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JPH11209898A5 - - Google Patents

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Publication number
JPH11209898A5
JPH11209898A5 JP1998026397A JP2639798A JPH11209898A5 JP H11209898 A5 JPH11209898 A5 JP H11209898A5 JP 1998026397 A JP1998026397 A JP 1998026397A JP 2639798 A JP2639798 A JP 2639798A JP H11209898 A5 JPH11209898 A5 JP H11209898A5
Authority
JP
Japan
Prior art keywords
anode
plating
plated
insoluble
soluble
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998026397A
Other languages
Japanese (ja)
Other versions
JPH11209898A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2639798A priority Critical patent/JPH11209898A/en
Priority claimed from JP2639798A external-priority patent/JPH11209898A/en
Publication of JPH11209898A publication Critical patent/JPH11209898A/en
Publication of JPH11209898A5 publication Critical patent/JPH11209898A5/ja
Pending legal-status Critical Current

Links

Description

【0012】
【課題を解決するための手段】
上記問題点を解決するため本願の請求項1に記載の発明は、電解メッキ液中に、メッキ対象物と、メッキ対象物から所定距離離間してメッキ対象物と対向するように設置されるアノード電極とを浸漬し、メッキ対象物とアノード電極間に通電することでメッキ対象物表面にメッキを行なうメッキ装置において、前記アノード電極は、溶解性アノード電極と不溶解性アノード電極とから構成されていることを特徴とする
また本願の請求項2に記載の発明は、前記溶解性アノード電極と不溶解性アノード電極とは、重ね合わせていることを特徴とする。
また本願の請求項3に記載の発明は、前記溶解性アノード電極をメッキ対象物側に対向せしめるように配置したことを特徴とする。
また本願の請求項4に記載の発明は、前記溶解性アノード電極と不溶解性アノード電極は、板状であることを特徴とする。
また本願の請求項5に記載の発明は、前記不溶解性アノード電極は、これを浸漬する電解メッキ液の成分金属からなる材料で形成されていることを特徴とする。
[0012]
[Means for solving the problem]
In order to solve the above problems, the invention described in claim 1 of the present application provides a plating apparatus in which an object to be plated and an anode electrode placed facing the object at a predetermined distance from the object to be plated are immersed in an electrolytic plating solution, and a current is passed between the object to be plated and the anode electrode, wherein the anode electrode is composed of a soluble anode electrode and an insoluble anode electrode.
In a second aspect of the present invention, the soluble anode electrode and the insoluble anode electrode are overlapped with each other.
The invention as set forth in claim 3 of the present application is characterized in that the soluble anode electrode is disposed so as to face the object to be plated.
In a fourth aspect of the present invention, the soluble anode electrode and the insoluble anode electrode are plate-shaped.
In a fifth aspect of the present invention, the insoluble anode electrode is formed from a material containing a metal component of the electrolytic plating solution in which it is immersed .

Claims (5)

電解メッキ液中に、メッキ対象物と、メッキ対象物から所定距離離間してメッキ対象物と対向するように設置されるアノード電極とを浸漬し、メッキ対象物とアノード電極間に通電することでメッキ対象物表面にメッキを行なうメッキ装置において、
前記アノード電極は、溶解性アノード電極と不溶解性アノード電極とから構成されていることを特徴とするメッキ用アノード電極。
A plating apparatus for plating a surface of an object to be plated by immersing the object to be plated and an anode electrode disposed opposite the object to be plated at a predetermined distance in an electrolytic plating solution and passing a current between the object to be plated and the anode electrode,
1. A plating anode, comprising : a soluble anode and an insoluble anode.
前記溶解性アノード電極と不溶解性アノード電極とは、重ね合わせていることを特徴とする請求項1記載のメッキ用アノード電極。2. The plating anode according to claim 1, wherein the soluble anode and the insoluble anode are overlapped with each other . 前記溶解性アノード電極をメッキ対象物側に対向せしめるように配置したことを特徴とする請求項1又は2に記載のメッキ用アノード電極。3. The plating anode according to claim 1, wherein the soluble anode is disposed so as to face the object to be plated. 前記溶解性アノード電極と不溶解性アノード電極は、板状であることを特徴とする請求項1又は2又は3に記載のメッキ用アノード電極。4. The plating anode according to claim 1, wherein the soluble anode and the insoluble anode are plate-shaped. 前記不溶解性アノード電極は、これを浸漬する電解メッキ液の成分金属からなる材料で形成されていることを特徴とする請求項1又は2又は3又は4に記載のメッキ用アノード電極。5. The plating anode according to claim 1 , wherein the insoluble anode is made of a material containing a metal component of the electrolytic plating solution in which the insoluble anode is immersed.
JP2639798A 1998-01-23 1998-01-23 Plating anode Pending JPH11209898A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2639798A JPH11209898A (en) 1998-01-23 1998-01-23 Plating anode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2639798A JPH11209898A (en) 1998-01-23 1998-01-23 Plating anode

Publications (2)

Publication Number Publication Date
JPH11209898A JPH11209898A (en) 1999-08-03
JPH11209898A5 true JPH11209898A5 (en) 2004-11-11

Family

ID=12192431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2639798A Pending JPH11209898A (en) 1998-01-23 1998-01-23 Plating anode

Country Status (1)

Country Link
JP (1) JPH11209898A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4862158B2 (en) * 2006-08-31 2012-01-25 国立大学法人静岡大学 Film forming apparatus and film forming method
JP4826496B2 (en) * 2007-02-16 2011-11-30 三菱マテリアル株式会社 Electrode plating anode electrode mounting structure
JP4942580B2 (en) * 2007-08-20 2012-05-30 株式会社荏原製作所 Current carrying belt for anode holder and anode holder
JP5400408B2 (en) * 2009-02-13 2014-01-29 株式会社荏原製作所 Current-carrying member for anode holder and anode holder
JP5692268B2 (en) * 2013-03-25 2015-04-01 トヨタ自動車株式会社 Metal film forming apparatus and film forming method
JP6024714B2 (en) * 2013-10-03 2016-11-16 トヨタ自動車株式会社 Nickel solution for film formation and film forming method using the same

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