JPH11316980A - Method of manufacturing mold for resin plate and method of manufacturing resin plate - Google Patents
Method of manufacturing mold for resin plate and method of manufacturing resin plateInfo
- Publication number
- JPH11316980A JPH11316980A JP12512598A JP12512598A JPH11316980A JP H11316980 A JPH11316980 A JP H11316980A JP 12512598 A JP12512598 A JP 12512598A JP 12512598 A JP12512598 A JP 12512598A JP H11316980 A JPH11316980 A JP H11316980A
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing
- resin plate
- mold
- substrate
- convex pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 72
- 239000011347 resin Substances 0.000 title claims abstract description 64
- 229920005989 resin Polymers 0.000 title claims abstract description 64
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 21
- 238000005323 electroforming Methods 0.000 claims abstract description 7
- 230000003647 oxidation Effects 0.000 claims description 12
- 238000007254 oxidation reaction Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 239000000523 sample Substances 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 230000001590 oxidative effect Effects 0.000 claims description 5
- 230000005684 electric field Effects 0.000 claims description 4
- 150000002500 ions Chemical class 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 4
- 206010040844 Skin exfoliation Diseases 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910000042 hydrogen bromide Inorganic materials 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Manufacturing Optical Record Carriers (AREA)
Abstract
(57)【要約】
【課題】 表面に形成される所望の凹凸パターンの寸法
精度を向上し、正しい原信号を復元可能な樹脂板を製造
できる鋳型の製造方法を提供する。この鋳型を用い、正
しい原信号を復元可能な信頼性の高い樹脂板を製造する
方法を提供する。
【解決手段】 基板１の表面を選択的に酸化し、基板１
の表面に所望の凹凸パターンに対応した酸化層２を形成
し、酸化層２をマスクとして基板１をエッチングし、表
面に所定の凹凸パターンが形成された原盤２０を得る。
または、形成した酸化層２を基板１から除去し、基板１
の表面に所定の凹凸パターンを形成する。その後、原盤
２０の凹凸面に導電化層３を介して金属層４を電鋳によ
り形成し、基板１から金属層４及び導電化層３を剥離し
て金属原盤３０を得る。
(57) [Problem] To provide a method of manufacturing a mold capable of improving a dimensional accuracy of a desired concavo-convex pattern formed on a surface and manufacturing a resin plate capable of restoring a correct original signal. A method for manufacturing a highly reliable resin plate capable of restoring a correct original signal using the mold is provided. SOLUTION: The surface of the substrate 1 is selectively oxidized and the substrate 1 is oxidized.
An oxide layer 2 corresponding to a desired concavo-convex pattern is formed on the surface of the substrate 1, and the substrate 1 is etched using the oxide layer 2 as a mask to obtain a master 20 having a predetermined concavo-convex pattern formed on the surface.
Alternatively, the formed oxide layer 2 is removed from the substrate 1 and the substrate 1
A predetermined concavo-convex pattern is formed on the surface of. After that, the metal layer 4 is formed on the uneven surface of the master 20 by electroforming with the conductive layer 3 interposed therebetween, and the metal layer 4 and the conductive layer 3 are separated from the substrate 1 to obtain the metal master 30.
Description
【０００１】[0001]
【発明が属する技術分野】本発明は、樹脂板製造用鋳型
の製造方法に係り、特に、表面に所定の情報に基づいて
形成された凹凸パターンを備えた樹脂板を製造するため
の鋳型の製造方法に関する。また、この樹脂板製造用鋳
型を用いた樹脂板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a mold for manufacturing a resin plate, and more particularly to a method for manufacturing a mold for manufacturing a resin plate having a concave-convex pattern formed on the surface based on predetermined information. About the method. The present invention also relates to a method for producing a resin plate using the resin plate production mold.
【０００２】[0002]
【従来の技術】従来から、表面に所定の情報に基づいた
凹凸パターンが形成された光ディスク等の樹脂板を形成
する際には、この凹凸パターンに対応した凹凸パターン
が形成された樹脂板製造用鋳型を母型として、この凹凸
パターンを前記樹脂板の表面に転写する方法が一般的に
行われている。2. Description of the Related Art Conventionally, when forming a resin plate such as an optical disk having an uneven pattern based on predetermined information on a surface, a resin plate having an uneven pattern corresponding to the uneven pattern is manufactured. A method of transferring this uneven pattern to the surface of the resin plate using a mold as a matrix is generally performed.
【０００３】この樹脂板製造用鋳型に形成されている凹
凸パターンは、通常、以下に示す工程により行われてい
る。すなわち、基板上にレジスト層を形成し、このレジ
スト層に、所望のパターンに基づいた選択的な露光を行
った後、これを現像し、前記パターンに対応したレジス
トパターンを形成する。次に、このレジストパターンを
マスクとして、前記基板にエッチングを行い、この基板
上に前記凹凸パターンに対応した凹凸パターンを形成す
る。[0003] The concave-convex pattern formed on the mold for manufacturing a resin plate is usually formed by the following steps. That is, a resist layer is formed on a substrate, this resist layer is selectively exposed based on a desired pattern, and then developed to form a resist pattern corresponding to the pattern. Next, using the resist pattern as a mask, the substrate is etched to form an uneven pattern corresponding to the uneven pattern on the substrate.
【０００４】[0004]
【発明が解決しようとする課題】前記樹脂板製造用鋳型
に形成される凹凸パターンは、高い寸法精度が要求され
るが、前述した露光によって所定の凹凸パターンを形成
する方法では、光の回析限界により、微細な凹凸パター
ンを高精度で形成するのは困難である。The uneven pattern formed on the mold for manufacturing a resin plate is required to have high dimensional accuracy. However, in the method of forming a predetermined uneven pattern by the above-described exposure, the diffraction of light is performed. Due to limitations, it is difficult to form a fine uneven pattern with high accuracy.
【０００５】本発明は、このような従来の問題点を解決
することを課題とするものであり、微細な凹凸パターン
が形成された樹脂板製造用鋳型であっても、この凹凸パ
ターンの寸法精度を向上することができ、正しい原信号
を復元可能な樹脂板を製造できる鋳型の製造方法を提供
することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to solve such a conventional problem. Even if the present invention is applied to a resin plate manufacturing mold on which a fine uneven pattern is formed, the dimensional accuracy of the uneven pattern can be improved. It is an object of the present invention to provide a method of manufacturing a mold capable of manufacturing a resin plate that can improve the original signal and can restore a correct original signal.
【０００６】また、本発明に係る樹脂板製造用鋳型の製
造方法により得られた鋳型を用いることにより、正しい
原信号を復元可能な信頼性の高い樹脂板を製造する方法
を提供することを目的とする。Another object of the present invention is to provide a method of manufacturing a highly reliable resin plate capable of restoring a correct original signal by using a mold obtained by the method of manufacturing a mold for manufacturing a resin plate according to the present invention. And
【０００７】[0007]
【課題を解決するための手段】この目的を達成するた
め、本発明は、基板の表面に形成された凹凸パターンを
樹脂板に転写するための樹脂板製造用鋳型の製造方法で
あって、前記基板の表面を選択的に酸化し、当該基板の
表面に前記凹凸パターンに対応した酸化層を形成する酸
化工程を備えた樹脂板製造用鋳型の製造方法を提供する
ものである。In order to achieve this object, the present invention provides a method of manufacturing a mold for manufacturing a resin plate for transferring an uneven pattern formed on the surface of a substrate to a resin plate, the method comprising: An object of the present invention is to provide a method of manufacturing a mold for manufacturing a resin plate, comprising an oxidation step of selectively oxidizing a surface of a substrate and forming an oxide layer corresponding to the uneven pattern on the surface of the substrate.
【０００８】また、本発明に係る樹脂板製造用鋳型の製
造方法は、前記酸化工程後、前記酸化層をマスクとし
て、前記基板をエッチングし、当該基板の表面に所定の
凹凸パターンを形成するエッチング工程を、さらに備え
ることができる。Further, in the method for manufacturing a mold for manufacturing a resin plate according to the present invention, after the oxidizing step, the substrate is etched using the oxidized layer as a mask to form a predetermined uneven pattern on the surface of the substrate. A step can be further provided.
【０００９】そしてまた、本発明に係る樹脂板製造用鋳
型の製造方法は、前記酸化工程後、前記酸化層を除去
し、前記基板の表面に所定の凹凸パターンを形成する酸
化層除去工程を、さらに備えることができる。Further, the method for manufacturing a mold for manufacturing a resin plate according to the present invention, further comprises: an oxide layer removing step of removing the oxide layer after the oxidation step and forming a predetermined uneven pattern on the surface of the substrate. Further provisions may be made.
【００１０】さらにまた、本発明に係る樹脂板製造用鋳
型の製造方法は、前記前記表面に所定の凹凸パターンが
形成された基板の該凹凸面上に、電気鋳造法（電鋳）に
より金属層を形成する電鋳工程と、前記基板から前記金
属層を剥離することにより、当該基板の凹凸パターンが
転写された金属原盤を形成する金属原盤形成工程を、さ
らに備えることができる。Further, in the method of manufacturing a mold for manufacturing a resin plate according to the present invention, the metal layer may be formed by electroforming (electroforming) on the uneven surface of the substrate having the predetermined uneven pattern formed on the surface. And a metal master forming step of forming a metal master on which the concavo-convex pattern of the substrate is transferred by peeling the metal layer from the substrate.
【００１１】前記酸化は、プローブにより電場を発生さ
せる、光を照射する、Ｘ線を照射する、イオンを照射す
る、のいずれかの方法を用いて行うことができる。The oxidation can be performed by using any method of generating an electric field by a probe, irradiating light, irradiating X-rays, or irradiating ions.
【００１２】また、本発明は、表面に所定の情報に基づ
いた凹凸パターンが形成された樹脂板の製造方法であっ
て、請求項１ないし請求項５のいずれか一項に記載の樹
脂板製造用鋳型の製造方法により得られた鋳型の凹凸面
に、樹脂板形成材料を設け、前記形成材料が固化した後
に、前記鋳型の凹凸面から当該固化した樹脂板を剥離す
る工程を備えた樹脂板の製造方法を提供するものであ
る。Further, the present invention is a method for manufacturing a resin plate having a surface with an uneven pattern based on predetermined information, wherein the resin plate is manufactured according to any one of claims 1 to 5. A resin plate forming material provided on the concave and convex surface of the mold obtained by the method for manufacturing a mold for use, and after the forming material is solidified, a resin plate comprising a step of peeling the solidified resin plate from the concave and convex surface of the mold Is provided.
【００１３】なお、本発明でいう凹凸パターンとは、最
終的に得られるべき樹脂板（記録媒体）の記録信号に応
じた凹凸パターンのことをいう。Incidentally, the concavo-convex pattern according to the present invention means a concavo-convex pattern corresponding to a recording signal of a resin plate (recording medium) to be finally obtained.
【００１４】[0014]
【発明の実施の形態】次に、本発明に係る実施の形態に
ついて図面を参照して説明する。Next, embodiments of the present invention will be described with reference to the drawings.
【００１５】（実施の形態１）図１は、本発明の実施の
形態１に係る樹脂板製造用鋳型の製造工程を示す断面図
である。(Embodiment 1) FIG. 1 is a sectional view showing a manufacturing process of a mold for manufacturing a resin plate according to Embodiment 1 of the present invention.
【００１６】実施の形態１に係る樹脂製造用鋳型は、光
ディスクの製造に使用するものであり、図１に示す工程
によって製造される。The mold for resin production according to the first embodiment is used for producing an optical disk, and is produced by the steps shown in FIG.
【００１７】すなわち、図１（１）に示す工程では、シ
リコン基板１上に形成すべきパターン情報に応じて、最
終的に原盤２０（樹脂板製造用鋳型）表面に形成される
凹凸パターンの凸部となる領域を、選択的に酸化する。
この酸化は、例えば、図２に示すように、プローブ１０
を、シリコン基板表面において０．０１〜１００μｍ／
ｓの速さで走査させながら、前記領域に０．１〜１００
Ｖの電圧を印加することにより行う。That is, in the step shown in FIG. 1A, the projections and depressions of the concavo-convex pattern finally formed on the surface of the master 20 (a mold for manufacturing a resin plate) according to the pattern information to be formed on the silicon substrate 1. The region to be a part is selectively oxidized.
This oxidation is performed, for example, as shown in FIG.
Is 0.01 to 100 μm /
While scanning at a speed of s, 0.1-100
This is performed by applying a voltage of V.
【００１８】プローブの材質としては、例えば、Ｗ（タ
ングステン）、Ｐｔ（白金）等の金属や、Ｓｉ（シリコ
ン）等の半導体が好適に利用できる。Ｓｉを用いる場合
には、電圧を印加し易くするために、プローブ表面を、
Ａｌ（アルミニウム）、Ｔｉ（チタン）、Ｃｒ（クロ
ム）、Ｎｉ（ニッケル）Ｃｕ（銅）、Ｒｕ（ルテニウ
ム）、Ａｇ（銀）、Ｗ、Ｉｒ（イリジウム）、Ｐｔ、Ａ
ｕ（金）等の金属でコーティングすることが好ましい。As the material of the probe, for example, metals such as W (tungsten) and Pt (platinum) and semiconductors such as Si (silicon) can be suitably used. When using Si, the surface of the probe should be
Al (aluminum), Ti (titanium), Cr (chromium), Ni (nickel) Cu (copper), Ru (ruthenium), Ag (silver), W, Ir (iridium), Pt, A
It is preferable to coat with a metal such as u (gold).
【００１９】このようにして、シリコン基板１上の、最
終的に原盤２０の表面に形成される凹凸パターンの凸部
となる領域に、酸化層２を１〜１００ｎｍの深さ（膜
厚）で形成した。In this manner, the oxide layer 2 is formed at a depth (film thickness) of 1 to 100 nm on the silicon substrate 1 in a region to be a convex portion of the concavo-convex pattern finally formed on the surface of the master 20. Formed.
【００２０】この酸化層２は、次の工程でエッチングを
行う際のマスクとなるが、従来方法で、エッチング用の
マスクを露光及び現像によって形成する場合と異なり、
前述した酸化工程によって形成される。このため、光の
回折の影響等を受けることなく、高精度なパターニング
を行うことができる。したがって、微細な凹凸パターン
であっても、精度よく形成することができる。This oxide layer 2 is used as a mask when etching is performed in the next step, but is different from the conventional method in which an etching mask is formed by exposure and development.
It is formed by the above-described oxidation process. Therefore, highly accurate patterning can be performed without being affected by diffraction of light. Therefore, even a fine uneven pattern can be accurately formed.
【００２１】次に、図１（２）に示す工程では、図１
（１）に示す工程で得た酸化層２をマスクとして、例え
ば、平行平板型反応性イオンエッチング（ＲＩＥ）方式
で、エッチングガスとしてＨＢｒ（臭化水素）を用い、
電極間バイアス１００Ｗ、ガス流量５０ｓｃｃｍ、真空
度１０Ｐａ、の条件で、シリコン基板１にエッチングを
行う。このエッチングは、光ディスクに形成されるべき
凹凸パターンの深さ（凸部の厚さ）に相当する深さまで
行う。Next, in the step shown in FIG.
Using the oxide layer 2 obtained in the step shown in (1) as a mask, for example, parallel plate reactive ion etching (RIE) using HBr (hydrogen bromide) as an etching gas,
Etching is performed on the silicon substrate 1 under the conditions of a bias between electrodes of 100 W, a gas flow rate of 50 sccm, and a degree of vacuum of 10 Pa. This etching is performed up to a depth corresponding to the depth of the concavo-convex pattern to be formed on the optical disc (thickness of the convex portion).
【００２２】次いで、図１（３）に示す工程では、図１
（２）に示す工程でマスクとして使用した酸化層２をバ
ッファードフッ酸により除去する。このようにして、表
面に所望の凹凸パターンが形成された原盤２０（樹脂板
製造用鋳型）を得た。Next, in the step shown in FIG.
The oxide layer 2 used as a mask in the step shown in (2) is removed with buffered hydrofluoric acid. In this manner, a master 20 (a resin plate manufacturing mold) having a desired concavo-convex pattern formed on the surface was obtained.
【００２３】（実施の形態２）次に、本発明に係る実施
の形態２について図面を参照して説明する。(Embodiment 2) Next, Embodiment 2 according to the present invention will be described with reference to the drawings.
【００２４】図３は、本発明の実施の形態２に係る樹脂
板製造用鋳型の製造工程を示す断面図である。FIG. 3 is a cross-sectional view showing a manufacturing process of a resin plate manufacturing mold according to Embodiment 2 of the present invention.
【００２５】実施の形態２に係る樹脂製造用鋳型は、光
ディスクの製造に使用するものであり、図３に示す工程
によって製造される。The mold for resin production according to the second embodiment is used for producing an optical disk, and is produced by the steps shown in FIG.
【００２６】すなわち、図３（１）に示す工程では、シ
リコン基板１上に形成すべきパターン情報に応じて、最
終的に原盤２０の表面に形成される凹凸パターンの凹部
となる領域を、選択的に酸化する。この酸化は、例え
ば、図２に示すように、プローブ１０を、シリコン基板
表面において、０．０１〜１００μｍ／ｓの速さで走査
させながら、前記領域に０．１〜１００Ｖの電圧を印加
することにより行う。That is, in the step shown in FIG. 3A, a region to be a concave portion of the concave / convex pattern finally formed on the surface of the master 20 is selected according to the pattern information to be formed on the silicon substrate 1. Oxidizes. In this oxidation, for example, as shown in FIG. 2, a voltage of 0.1 to 100 V is applied to the region while the probe 10 scans the silicon substrate surface at a speed of 0.01 to 100 μm / s. It is done by doing.
【００２７】プローブの材質としては、前述した実施の
形態１と同様のものが利用できる。As the material of the probe, the same material as in the first embodiment can be used.
【００２８】このようにして、シリコン基板１上の、最
終的に原盤２０の表面に形成される凹凸パターンの凹部
となる領域に、酸化層２を１〜３００ｎｍの深さ（膜
厚）で形成した。In this manner, the oxide layer 2 is formed at a depth (film thickness) of 1 to 300 nm on the silicon substrate 1 in a region to be a concave portion of the concavo-convex pattern finally formed on the surface of the master 20. did.
【００２９】なお、この酸化深さが、原盤２０上に形成
すべき凹凸パターンの凹部の深さに相当する。The oxidation depth corresponds to the depth of the concave portion of the concave / convex pattern to be formed on the master 20.
【００３０】次に、図３（２）に示す工程では、図３
（１）に示す工程で形成した酸化層２を、バッファード
フッ酸により除去する。このようにして、表面に所望の
凹凸パターンが形成された原盤２０（樹脂板製造用鋳
型）を得た。Next, in the step shown in FIG.
The oxide layer 2 formed in the step shown in (1) is removed with buffered hydrofluoric acid. In this manner, a master 20 (a resin plate manufacturing mold) having a desired concavo-convex pattern formed on the surface was obtained.
【００３１】なお、この実施の形態２では、酸化層２
が、原盤２０上に形成される凹凸パターンの凹部を形成
するためのパターンとなるが、この場合も、実施の形態
１と同様に、高精度なパターニングを行うことができ
る。したがって、微細な凹凸パターンであっても、精度
よく形成することができる。In the second embodiment, the oxide layer 2
Is a pattern for forming a concave portion of the concave-convex pattern formed on the master 20. In this case as well, high-precision patterning can be performed as in the first embodiment. Therefore, even a fine uneven pattern can be accurately formed.
【００３２】なお、実施の形態１及び２では、シリコン
基板１を用いた場合について説明したが、電圧を印加す
ることにより、局所的に酸化層の形成が可能であり、か
つ、基板あるいはその酸化層のいずれか一方を選択的に
エッチング可能なものであれば限定されるものではな
く、金属、セラミック、樹脂等、様々な材料から構成す
ることができる。In the first and second embodiments, the case where the silicon substrate 1 is used has been described. However, by applying a voltage, an oxide layer can be formed locally, and the substrate or its oxidized layer can be formed. The material is not limited as long as any one of the layers can be selectively etched, and can be made of various materials such as metal, ceramic, and resin.
【００３３】また、実施の形態１及び２では、プローブ
１０を用いて電圧１１を印加することにより、シリコン
基板１上に電場を発生させて、シリコン基板１の所望領
域を酸化する場合について説明したが、これに限らず、
前記酸化は、プローブを用いて、光の照射、Ｘ線の照
射、イオン照射等、様々な方法により行うことが可能で
ある。Further, in the first and second embodiments, a case has been described in which a voltage 11 is applied using the probe 10 to generate an electric field on the silicon substrate 1 and oxidize a desired region of the silicon substrate 1. However, not limited to this,
The oxidation can be performed using a probe by various methods such as light irradiation, X-ray irradiation, and ion irradiation.
【００３４】（実施の形態３）次に、本発明に係る実施
の形態３について図面を参照して説明する。Third Embodiment Next, a third embodiment according to the present invention will be described with reference to the drawings.
【００３５】図４は、本発明の実施の形態３に係る樹脂
板製造用鋳型の製造工程を示す断面図である。なお、実
施の形態３では、実施の形態１または実施の形態２で説
明した製造方法により得られる原盤２０から、さらに金
属原盤３０を製造する場合について説明する。FIG. 4 is a cross-sectional view showing a manufacturing process of a resin plate manufacturing mold according to Embodiment 3 of the present invention. In the third embodiment, a case will be described in which a metal master 30 is further manufactured from the master 20 obtained by the manufacturing method described in the first or second embodiment.
【００３６】図４（１）に示す工程では、実施の形態１
または実施の形態２で得た原盤２０の凹凸面上に、導体
化層３を、１０〜１００ｎｍの膜厚で形成する。なお、
この導体化層３は、Ａｌ、Ｔｉ、Ｃｒ、Ｎｉ、Ｃｕ、Ａ
ｇ、Ｗ、Ｐｔ、Ａｕ等から構成することができる。In the step shown in FIG.
Alternatively, conductive layer 3 is formed with a thickness of 10 to 100 nm on the uneven surface of master 20 obtained in the second embodiment. In addition,
This conductive layer 3 is made of Al, Ti, Cr, Ni, Cu, A
g, W, Pt, Au or the like.
【００３７】次に、図４（２）に示す工程では、図４
（１）に示す工程で得た導体化層３上にニッケルからな
る金属層４を電気鋳造法（電鋳）により形成する。Next, in the step shown in FIG.
A metal layer 4 made of nickel is formed on the conductive layer 3 obtained in the step shown in (1) by an electroforming method (electroforming).
【００３８】次いで、図４（３）に示す工程では、原盤
２０から金属層４及び導体化層３を一体的に剥離する。
このようにして、原盤２０に形成された凹凸パターンが
複写された金属原盤（樹脂板製造用鋳型）を得る。な
お、導体化層３は、必要に応じて剥離処理を施して、金
属層４から除去してもよい。Next, in a step shown in FIG. 4C, the metal layer 4 and the conductive layer 3 are integrally peeled from the master 20.
In this way, a metal master (a mold for manufacturing a resin plate) on which the concavo-convex pattern formed on the master 20 is copied is obtained. The conductive layer 3 may be removed from the metal layer 4 by performing a peeling treatment as needed.
【００３９】また、本発明に係る鋳型を用いて樹脂板
（例えば、光ディスク等）を製造するには、例えば、前
記鋳型の凹凸面上に、アクリレート系樹脂等の樹脂板形
成材料を設け、前記形成材料を固化させた後に、前記鋳
型の凹凸面から当該固化した樹脂板を剥離すればよい。
この時、前記鋳型の表面に形成されている凹凸パターン
は、樹脂板に形成すべき凹凸パターンの反転パターンで
ある。In order to manufacture a resin plate (for example, an optical disk) using the mold according to the present invention, for example, a resin plate forming material such as an acrylate resin is provided on the uneven surface of the mold, and After solidifying the forming material, the solidified resin plate may be peeled off from the uneven surface of the mold.
At this time, the concavo-convex pattern formed on the surface of the mold is a reverse pattern of the concavo-convex pattern to be formed on the resin plate.
【００４０】また、本発明に係る鋳型を用いて形成され
る樹脂板としては、光ディスクの他、プローブを用いて
信号の記録再生を行う情報媒体等、様々な記録媒体が挙
げられる。Examples of the resin plate formed using the mold according to the present invention include various recording media such as an information medium for recording and reproducing signals using a probe, in addition to an optical disc.
【００４１】[0041]
【発明の効果】以上説明したように、本発明に係る樹脂
板製造用鋳型の製造方法によれば、原盤に所望の凹凸パ
ターンを形成するためのマスクパターンを、酸化により
形成するため、高精度な凹凸パターンを得ることができ
る。したがって、正しい原信号を復元可能な信頼性の高
い樹脂板が得られる樹脂板製造用鋳型を製造することが
できる。As described above, according to the method for manufacturing a mold for manufacturing a resin plate according to the present invention, since a mask pattern for forming a desired concavo-convex pattern on an original master is formed by oxidation, high precision is achieved. A fine uneven pattern can be obtained. Therefore, it is possible to manufacture a resin plate manufacturing mold capable of obtaining a highly reliable resin plate capable of restoring a correct original signal.
【００４２】また、本発明に係る製造方法により得られ
た樹脂板製造用鋳型を用いて、樹脂板を製造すること
で、正しい原信号を復元可能な信頼性の高い樹脂板を得
ることができる。Further, by manufacturing a resin plate using the resin plate manufacturing mold obtained by the manufacturing method according to the present invention, a highly reliable resin plate capable of restoring a correct original signal can be obtained. .
【図１】本発明の実施の形態１に係る樹脂板製造用鋳型
の製造工程を示す断面図である。FIG. 1 is a cross-sectional view showing a process for manufacturing a resin plate manufacturing mold according to Embodiment 1 of the present invention.
【図２】本発明の実施の形態に係る酸化工程を示す一部
拡大図断面図である。FIG. 2 is a partially enlarged cross-sectional view showing an oxidation step according to the embodiment of the present invention.
【図３】本発明の実施の形態２に係る樹脂板製造用鋳型
の製造工程を示す断面図である。FIG. 3 is a cross-sectional view showing a process for manufacturing a resin plate manufacturing mold according to Embodiment 2 of the present invention.
【図４】本発明の実施の形態３に係る樹脂板製造用鋳型
の製造工程を示す断面図である。FIG. 4 is a cross-sectional view showing a manufacturing process of a resin plate manufacturing mold according to Embodiment 3 of the present invention.
１ シリコン基板 ２ 酸化層 ３ 導体化層 ４ 金属層 １０ プローブ １１ 電場 ２０ 原盤 ３０ 金属原盤 DESCRIPTION OF SYMBOLS 1 Silicon substrate 2 Oxide layer 3 Conducting layer 4 Metal layer 10 Probe 11 Electric field 20 Master 30 Metal master
Claims (6)
樹脂板に転写するための樹脂板製造用鋳型の製造方法で
あって、 前記基板の表面を選択的に酸化し、当該基板の表面に前
記凹凸パターンに対応した酸化層を形成する酸化工程を
備えた樹脂板製造用鋳型の製造方法。1. A method of manufacturing a mold for manufacturing a resin plate for transferring a concavo-convex pattern formed on a surface of a substrate to a resin plate, the method comprising selectively oxidizing the surface of the substrate, A method of manufacturing a mold for manufacturing a resin plate, comprising: an oxidation step of forming an oxide layer corresponding to the uneven pattern.
して、前記基板をエッチングし、当該基板の表面に所定
の凹凸パターンを形成するエッチング工程を、さらに備
えた請求項１記載の樹脂板製造用鋳型の製造方法。2. The method according to claim 1, further comprising, after the oxidizing step, an etching step of etching the substrate using the oxide layer as a mask to form a predetermined concavo-convex pattern on the surface of the substrate. Of manufacturing molds for garments.
前記基板の表面に所定の凹凸パターンを形成する酸化層
除去工程を、さらに備えた請求項１記載の樹脂板製造用
鋳型の製造方法。3. After the oxidizing step, the oxidized layer is removed,
The method for manufacturing a mold for manufacturing a resin plate according to claim 1, further comprising an oxide layer removing step of forming a predetermined uneven pattern on the surface of the substrate.
れた基板の該凹凸面上に、電気鋳造法により金属層を形
成する電鋳工程と、前記基板から前記金属層を剥離する
ことにより、当該基板の凹凸パターンが転写された金属
原盤を形成する金属原盤形成工程を、さらに備えた請求
項２または請求項３に記載の樹脂板製造用鋳型の製造方
法。4. An electroforming step of forming a metal layer by an electroforming method on the uneven surface of the substrate having a predetermined uneven pattern formed on the surface, and by peeling the metal layer from the substrate, 4. The method for producing a mold for manufacturing a resin plate according to claim 2, further comprising a metal master forming step of forming a metal master onto which the concavo-convex pattern of the substrate is transferred.
させる、光を照射する、Ｘ線を照射する、イオンを照射
する、のいずれかの方法を用いて行う請求項１ないし請
求項４のいずれか一項に記載の樹脂板製造用鋳型の製造
方法。5. The method according to claim 1, wherein the oxidation is performed by using a method of generating an electric field by a probe, irradiating light, irradiating X-rays, or irradiating ions. The method for producing a mold for producing a resin plate according to claim 1.
ンが形成された樹脂板の製造方法であって、 請求項１ないし請求項５のいずれか一項に記載の樹脂板
製造用鋳型の製造方法により得られた鋳型の凹凸面に、
樹脂板形成材料を設け、前記形成材料が固化した後に、
前記鋳型の凹凸面から当該固化した樹脂板を剥離する工
程を備えた樹脂板の製造方法。6. A method of manufacturing a resin plate having a concave-convex pattern formed on the surface based on predetermined information, wherein the method of manufacturing a resin plate manufacturing mold according to claim 1 is performed. On the uneven surface of the mold obtained by the method,
A resin plate forming material is provided, and after the forming material has solidified,
A method of manufacturing a resin plate, comprising a step of peeling the solidified resin plate from the uneven surface of the mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12512598A JP3627513B2 (en) | 1998-05-07 | 1998-05-07 | Method for producing mold for producing resin plate and method for producing resin plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12512598A JP3627513B2 (en) | 1998-05-07 | 1998-05-07 | Method for producing mold for producing resin plate and method for producing resin plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11316980A true JPH11316980A (en) | 1999-11-16 |
| JP3627513B2 JP3627513B2 (en) | 2005-03-09 |
Family
ID=14902475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12512598A Expired - Fee Related JP3627513B2 (en) | 1998-05-07 | 1998-05-07 | Method for producing mold for producing resin plate and method for producing resin plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3627513B2 (en) |
-
1998
- 1998-05-07 JP JP12512598A patent/JP3627513B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP3627513B2 (en) | 2005-03-09 |
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