JPH11204390A - Semiconductor manufacturing apparatus and device manufacturing method - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To reduce the time required for recovery and recovery from stoppage of an apparatus due to occurrence of an emergency, thereby enabling more efficient device manufacturing. SOLUTION: When the device is stopped due to the occurrence of an emergency, status acquisition means 310, 38 for acquiring information on the processing stage in the device at the time of stoppage and the status of each unit of the device.
0, detection means 320, 330, 340 for detecting the end of the emergency, and recovery processing means 310 for sending a predetermined command to each part of the apparatus according to the processing stage of the apparatus at the time of the stop and performing recovery processing; 350, 360, 380
And a return processing means for sending a command to each unit of the apparatus in order to return each unit of the apparatus to the state of each unit of the apparatus at the time of the stop after or in parallel with the recovery processing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention obtains a state of a device when the device is stopped due to an emergency such as a sudden position change due to an earthquake or the like, and thereafter recovers from the emergency. In such a case, a semiconductor manufacturing apparatus which performs an automatic maintenance operation (recovery processing) based on processing preset for each unit of the apparatus, restarts the apparatus and reports a failure location according to the result, and a semiconductor manufacturing apparatus using the same. The present invention relates to a device manufacturing method.

[0002]

2. Description of the Related Art Conventionally, when an emergency such as an abrupt position change due to an earthquake or the like has occurred and the apparatus has been stopped, subsequent recovery processing and return processing are performed in accordance with a manual determined by a person in charge of inspection. Was.

[0003]

However, in such a conventional method, in the recovery processing or the recovery processing, time is inevitably left from the end of the emergency to the start of the recovery processing or the recovery processing, and an emergency occurs. Since the state of the apparatus at the time cannot be known, a series of maintenance work must be performed, so that unnecessary time is wasted, which causes a problem that the number of production sheets is reduced.

SUMMARY OF THE INVENTION In view of the above-mentioned problems of the prior art, an object of the present invention is to provide a semiconductor manufacturing apparatus and a device manufacturing method using the same, which shorten the time required for recovery and recovery from an abnormal stop of the apparatus. To enable more efficient device manufacturing.

[0005]

In order to achieve this object, a semiconductor manufacturing apparatus according to the present invention, when the apparatus is stopped due to the occurrence of an emergency, stores information on the processing stages in the apparatus at the time of stoppage and the state of each unit of the apparatus. State acquiring means (310, 380) for acquiring, detecting means (320, 330, 340) for detecting the end of the emergency, and a predetermined command to each part of the apparatus according to the processing stage of the apparatus at the time of the stop. Recovery processing means (310, 3
50, 360, 380) and a recovery processing means for sending a command to each unit of the apparatus to return each unit to the state of each unit at the time of the stop after or in parallel with the recovery processing. It is characterized by the following. Here, reference numerals in parentheses indicate corresponding elements in the embodiment.

Further, the device manufacturing method of the present invention uses such a semiconductor manufacturing apparatus, and when the apparatus is stopped due to the occurrence of an emergency, obtains information on the processing stage in the apparatus at the time of the stop and the state of each unit of the apparatus. Then, when the emergency is over, it is detected, and thereafter, a predetermined command is sent to each section of the apparatus according to the processing stage of the apparatus at the time of the stop to perform the recovery processing, and after or after this recovery processing. In parallel with the processing, each unit of the apparatus is returned to the state of each unit at the time of the stop, and the manufacturing of the semiconductor device is continued.

[0007]

In a preferred embodiment of the present invention, the detecting means has means for detecting a position of the apparatus, and when the apparatus stops due to a position change, it is determined that the position change has been completed. It is to detect. Further, the return processing means sends a command for the return when the recovery processing ends normally. The status acquisition unit may be configured to stop the device when the device is stopped due to the occurrence of an emergency, for example, from the device status storage table in which the latest information on the processing stages in the device and the status of each unit of the device is stored. The information about the processing stage in the device and the state of each unit of the device is obtained. Further, the recovery processing means has a recovery processing table which defines necessary processing for recovery processing for each unit of the apparatus according to the processing stage of the apparatus at the time of stoppage. Further, when an abnormality is found in the recovery processing, a means for performing a necessary display on the abnormality is provided.

In this configuration, when the apparatus is abnormally stopped due to an emergency such as an abrupt position change such as an earthquake, information on a processing stage in the apparatus and a state of each unit of the apparatus at that time is recorded. And when it is determined from the detection result of the position detecting means that the emergency situation has been recovered,
When the equipment is restarted or a command is sent to perform maintenance on each unit, and it is determined that there is no abnormality, the status of each part of the equipment recorded when the equipment was stopped due to the occurrence of an emergency is read and the An instruction is sent to restart the process from the process immediately before the event occurred.

[0009]

FIG. 1 is a perspective view showing the appearance of a semiconductor manufacturing apparatus according to one embodiment of the present invention, and FIG. 2 is a view showing the internal structure of FIG. As shown in FIG. 1, the semiconductor manufacturing apparatus includes a temperature control chamber 101 for controlling an environmental temperature of the apparatus main body, an EWS main body 106 disposed therein and having a CPU for controlling the apparatus main body, and predetermined information in the apparatus. Display device 102 for displaying an image, and a monitor TV for displaying image information obtained via an imaging means in the device body
105, a console unit including an operation panel 103 for performing predetermined input to the apparatus, an EWS keyboard 104, and the like. In the figure, 107 is an ON-OFF switch, 108 is an emergency stop switch, 109 is various switches, a mouse, etc., 110 is a LAN communication cable, 111 is an exhaust duct for generating heat from the console function, and 112
Is a chamber exhaust device. The semiconductor manufacturing apparatus main body is installed inside the chamber 101. The EWS display 102 is of a thin flat type such as EL, plasma, liquid crystal, etc.
It is connected to the EWS main unit 106 by the AN cable 110. Operation panel 103, keyboard 104, monitor TV
105 etc. are also installed in front of the chamber 101,
A console operation similar to the conventional console operation can be performed from the front side.

FIG. 2 shows a stepper as a semiconductor manufacturing apparatus. In the figure, 202 is a reticle, 2
Reference numeral 03 denotes a wafer. When a light beam emitted from the light source device 204 illuminates the reticle 202 through the illumination optical system 205, a pattern on the reticle 202 can be transferred to a photosensitive layer on the wafer 203 by the projection lens 206. .
The reticle 202 is supported by a reticle stage 207 for holding and moving the reticle 202. The wafer 203 is exposed while being vacuum-sucked by the wafer chuck 291. The wafer chuck 291 can be moved in each axis direction by the wafer stage 209. Above the reticle 202, a reticle optical system 281 for detecting the amount of displacement of the reticle is arranged. Above the wafer stage 209, an off-axis microscope 282 is arranged adjacent to the projection lens 206. The main role of the off-axis microscope 282 is to detect the relative position between the internal reference mark and the alignment mark on the wafer 203. A reticle library 220 and a wafer carrier elevator 230, which are peripheral devices, are arranged adjacent to the stepper body, and necessary reticles and wafers are transferred to the stepper body by the reticle transfer device 221 and the wafer transfer device 231. The chamber 101 mainly includes an air conditioner room 210 for controlling the temperature of the air, a filter box 213 for filtering fine foreign substances to form a uniform flow of clean air, and a booth 214 for shutting off the environment of the apparatus from the outside.
It is composed of In the chamber 101, the air conditioner room 2
The air whose temperature has been adjusted by the cooler 215 and the reheat heater 216 in 10 is supplied into the booth 214 by the blower 217 via the air filter g. The air supplied to the booth 214 is taken into the air conditioner room 210 again from the return port ra and circulates in the chamber 101. Normally, this chamber 101 is not strictly a complete circulation system, and the air outside the booth 214, which is about 10% of the amount of circulating air, is conditioned to keep the inside of the booth 214 at a positive pressure at all times.
The air is introduced from an outside air inlet oa provided at 0 through a blower. In this way, the chamber 101 enables the environment temperature where the apparatus is placed to be kept constant and the air to be kept clean. The light source device 204 is provided with an intake port sa and an exhaust port ea in preparation for cooling of the ultra-high pressure mercury lamp and generation of toxic gas at the time of laser abnormality, and a part of the air in the booth 214 passes through the light source device 204 to be air-conditioned. The air is forcibly exhausted to factory equipment via a dedicated exhaust fan provided in the machine room 210. Further, a chemical adsorption filter cf for removing chemical substances in the air is provided so as to be connected to the outside air introduction port oa and the return port ra of the air conditioner room 210, respectively. Reference numeral 295 denotes a damper, which reduces vibration caused by vibration or the like from the semiconductor manufacturing apparatus.

FIG. 3 is a block diagram showing a configuration of a portion related to processing in the event of an emergency in the semiconductor manufacturing apparatus. In the figure, reference numeral 310 denotes a main processing unit, which sends commands for maintenance processing and recovery processing to the unit unit 370 in response to a signal transmitted from the signal transmission / reception unit 340, and stops the apparatus due to occurrence of an emergency. The device status at that time is stored in the device status storage table 38 at the time of emergency.
0, and writes the information to the device status storage table 390, and with respect to the recovery process, performs processing such as sending the information of the emergency device status storage table 390 to the recovery process determining unit 350. Reference numeral 320 denotes an apparatus position measurement unit, which is attached to the damper 295 in FIG.

The device position measuring unit 320 measures the current position of the device and transmits the measured value to the device position variation calculating unit 330. The device position change calculation unit 330 is configured to
The position fluctuation of the device is calculated from the position measured at 0, and the result is transmitted to the signal transmitting / receiving unit 340. Signal transmitting / receiving unit 34
A value of 0 determines whether or not recovery from an emergency has been performed based on the position change information sent from the device position change calculation unit 330, and sends the result to the main processing unit 310 as a signal.

The recovery processing determining unit 350 reads data immediately after the occurrence of an emergency from the emergency device status storage table 380, selects necessary processing from the recovery processing means table 360 based on the data, and stores the processing information. Send to main processing section 310. The recovery processing means table 360 stores recovery processing required for the recovery processing determining unit 350 as a table. FIG. 4 shows an example of the format of this table.

The unit section 370 indicates the reticle stage 207, wafer stage 209, wafer transfer system, and the like in FIG. In the emergency device status storage table 380,
The device status when the signal indicating emergency is transmitted from the signal transmitting / receiving unit 340 to the main processing unit 310 is stored from the device status storage table 390 via the main processing unit 310. The device status storage table 390 stores the latest status of the device status that changes every moment. The emergency device status storage table 380 and the device status storage table 390 have basically the same format, and a format example of these tables is shown in FIG.

FIGS. 6 and 7 are flow charts illustrating the processing of the part related to the processing at the time of occurrence of an emergency. FIG. 6 is a flowchart of a process using the elements 310 and 350 to 390 in FIG. 3, and FIG.
It is a flowchart of the process using 20-340.

As shown in FIG. 6, when an emergency occurs and the stop processing of the apparatus is performed, and the apparatus is stopped, the main processing section 310 firstly proceeds to step S101 to read out the apparatus state storage table 390 at this time. The acquired device status is stored in the emergency device status storage table 380 as the device status at the time of emergency. Then, step S10
In step 2, a signal indicating stop is transmitted to the signal transmission / reception unit 340, and the apparatus enters a device stop state in step S103. In step S104, step S20 in FIG.
In step 5, the state of step S103 continues until a signal indicating that recovery from an emergency has been received, which is transmitted from the position change sensor (signal transmitting / receiving unit 340). And
In step S104, when this recovery signal is received, the process proceeds to step S105 to perform a recovery process of the device.

At this time, regarding the necessary recovery processing, the recovery processing determining unit 350
0 based on the data of 0, and the result is
0, and the main processing unit 310
To the recovery process. Thereafter, in step S106, it is determined whether or not the recovery process has been normally completed. If the operation has been normally completed, the process proceeds to step S107, and a process for returning to the device state at the time of occurrence of an emergency is performed. Regarding this return processing, the previous step S105
As described above, the recovery processing determination unit 350 determines the data based on the data of the recovery processing means table 360 and the emergency device status storage table 380, and based on the result, the main processing unit 3
10 sends a command for a return process to each unit 370. Thereafter, in step S108, it is checked whether or not the return processing has been normally completed. If the return processing has been normally completed, the process proceeds to step S110, and the operation of the apparatus is restarted from the state immediately before the apparatus was stopped. Step S106
Alternatively, if it is determined in step S108 that the process has not been completed normally, in step S109, an error is displayed so that the operator can recognize the location of the error, and the recovery or restoration process is stopped.

On the other hand, as shown in FIG. 7, when the signal transmitting / receiving unit 340 receives the signal transmitted in step S102 regarding the stoppage of the apparatus due to the occurrence of the emergency, in step S200, this information is processed in step S205. Until they are saved. If this information has not been sent, the process of step S205 is not performed. When the reception in step S200 is performed, in step S201, the current position of the apparatus is detected using the position measurement unit 320. Subsequently, in step S202, the position change is calculated using the position change calculator 330 based on the measurement result in step S201. Next, in step S203, the position change calculation result calculated in step S202 is determined using the signal transmitting / receiving unit 340. Here, when it is determined that the emergency state has not been recovered (NG) due to the rapid change of the position of the apparatus, the process returns to step S200 and the processing of steps S200 to S202 is repeated.

In step S203, a sudden change in the position of the apparatus has subsided, and the system has recovered from the emergency (GOOD).
When the determination is made, the process proceeds to step S204, and it is determined whether the apparatus is currently stopped. This corresponds to step S1 in FIG.
In step 02, it is determined whether or not the signal indicating the suspension is transmitted and stored in step S200. If the signal is received and stored, the process proceeds to step S205, and the emergency recovery signal is transmitted to the main processing unit 310. Send. At this time, the stored reception information of the signal indicating the suspension is cleared. If it is determined in step S203 that no signal indicating that the apparatus is stopped has not been received, the apparatus remains normal.
The process returns to step S200 without transmitting the emergency recovery signal in 205.

Hereinafter, as a more specific example of this processing, a case will be described in which a sudden position change occurs due to the occurrence of an earthquake during exposure and the apparatus stops. When an abrupt positional change occurs due to the occurrence of an earthquake and the apparatus stops, the main processing unit 310 first acquires the state of the apparatus at the time of the occurrence of the earthquake in step S101.
Save as. In this example, since an earthquake occurred during exposure, 1 (during exposure) is entered in the sequence column as shown in FIG. The position of the wafer stage at this time ([x, y] = [+ 40, -60] in this example), the number of wafers (in this example, assuming that there are two wafer cassettes, 25 sheets in the first cassette, Information indicating whether 0 cassettes are present in cassette 2 (in this example, no cassette is set), and whether online processing is currently being performed (in this example, the state in which the cassette is being performed) is stored. I have. After that, in step S102, a signal indicating that the operation is stopped is transmitted to the sensor side (the signal transmitting / receiving unit 340).
In step S103, the state is stopped, and a loop of steps S103 and S104 is entered until an emergency recovery signal is sent from the sensor side, that is, until a recovery signal is received in step S104.

On the sensor side, a signal indicating that the apparatus is stopped is received from the apparatus in step S200, and the position of the apparatus is detected in step S201.
Then, the position variation is calculated from the result of step S201.
Thereafter, in step S203, it is determined from the calculation result in step S202 whether the position change of the device is continued or stopped, and if the position change is still continued, it is determined as NG and the process returns to step S200. , The processes of steps S201 and S202 are repeated. If the positional change has stopped, GOOD is determined in step S203, and the process proceeds to step S204. In step S204, since the signal indicating that the vehicle is stopped in step S200 has been received, YES is determined here, and step S205 is performed.
Sends an emergency recovery signal to the device.

In response, on the device side, step S10
In step S105, an emergency recovery signal is received.
In the recovery processing means table 360 and the emergency occurrence device state storage table 38 shown in FIGS.
0, the apparatus is subjected to a recovery process. At this time, first, the ID of the sequence in FIG. 5 is 1 (during exposure), so the item “during exposure: 1” in FIG. 4 is referred to. First, regarding the wafer stage (W. Stage: A), since it is indicated by ○, a process is performed to determine whether the wafer stage moves normally. Wafer cassette (W. Cass
ette1: B, W. Cassette2: C) is indicated by △, indicating that processing is performed when necessary. Further, referring to the same item in FIG.
Wafer cassette), there is no wafer cassette in the C side (second wafer cassette) (0 means that no cassette is set as described above). Therefore, with respect to the wafer cassette, only the B is processed to determine whether it is set normally. Online system (Onl)
ines. : Regarding Z), since it is x, no direct recovery processing is performed.

Next, in step S106, it is determined whether or not the above-described recovery processing has been normally completed. If the recovery processing has been normally completed, the process proceeds to step S107, and the process returns to the state at the time of occurrence of an emergency. Move on. That is, from the tables of FIGS. 4 and 5, [x, y]
== [+ 40, -60]. Further, it is checked whether or not 25 wafers are present in the wafer cassette of B (including the wafer currently mounted on the wafer stage). Further, the online system is restarted so as to be able to resume normally, and communication processing to the host computer is performed.

Next, in step S108, it is determined whether or not the above-described return processing has been normally completed. If the return processing has been normally completed, the process proceeds to step S110 to restart the processing of the apparatus, and the present invention is performed. A series of operations ends. If it is determined in step S106 and step S108 that the process has abnormally ended, an error is displayed (including the item that caused the abnormal end), and the process ends without performing the restart process. As an error display, when the number of wafers is two less than at the time of stop, for example, when a wafer has dropped from the wafer cassette, a message "Cannot resume because two wafers are less than at the time of stop" is displayed. be able to.

The present invention is not limited to the above-described embodiment, but can be implemented with appropriate modifications. For example,
Each of the parts 320, 330, and 340 in FIG. 3 is attached to an active damper or a device similar thereto, but when the semiconductor manufacturing apparatus is not equipped with an active damper, the semiconductor manufacturing apparatus is installed. You may make it attach to the floor which is set.
In the above description, the recovery process and the return process are performed separately, but these processes may be performed simultaneously. In this case, in the above description, since the recovery processing and the recovery processing were performed separately, one item in the table of FIG. 4 had two values for the recovery processing and the recovery processing. By simultaneously performing the return processing, the values may be combined into one item. Further, in the above description, the case of a sudden position change of the device due to an earthquake is taken as an example of the occurrence of an emergency, but the present invention is applied even when something collides with the device as a similar rapid position change. be able to. Furthermore, the present invention can also be applied to a case where the device is stopped due to a sudden drop in voltage due to a power failure or the like. In this case, a voltmeter (ammeter) may be used as a detecting device.

Next, a description will be given of an example of device manufacturing in which the above-described semiconductor manufacturing apparatus can be used. FIG. 8 shows a flow of manufacturing micro devices (semiconductor chips such as ICs and LSIs, liquid crystal panels, CCDs, thin-film magnetic heads, micro machines, etc.). In step 1 (circuit design), a device pattern is designed. Step 2 (mask production)
Then, a mask having the designed pattern is manufactured. On the other hand, in step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon or glass. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and includes processes such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). including. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, the semiconductor device is completed and shipped (Step 7)
Is done.

FIG. 9 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. Step 15
In (resist processing), a resist is applied to the wafer. Step 16 (exposure) uses the above-described exposure apparatus or exposure method to align and print the circuit pattern of the mask on a plurality of shot areas of the wafer. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer.

According to this, it is possible to manufacture a large-sized device which was conventionally difficult to manufacture at low cost.

[0029]

As described above, according to the present invention, it is possible to shorten the time from the stoppage of the apparatus due to the occurrence of an emergency to the recovery / return, and to manufacture the device more efficiently. In other words, when the device stops abnormally due to an emergency, the status of the device at that time is saved, and when the emergency ends, automatic maintenance work for recovery processing and return processing is performed. When you do
The process before the occurrence of the emergency can be continued as it is. In addition, even if an error occurs during maintenance work, the failure location can be displayed, so that the unit can be replaced smoothly at that location, and maintenance work at other locations can be performed according to the situation. It can be performed. Therefore, the repair work can be performed efficiently, and this has an effect of preventing a decrease in the number of production sheets.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an appearance of a semiconductor manufacturing apparatus according to one embodiment of the present invention.

FIG. 2 is a diagram showing the internal structure of the device of FIG.

FIG. 3 is a block diagram showing a configuration of a portion related to a process when an emergency occurs in the apparatus of FIG. 1;

FIG. 4 is a diagram showing a recovery processing means table in the configuration of FIG. 3;

FIG. 5 is a diagram showing the latest device status table when the device is stopped due to the occurrence of an emergency in the configuration of FIG. 3;

FIG. 6 is a flowchart showing processing on the device side in the configuration of FIG. 3;

FIG. 7 is a flowchart showing processing on the position fluctuation sensor side in the configuration of FIG. 3;

FIG. 8 is a flowchart showing an example of manufacturing a device that can use the apparatus or method of the present invention.

FIG. 9 is a flowchart showing a detailed flow of a wafer process in FIG. 8;

[Explanation of symbols]

101: temperature control chamber, 102: display device for EWS, 103: operation panel, 104: keyboard for EWS, 105: monitor TV, 106: EWS body, 10
7: ON-OFF switch, 108: emergency stop switch, 109: various switches, mouse, etc. 110: LAN
Communication cable, 111: exhaust duct, 112: exhaust device, 202: reticle, 203: wafer, 204: light source device, 205: illumination optical system, 206: projection lens, 20
7: reticle stage, 209: wafer stage, 21
0: air conditioner room, 213: filter box, 214: booth, 217: blower, 281: reticle microscope, 28
2: Off-axis microscope, 295: Damper, 310: Main processing unit, 320: Device position measurement unit, 330: Device position variation calculation unit, 340: Signal transmission / reception unit, 350: Recovery processing determination unit, 360: Recovery processing means table 370: unit section, 380: emergency status device status storage table,
390: device state storage table, g: air filter, c
f: chemical adsorption filter, oa: outside air introduction port, ra: return port.

Claims (6)

[Claims] 1. A state acquisition means for acquiring information on a processing stage in an apparatus and a state of each unit of the apparatus when the apparatus is stopped when the apparatus is stopped due to the occurrence of an emergency, and a detection for detecting completion of the emergency Means, recovery processing means for sending a predetermined command to each section of the apparatus according to the processing stage of the apparatus at the time of the stop and performing recovery processing, and after or concurrently with the recovery processing, the apparatus at the time of the stop A semiconductor manufacturing apparatus comprising: a return processing unit that sends a command to each unit of the apparatus to return each unit of the apparatus to the state of each unit. 2. The apparatus according to claim 1, wherein said detecting means has means for detecting a position of the apparatus, and when the apparatus stops due to a position change, detects that the position change has stopped. Item 2. A semiconductor exposure apparatus according to item 1. 3. The semiconductor manufacturing apparatus according to claim 1, wherein said return processing means sends an instruction for said recovery when said recovery processing ends normally. 4. The apparatus according to claim 1, wherein when the apparatus is stopped due to the occurrence of an emergency, the apparatus obtains the latest information relating to the processing stages of the apparatus and the state of each unit of the apparatus. Information on the processing stages in the apparatus at the time of stoppage and the states of the respective parts of the apparatus. The recovery processing means comprises: 4. The semiconductor manufacturing apparatus according to claim 1, further comprising a recovery processing table that defines processing required for recovery processing for the semiconductor device. 5. 5. The semiconductor manufacturing apparatus according to claim 1, further comprising means for performing a necessary display on the abnormality when the abnormality is found in said recovery processing. 6. A semiconductor manufacturing apparatus according to claim 1, wherein when the apparatus is stopped due to an emergency, information on a processing stage in the apparatus at the time of the stop and a state of each unit of the apparatus is acquired. When the emergency is over, it is detected, and after that, a predetermined command is sent to each unit of the device according to the processing stage of the device at the time of the stop to perform the recovery process, and after or after this recovery process. A method for manufacturing a device, comprising: returning each unit of the apparatus to the state of each unit at the time of the stop in parallel, and continuing manufacturing of the semiconductor device.