JPH1133914A - Polishing liquid supply device for lapping machine - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To sufficiently supply a polishing liquid by pressurizing the polishing liquid. It should be simple, hard to cause failure, and easy to maintain. SOLUTION: A substantially annular receiving portion 31 is provided above a rotating upper plate 14, and a polishing liquid 34 is poured from a nozzle 33 fixed to a machine base. A pump 35 is provided on the upper plate, and the polishing liquid in the receiving portion is pressurized and supplied to the workpiece 23.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for supplying a polishing liquid to a lapping machine used for polishing crystal for a crystal unit.

[0002]

A lapping machine of this kind is:
The work is fitted to the carrier, sandwiched between the upper and lower panels,
While supplying the polishing liquid, the upper plate, the lower plate, and the carrier are driven, and the workpiece is moved to perform polishing.
Normally, the upper and lower plates are both annular and rotate in opposite directions, and a small number of carriers are provided along the rings of the upper and lower plates. The gear is driven by meshing with the gear, and revolves along the ring while rotating. That is, the upper board, the lower board, and the carrier all exercise.

As a means for supplying the polishing liquid to the moving object, an annular receiving portion is conventionally provided on the upper plate, and the polishing liquid is poured from a nozzle fixed here, and the receiving portion and the upper plate are supplied. And a lower surface of the workpiece is connected by a pipe, and the polishing liquid is supplied from a receiving portion to a workpiece portion by gravity.

[0004] This structure has the advantages that it is simple, hardly causes a failure, and requires almost no maintenance work. However, since the polishing liquid is supplied only by gravity, when processing a large workpiece, or when performing polishing processing for finishing a smooth surface, the supply amount of the polishing liquid is insufficient, and the processing accuracy and processing speed are reduced. There is a disadvantage that it decreases.

[0005] As another structure, there is also known a structure in which a pump is provided on a machine base to pressurize a polishing liquid, and the polishing liquid is sent to a rotating upper plate via a rotary joint and supplied to a workpiece.

In this structure, since the polishing liquid is pressurized, it can be sufficiently supplied. However, a rotary joint having a sliding portion is indispensable, and the polishing liquid is passed through the sliding portion. Therefore, abrasion naturally occurs, and daily inspection and maintenance work is required.

Accordingly, an object of the present invention is to provide a new structure which is simple, hard to cause a failure, and easy to maintain, while realizing a sufficient supply of the polishing liquid and realizing a sufficient supply.

It is another object of the present invention to more effectively utilize the structure for pressurizing the polishing liquid and realize more accurate polishing.

[0009]

According to the present invention, a pump is provided on the upper plate in the conventional arrangement in which the receiving portion is provided, and the pump pressurizes the polishing liquid in the receiving portion.

According to this configuration, the supply amount of the polishing liquid can be increased, and a rotary joint is not required, so that inspection and maintenance are simplified.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS That is, according to the present invention, a work is fitted to a carrier, sandwiched between an upper plate and a lower plate, and the upper plate, the lower plate, and the carrier are driven while supplying a polishing liquid. And
In a lapping machine that moves and grinds a workpiece, the lapping machine has a substantially annular shape, is provided above a rotating upper plate, and receives a polishing liquid flowing out from a nozzle fixed to a machine base,
This is a polishing liquid supply device for a lapping machine having a pump provided on the upper plate, which sucks the polishing liquid from the receiving portion, pressurizes the liquid, and supplies the polishing liquid to the workpiece portion on the lower surface of the upper plate.

In addition to the configuration in which only one pump is provided, a configuration in which a plurality of pumps are provided is also possible. That is, the present invention includes a configuration in which the polishing liquid supply device includes pumps that respectively supply the polishing liquid to a plurality of locations along the upper plate. Further, each pump may operate intermittently sequentially.

According to this configuration, since the polishing liquid is dispersed and supplied to each part under pressure, the polishing is performed uniformly, and high precision is realized. Further, when the respective pumps operate intermittently, the supply amount does not become excessive and the appropriate polishing is realized while ensuring the dispersion of the polishing liquid.

The power of the pump can be supplied by connecting it to a connection fixed to the machine base via a slip ring. Usually, a lapping machine is equipped with a slip ring of this type for a sensor for detecting the thickness of a workpiece while polishing. Therefore, a configuration may be adopted in which a power supply current circuit is provided by increasing the number of slip ring circuits, or a configuration in which this power supply current is supplied in a manner superimposed on the sensor circuit.

When a plurality of pumps are sequentially operated, it is convenient to perform a switching operation using a slip ring. Further, it is needless to say that the switching operation may be performed using a dedicated control device.

Alternatively, a battery or a solar cell may be provided on the upper panel and used. In this case, since the lapping machine itself is exactly the same as the conventional one and only the device of the present invention needs to be added, the implementation is remarkably easy.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below with reference to the illustrated embodiments.

In this lapping machine 10, the lower board 11 is
It is formed into an annular shape, and is mounted on the lower drive unit 12 and rotated. A groove 13 extending in the radial direction and the circumferential direction is formed on the polishing surface of the lower platen 11.

The upper plate 14 has an annular shape, and a connecting portion 15 provided at the center is connected to a drive shaft 16.
By 6, the lower plate 11 is rotated in the opposite direction. Grooves 17 extending in the radial and circumferential directions are formed on the polished surface of the upper plate 14. Further, a suspension frame 18 is provided on an upper portion of the upper panel 14, and a lifting section 19 extending from a machine stand (not shown) so as to be able to ascend and descend is inserted into the center of the suspension frame 18 from above. The hoisting portion 19 is lowered (not shown) during operation (not shown) and separates from the hanging frame 18. During hoisting (not shown), the hoisting portion 19 rises and hooks the hanging frame 18 to lift the upper panel 14. A slip ring 20 is provided at the tip of the lifting section 19. The slip ring 20 is connected to a thickness sensor of a workpiece provided on the upper plate 14, but the sensor and the circuit are not shown.

The carriers 21,... Are small circles,
Several pieces are provided along the ring of the upper board 14 and the lower board 11. Each carrier 21 has fitting holes 22,..., And workpieces 23,. A gear 24 is formed around each carrier 21,..., Which is driven by meshing with a center gear 25 and an internal gear 26. Therefore, each carrier 21,. .

The above is the configuration of a normal lapping machine, which is provided with the polishing liquid supply device 30 of the present invention.

In the polishing liquid supply device 30, the receiving portion 31 is substantially annular, and is supported above the upper plate 14 by several columns 32 (only 1 is shown). Polishing liquid 3 flowing out of attached nozzle 33
Receive 4.

The pump 35 is provided in the middle of a pipe 36 connecting the receiving part 31 and the groove 17 of the upper plate 14, and pressurizes the polishing liquid 34 of the receiving part 31 and sends it to the groove 17. The power of the pump 25 is supplied by being connected to the power supply device of the machine through the slip ring 20 and the circuit in the lifting section 19 by the electric wire in the connection pipe 37 connected to the slip ring 20. The connecting pipe 37 has flexibility so that the rotation of the upper panel 14 and the lifting of the lifting section 19 can be performed without any trouble.

The lapping machine 10 and the polishing liquid supply device 30
Has the above configuration, and is used and operates as follows.

First, the upper plate 14 is lifted by the lifting portion 19, the work 23 is fitted on the lower plate 11, and the carrier 21 is fitted thereon, and the upper plate 14 is lowered to the state shown in the drawing. Thus, the lapping machine is driven, and the upper plate, the lower plate, and the carrier are driven. At the same time, the receiving part 3 receives the polishing liquid 34 from the nozzle 33.
4, the pump is operated, and this is pressurized and added to the groove 17 of the upper plate 14. In this case, the polishing liquid is sufficiently supplied to the front and back of the workpiece, and is polished quickly and with high precision. After the polishing, the upper plate 14 is lifted by the lifting unit 19, and the workpiece is taken out.

[0026]

As described above, the polishing liquid supply apparatus of the present invention uses a pump to supply the polishing liquid to the workpiece by pressurizing the polishing liquid. In the case of performing the polishing process for finishing the polishing, the supply amount of the polishing liquid does not become insufficient, and high processing accuracy can be realized at a high processing speed. Moreover, like the conventional lapping machine without a pump, the polishing liquid is supplied to the upper plate during exercise by receiving the polishing liquid flowing out of the nozzle at the receiving portion without using a rotary joint.
It is unlikely to cause a failure and requires almost no maintenance work.

Further, if a plurality of pumps are provided to supply the polishing liquid in a dispersed manner to each location, the polishing can be performed more uniformly and higher precision can be realized. In addition, when each pump is operated intermittently in sequence, an appropriate amount of the polishing liquid can be dispersed and supplied, and the accuracy can be further improved.

[Brief description of the drawings]

FIG. 1 is a front sectional view showing one embodiment of the present invention.

[Explanation of symbols]

10 lapping machine, 11 lower board, 12 driving unit, 13…
Groove, 14: Upper plate, 15: Joint, 16: Drive shaft, 17:
Groove, 18: suspension frame, 19: lifting part, 20: slip ring, 21: carrier, 22: fitting hole, 23: workpiece, 24: gear, 25: center gear, 26: internal gear. Reference numeral 30: polishing liquid supply device, 31: receiving portion, 32: support column, 33: nozzle, 34: polishing liquid, 35: pump, 36
... pipe, 37 ... connecting pipe.

Claims (4)

[Claims] 1. A work is fitted to a carrier, sandwiched between an upper plate and a lower plate, and the upper plate,
In a lapping machine that drives a lower platen and a carrier to move a workpiece to perform polishing, the lapping plate has a substantially annular shape, is provided above a rotating upper plate, and receives a polishing liquid flowing out from a nozzle fixed to a machine base. A receiving part and an upper plate are provided, and the polishing liquid is sucked from the receiving part,
A polishing liquid supply device for a lapping machine having a pump that pressurizes and supplies a polishing liquid to a workpiece portion on a lower surface of an upper plate. 2. The polishing liquid supply device for a lapping machine according to claim 1, further comprising a pump for supplying a polishing liquid to a plurality of locations along the upper plate. 3. The polishing liquid supply device for a lapping machine according to claim 2, wherein each pump operates intermittently and sequentially. 4. The polishing liquid supply device for a lapping machine according to claim 1, wherein the power supply of the pump is connected to a connection portion fixed to the machine base via a slip ring.