JPH11111890A - High frequency wiring board - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To reduce manufacturing cost. Also, a high-frequency wiring board applicable to various product specifications is provided. A plurality of via-hole conductors (13, 1) are provided in a dielectric substrate on which a conductor layer is formed at an interval of 1/2 or less of a signal wavelength.
6, a plurality of via-hole conductor groups 14 and 17 in which the dielectric waveguides 8 and 9 forming signal transmission lines 15 and 18 between the adjacent via-hole conductor groups 14 and 17 are arranged. A signal transmission line 15 between the waveguides 8 and 9;
A high-frequency wiring board 7 stacked so that the directions of the signal transmission lines 18 are substantially orthogonal to each other and connected between the two signal transmission lines 15 and 18 by feeders 20, 23 and 24 penetrating through holes in the conductor layer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency wiring board such as a semiconductor package utilizing high-frequency signals such as microwaves and millimeter waves.

[0002]

2. Description of the Related Art Conventionally, as a high-frequency signal transmission line for microwaves or millimeter waves formed on a wiring board or a semiconductor package, there is a planar line such as a macrostrip line, a strip line, a coplanar line, and a slot line. The flat type line has a simple configuration and is easy to manufacture, but on the other hand, there is a problem that the transmission characteristics are degraded at 30 GHz or more.

In order to solve such a problem and achieve excellent transmission characteristics even in the millimeter wave region, a dielectric waveguide structure as shown in FIGS. 5 and 6 has been proposed. According to the dielectric waveguide structure A of FIG. 5, the conductor layers 2 and 3 are formed on both main surfaces of the dielectric layer 1, and the two rows of via-hole conductors 4 connecting the conductor layers 2 and 3 form the conductor layers. Side walls are formed, and a region of the dielectric layer 1 surrounded by the side walls is used as a signal transmission line 5 (see JP-A-6-53711).

Further, in the dielectric waveguide structure B shown in FIG. 6 proposed by the present inventors, the dielectric waveguide structure A
Is formed of a plurality of dielectric layers 6, and the respective dielectric layers 6 are stacked via a sub-conductor layer 7. The side wall on which the via-hole conductors 4 are arranged is reinforced by the sub-conductor layer 7 as an electric wall, and the transmission characteristics are improved (see Japanese Patent Application No. 8-15723).

Thus, the dielectric waveguide structure A having the above structure,
According to B, excellent transmission characteristics can be obtained even in the millimeter-wave region, and the line can be routed arbitrarily in the plane, and can be easily manufactured using the conventional dielectric sheet lamination technology. As a result, a dielectric waveguide suitable for a high-frequency signal used for a wiring board or a semiconductor package was obtained.

[0006]

However, in the dielectric waveguide structures A and B, when the signal transmission line 5 is routed, a large number of via-hole conductors, for example, thousands to tens of thousands of via-holes are provided on the side surface. Since the conductors 4 are arranged, there are the following problems.

The via hole conductor is formed by forming a via hole by processing a dielectric sheet by microdrilling, laser, or punching, and then embedding a conductive paste in the via hole by a printing technique. Among these processing methods,
In the case of using a micro drill, a dielectric layer having a certain thickness can be processed, but there is a problem in that the production efficiency is low because the layers are formed sequentially. In contrast, laser drilling can be performed at high speed, but on the other hand,
Equipment for laser irradiation is very expensive. Therefore,
Usually, a punching process using a metal pin is used.

There are two types of punching. One method is to make holes one by one with one pin, and another method is to make a jig in which a number of pins are attached at predetermined positions in advance, and to make one sheet. On the other hand, there is a method of making all holes at the same time. In the former method, since the hole processing position is determined by the input numerical data, any arrangement processing is possible, but there is a problem that the processing time is long. In the latter method, punching can be performed very efficiently, but if even one pin is broken, the jig needs to be replaced, which is a problem in terms of manufacturing cost. Furthermore, a method combining both processing methods is also conceivable. If a via hole in one sheet is divided into several blocks and a jig having a large number of pins is prepared for each block, the cost of one jig is reduced. The processing time can be reduced.
However, when the transmission circuit is routed in various patterns and the pattern is different for each product, a very large number of jigs are required, and as a result, the manufacturing cost increases.

The inventor of the present invention has made intensive studies in view of the above circumstances. As a result, a plurality of via-hole conductor groups in which a large number of via-hole conductors are arranged in a predetermined direction are arranged, and a signal transmission line is provided between adjacent via-hole conductor groups. A plurality of dielectric waveguides to be formed by punching, and a high-frequency wiring board in which they are stacked so as to connect between signal transmission lines,
It has been found that simply by defining a signal transmission line for each dielectric waveguide body, it can be applied to various product specifications and the manufacturing cost can be reduced.

Accordingly, the present invention has been completed based on the above findings, and an object of the present invention is to provide a high-frequency wiring board that can be applied to various product specifications while reducing manufacturing costs.

[0011]

According to the high-frequency wiring board of the present invention, a large number of via-hole conductors are fixed at intervals of less than 1/2 of a signal wavelength in a thickness direction of a dielectric board having conductor layers formed on both main surfaces. A second dielectric waveguide similar to the first dielectric waveguide, in which three or more rows of via-hole conductor groups arranged in the same direction are arranged and adjacent via-hole conductor groups serve as signal transmission lines; An opening is provided in the conductor layer between the dielectric waveguides stacked so that the directions of both signal transmission lines are substantially orthogonal to each other,
The present invention is characterized in that both of the signal transmission lines are connected by penetrating a feeder through the opening.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to FIGS. FIG. 1 is an exploded cross-sectional view of the high-frequency wiring board 7 of the present invention, and FIG. 2 is a cross-sectional view taken along the line XX in FIG. FIG. 3 is a plan view of each dielectric waveguide constituting the high-frequency wiring board of the present invention. FIG. 4 is a plan view of each dielectric waveguide when the high-frequency wiring board of the present invention is used for a feed circuit of an array antenna. It is a top view of a wave body.

According to the high-frequency wiring board 7 shown in FIGS. 1 and 2, two types of dielectric waveguides 8 and 9 are stacked, and both main surfaces are usually called ground layers. Conductive layers 10, 11, and 12 are formed. In addition,
The conductor layer 11 is a common conductor layer of both the dielectric waveguide bodies 8 and 9.

In the dielectric waveguide 8, a large number of via-hole conductors 13 are arranged in the x-direction at intervals of less than １ ／ of the signal wavelength, whereby a via-hole conductor group 14 is formed. A plurality are arranged in the direction. A signal transmission line 15 is formed between the adjacent via-hole conductor groups 14.

Also in the other dielectric waveguide 9, a large number of via-hole conductors 16 are arranged in the y-direction, that is, orthogonal to the x-direction at intervals of less than half the signal wavelength.
As a result, the via-hole conductor group 17 is formed, and a plurality of the via-hole conductor groups 17 are arranged in the y-direction. A signal transmission line 18 is formed between the adjacent via-hole conductor groups 17.

A hole 19 is formed in the conductor layer 10 as the opening, and a power supply 20 is passed through the hole 19 so as not to be in contact therewith. Similarly, the conductor layer 11,
Holes 21 and 22 are also penetrated through 12, and the power supply bodies 23 and 24 are penetrated without contact. These power supply bodies 20, 23, 24 are, for example, pin-shaped.

In the high-frequency wiring board 7 having the above structure,
When a high-frequency signal is input to the feeder 24, the signal propagates through the signal transmission line 18 of the dielectric waveguide 9, propagates through the feeder 23 through the signal transmission line 15 of the dielectric waveguide 8, and Is output.

According to the high-frequency wiring board 7, the via-hole conductors 13 and 16 may be arranged at intervals of less than 1/2 of the signal wavelength, preferably at intervals of about 1/4. An electric wall is formed in a direction perpendicular to the transmission line 1 so that a signal (electromagnetic wave) is
It becomes a pseudo waveguide that propagates well only in directions 5 and 18.

In the high-frequency wiring board 7 having such a configuration, a dielectric layer is formed on the conductor layer 12, and a microstrip line, a coplanar line, or a printed antenna element is formed thereon. Good. In the signal transmission lines 15 and 18, the feeder 2
Since the light is propagated from left to right in both directions, via-hole conductors having a reflection function for one propagation are arranged, and the high-frequency signal reflected thereby and the high-frequency signal propagated to the other are combined. . In this case, a via-hole conductor having such a reflection function may be arranged at a position about one-fourth of the guide wavelength from the power supply so that the phases of the electromagnetic waves are the same.

According to the circuit connection example shown in FIG. 3, A is a plan view of the dielectric waveguide 8 and B is a plan view of the dielectric waveguide 9. In addition, both open circles and black circles represent the conductor layer 10,
Holes 19, 21 and 22 provided in 11 and 12 are shown, and white circles indicate feed portions for connecting the respective lines of the dielectric waveguide body 8 and the dielectric waveguide body 9 to the lines of the lower dielectric waveguide body. , Black circles indicate feed sections that connect the respective lines of the dielectric waveguide body 8 and the dielectric waveguide body 9 to the upper dielectric waveguide.

First, a power supply path from the back surface of the dielectric waveguide body 8 to the upper surface of the dielectric waveguide body 9 will be described. The signal transmission line 1 from the back surface of the dielectric waveguide body 8 through the power supply body 20a is shown.
5a is supplied as a signal. This signal is propagated in the signal transmission line 15a in the y-direction, fed to the signal transmission line 18b of the dielectric waveguide body 9 through the feeder 23a, and
It propagates in the direction and is connected from the feeder 24 a to the upper surface of the dielectric waveguide 9.

A power supply path from the upper surface of the dielectric waveguide body 9 to another position on the upper surface of the dielectric waveguide body 9 is shown. Is supplied as a signal to the signal transmission line 18c. Next, the signal is propagated to the signal transmission line 15b in the y direction through the power supply 23b, and supplied as a signal to the signal transmission line 18d in the x direction through the power supply 23c. And
Power is supplied to the upper surface of the dielectric waveguide body 9 through the power supply 24c.

In the circuit connection example of FIG. 3, a power supply line K may be further formed at the center of the signal transmission lines 15 and 18, whereby the power supply line becomes a coaxial type line, and unnecessary noises in the power supply line. Will not get on. Such a power line K
Are similarly connected by via-hole conductors.

Next, FIG. 4 shows an example of a feed circuit of the array antenna. According to the figure, power is supplied as a signal to the signal transmission line 15c through the feeder 20b on the back surface of the dielectric waveguide body 8. This signal is divided into two, and one signal is passed to the power supply 23d. In addition, since the power supply relationship is vertically symmetric in FIG. 4, only the lower power supply circuit will be described. The signal passing through the power supply 23d is divided into two, one of which is transmitted to the power supply 23e and the other is transmitted to the power supply 23f. The respective signals pass through the signal transmission lines 15d and 15e, but since they have a symmetrical power supply relationship in FIG. 4, those on the left side are omitted. Next, the signal passing through the signal transmission line 15e is divided into two by the feeders 23g and 23h, and reaches the signal transmission lines 18f and 18g. Then, the feeders 24d, 24d, from the signal transmission lines 18f, 18g, respectively.
The antenna element is connected to an externally arranged antenna element through 24e, 24f, and 24g, and a signal is supplied to the antenna element.

Next, a method for manufacturing the high-frequency wiring board 7 of the present invention will be described. The dielectric waveguides 8 and 9 are made of a dielectric material such as alumina ceramics, glass ceramics, or aluminum nitride ceramics. When the dielectric waveguides 8 and 9 are made of alumina ceramics, an organic solvent or solvent suitable for a ceramic raw material powder such as alumina, silica, and magnesia is used. , And a sheet-shaped formed body (green sheet) is produced by a doctor blade method or a rolling method, and conductive layers containing metal powders such as tungsten and molybdenum as conductor layers 10, 11, and 12 on the surface of the ceramic green sheet. By adopting a conventionally well-known thick film printing method or the like,
Print and apply with a thickness of 25 μm. At the same time, a conductive paste is buried in the holes for the via-hole conductors 13 and 16 previously opened in the ceramic green sheet, and baked (about 1600 ° C.) simultaneously with the ceramic green sheet to form the dielectric waveguides 8 and 8. 9 to form a high-frequency wiring board 7 having a laminated structure.

In order to form a large number of holes in the green sheet as described above, in order to obtain a required via-hole conductor arrangement, a jig in which a large number of pins are previously mounted at predetermined positions corresponding to the arrangement is required. When a plurality of the waveguides are manufactured and punched using this jig, a plurality of them can be manufactured for both of the dielectric waveguides 8 and 9. Then, in order to obtain specifications corresponding to the respective dielectric waveguides 8 and 9, holes are provided according to different specifications so as to be provided at predetermined positions such as feeders 20, 23 and 24. For example,
Each of the dielectric waveguides 8 and 9 is formed of a three-layer green sheet, and a via-hole conductor is appropriately formed in accordance with the lamination of the individual layers.
0, 23, 24 can be provided.

By manufacturing as described above, a common one can be used for each dielectric waveguide until the via-hole conductor array is formed. Since the hole is formed, it can be applied to various product specifications, and the manufacturing cost is reduced.

It should be noted that the present invention is not limited to the above embodiment, and various changes and improvements may be made without departing from the spirit of the present invention. For example, in this embodiment, two dielectric waveguides are stacked,
One or more dielectric waveguides may be stacked.
In addition, the feeder is constituted by a pin-shaped via-hole conductor. Instead of this, the feeder is formed by forming a slot or hole in a part of the conductor layer shared between the upper and lower layers of the laminated structure. The connection may be made by this.

[0029]

As described above, according to the high-frequency wiring board of the present invention, a plurality of via-hole conductor groups in which a large number of via-hole conductors are arranged in a predetermined direction are arranged, and a signal transmission line is provided between adjacent via-hole conductor groups. Are stacked so that the directions of the signal transmission lines between adjacent dielectric waveguides are substantially orthogonal to each other, and both are provided by a feeder penetrated through the opening in the conductor layer. Are connected between the signal transmission lines. With such a configuration, a common punching process can be performed for each dielectric waveguide body.
Manufacturing costs are significantly reduced. Furthermore, conventionally, two rows of via-hole conductor groups had to be formed for one signal transmission line, but in the present invention, a common via-hole conductor group is used between adjacent signal transmission lines. The number of via-hole conductor groups with respect to the number of signal transmission lines was reduced, which also reduced the manufacturing cost.

Further, according to the present invention, it is possible to provide a high-frequency wiring board applicable to various product specifications simply by defining a signal transmission line for each dielectric waveguide body. With the development of communication systems, ID card systems, wireless LANs, vehicle-mounted radars, and the like using high-frequency signals, high-frequency wiring boards such as high-frequency element storage packages used for these devices have been provided.

[Brief description of the drawings]

FIG. 1 is an exploded sectional view of a high-frequency wiring board according to the present invention.

FIG. 2 is a cross-sectional view taken along line XX of FIG. 1;

FIGS. 3A and 3B are plan views of individual dielectric waveguides constituting the high-frequency wiring board of the present invention.

FIGS. 4A and 4B are plan views of individual dielectric waveguides constituting the high-frequency wiring board of the present invention.

FIG. 5 is a perspective view of a conventional dielectric waveguide structure.

FIG. 6 is a perspective view of a conventional dielectric waveguide structure.

[Explanation of symbols]

 7 High frequency wiring board 8, 9 Dielectric waveguide body 10, 11, 12 Conductive layer 13, 16 Via hole conductor 14, 17 Via hole conductor group 15, 18 Signal transmission line 19, 21, 22 Hole 20, 23, 24 Feeder

Claims (1)

[Claims] 1. A via hole conductor group comprising a plurality of via hole conductors in which a large number of via hole conductors are arranged in a fixed direction at intervals of less than 1/2 of a signal wavelength in a thickness direction of a dielectric substrate having a conductor layer formed on both main surfaces. And a second dielectric waveguide similar to the first dielectric waveguide between adjacent via-hole conductor groups, which is a signal transmission line, in which the directions of both signal transmission lines are substantially orthogonal to each other. A high-frequency wiring board in which an opening is provided in the conductor layer between the dielectric waveguide bodies stacked as described above, and a feeder is penetrated through the opening to connect both signal transmission lines.