JPH11207633A - Diamond blade - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a diamond blade capable of preventing the wear of a boundary part between a cutting diamond chip and a steel substrate and shaking during cutting by reinforcing the substrate. SOLUTION: In a diamond blade DB having an outer diameter of approximately 250 mm or more for manufacturing a steel substrate 1 and cutting diamond chips 4 and 5 by a simultaneous sintering method, roughly T-shaped cutting diamond chips 4 and 5 having tongue parts 4a and 5a extended toward the center direction of a diamond wheel are attached to the outer periphery of the steel substrate 1 at a specified interval, and a plurality of substrate reinforcing diamond chips 6 formed toward the outer peripheral direction to have specified widths are attached to almost a middle position between the outer periphery of the substrate 1 and diamond blade DB at specified intervals in a circumferential direction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a diamond blade, and more particularly to a diamond blade used for cutting concrete, stone, and the like.

[0002]

2. Description of the Related Art In general, a diamond blade used for cutting hard and brittle materials such as stone and concrete has a large number of grooves formed on the outer periphery of a substrate, and the gap between the grooves is defined as a peripheral edge of the segment. The grain layer chip is formed by sintering, brazing, welding, or the like, and joining it to a substrate.

[0003] The diamond blade as described above,
As the cutting operation progresses, chips generate a phenomenon called so-called under-neck wear, in which the substrate portion below the joint of the diamond chips is scraped off. For this reason, there is a disadvantage that the diamond blade itself cannot be used although the diamond abrasive layer can still be used sufficiently.

In the cutting operation, in order to prevent the cutting surface of the work material from coming into contact with the substrate of the diamond blade, that is, so-called plate warping, the thickness of the substrate is reduced by the thickness of the diamond abrasive layer serving as the blade portion. It is necessary to provide a predetermined clearance between both surfaces of the substrate and the cut surface of the work material so as to reduce the thickness. For this reason, there has been a limitation in making the diamond blade thinner.

Therefore, as shown in FIG. 3, a diamond abrasive layer extending to the inner peripheral side of the substrate is formed, thereby providing abrasion resistance, preventing wear under the neck, and at the same time producing a grinding effect. There has been proposed a technique (see Japanese Patent Application Laid-Open No. 8-90425) that allows a thin diamond blade to be obtained at the same time that a cut surface is obtained and clearance is not required. That is, in this technique, a T-shaped diamond tip is attached in order to prevent abrasion of the boundary between the diamond tip and the substrate.

[0006]

Generally, when a diamond blade is manufactured by a co-sintering method, a steel substrate is heated to about 750 to 900 ° C. in a hot press (sintering furnace). There is an inconvenience of softening (even with a quenched substrate). Therefore, it is conceivable to increase the strength of the substrate. However, if the strength of the substrate is strong, the substrate may run out during the cutting operation by the diamond blade, and may not be able to be cut.

The diamond blade disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 8-90425 uses a thin substrate. Therefore, when the outer diameter of the diamond blade is increased (for example, the outer diameter is about 250 mm or more), cutting with the diamond blade is performed. There is a disadvantage that it is not possible to prevent the deflection of the diamond blade during operation.

An object of the present invention is to provide a diamond blade capable of preventing wear at a boundary between a diamond chip for cutting and a steel substrate and preventing run-out during cutting by strengthening the substrate.

[0009]

According to the first aspect of the present invention, there is provided a diamond blade having an outer diameter of approximately 250 mm or more for producing a steel substrate and a diamond chip for cutting by a simultaneous sintering method. At the same time, a substantially T-shaped cutting diamond chip having a tongue piece extending toward the center of the diamond wheel is attached to the outer periphery of the steel substrate at a predetermined interval, and the outer periphery of the substrate and the center of the diamond blade are attached. This problem can be solved by providing a configuration in which a plurality of substrate reinforcing diamond chips formed at a predetermined width in the outer peripheral direction at a substantially intermediate position are attached at predetermined circumferential intervals.

When the diamond blade according to the present invention is used to perform a cutting operation, the work is first cut by the cutting diamond chips 4 and 5, and as the cutting depth increases, the substrate reinforcing diamond chip 6 is cut. The cutting work proceeds in contact with the material. Since the diamond chips 6 protrude from both sides of the substrate 1, even if the diamond blade is inclined during the cutting operation,
Does not come into contact with the work material.

Therefore, it is possible to prevent the low-strength substrate from being deformed by the cutting heat and coming into contact with the work material so that the cutting becomes impossible as in the prior art. A steel substrate and a diamond chip for cutting are manufactured by a simultaneous sintering method.
Even with a diamond blade having a diameter of 50 mm or more, it is possible to prevent warpage of the plate, to prevent abrasion of a thin boundary between the diamond chip for cutting and the steel substrate, and to prevent runout during cutting by strengthening the substrate. It is possible to do.

[0012] At this time, it is preferable that the cutting diamond tip is of a plurality of types having different lengths extending toward the center of the tongue piece. By making the lengths of the tongue pieces different as described above, it is possible to reduce the use amount of the shorter diamond abrasive grains while maintaining the operation and effect of the present invention, thereby suppressing the cost.

Further, the thickness of the cutting diamond tip is preferably equal to or slightly larger than that of the substrate reinforcing diamond tip. As a result, the diamond chip for substrate reinforcement rotates within the width cut by the diamond chip for cutting, thereby reducing the contact between the diamond chip for substrate reinforcement and the cut surfaces located on both sides of the substrate, and causing friction or the like. Heat generation and plate warpage can be more effectively prevented.

Further, the diamond chip for reinforcing the substrate is
It is preferable that the groove be formed in a wedge shape and be located on a line connecting the groove and the center of the substrate. With this configuration, not only is it easy to balance the entire diamond blade, but also the amount of diamond abrasive grains used can be reduced as compared to a case where the substrate reinforcing diamond chip is rectangular.

Further, it is preferable that the diamond abrasive grains contained in the chip for strengthening the substrate are formed of finer grains than the diamond abrasive grains of the diamond tip for cutting. Since the diamond abrasive grains having such fine particle diameters are inexpensive, it is possible to reduce the manufacturing cost.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Diamond blade D of the present invention
B is a diamond blade DB having an approximate outer diameter of 250 mm or more for producing the steel substrate 1 and the diamond cutting chips 4 and 5 by a simultaneous sintering method. The diamond cutting chips 4 and 5 are mounted on the outer periphery of the steel substrate 1 at predetermined intervals.

At this time, the cutting diamond tip 4
Reference numeral 5 has a substantially T-shape with tongue pieces 4a and 5a extending toward the center of the diamond blade DB. The cutting diamond chips 4 and 5 are provided with tongue pieces 4a and 5
A plurality of types having different lengths extending toward the center of a are used.

A plurality of diamond chips 6 for reinforcing the substrate are attached to the substrate 1 at predetermined intervals in the circumferential direction of the substrate 1. The diamond chips 6 for reinforcing the substrate are located between the outer periphery of the substrate 1 and the center of the diamond blade DB. It is formed at a substantially intermediate position with a predetermined width toward the outer peripheral direction. The diamond chip 6 for reinforcing the substrate is formed in a wedge shape, and is located on a line connecting the groove 2 and the center of the substrate 1.

The thickness of the cutting diamond chips 4 and 5 is equal to or slightly larger than that of the substrate reinforcing diamond chip 6. The diamond abrasive grains contained in the chip 6 for reinforcing the substrate are diamond chips 4 for cutting.
5 is made of a finer grain than the diamond abrasive grains.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described below with reference to the drawings. It should be noted that the members, materials, arrangements, and the like described in the following examples do not limit the present invention and can be variously modified within the scope of the present invention.

1 and 2 show a diamond blade according to the present invention. FIG. 1 is a front view of the diamond blade, and FIG. 2 is a partial cross-sectional view taken along line AA of FIG.

As shown in FIG. 1, a diamond blade DB according to the present invention comprises a steel substrate 1, diamond chips 4 and 5 for cutting, and a diamond chip 6 for reinforcing the substrate.
And are the main components.

The diamond blade DB of the present invention is manufactured by simultaneously sintering the steel substrate 1 and the cutting diamond chips 4 and 5 among the above-mentioned structures. It is intended for. In the following example, a diamond blade DB having an outer diameter of 305 mm will be described as an example.

The steel substrate 1 of this embodiment is a circular plate, and has a mounting hole 3 formed at the center for mounting to a jig or the like (not shown), and grooves 2 formed at predetermined intervals on the outer periphery. . A circular portion 2 a is formed at the end of the groove 2 on the side of the mounting hole 3. A segment is formed between the grooves 2, and diamond chips 4 and 5 for cutting are formed in the segment. That is, diamond chips 4 and 5 for cutting are mounted on the outer periphery of the steel substrate 1 at predetermined intervals. In this example, 24 groove portions 2 are formed, and 24 segment portions are formed between the groove portions 2.

The cutting diamond tips 4 and 5 of this embodiment
Uses two types. As shown in FIG. 1, each of the cutting diamond tips 4 and 5 has tongue pieces 4a and 5 extending toward the center of the diamond blade DB.
a and is substantially T-shaped when viewed from the front in FIG. And two kinds of cutting diamond chips 4, 5
Are configured such that the lengths of the tongue pieces 4a and 5a extending toward the center are different. In this example, the tongue piece 4a of the cutting diamond tip 4 is formed shorter than the tongue piece 5a of the cutting diamond tip 5.

In this example, two different types of cutting diamond chips 4 and 5 are alternately formed one by one adjacent to each other with the groove 2 interposed therebetween. It may be configured so that two or more are continuous and alternate.

The tongue pieces 4a and 5a of the cutting diamond chips 4 and 5 having different lengths are not limited to two types as in this embodiment, but may be formed of more than two types. With regard to (1), it is also possible to adopt a configuration in which the rotation balance of the diamond blade DB is taken into consideration, and the diamond blade DB is arranged on the substrate 1 in a well-balanced manner.

In this embodiment, the substrate reinforcing diamond chips 6 are formed on both surfaces of the substrate 1. That is, as shown in FIGS. 1 and 2, the substrate reinforcing diamond chip 6 is formed with a predetermined width in the outer peripheral direction of the diamond blade DB, and is formed between the outer periphery of the substrate 1 and the center of the diamond blade DB. At a substantially middle position, a plurality are mounted at predetermined intervals in the circumferential direction. In this example, twelve substrate reinforcing diamond chips 6 are formed. The diamond chip 6 for reinforcing the substrate is formed by the simultaneous sintering method, similarly to the diamond chips 4 and 5 for cutting.

As shown in FIG. 2, the thickness T1 of the cutting diamond chips 4 and 5 and the thickness T2 of the substrate reinforcing diamond chip 6 are the same or the same. It is preferable that the thickness T1 is slightly thicker. That is, T1 = T2 or T1
1 = T2 + (about 0.1 to 0.2 mm) thicker.

As shown in FIG. 1, the substrate reinforcing diamond chip 6 of this embodiment has a wide wedge shape on the outer peripheral side, and is located on a line connecting the groove 2 and the center of the substrate 1. Is formed. This is selected from the viewpoint of balance, but the shape and position of the diamond chip 6 for reinforcing the substrate are not limited to this.

Further, the diamond abrasive grains contained in the substrate-strengthening diamond chips 6 of this embodiment are finer than the diamond abrasive grains of the cutting diamond chips 4 and 5. Thus, an inexpensive (fine) one can be used, and the manufacturing cost can be reduced.

Next, a description will be given of a case where a cutting operation is performed with the diamond blade DB of the present embodiment having the above-described configuration. First, a work material (not shown) is cut by the cutting diamond chips 4 and 5, and as the cutting depth of the diamond blade DB into the cut material becomes deeper, the state where the substrate reinforcing diamond chip 6 is in contact with the work material. The cutting work proceeds.

As the cutting operation progresses, the substrate portion of the diamond blade DB also enters the cut surface.
Protrudes from both sides of the substrate 1, so during the cutting operation,
Even if the diamond blade DB is inclined, the substrate 1 can be prevented from contacting the cut surface of the work material.

Therefore, it is possible to prevent the low-strength substrate from being deformed by the cutting heat and coming into contact with the work material to make it impossible to cut as in the prior art.

[0035]

As described above, the present invention relates to a diamond blade having an outer diameter of approximately 250 mm or more for producing a steel substrate and a diamond chip for cutting by a simultaneous sintering method.
A substantially T-shaped cutting diamond chip having a tongue piece extending toward the center of the diamond wheel is attached to the outer periphery of the steel substrate at a predetermined interval, and approximately the center of the outer periphery of the substrate and the center of the diamond blade. A plurality of diamond chips for reinforcing the substrate formed at a predetermined width in the outer peripheral direction at the intermediate position are attached at predetermined intervals in the circumferential direction. Since the diamond chips for reinforcing the substrate are attached, the side surface of the substrate is a work material. It does not come into direct contact with the blade, thereby preventing the generation of frictional heat and vibration, thereby improving work safety and strengthening the entire blade.

Further, since the diamond blade is a co-sintered diamond blade, it can be manufactured at a lower cost than a diamond blade in which a diamond chip is attached to the outer periphery of a high-strength quenched substrate by laser welding. We can provide diamond blade.

[Brief description of the drawings]

FIG. 1 is a front view of a diamond blade according to the present invention.

FIG. 2 is a partial cross-sectional view taken along line AA of FIG.

FIG. 3 is a front view showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Steel substrate 1 2 Groove part 2a Circular part 3 Mounting hole 4,5 Diamond chip for cutting 4a, 5a Tongue piece part 6 Diamond chip for substrate reinforcement DB diamond blade

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI B28D 1/24 B28D 1/24

Claims (5)

[Claims] 1. A diamond blade having an outer diameter of approximately 250 mm or more for producing a steel substrate and a diamond chip for cutting by a simultaneous sintering method, wherein the diamond blade extends toward the center of a diamond wheel on the outer periphery of the steel substrate. A substantially T-shaped cutting diamond chip having a protruding tongue piece is attached at a predetermined interval, and a substrate reinforcement formed at a predetermined width in the outer peripheral direction at a substantially intermediate position between the outer periphery of the substrate and the center of the diamond blade. Characterized in that a plurality of diamond tips are attached at predetermined intervals in the circumferential direction. 2. The diamond blade according to claim 1, wherein the cutting diamond tip is of a plurality of types having different lengths extending toward the center of the tongue piece. 3. The diamond blade according to claim 1, wherein the diamond tip for cutting has a thickness equal to or slightly larger than that of the diamond tip for reinforcing the substrate. 4. The diamond chip for reinforcing a substrate,
2. The diamond blade according to claim 1, wherein the diamond blade is formed in a wedge shape and is located on a line connecting the groove and the center of the substrate. 5. The diamond abrasive grains contained in the chip for strengthening a substrate, the diamond abrasive grains having a smaller particle diameter than the diamond abrasive grains of the diamond tip for cutting. Or a diamond blade as described.