JPH11232417A - Manufacture of ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide high adhesive power and durability, to improve thickness precision and to reduce the number of processes by sticking an IC module and a card-like support with an optical cation curing self-adhesive sheet which is previously worked in an adhesion face form. SOLUTION: In the adhesion of an IC module and a card-like support, an optical cation curing self-adhesive sheet which is previously worked in an adhesion face form is sandwiched in a prescribed position between the IC module and the card-like supporting body and it is lightly pressed, they the IC module and the card-like support are recognized to be stacked in precise positions, and then light is irradiated, and the optical cation curing self-adhesive sheet is cured, thus the IC module and the card-like support are adhered. Curing by optical cation polymerization differs from that of an optical radical polymerization type and the reaction proceeds even after light irradiation. Thus, curing reaction is controlled by controlling the intensity of irradiation. Therefore sufficient adhesive power can be given between the IC module and the card-like support.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing an IC card.

[0002]

2. Description of the Related Art In recent years, IC cards have rapidly spread as cash cards, prepaid cards, ID cards, and the like as high-capacity, high-density, high-reliability information recording media that can replace conventional magnetic recording type information cards. Have begun to do. IC
The card has a structure in which components such as an IC chip and a power supply which are the center of a computer are fixed to a support made of a card-shaped resin plate. After the IC chip is mounted on a support made of a card-like resin plate or a printed board by a method such as wire bonding, it is fixed with a thermosetting or light-curing liquid resin material generally called a sealant.
A member connecting an IC chip to a printed circuit board, which is an electric circuit, is particularly called an IC module.

In recent years, with the rapid spread of IC cards,
Significant reduction in manufacturing cost such as improvement of the manufacturing efficiency is required. For example, Japanese Patent Application Laid-Open No. 63-150929 discloses a method in which an IC chip is directly embedded in a card-shaped support and fixed with a sealant. There has been reported a method of improving the flatness by increasing the production efficiency by pressing a transparent shaping plate so that the photocurable liquid sealant does not protrude and protrude.

However, even in this method, it is necessary to strictly control the amount of the sealant to be applied in order to improve the flatness, and the productivity is reduced since the IC chip is directly embedded in the card. there were. Further, a method for efficiently modularizing an IC chip to increase productivity is disclosed in Japanese Patent Laid-Open No.
As described in Japanese Patent Application Laid-Open No. 51009, even in this method, an adhesive such as hot melt is used for bonding the IC module and the card-shaped support, so that the adhesive thickness at the time of bonding is not uniform and the IC module and the card-shaped support are not provided. The parallelism of the body collapses,
In addition, there is contamination due to protrusion of the adhesive itself, and as a result, production efficiency is reduced.

[0005] However, as a method for increasing the parallelism in bonding the IC chip or the IC module to the card-shaped support as described above and preventing contamination due to the protrusion of the adhesive, an adhesive having an easy adhesion and a uniform thickness is used. Use of sheets is conceivable, but it is difficult to use pressure-sensitive adhesive sheets at present because high adhesive strength and durability are not desired.

[0006]

DISCLOSURE OF THE INVENTION The present invention has been made in view of the above facts, and has as its object to provide a support comprising a component such as an IC chip and an IC module and a card-shaped resin plate. (Hereinafter, these may be collectively referred to as IC card members.) In a method of manufacturing an IC card for bonding and fixing members, a high adhesive force and durability are provided for fixing the members, the thickness accuracy is high, and the process is remarkably performed. An object of the present invention is to provide a method for manufacturing an IC card which can be reduced.

[0007]

According to the first aspect of the present invention,
The gist of the present invention is a method for manufacturing an IC card, which comprises bonding an IC module and a card-shaped support with a photocationically curable adhesive sheet that has been processed into a bonding surface shape in advance.

According to a second aspect of the present invention, there is provided the IC card according to the first aspect, wherein the cationic photocurable adhesive sheet comprises a cationic photopolymerization initiator, a cationically polymerizable compound, and an adhesive polymer. The gist of the present invention is a manufacturing method of the above.

The cationic photocurable pressure-sensitive adhesive sheet used in the present invention exhibits tackiness in a normal state, and can adhere adherends to each other with a weak pressure such as light finger pressure. I
Adhesion by sticking C card member with adhesive sheet
Since it can be fixed, the number of bonding steps can be significantly reduced. Further, since the photocationically curable pressure-sensitive adhesive sheet can be formed to have a certain thickness, the thickness accuracy is significantly improved. The photocationically curable adhesive sheet of the present invention is cured by irradiating light of an active wavelength, and can firmly adhere IC card members to each other. It is processed into the shape of the bonding surface of each of the card members.

The photocationically curable adhesive sheet gradually cures after photoirradiation because the photocationic polymerization reaction proceeds in the system. In the cationic photopolymerization reaction, since the active species are hardly affected by reaction inhibition such as oxygen and exist for a long period of time, the cationic photocurable adhesive sheet after light irradiation can be cured by a dark reaction. Therefore, since the curing reaction proceeds without continuously irradiating light, the photocationically curable adhesive sheet after light irradiation does not immediately lose its pressure-sensitive adhesive property. Can be stuck to the IC card member and bonded, and even when the stuck place is a shadow zone, an adhesive cured product having excellent adhesive strength can be reliably obtained.

As inhibitors of the photocationic polymerization reaction,
Examples include water and basic substances. The degree of the inhibition depends on the type of the inhibitor and the composition of the photo-cation-curable pressure-sensitive adhesive sheet. It is desirable to design and select the configuration of the photocationically curable adhesive sheet and IC card member so that the substance does not significantly inhibit the polymerization curing reaction.

The photo-cationically curable adhesive sheet which has been polymerized and cured has an increased cohesive force due to three-dimensional crosslinking of the photo-cationically polymerizable functional groups. Therefore, an adhesive cured product having excellent hardness and heat resistance is provided. Therefore, ultimately, it is desirable that the photocationically curable pressure-sensitive adhesive sheet be increased in hardness and heat resistance so as to lose pressure-sensitive adhesiveness.

The thickness of the photocationically curable adhesive sheet is as follows:
Although not particularly limited, preferably, 1 to 30
00 μm, more preferably 10 to 1000 μm. If the thickness of the sheet is less than 1 μm, curing proceeds rapidly after light irradiation, and the working time is restricted, and
If it exceeds 000 μm, it takes a long time to cure.

The processing of the adhesive surface shape previously applied to the photocationically curable pressure-sensitive adhesive sheet refers to the I / O of the IC card to be manufactured.
This is for firmly bonding and fixing the C card members with good thickness accuracy.

Means for processing the photocationically curable pressure-sensitive adhesive sheet into an adhesive surface shape is not particularly limited.
For example, a method of punching and cutting a photo-cation-curable adhesive sheet into a member shape, pressing the photo-cation-curable adhesive sheet into a predetermined shape, and forming a concave portion for sealing the member. Method of shaping the shape, screen printing coating of the cationic photocurable adhesive composition on process paper,
A method of partially applying a predetermined adhesive surface shape by a coating method such as gravure printing or inkjet printing is used.

The photo-cationically curable adhesive sheet processed into an adhesive surface shape can prevent the adhesive surface from being exposed to external light, being contaminated with dust, or causing troubles such as unnecessary bonding. Preferably, the adhesive surface is protected by a light-shielding protective film. Examples of the light-shielding protective film include, for example, plastic films such as polyethylene terephthalate, polyethylene naphthalate, polyethylene, polypropylene, cellophane, polystyrene, and polyimide, which have been release-treated with silicone, polytetrafluoroethylene, and the like, and nonwoven fabrics and papers. . These light-shielding protective films may be a single film formed by kneading a light-shielding pigment such as carbon black, or a composite film in which a light-shielding layer containing a light-shielding agent such as carbon black is laminated. You may.

The light having an active wavelength is not particularly limited as long as it can be cured by irradiating the photocationically curable adhesive sheet and can firmly adhere the adherend. For example, ultraviolet rays, electron beams, β rays, γ rays,
Examples include electromagnetic waves such as visible light and infrared light. Of the light having the active wavelength, ultraviolet light, which is generally easy and convenient to handle and can obtain relatively high energy, is preferably used. More preferably, ultraviolet light having a wavelength of 200 to 400 nm is used. Ultraviolet rays can be emitted using a light source such as a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a chemical lamp, and a xenon lamp.

As described above, curing by photocationic polymerization differs from photoradical polymerization-type curing, in that the reaction proceeds even after irradiation with light. Therefore, the curing reaction is controlled by adjusting the irradiation intensity. The bonding between the IC module and the card-shaped support is carried out by sandwiching a photocationically curable adhesive sheet that has been processed in advance into a bonding surface at a position between the IC module and the card-shaped support that has been processed into the bonding surface. After confirming that the IC module and the card-shaped support are laminated at the correct position by pressing lightly, light irradiation is performed to cure the photo-cation-curable adhesive sheet to form the IC module and the card-shaped support. After irradiation, the photocationic curable adhesive sheet is immediately cured to adjust the irradiation intensity so that the adhesiveness is not lost, and the IC module and the card are irradiated in the light irradiation environment. The IC support and the card-like support may be bonded by curing the photo-cationic curable adhesive sheet by laminating and positioning the support at a position where the support in the form of a bonding surface has been processed in advance.

By performing the operations of lamination, positioning, adhesion by pressing, and light irradiation, the photocationically curable adhesive sheet finally cures while being bonded to the IC module and the card-like support surface. , To develop a sufficient adhesive strength between them. As described above, since the curing method by photocationic polymerization by light irradiation can be applied to both transparent and opaque materials, ICs made of opaque materials are basically used.
It can be suitably used for curing the adhesive between the module and the card-shaped support. The IC module as the adherend and the card-shaped support are bonded and fixed with a high adhesive force, high durability is provided, and the bonding step is performed. It is possible to manufacture a low-cost IC card that can be simplified and reduced in man-hour.

According to the second aspect of the present invention, the cationic photocurable adhesive sheet contains, as essential components, a cationic photopolymerization initiator, a cationically polymerizable compound, and an adhesive polymer.

The photo-cationic polymerization initiator is activated by irradiation with light to generate a photo-cationic polymerization initiator, and can initiate polymerization by irradiation with light. Can be started. These photocationic polymerization initiators are not particularly limited, and may belong to any of an ionic photoacid generating type and a nonionic photoacid generating type. Examples of those belonging to the ionic photoacid generation type include, for example, onium salts such as aromatic diazonium salts, aromatic halonium salts, and aromatic sulfonium salts, and organometallic complexes such as iron allene complexes, titanocene complexes, and arylsilanol-aluminum complexes. And the like, and as these commercially available products, Asahi Denka Co., Ltd. product name "OPTMER S
P-150 "," OPTMER SP-170 ", manufactured by General Electronics Co., Ltd., trade name" UVE 1014 ",
There is a product name “CD-1012” manufactured by Sartomer.

Examples of those belonging to the nonionic photoacid generating type include nitrobenzyl ester, sulfonic acid derivative, phosphoric acid ester, phenolsulfonic acid ester, diazonaphthoquinone, N-hydroxyimidesulfonate and the like. . These photocationic polymerization initiators may be used alone or in combination of two or more, and may be cured in a plurality of stages using a plurality of photocationic polymerization initiators having different effective active wavelengths. .

The cationic photopolymerization initiator is used in an amount of 0.000 to 1 mol of the functional group of the cationic photopolymerizable compound described below.
It is preferable to mix in the range of 1 to 10 mol.
If the amount is less than 0.0001 mol, the cationic photopolymerization does not proceed sufficiently, and the curing rate may be reduced.
When the temperature exceeds the limit, the curing by light irradiation proceeds too quickly, and the work time required for application to the adherend may be restricted.

The cationic photopolymerizable compound is not particularly limited, but the main ones include, in the molecule, a photocationically polymerizable functional group such as a hydroxyl group, a vinyl ether group, an episulfide group, an ethyleneimine group, There is a polymerizable compound having an epoxy group or the like. These cationically polymerizable compounds may be used alone or in combination of two or more. The molecular weight of the cationically polymerizable compound is not particularly limited, and the cationically polymerizable compound may be a monomer or an oligomer.
It may be a polymer.

Among the cationically polymerizable compounds, the cationically polymerizable compound having an epoxy group is particularly preferable because the reactivity of ring-opening polymerization of the epoxy group is high and the curing step is short, so that the bonding step can be shortened. Used for

The cationically polymerizable compound having an epoxy group is not particularly limited, but examples thereof include bisphenol A type, bisphenol F type, phenol novolak type, cresol novolak type, glycidyl ether type, glycidylamine type and the like. Epoxy resins are mentioned.

The epoxy resin has a softening point of 40 ° C.
It is preferable to use the above-mentioned solid epoxy resin in order to enhance workability such as cutability. The softening point can be measured by a ring and ball method (ASTM E28-51T).

Preferred solid epoxy resins having a softening point of 40 ° C. or higher include, for example, bisphenol A such as Epicoat 1001 (softening point 64 ° C.) and Epicoat 1002 (softening point 78 ° C.) manufactured by Yuka Shell Epoxy Co., Ltd. Type epoxy oligomer; manufactured by Asahi Denka Co., Ltd .; trade name: phenol novolac type epoxy resin such as Adeka Optomer KRM2610 (softening point: 65 ° C.); Product name: Adeka Optmer KRM2650, manufactured by Asahi Denka Co., Ltd.
(Softening point 64 ° C.) and the like.

Further, similarly to the epoxy resin, an addition polymer of a monomer or oligomer having an epoxy group is preferably used. Examples of the addition polymer of a monomer or oligomer having an epoxy group include, for example, glycidylated polyester,
Glycidylated polyurethane, glycidylated acrylic polymer and the like can be mentioned. Among the addition polymers of monomers and oligomers having an epoxy group, glycidylated acrylic polymers are particularly preferred because they have high compatibility with acrylic adhesive polymers used as adhesive polymers described later and exhibit high adhesive strength. It is. Glycidylated acrylic polymer is, for example, a method of reacting epichlorohydrin with an acrylic polymer having a hydroxyl group,
Alternatively, it can be obtained by a method of copolymerizing glycidyl (meth) acrylate with another acrylic monomer or the like.

The cationically polymerizable compound may be optionally used
Further, these resins may be blended or added with other resin components or the like to increase the flexibility or to improve the adhesive force or the bending force. Carboxyl group-containing butadiene-acrylonitrile rubber) modified epoxy resin; acrylic rubber, NBR, SB
Epoxy resin in which various rubbers such as R, butyl rubber, or isoprene rubber are dispersed; epoxy resin modified with liquid rubber as described above; and various resins such as acryl, urethane, urea, polyester, and styrene are added. Epoxy resins; chelate-modified epoxy resins; polyol-modified epoxy resins and the like can be used.

The cationically polymerizable compound may further have a modified functional group, or may have a reactive functional group such as a radically polymerizable unsaturated bond introduced therein. .

The cationically polymerizable compound has a functional group equivalent of 150 to 5,000 g in the curable adhesive composition.
It is preferably present at about regin / mol. If the functional group equivalent is smaller than this, the reactivity is increased, and the working time until sticking to the adherend after irradiation may be restricted, and if it is large, the reaction speed becomes slow and it takes a long time to cure. Sometimes. However, the amount of the functional group cannot be univocally determined because it is determined depending on the desired reaction rate and curing properties.

The tacky polymer has been used to impart pressure-sensitive adhesive properties to the photocationically curable adhesive sheet.
In this case, in order to provide pressure-sensitive adhesive properties, the photocationically curable adhesive sheet is configured so that the votac is preferably 3 or more at room temperature.

In order to obtain pressure-sensitive adhesiveness, it is necessary that the balance between wettability to an adherend and cohesion is appropriate. Therefore, in order to obtain cohesive force, a rubber-based resin or an acrylic polymer widely used as a main component of a conventional pressure-sensitive adhesive is used as the tacky polymer.

Examples of the adhesive polymer include silicones and polyesters such as a mixture of a silicone rubber such as polydimethylsiloxane and polydiphenylsiloxane and a silicone resin such as polysiloxane having a trimethylsilyl group or a triphenylsilyl group. Polyurethanes, polyethers, polycarbonates,
Polymers such as polyvinyl ethers, polyvinyl chlorides, polyvinyl acetates, and polyisobutylene, acrylic polymers, acrylic rubber, acrylonitrile / butadiene rubber (NBR), random styrene / butadiene rubber, butyl rubber, isoprene rubber (IR) , Butadiene rubber, ethylene / propylene rubber (EPM), ethylene / propylene / diene rubber (EPDM), urethane rubber, styrene / isoprene / styrene block rubber (S
IS), styrene / ethylene / butadiene / styrene block rubber (SEBS), and synthetic rubber polymers such as styrene / butadiene block rubber. Further, the adhesive polymer may be a homopolymer or a copolymer.

In particular, in the present invention, an acrylic polymer containing an alkyl acrylate having a low glass transition point as a main component is preferably used because the polymer alone can exert appropriate pressure-sensitive adhesiveness.

Preferred acrylic polymers include, for example, homopolymers or copolymers of alkyl (meth) acrylate monomers having an alkyl group having 1 to 14 carbon atoms, and more preferably alkyl (meth) acrylate. A) an acrylate monomer and said alkyl (meth)
A copolymer of an acrylate monomer and a vinyl monomer having an unsaturated bond copolymerizable therewith can be exemplified.

The alkyl (meth) acrylate monomers include methyl (meth) acrylate and ethyl (meth) acrylate.
Acrylate, n-butyl (meth) acrylate, 2-
Examples include ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, isononyl (meth) acrylate, and isomyristyl (meth) acrylate.

The vinyl monomer is not particularly limited as long as it is a compound having an unsaturated bond copolymerizable with the alkyl (meth) acrylate monomer. Examples of the vinyl monomer include methacrylates other than the alkyl (meth) acrylate monomer, vinyl acetate, and styrene. , Vinyl chloride, ethylene, propylene, 2-hydroxyethyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, ε-
Caprolactone (meth) acrylate, 2-acryloyloxyethyl (propyl) succinic acid, (meth) acrylonitrile, N-vinylpyrrolidone, isobornyl (meth) acrylate, N-acryloylmorpholine, benzyl (meth) acrylate, glycidyl (meth) acrylate , N-vinylcaprolactone, N-vinylpiperidine, (meth) acrylic acid, maleic anhydride, crotonic acid, itaconic acid and the like.

The cationic photocurable pressure-sensitive adhesive sheet used in the present invention may contain, in addition to the above, other known tackifying resins and extenders as long as the object of the present invention is not impaired. Good.

For example, in order to improve the tackiness of the photocationically curable adhesive sheet, a rosin-based resin, a modified rosin-based resin, a terpene resin, a terpene phenol resin, an aromatic modified terpene resin, a C5-based or C9-based resin can be used. Petroleum resin,
A tackifying resin such as a chroman resin may be added.
In particular, when the adherend is a polyolefin, a rosin-based resin and a petroleum resin are preferable in that a strong adhesive force can be exhibited.

The photocationically curable adhesive sheet may be appropriately cross-linked before light irradiation in order to balance the wettability and cohesion of the adherend and the curable adhesive. (Hereinafter, referred to as initial crosslinking).

Although the method of the initial crosslinking is not particularly limited, the functional group in the photocationically curable adhesive sheet is
Generally, molecular crosslinking by a polyfunctional oligomer (for example, polyisocyanate, polyepoxy, polyol, polyfunctional acrylic oligomer, etc.), ionic crosslinking by a metal oxide or a metal chelate, and the like are common.

The initial crosslinking is preferably 70% or less in the insoluble portion (gel portion) of the photocationically curable adhesive sheet. If the initial crosslinking degree is higher than this, the wettability to the adherend is reduced, and a sufficient initial adhesive strength may not be obtained.

The photocationically curable adhesive sheet is kneaded with the above-described components and processed into a sheet. Means for processing into a sheet shape is not particularly limited as long as it can be processed with high precision in thickness, and for example, various forming methods such as a roll coating method, a gravure coating method, and an extrusion method can be used. . When the cationic photopolymerizable composition constituting the cationic photocurable adhesive sheet is solid, or has a high viscosity even in a liquid state, and cannot be applied, the composition may be diluted with an appropriate solvent. Alternatively, the viscosity may be reduced by melting from heating.

In the case of dilution, a solvent having a boiling point of 40
It is preferable to use an organic solvent of about 200 ° C. Examples of such organic solvents include acetone, methyl ethyl ketone, methyl isobutyl ketone, ethyl formate, butyl formate, methyl acetate, ethyl acetate, butyl acetate, toluene, p-xylene, n-hexane, cyclohexane, chloroform, carbon tetrachloride And other common solvents can be used. These common solvents are described in detail in "Solvent Handbook" published by Kodansha. When using these organic solvents, it is desirable to select one having high compatibility with the composition.

When processed into a sheet, the surface is preferably protected by a releasable support having a releasable property. More preferably, it is desirable to apply the curable pressure-sensitive adhesive composition to a surface-peelable support that is configured to have releasability on both sides, and wind it into a roll.

The photocationically curable pressure-sensitive adhesive sheet does not necessarily need to be provided on a substrate. That is, the curable adhesive sheet may be a curable adhesive sheet supported by a substrate, or a double-sided adhesive curable adhesive sheet having no substrate.
When a substrate is required, the photo-cationically curable composition is applied to the substrate by applying a curable adhesive composition to the substrate or by transferring the curable adhesive applied to a peelable support. An adhesive sheet may be formed.

From the viewpoint of dimensional change such as expansion or shrinkage during heating, a substrate having excellent heat resistance is preferable. Generally, polyester, polyimide,
A heat-resistant substrate such as polypropylene, paper, nonwoven fabric, and metal foil can be suitably used. However, the material constituting the base material is not particularly limited.

In the method for manufacturing an IC card according to the first aspect of the present invention, as described above, the IC module is made of a card-like support by using a photocationically curable adhesive sheet that has been processed into an adhesive surface shape in advance. Since the thickness of the adhesive layer at the time of bonding is set to a high degree of accuracy, the bonding position of an IC module or the like is positioned on the photocationically curable pressure-sensitive adhesive sheet. Since the IC module is preliminarily processed into an adhesive surface shape, the IC module is accurately adhered to the card-shaped support, and when the obtained IC card is used, the IC module is actuated due to a deviation such as parallelism between the IC module and the card-shaped support. There are no defects. In addition, the bonding process does not extend to several complicated processes, and is a simple process of arranging the IC module and the like on the photocationically curable adhesive sheet affixed to the card-shaped support, lightly applying a pressure, and irradiating light. Therefore, the manufacturing cost can be significantly reduced.

The method for producing an IC card according to the present invention is characterized in that an IC module is adhered to a card-like support by a photocationic polymerization reaction using a photocationically curable adhesive sheet. Since the curing of the curable adhesive sheet gradually progresses, it has pressure-sensitive adhesive properties even after light irradiation, and can simplify the work of the bonding step of the IC module, and is cured after bonding. The module can be firmly adhered to the card-shaped support. In addition, the liquid adhesive can be easily bonded to a vertical surface or the like where application is difficult.

In addition, since the photo-cationic polymerization reaction is such that the polymerization-curing reaction proceeds by a dark reaction after light irradiation, curing by photo-radical polymerization is impossible.
Even if the adhesive is placed in the shadow zone,
Curing proceeds reliably, giving a strong adhesive cured product. or,
After light irradiation, IC module can be attached.
Adhesion to the opaque card-shaped support can also be reliably performed.

In the method for producing an IC card according to the present invention, the IC module is adhered to the card-like support by using a cationic photocurable adhesive sheet by a cationic photopolymerization reaction. Does not require high-temperature heating in the bonding step, and there is no risk of damaging IC devices and the like.

In the method for manufacturing an IC card according to the second aspect of the present invention, as described above, the photocationically curable adhesive sheet comprises a photocationic polymerization initiator, a photocationic polymerizable compound, and an adhesive polymer. It has sufficient initial adhesive strength under normal conditions. Therefore, the operation of positioning and temporarily attaching the IC module can be performed extremely easily and reliably, and the number of work steps in the bonding process can be reduced.
The production of high quality and the reduction of manufacturing cost can be achieved at the same time.

[0055]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to typical examples.

Example 1 50 parts by weight of a bisphenol A type solid epoxy resin (manufactured by Yuka Shell Epoxy Co., Ltd., trade name “Epicoat 828”), an aromatic sulfonium salt-based photocationic polymerization initiator (manufactured by Asahi Denka Co., Ltd.) 1 part by weight of trade name “Optomer SP170”), 50 parts by weight of polyethyl acrylate (weight average molecular weight 700,000) and 150 parts by weight of methyl ethyl ketone (MEK) are stirred and mixed in a homomixer at 23 ° C. for 10 minutes. A photocationically polymerizable composition was obtained. The cationic photopolymerizable composition was applied to a silicone release-treated polyethylene terephthalate film having a thickness of 50 μm (hereinafter simply referred to as a PET film) by a solution casting method so that the thickness after drying was 80 μm. This was applied to prepare a photocationically curable adhesive sheet, and a sheet punched into a 10 mm square outer periphery and a 6 mm square inner periphery was prepared.

Next, a glass epoxy plate having a thickness of 0.5 mm, which was cut into 10 mm squares, was regarded as an IC module substrate, and a punched piece of a photocationically curable adhesive sheet was adhered to this by finger pressure. .

After the application, the PET film was peeled off from the photocationically curable adhesive sheet within 30 seconds, and irradiated with ultraviolet rays of 365 nm at an irradiation intensity of 40 mW / cm ² for 30 seconds by a high pressure mercury lamp. Further, within 30 seconds after irradiation,
It was stuck on an ABS resin plate (card-like support) of mm (thickness) x 50 mm x 100 mm by finger pressure, and was left to cure at 20 ° C for 1 day to obtain a test piece.

(Example 2) The procedure of Example 1 was repeated, except that the ABS resin sheet of Example 1 was replaced with a hard vinyl chloride resin sheet having the same thickness.

(Comparative Example 1) "Double Tack 5500H" (double-sided adhesive tape, trade name, manufactured by Sekisui Chemical Co., Ltd.) was applied to an IC module substrate with a heat laminator at 120 ° C at 2 kg / kg.
C. at a pressure of 0.3 cm / min. This is A
It was pressed and bonded at a pressure of ² kg / cm ² for 30 minutes on a BS resin plate.

(Comparative Example 2) A cationic photopolymerizable composition containing no polyethyl acrylate was prepared in the same manner as in Example 1 and directly applied to an IC module substrate without forming a cationic photocurable adhesive sheet. Within 30 seconds after brush-coating and drying, UV light of 365 nm was irradiated with 40 mW using a high-pressure mercury lamp.
/ Cm ² for 30 seconds. Immediately after irradiation, it was stuck on an ABS resin plate by finger pressure.

(Evaluation) For each of the test pieces of Examples 1 and 2 and Comparative Examples 1 and 2 obtained as described above, the adhesive strength after curing and the photo-cation-curable adhesive sheet or photo-cation-curable coating were measured. The variation in film thickness was evaluated in the following manner. The evaluation results are shown in Table 1.

Adhesion after curing: The test piece was left at 20 ° C. for one day, hooked on the end of the substrate, peeled off from the card-like support using a tensile tester, and the peel strength was measured. .

Variation in thickness: The test piece was cut perpendicularly to the adhesive surface so as to pass through the center of the glass epoxy plate, and the thickness of the photo-cation-curable adhesive sheet or photo-cation-curable coating film on the cut surface was measured. The variation in the size was measured using an optical microscope with 10 samples, and represented by the difference between the maximum value and the minimum value.

[0065]

[Table 1]

As shown in Table 1, the test pieces of the examples all had good thickness accuracy and high adhesive strength.
On the other hand, although the test piece of Comparative Example 1 had good thickness accuracy, it was not cured, so the adhesive strength was as low as about 1/4 of that of the example, which is not practical. there were. or,
In Comparative Example 2, the accuracy of the thickness was poor, and despite the use of the photocationically curable composition, the adhesive strength was not sufficiently exhibited, and the sample was not practically usable.

[0067]

Since the method of manufacturing an IC card according to the present invention is configured as described above, the IC module is accurately bonded to the card-like support, and the IC module is used when the obtained IC card is used. There is no occurrence of operation failure or the like due to misalignment such as parallelism between the card and the card-shaped support. In addition, since the bonding process can be performed with a simple process, the manufacturing cost can be significantly reduced.

Further, the obtained IC card is given an appropriate flexibility, so that the mounted IC device is not damaged by the deformation of the IC card when the IC card is used.

Further, in the method for manufacturing an IC card according to the present invention, the potable time of the photocationically curable adhesive sheet is relatively long, and the operation of the IC module bonding step can be carried out reliably. It can be firmly adhered to the card-shaped support. Also, it can be easily attached even in a place where attachment is difficult. Moreover, in the cationic photopolymerization reaction, even when the adhesive is placed in a shadow zone where curing was not possible by photoradical polymerization, curing proceeds reliably and a strong adhesive cured product is provided. Further, the IC module can be attached after the light irradiation, and the adhesion to the opaque card-shaped support can be surely performed.

The method of manufacturing an IC card according to the present invention
Since high-temperature heating is not required in the bonding step of the C module, there is no possibility of damaging the IC device or the like. Therefore, the operation of positioning and temporarily attaching the IC module can be performed extremely easily and reliably, and the number of work steps in the bonding process can be reduced. It can be achieved.

Claims (2)

[Claims] 1. A method of manufacturing an IC card, comprising: bonding an IC module and a card-shaped support with a photocationically curable adhesive sheet that has been processed into an adhesive surface shape in advance. 2. The method for producing an IC card according to claim 1, wherein the cationic photocurable adhesive sheet comprises a cationic photopolymerization initiator, a cationically polymerizable compound and an adhesive polymer.