JPH10284659A - Heat sink structure for semiconductor components - Google Patents

Abstract

(57) [Problem] To provide a heat sink structure of a semiconductor component, in which a heat sink and a semiconductor component can be easily attached and detached and heat conduction can be reliably performed. SOLUTION: In a heat sink structure of a semiconductor component using a heat sink, a semiconductor component having a flat surface, a support plate having one surface fixed to the flat surface of the semiconductor component, and one end fixed to a central portion of the support plate. A screw stud provided orthogonal to the support plate, a heat sink inserted into the stud, and a heat sink provided between the heat sink and the support plate to conduct heat between the heat sink and the support plate. 3. A heat sink structure for a semiconductor component, comprising: a heat conductor made of a silicone rubber material in a gel state; and a nut screwed to the stud to press and fix the heat sink to the support plate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink structure for a semiconductor component, in which a heat sink and a semiconductor component can be easily attached and detached and heat conduction can be reliably performed.

[0002]

2. Description of the Related Art FIG. 5 is a diagram for explaining the configuration of a conventional example generally used in the prior art.
No. (Japanese Patent Application No. 1-182554).

In the figure, 1 is an LSI case, 2 is an LS
This is the lead of I case 1. 3 is a printed board. 4
Is a heat transfer plate of the semiconductor element 5 mounted on the LSI case 1 and in the LSI case 1.

Reference numeral 6 denotes a support plate for a heat sink, which is attached to the heat transfer plate 4 via an adhesive 7. Reference numeral 8 denotes a screw hole provided in the support plate 6.

A heat sink 9 is in contact with the support plate 6 via a heat dissipation sheet 11 for obtaining insulation and close contact. 12 is a through hole 13 provided in the heat sink 9
The mounting screw is screwed into the screw hole 8 through the through hole to fix the heat sink 9 to the support plate 6.

In the above configuration, since the heat sink 9 is fixed to the support plate 6 by the mounting screws 12 via the heat radiation sheet 11, the heat of the support plate 6 is conducted to the heat sink 9, and the heat is radiated by the heat sink 9. Is done.

[0007]

However, in such an apparatus, the heat sink 9 is connected to the heat radiating sheet 11 so that the heat of the support plate 6 is sufficiently conducted to the heat sink 9.
, It must be pressed with a large and uniform force, and the heat conduction tends to lack certainty and is inferior in reliability.

In order to avoid this, silicon grease is applied between the support plate 6 and the heat sink 9. However, silicon grease has a disadvantage that oil components are easily separated.

The present invention solves this problem. SUMMARY OF THE INVENTION An object of the present invention is to provide a heat sink structure of a semiconductor component, in which a heat sink and a semiconductor component can be easily attached and detached and heat conduction can be reliably performed.

[0010]

In order to achieve this object, the present invention provides a heat sink structure for a semiconductor component using a heat sink, comprising: a semiconductor component having a flat surface; A support plate to be fixed, a screw stud one end of which is fixed to a central portion of the support plate and provided perpendicular to the support plate; a heat sink inserted into the stud; and a space between the heat sink and the support plate. A heat conductor made of a gel-like silicon rubber material in use for conducting heat between the heat sink and the support plate, and a nut screwed to the stud to press and fix the heat sink to the support plate. A heat sink structure of a semiconductor component characterized by the above features.

[0011]

In the above construction, first, a support plate is bonded and fixed to a semiconductor component. A heat conductor is inserted into the stud. The heat sink is inserted into the stud. The nut is screwed onto the stud, and eventually a heat sink is attached to the semiconductor component. Hereinafter, a detailed description will be given based on embodiments.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an explanatory view of a main part of an embodiment of the present invention, FIG. 2 is a plan view of FIG. 1, and FIGS. 3 and 4 are assembly views of FIG.

In FIG. 1, reference numeral 21 denotes a semiconductor component having a flat surface. In this case, LSI components are shown.
Reference numeral 22 denotes a support plate having one surface fixed to the plane of the semiconductor component 21. In this case, they are bonded by an adhesive.

Reference numeral 23 denotes a screw stud fixed at one end to the center of the support plate 22 and provided orthogonal to the support plate. In this case, the support plate 22 and the stud 23 are integrally formed from the beginning. Specifically, it is made by shaving from a round bar. Note that the support plate 22 and the stud 23 are
It may be made separately and one end of the stud 23 may be assembled to the support plate 22 by welding or press fitting.

Reference numeral 24 denotes a heat sink inserted into the stud 23. 25 is screwed into the stud 23,
A nut for pressing and fixing the heat sink 24 to the support plate 22.

Reference numeral 26 denotes a heat conductor which is provided between the support plate 22 and the heat sink 24 and conducts heat between the support plate 22 and the heat sink 24 and is made of a gel-like silicon rubber material in use.

In this case, a thermosetting silicone rubber material is used. Specifically, for example, TSE3281-G silicone rubber manufactured by Toshiba Silicone Co., Ltd., TC-20A, TC-30A, TC-A manufactured by Shin-Etsu Silicone Co., Ltd.
45A, TC-80A silicone rubber is used.
27 is a spring washer provided between the heat sink 24 and the nut 25.

In the above configuration, as shown in FIG. 4, first, a support plate 22 is bonded to a semiconductor component 21. The heat conductor 26 is inserted into the stud 23, and then the heat sink 24 and the spring washer 27 are inserted. Nut 2
5 is screwed into the stud 23, and eventually the semiconductor component 2
1, a heat sink 24 is attached.

As a result, (1) Since the heat conductor 26 made of a thermosetting silicone rubber material that conducts heat between the support plate 22 and the heat sink 24 is provided between the support plate 22 and the heat sink 24, The heat conductor 26 made of a thermosetting silicone rubber material has a high temperature,
For example, it cures at 150 ° C., but in a medium temperature range, for example,
When used at 0 to 80 ° C., the heat conductor 26 is not cured and is in a gel state, so that it is used in a state where no adhesive force is generated and in a state where it is not cured, so that it can be easily removed.

Further, since the heat conductor 26 is not cured and is in a gel state, the heat conductor 26 is filled and mounted without an air layer, and is adapted to the heat contact surface, so that the contact heat resistance can be reduced.
Heat can be efficiently conducted from the support plate 22 to the heat sink 24. Therefore, the heat sink 24
Thus, a heat sink structure of a semiconductor component which can efficiently conduct heat to the semiconductor device and can be easily removed is obtained.

(2) Since the heat conductor 26 is in a gel state,
As shown in FIG. 5, the heat sink 9 is connected to the heat radiating sheet 11 so that the heat of the support plate 6 is sufficiently conducted to the heat sink 9.
A heat sink structure of a semiconductor component, which does not need to be pressed with a uniform large force, and is easy to assemble, can be obtained.

(3) Since the heat conductor 26 is in a gel state,
The adhesion between the support plate 6 and the heat sink 9 is good, and
The heat can be reliably transmitted from the heat sink to the heat sink 9, and a heat sink structure of a semiconductor component having high reliability of heat conduction can be obtained.

(4) Since the heat conductor 26 made of a thermosetting silicone rubber material is used, a heat sink structure of a semiconductor component, unlike silicon grease, in which oil components are not easily separated can be obtained.

(5) Since the heat sink 24 can be freely removed, even if the height direction is restricted, the heat sink 24 can be replaced with a heat sink that is expanded in the horizontal direction, so that the cooling capacity can be reliably ensured. Can be.

[0025]

As described above in detail, according to the present invention, (1) a heat conductor made of a thermosetting silicone rubber material that conducts heat between the support plate and the heat sink is formed by the support plate and the heat sink. The heat conductor made of a thermosetting silicone rubber material is hardened at a high temperature, for example, 150 ° C., but is used at a medium temperature region, for example, 70 to 80 ° C., so that the heat conductor is formed. Because the body does not harden and is gel-like,
Since it is used in a state where no adhesive force is generated and in a state where it is not cured, it can be easily removed.

Also, since the heat conductor is not cured and is gel-like, it is filled and mounted without the air layer, and fits into the heat contact surface, so that the contact heat resistance can be reduced and the heat sink can be removed from the support plate. The heat conduction to the can be done efficiently. Therefore, a heat sink structure of a semiconductor component which can efficiently conduct heat from the support plate to the heat sink 24 and can be easily removed is obtained.

(2) Since the heat conductor is in a gel state, it is not necessary to press the heat sink with a large uniform force on the heat radiating sheet so that the heat of the support plate is sufficiently conducted to the heat sink, and the semiconductor is easy to assemble. A component heat sink structure is obtained.

(3) Since the heat conductor is in the form of a gel, it has good adhesion between the support plate and the heat sink, heat can be reliably transmitted from the support plate to the heat sink, and the semiconductor component has high reliability in heat conduction. Is obtained.

(4) Since a heat conductor made of a thermosetting silicone rubber material is used, a heat sink structure of a semiconductor component which is unlikely to easily separate oil components, such as silicon grease, can be obtained.

(5) Since the heat sink can be freely removed, even if the height direction is restricted, the heat sink can be replaced with a heat sink expanded in the lateral direction.
Cooling capacity can be reliably ensured.

Therefore, according to the present invention, it is possible to realize a semiconductor component heat sink structure in which the heat sink and the semiconductor component can be easily attached and detached and heat conduction can be reliably performed.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a main part configuration of an embodiment of the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is an operation explanatory diagram of FIG. 1;

FIG. 4 is an operation explanatory diagram of FIG. 1;

FIG. 5 is an explanatory diagram of a configuration of a conventional example generally used in the related art.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 21 Semiconductor component 22 Support plate 23 Screw stud 24 Heat sink 25 Nut 26 Heat conductor 27 Spring washer

Claims (1)

[Claims] 1. A heat sink structure of a semiconductor component using a heat sink, comprising: a semiconductor component having a flat surface; a support plate having one surface fixed to the flat surface of the semiconductor component; A screw stud fixed and provided orthogonal to the support plate; a heat sink inserted into the stud; and a heat sink provided between the heat sink and the support plate for conducting heat between the heat sink and the support plate. A heat sink structure for a semiconductor component, comprising: a heat conductor made of a silicon rubber material in a gel state in a state; and a nut screwed to the stud to press and fix the heat sink to the support plate.