimmed with high precision.

<Example> Embodiments of the present invention will be described below with reference to the drawings.

[First Embodiment] First, the first embodiment of the present invention is shown in FIGS. 1 and 2(a).
The explanation will be based on (b).

FIG. 1 is a plan view of a trimming resistor according to the first embodiment of the present invention;
FIG. 2(a) is an enlarged plan view of the main part showing a trimmed state, and FIG. 2(b) is a sectional view taken along the line AA in FIG. 2(a).

As shown in FIG. 1, the trimming resistor of this embodiment is provided in a semiconductor integrated circuit and consists of resistive layers 30, 31, 32 and electrodes 36, 37, 42.
A first shorting electrode 36.37 that connects the connection points 33, 34.35 on one side to each other, and a second electrode 42 for shorting that connects the connection points 38, 39.40 on the other side of the resistance layer 31.32 to each other.
The first electrode 36, 37 and the second electrode 42 are arranged close to each other within an electrically insulating range (for example, 5 μm).

The electrodes 36, 37, 42 are made of metal, and the wirings 43, 4 connect the resistance layers 30, 31, 32 in series, respectively.
4.46, and abbreviated bonding pads 48, 49, 50, and 51 extending from the wirings 43, 44, and 46 and connected by a conductor 47 when the resistance layer 31.32 is short-circuited.

And said pad 4.8.50 and pad 49°51
The distance between them is such that they are placed close to each other within a range that allows electrical insulation.

In addition, in FIG. 1, 45 is a metal wiring connected to the other side connection point 38 of the resistance layer 30.

Next, a method for trimming the resistance value of the trimming resistor will be explained based on FIGS. 2(a) and 2(b).

For example, if the value of the series resistance of the resistance layer 30, 31, 32 is greater by the resistance value rise R2 required from the circuit characteristics, as shown in FIG. Gold ball) 47 is connected. However, the conductor 47 is not connected to the pads 49 and 51 to maintain an insulated state.

In this case, the resistance layer 3I will not be short-circuited, and the resistance value R
It becomes smaller by 2 minutes and the trimming adjustment is completed.

Further, if the value of the series resistance of the resistance layers 30, 31.32 is larger than the resistance value required from the circuit characteristics by It, 2, R3, the conductor 47 is connected to the pad 49.51 in addition to the bat 48.50. Then, the resistance layer 3132 is short-circuited and the resistance values R2 and R3 are reduced to complete the trimming adjustment.

In this way, by connecting the conductor 47 across both the first electrode 36, 37 and the second electrode 42 to short-circuit the resistance layer 31, 32 that requires trimming adjustment, it is possible to trim the resistance value in a conventional manner. It is no longer necessary to flow an excessive current through the semiconductor integrated circuit, and the semiconductor integrated circuit is not damaged.

Furthermore, since the resistance layers to be shorted can be completely shorted, the resistance value can be trimmed with high precision.

[Second Embodiment] Next, a second embodiment of the present invention will be described based on FIG. 3.

FIG. 3 is an enlarged plan view of a pad of a trimming resistor according to a second embodiment of the present invention.

As shown in the figure, the trimming resistor of this example has the first electrode 3
A concave portion 52 is formed in the pad 48 and 49 of 6.37, and a convex portion 53 that engages with the concave portion 52 is the pad 5 of the second electrode 42.
0.51, and the first electrode 36, 37 and the second electrode 42 are provided in a comb shape.

In the above configuration, for example, if the alignment accuracy of the conductor 47 is a problem when connecting the conductor 47 across both pads 48 and 50, the concave portion 52 of the pad 48
By arranging and combining the convex portion 53 of the pad 50 and the convex portion 53 of the pad 50 as close as possible to the extent that electrical insulation is possible, the conductor 47
Positioning can be performed with high precision.

At this time, the width of the portions of the pads 48 and 50 corresponding to the comb-shaped teeth needs to be smaller than the diameter of the conductor (gold ball) 47.

Other configurations, functions, and effects are the same as in the first embodiment.

Further, the same effect can be obtained even if the pads 48, 49, 50, 51 are shaped as shown in FIG.

It should be noted that the present invention is not limited to the above embodiments, and it goes without saying that many modifications and changes can be made to the above embodiments within the scope of the present invention.

For example, in the above embodiment, the number of resistance layers is three and the number of pads is four, but this combination may be increased or decreased according to desired resistance value accuracy or circuit characteristics.

The conductor 47 used for the pad may be made of any conductive material other than gold balls, and the method of forming the conductor 47 is not limited to wire bonding, but may also include ion beam method, photo-CVD method, etc. good.

<Effects of the Invention> As is clear from the explanation in section 2 below, according to the present invention, the first electrode that connects the connection point on one side of the resistance layer and the second electrode that connects the connection point on the other side of the resistance layer are connected. Since they are placed close together to the extent that they can be electrically insulated, when trimming the resistance value, connect a conductor across both the first and second electrodes to short-circuit the resistor and clasp that require trimming adjustment. be able to.

Therefore, when trimming the resistance value, it is no longer necessary to flow an excessive current through the semiconductor integrated circuit as in the conventional case, and the semiconductor integrated circuit can be prevented from being damaged.

Furthermore, since the resistance layers to be shorted can be completely shorted, the resistance value can be trimmed with high precision.

[Brief explanation of the drawing]

Plan view, FIG. 2(a) is an enlarged plan view of essential parts showing a trimmed state, FIG. 2(b) is a sectional view taken along line AA of FIG. 2(a), and FIG. 3 is a second embodiment of the present invention. FIG. 4 is a diagram showing a modification of the second embodiment shown in FIG. 3, and FIG. 5 is a plan view of a conventional trimming resistor. 30. 31, 32: Resistance layer, 33, 34, 35 connection point on one side, 36. 37 first electrode, 39, 40: connection point on other side, 42: second electrode, 47: conductor, 52/recess , 53:
Convex part. Applicant Sharp Corporation

Claims (2)

[Claims] 1. A first electrode for shorting connected to a connection point on one side of the resistance layer and a second electrode for shorting connected to a connection point on the other side of the resistance layer are arranged close to each other to the extent that they can be electrically insulated, A method for adjusting the resistance value of a trimming resistor, comprising connecting a first electrode and a second electrode with a conductor to short-circuit a resistive layer. 2. A trimming resistor is provided in a semiconductor integrated circuit and is composed of a resistive layer and an electrode, and includes a first short-circuiting electrode that connects a connection point on one side of the resistive layer, and a second short-circuiting electrode that connects a connecting point on the other side of the resistive layer. What is claimed is: 1. A trimming resistor comprising: a first electrode and a second electrode disposed close to each other to the extent that they can be electrically insulated.