JPH11330786A - Electronic component mounting method - Google Patents

Abstract

(57) [Problem] To provide an electronic component mounting method capable of reducing a moving amount of a vertical movement of a suction nozzle at the time of mounting an electronic component and shortening a tact time. SOLUTION: A plurality of suction nozzles 14 (14A to 14A) are provided.
D), when the electronic component 22A is mounted by the first mounting nozzle 14A in the electronic component mounting apparatus provided in the mounting head unit 15, the other mounting nozzles 14B to 14B are mounted.
D is a position lower than the recognized height L2 from the recognized height L2 when the mounting head unit 15 is moved onto the circuit board 11, and the electronic component 22B held by the mounting nozzles 14B to 14D. 22D is lowered to the standby reference height L3 at which the electronic components 22D do not interfere with the electronic components 22 of the circuit board 11, and the electronic component 22 waits. As a result, the overall mounting tact can be shortened, and the production efficiency is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method for sequentially mounting electronic components held up and down by a plurality of mounting nozzles at predetermined positions on a circuit board.

[0002]

2. Description of the Related Art An electronic component mounting apparatus is required to mount electronic components on a circuit board quickly and accurately to improve mounting quality.

Hereinafter, a method for mounting an electronic component will be described with reference to FIGS. 4 to 6, taking a conventional electronic component mounting apparatus having four suction nozzles as an example of a mounting nozzle as an example.

As shown in FIGS. 4 and 5, a conventional electronic component mounting apparatus 10 includes a board transfer device 12 for loading and unloading a circuit board 11, a component supply device 13 having a plurality of component supply units, and Can be loaded with four suction nozzles 14,
An XY robot 1 having a mounting head unit 15 capable of moving the loaded suction nozzle 14 up and down and rotating, and a board recognition camera 16 and capable of moving in the X and Y directions
7, a component imaging device 18 for imaging the electronic component 22, a component discarding unit 19 for discarding the electronic component 22 when the measurement result of the component posture is abnormal, and the electronic component mounting device 10.
And a control unit 20 for controlling the operation of

The mounting operation in the electronic component mounting apparatus 10 is performed as follows. First, the circuit board 11 is carried into the mounting position by the board transfer device 12. The XY robot 17 moves the board recognition camera 16 onto the circuit board 11 and checks a position where each electronic component 22 is to be mounted. Next, the mounting head unit 15 is moved to the component supply unit 13 by the XY robot 17, and the plurality of suction nozzles 14 provided are provided.
The electronic components 22 (22A to 22D) are sucked and held by the (first to fourth suction nozzles 14A to 14D), and all the suction nozzles 14 are raised to the upper end positions. By moving the mounting head unit 15 so that the electronic components 22A to 22D held by the suction nozzles 14A to 14D pass over the component imaging device 18, the electronic components 22A to 22D are transferred to the component imaging device 18. The holding posture is photographed, the holding posture is measured, and the quality of the holding posture is determined based on the measurement result.

[0006] From the determination results, the electronic components 22A to 22A
If the holding posture of D is normal, the positions of the electronic components 22A to 22D are corrected based on the obtained image information, and then the mounting head unit 15 is moved to a desired first mounting position by the XY robot 17. First, the first suction nozzle 14A holding the electronic component 22A is lowered to the mounting height L1, and the electronic component 22A is mounted on the mounting circuit board 11. After that, the first suction nozzle 14A is raised to the recognition height L2. Next, the mounting head unit 15 is moved to a desired second mounting position by the XY robot 17, and similarly, the electronic components 22B, 22C, and 22D are sequentially moved by the second to fourth suction nozzles 14B, 14C, and 14D. It is mounted on the circuit board 11. Note that L0 in FIG. 5 is the upper surface position of the circuit board 11. FIG. 6 shows a timing chart of the suction nozzle of the conventional electronic component mounting method when the movement in the XY directions by the XY robot 17 is unnecessary as an example.

As described above, in the conventional electronic component mounting method,
As shown in FIGS. 5 and 6, in the process of mounting the electronic component 22, the mounting head unit 15 is moved to the mounting position, and the suction nozzle 14 is imaged by the component imaging device 18 so that the electronic component 22 can be recognized. From the recognition height L2 (for example, the top dead center in the vertical range of the suction nozzle 14), the mounting height L1 at which the electronic component 22 is actually mounted on the circuit board 11
After mounting the electronic component 22, it is raised again to the recognition height L2, and after confirming that the suction nozzle 14 has been raised to the recognition height L2, the lowering operation of the next suction nozzle 14 is performed. The operation of mounting by repeating is performed in order.

[0008] When it is determined that the holding posture of the electronic components 22A to 22D is abnormal when the electronic component 22 is recognized by imaging the component imaging device 18, the mounting head unit 15 is moved by the XY robot 17. The electronic components 22A to 22D held by the suction nozzles 14A to 14D are discarded by moving to the component disposal unit 13.

[0009]

However, in the above-mentioned conventional electronic component mounting method, after the previous suction nozzle 14 (for example, the first suction nozzle 14A) is mounted and raised to the recognition height L2, The operation of lowering the suction nozzle 14 (for example, the second suction nozzle 14B) from the recognition height L2 to the mounting height L1 is repeatedly performed, so that the moving time required for the vertical movement of the suction nozzle 14 occurring during this time is long. Thus, it contributed to an increase in tact time, leading to a decrease in production capacity.

SUMMARY OF THE INVENTION The present invention has been made to solve this problem, and an object of the present invention is to provide an electronic component mounting method capable of reducing a tact time associated with the movement of a mounting nozzle such as a suction nozzle.

[0011]

In order to solve the above-mentioned problems, an electronic component mounting method according to the present invention comprises a mounting head section movable in a predetermined direction, a plurality of mounting nozzles provided movably up and down, and a mounting head section. An electronic component mounting method for sequentially mounting electronic components held by the mounting nozzles at predetermined positions on a circuit board by moving the mounting nozzles and moving the mounting nozzles up and down. When mounting electronic components with the first mounting nozzle in the mounting head, the other mounting nozzles are held when the mounting head is moved so that the mounting nozzles of the mounting head are positioned on the circuit board. From the height, it is lower than the holding height of this mounting nozzle,
The electronic component held by the mounting nozzle is lowered to a standby reference height where the electronic component does not interfere with the electronic component of the circuit board, and the electronic component is lowered from the standby reference height. Is lowered to a mounting height mounted on a circuit board to perform a mounting operation.

As a result, it is possible to reduce the tact time associated with the movement of the mounting nozzle such as the suction nozzle.

[0013]

According to a first aspect of the present invention, there is provided an electronic component mounting method, wherein a plurality of mounting nozzles are provided on a mounting head movable in a predetermined direction so as to be movable up and down. An electronic component mounting method in which electronic components held by mounting nozzles are sequentially mounted at predetermined positions on a circuit board by moving and elevating and lowering mounting nozzles. When mounting the electronic component by the first mounting nozzle in the head portion, the other mounting nozzles are moved from the mounting height when the mounting head portion is moved so that the mounting nozzle of the mounting head portion is located on the circuit board, A stand-by position that is lower than the holding height of the mounting nozzle so that the electronic components held by the mounting nozzle do not interfere with the electronic components on the circuit board. Quasi-up to the height, to wait is lowered,
Thereafter, the other mounting nozzle is lowered from the standby reference height to a mounting height at which the electronic component is mounted on the circuit board, and the mounting operation is performed.

According to this method, the second and subsequent mounting nozzles are lowered to the standby reference height, which is a lower position than the holding height, and are on standby. Compared to the case, these mounting nozzles can be lowered to the mounting height in a shorter time.

According to a second aspect of the present invention, in the electronic component mounting method according to the first aspect, the mounting nozzle that has first been mounted is raised from the mounting height to a level higher than the standby reference height. When the mounting nozzle is raised to the standby reference height, the movement of the mounting head for the mounting operation of the next mounting nozzle is started and the next mounting nozzle is lowered from the standby reference height to the mounting height. It is to let.

According to this method, when the mounting nozzle is raised to the standby reference height, the operation of moving the mounting head unit for mounting the next mounting nozzle is started to move the next mounting nozzle to the standby reference height. From the height to the mounting height,
Quicker transition to the mounting operation of the next mounting nozzle compared to the case where the mounting head moves or the next mounting nozzle moves down when the mounting nozzle is raised to the holding height as before. Can be.

According to a third aspect of the present invention, in the electronic component mounting method according to the first or second aspect, the holding height of the mounting nozzle is such that the electronic component held by the mounting nozzle is provided at a predetermined position. The height of the standby reference height and the mounting height are set in accordance with the thickness of the electronic component.

According to this method, the mounting operation by each mounting nozzle can be performed accurately and quickly. Hereinafter, an electronic component mounting method according to an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. In the electronic component mounting apparatus that performs the present electronic component mounting method, the same components as those of the conventional electronic component mounting apparatus are denoted by the same reference numerals.

As shown in FIGS. 1 to 3, a control unit 2 provided in the electronic component mounting apparatus 1 includes a suction nozzle 1
4 as the height to stop, the recognition height L2, the mounting height L
In addition to 1, the standby reference height L3, which is the standby height before mounting, is recognized in advance. The standby reference height L3 is determined by the suction nozzle 14 (first to fourth suction nozzles 14A to 14A).
D) The electronic component 22 (22A to 22A) held by
D) is a height that does not interfere with the mounted electronic components 22 on the circuit board 11 to be mounted, and as shown in FIG. 1, the height between the recognition height L2 and the mounting height L1. That's it. The standby reference height L3 and the mounting height L1 are the electronic components 2
2 is set according to the thickness.

The control unit 2 measures the component holding posture by the component imaging device 18 in the same manner as the conventional electronic component mounting method, and the electronic component 22A held by the first suction nozzle 14A is mounted on the circuit board 11. The mounting head unit 1 is moved by the XY robot 17 so as to be located directly above the mounting point (first mounting point).
After moving 5, the following operation is performed.

First, in the mounting head section 15, the first suction nozzle 14A holding the electronic component 22A by suction is lowered to the mounting height L1, and at the same time, the electronic component 22B
２２22D at the recognition height L2 in the state of being held by suction.
The fourth suction nozzles 14B to 14D are set to the standby reference height L.
Lower to 3 and wait. Then, after the first suction nozzle 14A reaches the mounting height L1 and mounts the electronic component 22A at a desired position on the upper surface of the circuit board 11, the first suction nozzle 14A raises the electronic component 22A to the recognition height L2. At the same time that the suction nozzle 14A passes the standby reference height L3, X
The mounting head 15 is moved in the X and Y directions by the Y robot 17 so that the second mounting position (the second electronic component 22B held by the second suction nozzle 14B is directly above the mounting point of the circuit board 11). Position), and the descent of the second suction nozzle 14B which has been waiting at the standby reference height L3 is started to mount the electronic component 22B. Thereafter, similarly, when the second and third suction nozzles 14B and 14C pass the standby reference height L3 after the mounting, the electronic components 22C and 22
Third and fourth suction nozzles 14C, 14 holding D
D to lower each electronic component 22C, 22D to the circuit board 1.
1 is mounted on the upper surface.

As described above, according to the present embodiment, the second to second embodiments
Since the fourth suction nozzles 14B to 14D are previously lowered to the standby reference height L3, which is a position lower than the recognition height L2, and are on standby, the second to fourth suction nozzles 14B to 14D are used as in the related art. 14D is compared with a case where the second suction nozzle 14B is at the recognition height L2.
14D can be lowered to the mounting height L1 in a short time, and the tact time can be reduced by eliminating the time spent for the nozzle movement amount.

When the previous suction nozzles 14A to 14C are raised to the standby reference height L3 after mounting, the movement operation of the mounting head unit 15 for mounting the next suction nozzles 14B to 14D is started. Next suction nozzles 14B-1
In order to lower the 4D from the standby reference height L3 to the mounting height L1, as in the related art, the previous suction nozzles 14A to 14C are used.
Is moved to the recognition height L2 after the mounting, the next suction nozzle 1 is compared with the case where the mounting head unit 15 is moved or the next suction nozzles 14B to 14D are lowered.
It is possible to quickly shift to the mounting operation of 4B to 14D, thereby also reducing the tact time.

In the above embodiment, the mounting head 15 having the four suction nozzles 14A to 14D has been described. However, if the number of the suction nozzles 14 is plural, the effect can be obtained. . The holding height when the mounting head unit 15 is moved so that the suction nozzle 14 of the mounting head unit 15 is located on the circuit board 11 is as follows.
A description will be given of a case where the electronic component 22 held by the suction nozzle 14 is imaged by the component imaging device 18 and the height is set so that the electronic component 22 is recognized. According to this, mounting by each suction nozzle 14 is adapted to the actual operation. The operation can be performed accurately and quickly, but it goes without saying that the present invention is not limited to this. Also, the case where the mounting operation is performed by the suction operation as the mounting nozzle has been described, but the present invention is not limited to this.

[0025]

As described in detail above, according to the present invention,
In an electronic component mounting apparatus in which a plurality of mounting nozzles are provided in a mounting head unit, when mounting an electronic component using the first mounting nozzle, the other mounting nozzles are positioned on the circuit board when other mounting nozzles are mounted. As described above, from the holding height when the mounting head is moved, the mounting height is lower than the holding height of the mounting nozzle, and the electronic components held by the mounting nozzle may interfere with the electronic components of the circuit board. By lowering to a standby reference height that does not have a standby reference height, the overall mounting tact time can be shortened, and as a result, production efficiency is improved.

[Brief description of the drawings]

FIG. 1 is a front view showing a positional relationship of a plurality of suction nozzles for describing an electronic component mounting method according to an embodiment of the present invention.

FIG. 2 shows a timing chart of a suction nozzle of the electronic component mounting method (as an example, a case where it is unnecessary to move the XY robot in the XY directions).

FIG. 3 is a perspective view of an electronic component mounting apparatus that performs the electronic component mounting method.

FIG. 4 is a perspective view of an electronic component mounting apparatus that performs a conventional electronic component mounting method.

FIG. 5 is a front view showing a positional relationship between a plurality of suction nozzles for explaining a conventional electronic component mounting method.

FIG. 6 shows a timing chart of a suction nozzle in a conventional electronic component mounting method (as an example, an X-axis by an XY robot);
This shows a case where movement in the Y direction is unnecessary).

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 electronic component mounting device 2 control unit 11 circuit board 14, 14A to 14D suction nozzle (mounting nozzle) 15 mounting head unit 17 XY robot 18 component imaging device 22, 22A to 22D electronic component L1 mounting height L2 recognition height (holding) Height) L3 Standby reference height

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Naoyuki Kitamura 1006 Kadoma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd.

Claims (3)

[Claims] A plurality of mounting nozzles are provided on a mounting head that is movable in a predetermined direction so as to be movable up and down. The mounting nozzle is moved by the mounting head and the mounting nozzle is moved up and down, so that the electronic nozzle held by the mounting nozzle is moved. An electronic component mounting method for sequentially mounting components at a predetermined position on a circuit board, wherein when mounting electronic components sequentially by each mounting nozzle, when mounting electronic components by a first mounting nozzle in a mounting head portion, another method is used. The mounting nozzle is positioned lower than the mounting height of the mounting nozzle from the holding height when the mounting head is moved so that the mounting nozzle of the mounting head is positioned on the circuit board. Lower the electronic components to a standby reference height that does not interfere with the electronic components on the circuit board, and make them stand by,
Thereafter, the other mounting nozzle is lowered from the standby reference height to a mounting height at which the electronic component is mounted on the circuit board to perform a mounting operation. 2. When the mounting nozzle that has first been subjected to the mounting operation is raised from the mounting height to above the standby reference height, when the mounting nozzle is raised to the standby reference height,
2. The electronic component mounting method according to claim 1, wherein the operation of moving the mounting head unit for the mounting operation of the next mounting nozzle is started to lower the next mounting nozzle from the standby reference height to the mounting height. 3. The holding height of the mounting nozzle is a height at which the electronic component held by the mounting nozzle is imaged by a component imaging device provided at a predetermined position to recognize the electronic component. 3. The electronic component mounting method according to claim 1, wherein the height is set according to the thickness of the electronic component.