JPH11204841A - Optical semiconductor device and its manufacturing method - Google Patents
Optical semiconductor device and its manufacturing methodInfo
- Publication number
- JPH11204841A JPH11204841A JP10018262A JP1826298A JPH11204841A JP H11204841 A JPH11204841 A JP H11204841A JP 10018262 A JP10018262 A JP 10018262A JP 1826298 A JP1826298 A JP 1826298A JP H11204841 A JPH11204841 A JP H11204841A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- lens
- optical
- semiconductor
- optical axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
(57)【要約】
【課題】 生産性よく製造することができかつ光半導体
チップとレンズの光軸との間の位置ずれを少なくできる
光半導体素子を提供する。
【解決手段】 半導体チップが設けられた支持体と、上
記半導体チップを覆うように設けられたレンズとを備
え、該レンズを介して光を入出力する光半導体素子であ
って、上記支持体は、上記レンズに設けられた凹部に上
記半導体チップが上記レンズの光軸上に位置しかつ上記
半導体チップの入出力面が該光軸に略垂直になるように
嵌合されている。
(57) [PROBLEMS] To provide an optical semiconductor element which can be manufactured with high productivity and can reduce the displacement between the optical semiconductor chip and the optical axis of the lens. SOLUTION: The optical semiconductor device includes a support provided with a semiconductor chip, and a lens provided so as to cover the semiconductor chip, and inputs and outputs light through the lens. The semiconductor chip is fitted in a concave portion provided in the lens such that the semiconductor chip is located on the optical axis of the lens and the input / output surface of the semiconductor chip is substantially perpendicular to the optical axis.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、レンズを備えた光
半導体素子とその製造方法に関する。The present invention relates to an optical semiconductor device having a lens and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】従来のレンズを有する光半導体素子は、
例えば、特開平７−３０７４９２号公報に開示されてい
るように、所定の位置に凹部が形成された基板を用い、
該凹部にＬＥＤチップ（光半導体チップ）を設け、該チ
ップを覆うように樹脂を充填した後、インサート成形に
より一体的にレンズを形成することにより製造されてい
た。2. Description of the Related Art An optical semiconductor device having a conventional lens is:
For example, as disclosed in Japanese Patent Application Laid-Open No. 7-307492, a substrate having a concave portion formed at a predetermined position is used,
An LED chip (optical semiconductor chip) is provided in the recess, a resin is filled so as to cover the chip, and then a lens is integrally formed by insert molding.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上述し
た従来の製造方法は、通常の成形に比較して金型構造が
複雑でサイクルタイムの長いインサート成形を用いてい
るため、生産性が悪いという問題点があった。また、イ
ンサート成形において、インサートされる基板を精度よ
く位置決めすることが難しく、基板に設けられた光半導
体チップとレンズとの間に光軸ずれが生じる場合がある
という問題点があった。また、インサート成形をする方
法以外に、例えば、ガラスレンズを金属環にはめ込んで
なるキャップ状のレンズを基板に被せたいわゆるキャン
タイプの光半導体素子もあるが、該光半導体素子は、基
板とレンズとをハーメチックシール（抵抗溶接）する必
要があり、極めて生産性が悪いという問題点があった。
また、この場合でも、基板とレンズとの位置がずれる
と、光半導体チップとレンズとの間に光軸ずれが生じる
という問題点があった。However, the conventional manufacturing method described above has a problem that productivity is poor because insert molding having a complicated mold structure and a long cycle time is used as compared with ordinary molding. There was a point. In addition, in insert molding, it is difficult to accurately position a substrate to be inserted, and there is a problem that an optical axis shift may occur between an optical semiconductor chip provided on the substrate and a lens. In addition to the insert molding method, for example, there is a so-called can-type optical semiconductor element in which a cap-shaped lens in which a glass lens is fitted into a metal ring is covered on a substrate. Need to be hermetically sealed (resistance welding), and there is a problem that productivity is extremely low.
Also in this case, there is a problem that if the position of the substrate and the lens is shifted, an optical axis shift occurs between the optical semiconductor chip and the lens.
【０００４】本発明は、従来例の問題点を解決して、生
産性よく製造することができかつ光半導体チップとレン
ズとの間の光軸ずれの少ない光半導体素子を提供するこ
とを目的とする。An object of the present invention is to provide an optical semiconductor element which can be manufactured with high productivity and has a small optical axis shift between an optical semiconductor chip and a lens, by solving the problems of the conventional example. I do.
【０００５】[0005]
【課題を解決するための手段】本発明は以上の従来例の
問題点を解決するために鋭意検討した結果なされたもの
である。すなわち、本発明に係る光半導体素子の製造方
法は、半導体チップが設けられた支持体と、上記半導体
チップを覆うように設けられたレンズとを備え、該レン
ズを介して光を入出力する光半導体素子の製造方法にお
いて、光の出力面と反対側の面に凹部を備えた１又は複
数のレンズを成形する工程と、上記凹部に対応する外形
状を有する支持体に、該支持体が上記凹部に挿入された
ときに半導体チップが上記レンズの光軸上に位置するよ
うかつ上記半導体チップの入出力面が該光軸に略垂直に
なるように半導体チップを搭載する工程と、上記半導体
チップが搭載された支持体を上記レンズの凹部に嵌合さ
せる工程とを含むことを特徴とする。SUMMARY OF THE INVENTION The present invention has been made as a result of intensive studies to solve the problems of the prior art described above. That is, a method of manufacturing an optical semiconductor device according to the present invention includes a support provided with a semiconductor chip, and a lens provided so as to cover the semiconductor chip, and a light input / output through the lens. In the method for manufacturing a semiconductor element, a step of molding one or more lenses having a concave portion on a surface opposite to a light output surface, and a support having an outer shape corresponding to the concave portion, Mounting the semiconductor chip such that the semiconductor chip is positioned on the optical axis of the lens when inserted into the recess and the input / output surface of the semiconductor chip is substantially perpendicular to the optical axis; and Fitting the support on which is mounted the concave portion of the lens.
【０００６】また、本発明に係る第１の光半導体素子
は、半導体チップが設けられた支持体と、上記半導体チ
ップを覆うように設けられたレンズとを備え、該レンズ
を介して光を入出力する光半導体素子であって、上記支
持体は、上記レンズに設けられた凹部に上記半導体チッ
プが上記レンズの光軸上に位置しかつ上記半導体チップ
の入出力面が該光軸に略垂直になるように嵌合されてい
ることを特徴とする。これによって、上記半導体チップ
と上記レンズの光軸との間の位置関係を上記レンズの凹
部の形成精度と同程度の精度で組み合わせることがで
き、極めて上記レンズの光軸と半導体チップとの間の位
置ずれが小さい光半導体素子を提供することができる。
また、インサート成形又はハーメチックシールの工程を
経ることなく製造できるので、極めて生産性よく製造す
ることができる。ここで、光半導体素子とは、半導体材
料を用いて構成した発光素子及び受光素子等をいう。Further, a first optical semiconductor device according to the present invention includes a support provided with a semiconductor chip, and a lens provided so as to cover the semiconductor chip, and receives light through the lens. An output optical semiconductor element, wherein the support is such that the semiconductor chip is positioned on an optical axis of the lens in a concave portion provided in the lens, and an input / output surface of the semiconductor chip is substantially perpendicular to the optical axis. Characterized in that they are fitted so that Thereby, the positional relationship between the semiconductor chip and the optical axis of the lens can be combined with the same precision as the precision of forming the concave portion of the lens, and extremely between the optical axis of the lens and the semiconductor chip. An optical semiconductor device with small displacement can be provided.
Further, since it can be manufactured without going through the steps of insert molding or hermetic sealing, it can be manufactured with extremely high productivity. Here, the optical semiconductor element refers to a light-emitting element, a light-receiving element, and the like formed using a semiconductor material.
【０００７】また、本発明に係る第１の光半導体素子に
おいては、上記光半導体素子において、上記半導体チッ
プと上記レンズとの間に透光性を有する可撓性樹脂が充
填されていることが好ましい。これによって、使用する
環境温度の変化による上記レンズの膨張・収縮により半
導体チップに不要な応力が印加されるのを防止でき、か
つ半導体チップへの水分、水蒸気、有害ガスの侵入を防
止することができるので、信頼性の高い光半導体素子を
提供することができる。In the first optical semiconductor device according to the present invention, the optical semiconductor device may be such that a flexible resin having a light transmitting property is filled between the semiconductor chip and the lens. preferable. This can prevent unnecessary stress from being applied to the semiconductor chip due to expansion and contraction of the lens due to a change in the environmental temperature used, and prevent moisture, water vapor, and harmful gas from entering the semiconductor chip. Therefore, a highly reliable optical semiconductor device can be provided.
【０００８】また、本発明に係る第２の光半導体素子
は、それぞれ半導体チップが設けられた複数の支持体
と、上記各半導体チップを覆うように設けられた複数の
レンズとを備え、上記各レンズを介して光を入出力する
アレータイプの光半導体素子であって、上記複数のレン
ズは一列又はマトリクス状に一体で配列されてなり、上
記各支持体は、上記各レンズに設けられた凹部に上記半
導体チップが上記レンズの光軸上に位置しかつ上記半導
体チップの入出力面が該光軸に略垂直になるように嵌合
されていることを特徴とする。これによって、極めて上
記レンズの光軸と半導体チップとの間の位置ずれが小さ
い複数の光半導体素子が精度よく一列又はマトリクス状
に配列されたアレータイプの光半導体素子を提供するこ
とができる。Further, a second optical semiconductor device according to the present invention includes a plurality of supports each provided with a semiconductor chip, and a plurality of lenses provided so as to cover each of the semiconductor chips. An array-type optical semiconductor element for inputting and outputting light through a lens, wherein the plurality of lenses are integrally arranged in a row or in a matrix, and each of the supports is provided with a concave portion provided in each of the lenses. The semiconductor chip is located on the optical axis of the lens and the input / output surface of the semiconductor chip is fitted so as to be substantially perpendicular to the optical axis. Thus, it is possible to provide an array-type optical semiconductor element in which a plurality of optical semiconductor elements having a very small displacement between the optical axis of the lens and the semiconductor chip are arranged in a line or in a matrix with high accuracy.
【０００９】また、本発明に係る第２の光半導体素子に
おいては、上記半導体チップと上記レンズとの間に透光
性を有する可撓性樹脂が充填されていることが好まし
い。これによって、使用する環境温度の変化による上記
レンズの膨張・収縮により半導体チップに不要な応力が
印加されるのを防止でき、かつ半導体チップへの水分、
水蒸気、有害ガスの侵入を防止することができるので、
信頼性の高い光半導体素子を提供することができる。ま
た、該樹脂を充填することにより、半導体チップと外部
との間の屈折率差を緩和でき、光取り出し効率を向上さ
せることができる利点も有する。Further, in the second optical semiconductor element according to the present invention, it is preferable that a transparent resin having a light transmitting property is filled between the semiconductor chip and the lens. Thereby, it is possible to prevent unnecessary stress from being applied to the semiconductor chip due to expansion and contraction of the lens due to a change in the use environment temperature, and to prevent moisture and
Water vapor and harmful gas can be prevented from entering,
An optical semiconductor element with high reliability can be provided. Further, by filling the resin, the difference in the refractive index between the semiconductor chip and the outside can be reduced, and the light extraction efficiency can be improved.
【００１０】[0010]
【発明の実施の形態】図１は、本発明に係る実施形態の
多点発光型発光素子（ＬＥＤ素子）の構成を示す模式断
面図である。本実施形態の多点発光型発光素子は、それ
ぞれ半導体チップ２３を備えた支持体２が、複数のレン
ズ１の各底面に設けられた凹部１１に嵌合されて作成さ
れる。ここで、複数のレンズ１は、１列又はマトリクス
状に配列されるように一体で成形されてレンズアレー１
００を構成する。FIG. 1 is a schematic sectional view showing the structure of a multipoint light emitting device (LED device) according to an embodiment of the present invention. The multipoint light emitting device of the present embodiment is manufactured by fitting the support 2 having the semiconductor chip 23 into the concave portion 11 provided on each bottom surface of the plurality of lenses 1. Here, the plurality of lenses 1 are integrally formed so as to be arranged in one row or in a matrix, and the lens array 1 is formed.
00.
【００１１】さらに、詳細に説明すると、図１の発光素
子において、支持体２は、半導体チップ２３がダイボン
ディングされる底面２１２と底面２１２に対して所定の
角度をなすように形成された反射面２１１とを有する凹
部を一方の主面に備え、かつ底面２１２から支持体２の
他方の主面に連続して形成された２つの外部接続電極２
２を備える。ここで、支持体２は、光反射性を有する樹
脂等にて形成され、底面２１２と所定の角度をなすよう
に形成された反射面２１１は、半導体チップ２３によっ
て発光された光を所定の方向に反射させる。また、外部
接続電極２２は、例えばインサート成形又はメッキ等に
より支持体２と一体的に形成することができる。More specifically, in the light emitting device of FIG. 1, the support 2 has a bottom surface 212 to which the semiconductor chip 23 is die-bonded and a reflection surface formed so as to form a predetermined angle with respect to the bottom surface 212. And two external connection electrodes 2 formed on one main surface and formed continuously from the bottom surface 212 to the other main surface of the support 2.
2 is provided. Here, the support body 2 is formed of a resin having light reflectivity or the like, and the reflection surface 211 formed so as to form a predetermined angle with the bottom surface 212 transmits light emitted by the semiconductor chip 23 in a predetermined direction. To reflect. Further, the external connection electrode 22 can be formed integrally with the support 2 by, for example, insert molding or plating.
【００１２】本実施形態の発光素子において、半導体チ
ップ２３は支持体２の底面２１２にダイボンディングさ
れ半導体チップ２３の正電極及び負電極はそれぞれ、外
部接続電極２２にワイヤ２４で接続される。そして、半
導体チップ２３を覆うように支持体２の凹部に、シリコ
ン等の透光性を有しかつ可撓性を有する樹脂３を充填し
た後、支持体外周部２１をレンズ１の凹部１１に嵌合さ
せる。In the light emitting device of this embodiment, the semiconductor chip 23 is die-bonded to the bottom surface 212 of the support 2, and the positive electrode and the negative electrode of the semiconductor chip 23 are connected to the external connection electrodes 22 by wires 24, respectively. After the concave portion of the support 2 is filled with the translucent and flexible resin 3 such as silicon so as to cover the semiconductor chip 23, the outer peripheral portion 21 of the support is placed in the concave portion 11 of the lens 1. Fit.
【００１３】以上のように形成された実施形態の発光素
子は、レンズ１を所望の形状に成形した後、半導体チッ
プ２３を備えた支持体２を、レンズ１の凹部１１に嵌合
するようにしているので、以下のような種々の効果を有
する。 （１）レンズアレー１００（レンズ１）を、インサート
成形に比較して容易でかつサイクルタイムの短い射出又
は型押し成形方法を用いて成形できるので、形状精度の
高いレンズ１を生産性よく形成できる。 （２）また、半導体チップが搭載された支持体２を、位
置精度よく形成されたレンズ１の凹部１１に嵌合により
位置決めしているので、支持体２（半導体チップ２３）
とレンズ１との位置ずれを小さくでき、半導体チップ２
３とレンズ１との光軸ずれを小さくできる。 （３）また、本実施形態では、半導体チップ２３の周辺
は可撓性を有する樹脂３が充填されているので、環境温
度の変化によるレンズ１の膨張・収縮により半導体チッ
プに応力が印加されるのを防止でき、かつ半導体チップ
２３への水分、水蒸気、有害ガスの侵入を防止すること
ができる。また、該樹脂３を充填することにより、半導
体チップと外部との間の屈折率差を緩和でき、光取り出
し効率を向上させることができる利点も有する。 （４）また、本実施形態では、図２に示すようにチップ
タイプの発光素子に用いる支持体を転用して使用するこ
とができるので、部品の共通化が可能であり、量産効果
により部品単価を下げることができる。 （５）また、本実施形態の発光素子では、レンズ材料と
して非晶質ナイロン、ノルボネン樹脂等の光透過性及び
耐候性に優れた樹脂を使用できるので、発光効率及び信
頼性を高くできる。特に波長の比較的短い発光が可能な
窒化ガリウム系半導体発光素子では、発光された波長の
短い光りが、レンズに用いた樹脂を劣化させることがあ
るが、上述のように光透過性及び耐候性に優れた樹脂を
使用することにより、窒化ガリウム系半導体発光素子の
長寿命化が図れる。In the light emitting device of the embodiment formed as described above, after the lens 1 is formed into a desired shape, the support 2 having the semiconductor chip 23 is fitted into the concave portion 11 of the lens 1. Therefore, it has the following various effects. (1) Since the lens array 100 (lens 1) can be formed using an injection or embossing method that is easier and has a shorter cycle time than insert molding, the lens 1 with high shape accuracy can be formed with high productivity. . (2) Since the support 2 on which the semiconductor chip is mounted is positioned by fitting into the concave portion 11 of the lens 1 formed with high positional accuracy, the support 2 (semiconductor chip 23)
Displacement between the lens and the lens 1 can be reduced.
The optical axis deviation between the lens 3 and the lens 1 can be reduced. (3) In the present embodiment, since the periphery of the semiconductor chip 23 is filled with the flexible resin 3, stress is applied to the semiconductor chip by expansion and contraction of the lens 1 due to a change in environmental temperature. And the entry of moisture, water vapor and harmful gas into the semiconductor chip 23 can be prevented. Further, by filling the resin 3, the difference in the refractive index between the semiconductor chip and the outside can be reduced, and the light extraction efficiency can be improved. (4) Further, in the present embodiment, as shown in FIG. 2, the support used for the chip type light emitting element can be diverted and used, so that parts can be shared, and the unit cost of parts can be reduced due to mass production effects. Can be lowered. (5) In the light emitting device of the present embodiment, a resin having excellent light transmittance and weather resistance, such as amorphous nylon and norbonene resin, can be used as a lens material, so that luminous efficiency and reliability can be increased. Particularly, in a gallium nitride based semiconductor light emitting device capable of emitting light having a relatively short wavelength, light emitted with a short wavelength may deteriorate the resin used for the lens. By using a resin excellent in the gallium nitride, the life of the gallium nitride based semiconductor light emitting device can be extended.
【００１４】尚、本実施形態の発光素子においてはさら
に、可撓性樹脂３とレンズとの間に蛍光体を含有させた
樹脂を形成するようにしてもよい。この場合例えば、半
導体チップとして青色系の光の発光が可能な窒化ガリウ
ム系半導体発光素子を用い、蛍光体として、イットリウ
ム・アルミニウムガーネット系の蛍光体とを組み合わせ
ることにより、優れた白色光を出力できる発光素子を作
成できる。In the light emitting device of this embodiment, a resin containing a phosphor may be formed between the flexible resin 3 and the lens. In this case, for example, an excellent white light can be output by using a gallium nitride-based semiconductor light emitting element capable of emitting blue light as a semiconductor chip and combining a yttrium / aluminum garnet-based fluorescent material as a fluorescent material. A light-emitting element can be manufactured.
【００１５】以上の実施形態では、発光素子に適用した
例を示したが、本発明はこれに限らず、受光素子に適用
してもよい。以上のようにしても実施形態と同様の効果
を有する。In the above embodiment, an example in which the present invention is applied to a light emitting element is described. However, the present invention is not limited to this, and may be applied to a light receiving element. The same effects as those of the embodiment can be obtained in the above manner.
【００１６】また、本実施形態では、レンズ１の凹部１
１と支持体２とを嵌合させることにより位置精度を向上
させるようにしたが、本発明はこれに限らず、レンズ１
の凹部１１と支持体２との一方に位置決め用の突起を形
成し他方に位置決め用の穴を形成するようにして位置決
めをしてもよい。以上のようにしても実施形態と同様の
効果を有する。In this embodiment, the concave portion 1 of the lens 1 is used.
Although the position accuracy is improved by fitting the support 1 and the support 2, the present invention is not limited to this.
The positioning may be performed such that a positioning projection is formed on one of the concave portion 11 and the support 2 and a positioning hole is formed on the other. The same effects as those of the embodiment can be obtained in the above manner.
【００１７】また、本実施形態では、複数のレンズ１を
配列したレンズアレー１００を用いたが、本発明はこれ
に限らず、支持体（基板）上に配列させた半導体チップ
アレーを先に形成し、各半導体チップに、個々に分離さ
れたレンズを嵌合させるようにしてもよい。以上のよう
にしても実施形態と同様の効果を有する。In this embodiment, the lens array 100 in which the plurality of lenses 1 are arranged is used. However, the present invention is not limited to this, and the semiconductor chip array arranged on the support (substrate) is formed first. Alternatively, individually separated lenses may be fitted to each semiconductor chip. The same effects as those of the embodiment can be obtained in the above manner.
【００１８】また、本実施形態では、複数のレンズ１を
配列したレンズアレー１００を用いたが、本発明はこれ
に限らず、支持体（基板）上に配列させた半導体チップ
アレーを先に形成し、各半導体チップに、個々に分離さ
れたレンズを嵌合させるようにしてもよい。以上のよう
にしても実施形態と同様の効果を有する。In the present embodiment, the lens array 100 in which the plurality of lenses 1 are arranged is used. However, the present invention is not limited to this, and the semiconductor chip array arranged on the support (substrate) is formed first. Alternatively, individually separated lenses may be fitted to each semiconductor chip. The same effects as those of the embodiment can be obtained in the above manner.
【００１９】[0019]
【発明の効果】以上詳述したように、本発明に係る光半
導体素子は、上記支持体が上記レンズに設けられた凹部
に上記半導体チップが上記レンズの光軸上に位置しかつ
上記半導体チップの入出力面が該光軸に略垂直になるよ
うに嵌合されているので、極めて上記レンズの光軸と半
導体チップとの間の位置ずれが小さくでき、光の入出力
特性に優れた光半導体素子を提供することができる。ま
た、本発明に係る光半導体素子は、インサート成形又は
ハーメチックシールの工程を経ることなく製造できるの
で、極めて生産性よく製造することができる。As described in detail above, in the optical semiconductor device according to the present invention, the semiconductor chip is located on the optical axis of the lens in the concave portion where the support is provided in the lens. Since the input / output surface of the lens is fitted so as to be substantially perpendicular to the optical axis, the displacement between the optical axis of the lens and the semiconductor chip can be extremely reduced, and the light having excellent light input / output characteristics can be obtained. A semiconductor device can be provided. Further, since the optical semiconductor element according to the present invention can be manufactured without performing the steps of insert molding or hermetic sealing, it can be manufactured with extremely high productivity.
【図１】 本発明に係る実施形態の発光素子の模式断面
図である。FIG. 1 is a schematic sectional view of a light emitting device of an embodiment according to the present invention.
【図２】 図１における１つの発光部分を拡大して示す
模式断面図である。FIG. 2 is a schematic cross-sectional view showing one light emitting portion in FIG. 1 in an enlarged manner.
１…レンズ、 ２…支持体、 ３…樹脂、 １１…凹部、 ２１…支持体外周部、 ２２…外部接続電極、 ２３…半導体チップ、 １００…レンズアレー。 DESCRIPTION OF SYMBOLS 1 ... lens, 2 ... support, 3 ... resin, 11 ... recessed part, 21 ... outer peripheral part of a support, 22 ... external connection electrode, 23 ... semiconductor chip, 100 ... lens array.
Claims (5)
記半導体チップを覆うように設けられたレンズとを備
え、該レンズを介して光を入出力する光半導体素子の製
造方法において、 光の出力面と反対側の面に凹部を備えた１又は複数のレ
ンズを成形する工程と、 上記凹部に対応する外形状を有する支持体に、該支持体
が上記凹部に挿入されたときに半導体チップが上記レン
ズの光軸上に位置するようかつ上記半導体チップの入出
力面が該光軸に略垂直になるように半導体チップを搭載
する工程と、 上記半導体チップが搭載された支持体を上記レンズの凹
部に嵌合させる工程とを含むことを特徴とする光半導体
素子の製造方法。1. A method of manufacturing an optical semiconductor device, comprising: a support provided with a semiconductor chip; and a lens provided to cover the semiconductor chip, wherein the optical semiconductor element inputs and outputs light through the lens. Forming one or more lenses having a concave portion on the surface opposite to the output surface; and forming a semiconductor chip when the support is inserted into the concave portion on a support having an outer shape corresponding to the concave portion. Mounting the semiconductor chip such that the semiconductor chip is positioned on the optical axis of the lens and the input / output surface of the semiconductor chip is substantially perpendicular to the optical axis; And a step of fitting into the concave portion.
記半導体チップを覆うように設けられたレンズとを備
え、該レンズを介して光を入出力する光半導体素子であ
って、 上記支持体は、上記レンズに設けられた凹部に上記半導
体チップが上記レンズの光軸上に位置しかつ上記半導体
チップの入出力面が該光軸に略垂直になるように嵌合さ
れていることを特徴とする光半導体素子。2. An optical semiconductor device comprising: a support provided with a semiconductor chip; and a lens provided so as to cover the semiconductor chip, wherein the optical semiconductor element inputs and outputs light through the lens. Is characterized in that the semiconductor chip is fitted in a concave portion provided in the lens such that the semiconductor chip is located on the optical axis of the lens and the input / output surface of the semiconductor chip is substantially perpendicular to the optical axis. Optical semiconductor device.
チップと上記レンズとの間に透光性を有する可撓性樹脂
が充填されている請求項２記載の光半導体素子。3. The optical semiconductor element according to claim 2, wherein the optical semiconductor element is filled with a light-transmissive flexible resin between the semiconductor chip and the lens.
の支持体と、上記各半導体チップを覆うように設けられ
た複数のレンズとを備え、上記各レンズを介して光を入
出力する光半導体素子であって、 上記複数のレンズは一列又はマトリクス状に一体で配列
されてなり、上記各支持体は、上記各レンズに設けられ
た凹部に上記半導体チップが上記レンズの光軸上に位置
しかつ上記半導体チップの入出力面が該光軸に略垂直に
なるように嵌合されていることを特徴とする光半導体素
子。4. An optical semiconductor element comprising: a plurality of supports each provided with a semiconductor chip; and a plurality of lenses provided so as to cover each of the semiconductor chips, and input and output light through each of the lenses. Wherein the plurality of lenses are integrally arranged in a row or in a matrix, and each of the supports is such that the semiconductor chip is positioned on the optical axis of the lens in a concave portion provided in each of the lenses; An optical semiconductor device, wherein the input / output surface of the semiconductor chip is fitted so as to be substantially perpendicular to the optical axis.
チップと上記レンズとの間に透光性を有する可撓性樹脂
が充填されている請求項４記載の光半導体素子。5. The optical semiconductor element according to claim 4, wherein said optical semiconductor element is filled with a light-transmitting flexible resin between said semiconductor chip and said lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10018262A JPH11204841A (en) | 1998-01-13 | 1998-01-13 | Optical semiconductor device and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10018262A JPH11204841A (en) | 1998-01-13 | 1998-01-13 | Optical semiconductor device and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11204841A true JPH11204841A (en) | 1999-07-30 |
Family
ID=11966771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10018262A Pending JPH11204841A (en) | 1998-01-13 | 1998-01-13 | Optical semiconductor device and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11204841A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003075690A (en) * | 2001-08-31 | 2003-03-12 | Matsushita Electric Works Ltd | Transmitter and receiver |
| JP2004078145A (en) * | 2001-11-09 | 2004-03-11 | Ccs Inc | Light supply arrangement |
| JP2005050827A (en) * | 2004-10-22 | 2005-02-24 | Matsushita Electric Works Ltd | Process for manufacturing illumination light source and illumination light source |
| US6924514B2 (en) | 2002-02-19 | 2005-08-02 | Nichia Corporation | Light-emitting device and process for producing thereof |
| JP2007059618A (en) * | 2005-08-24 | 2007-03-08 | Matsushita Electric Works Ltd | Led light fixture |
| JP2007073825A (en) * | 2005-09-08 | 2007-03-22 | Stanley Electric Co Ltd | Semiconductor light emitting device |
| JP2010171340A (en) * | 2009-01-26 | 2010-08-05 | Panasonic Electric Works Co Ltd | Light emitting device |
| JP2013057702A (en) * | 2011-09-07 | 2013-03-28 | Casio Comput Co Ltd | Lens array, light source device, projector and manufacturing method of light source device |
| US20160341852A1 (en) | 2014-01-23 | 2016-11-24 | Koninklijke Philips N.V. | Light emitting device with self-aligning preformed lens |
-
1998
- 1998-01-13 JP JP10018262A patent/JPH11204841A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003075690A (en) * | 2001-08-31 | 2003-03-12 | Matsushita Electric Works Ltd | Transmitter and receiver |
| JP2004078145A (en) * | 2001-11-09 | 2004-03-11 | Ccs Inc | Light supply arrangement |
| US6924514B2 (en) | 2002-02-19 | 2005-08-02 | Nichia Corporation | Light-emitting device and process for producing thereof |
| JP2005050827A (en) * | 2004-10-22 | 2005-02-24 | Matsushita Electric Works Ltd | Process for manufacturing illumination light source and illumination light source |
| JP2007059618A (en) * | 2005-08-24 | 2007-03-08 | Matsushita Electric Works Ltd | Led light fixture |
| JP2007073825A (en) * | 2005-09-08 | 2007-03-22 | Stanley Electric Co Ltd | Semiconductor light emitting device |
| JP2010171340A (en) * | 2009-01-26 | 2010-08-05 | Panasonic Electric Works Co Ltd | Light emitting device |
| JP2013057702A (en) * | 2011-09-07 | 2013-03-28 | Casio Comput Co Ltd | Lens array, light source device, projector and manufacturing method of light source device |
| US20160341852A1 (en) | 2014-01-23 | 2016-11-24 | Koninklijke Philips N.V. | Light emitting device with self-aligning preformed lens |
| JP2017504215A (en) * | 2014-01-23 | 2017-02-02 | コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． | Light emitting device having a self-aligned preform lens |
| US10416356B2 (en) | 2014-01-23 | 2019-09-17 | Lumileds, LLC | Light emitting device with self-aligning preformed lens |
| US10895669B2 (en) | 2014-01-23 | 2021-01-19 | Lumileds Llc | Light emitting device with self-aligning preformed lens |
| US11313996B2 (en) | 2014-01-23 | 2022-04-26 | Lumileds Llc | Light emitting device with self-aligning preformed lens |
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